Air-cooling and water-cooling mixed heat dissipation plate

Abstract

The utility model discloses an air-cooling and water-cooling mixed heat dissipation plate, and belongs to the technical field of heat dissipation. Comprising a substrate, the lower side face of the substrate is a conduction plane, heat dissipation fins are arranged on the upper side face of the substrate, and an adapter block protruding out of the substrate is arranged at the front end of the substrate; a connecting plate is fixed to the front end face of the base plate and fixedly connected with the adapter block. The connecting plate is provided with a liquid inlet and a liquid return port which are opposite to the adapter block; a liquid inlet cavity and a liquid return cavity which are correspondingly communicated with the liquid inlet and the liquid return opening respectively are formed in the adapter block; a cooling flow channel is formed in the base plate, and the two ends of the cooling flow channel communicate with the corresponding liquid inlet cavity and the corresponding liquid return cavity correspondingly. According to the utility model, the liquid cooling medium circularly flows in the flow channel of the substrate, the heat dissipation fins are used in a matched manner, two heat dissipation modes of liquid cooling and air cooling are combined, and more efficient and quicker heat dissipation is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation technical field, concretely relates to a forced air cooling and water cooling mixed heat dissipation plate. BACKGROUND

[0002] In modern electronic equipment and system, along with the performance of component and the increase of integration, the heat dissipation problem becomes increasingly serious. The traditional heat dissipation mode, such as natural air cooling or simple forced air cooling, has been difficult to meet the heat dissipation demand of high-performance components. Especially in some special cavities, due to space limitation and component layout, ordinary liquid cooling plate is often difficult to directly contact the components needing cooling, resulting in poor heat dissipation effect.

[0003] On the other hand, although the air-cooled cold plate can reduce the cavity temperature to a certain extent, its heat dissipation efficiency is limited by the air heat conduction performance, and often cannot achieve the ideal cooling effect. Especially in high-power density, high-heat components, simply relying on air cooling often leads to high temperature of components, affecting their performance and life. SUMMARY

[0004] The utility model aims at providing a forced air cooling and water cooling mixed heat dissipation plate, which integrates air cooling and water cooling structure to improve the heat dissipation efficiency of the heat dissipation plate.

[0005] The utility model discloses the following technical scheme: a forced air cooling and water cooling mixed heat dissipation plate, including the substrate, the downside of the substrate is the conduction plane, and the upside of the substrate is provided with the heat dissipation fin, and the front end of the substrate has the adapter block that protrudes from the substrate;The front end surface of the substrate is fixed with the connecting plate, and the connecting plate is fixedly connected with the adapter block;

[0006] Among them, the connecting plate is provided with the liquid inlet and the liquid return port opposite to the adapter block;The adapter block is provided with the liquid inlet cavity and the liquid return cavity that are communicated with the liquid inlet and the liquid return port respectively;The cooling flow channel is arranged in the substrate, and the two ends of the cooling flow channel are communicated with the corresponding liquid inlet cavity and liquid return cavity respectively.

[0007] Preferably, the connecting plate surface is provided with the positioning sink groove opposite to the adapter block, and the liquid inlet and the liquid return port are arranged at the bottom of the positioning sink groove.

[0008] Preferably, the periphery of the liquid inlet and the liquid return port is provided with uniformly distributed screw holes.

[0009] Preferably, the periphery of the connecting plate exceeds the substrate, and the connecting plate periphery is provided with a connecting hole.

[0010] Preferably, the liquid inlet cavity and the liquid return cavity are long slots arranged on the front side of the adapter block, and the long slot bottom is provided with a through hole communicated with the cooling flow channel;The through hole is staggered with the liquid inlet and the liquid return port.

[0011] Preferably, the substrate and the adapter block are integrated structures.

[0012] Preferably, the substrate and the adapter block are fixedly connected with the connecting plate by friction welding.

[0013] Preferably, the rear end of the substrate has a positioning protrusion.

[0014] The beneficial effects of the present application are as follows:

[0015] By opening a cooling flow channel in the substrate and connecting a liquid cooling system, the liquid cooling medium can circulate in the flow channel, effectively taking away the heat on the substrate, having higher heat dissipation efficiency and lower noise; the heat dissipation fins on the substrate cooperate with the heat dissipation fan to accelerate the air flow around the heat dissipation fins, further improving the heat dissipation efficiency; the heat dissipation plate combines the liquid cooling and air cooling two heat dissipation modes, can fully exert their respective advantages, realize more efficient and faster heat dissipation;

[0016] The design of the heat dissipation plate is compact, and the substrate, the connecting plate, the adapter block and other components are connected by reasonable layout and friction welding connection mode, realizing efficient heat dissipation effect, while maintaining smaller size and weight; the connecting hole and the positioning protrusion and other structures on the connecting plate make the heat dissipation plate can be conveniently fixed to the component to be cooled, improving the convenience and stability of installation. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0018] Figure 1 A perspective view of a mixed air-cooled and water-cooled heat dissipation plate according to an embodiment of the present application is provided.

[0019] Figure 2 An exploded view of a mixed air-cooled and water-cooled heat dissipation plate according to an embodiment of the present application is provided.

[0020] Figure 3 A top view of a mixed air-cooled and water-cooled heat dissipation plate according to an embodiment of the present application is provided.

[0021] Figure 4 A front view of a mixed air-cooled and water-cooled heat dissipation plate according to an embodiment of the present application is provided.

[0022] Figure 5 A Figure 4 A-A sectional view.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Substrate; 11. Conductive plane; 12. Heat dissipation fins; 13. Cooling channels; 14. Positioning protrusions;

[0025] 2. Adapter block; 21. Liquid inlet chamber; 22. Liquid return chamber; 23. Through hole;

[0026] 3. Connecting plate; 31. Liquid inlet; 32. Liquid return outlet; 33. Positioning sink; 34. Threaded hole; 35. Connecting hole. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Example 1:

[0029] like Figures 1 to 5 As shown, this utility model provides a hybrid air-cooled and water-cooled heat dissipation plate, including a base plate 1 and a connecting plate 3 fixed to the front end face of the base plate 1.

[0030] The lower surface of the substrate 1 is a conductive plane 11, used for direct contact with the component to be cooled. A row of evenly distributed heat dissipation fins 12 is formed on the upper surface of the substrate 1. These fins, in conjunction with a cooling fan, improve the heat dissipation efficiency of the substrate 1. A connecting block 2 protrudes from the front end of the substrate 1. The connecting block 2 is positioned against one side of the substrate 1 and is an integral part of the substrate 1. Both the connecting block 2 and the front surface of the substrate 1 are planar.

[0031] The connecting plate 3 is attached and fixed to the front end face of the adapter block 2 and the base plate 1 by friction welding. The periphery of the connecting plate 3 extends beyond the base plate 1 and the heat dissipation fins 12, and the connecting plate 3 has connecting holes 35 around its periphery for fixing the base plate 1 relative to the component to be cooled. The rear end of the base plate 1 has a positioning protrusion 14, which improves the stability between the base plate 1 and the component to be cooled by cooperating with the positioning protrusion 14.

[0032] In this embodiment, a cooling channel 13 is provided inside the substrate 1. The cooling channel 13 is connected to the liquid cooling system through the liquid inlet 31 and the liquid return port 32 on the connecting plate 3, so as to realize the circulation of the liquid cooling medium inside the substrate 1 and further improve the heat dissipation efficiency of the substrate 1 through the liquid cooling medium.

[0033] Example 2:

[0034] On the basis of the above embodiment one, in combination Figures 1 to 5 As shown in the drawings, the connecting plate 3 front surface is provided with a positioning sink 33, the positioning sink 33 and the position of the adapter block 2 are opposite. The liquid inlet 31 and the liquid return port 32 are provided at the bottom of the positioning sink 33, and a plurality of threaded holes 34 are provided around the liquid inlet 31 and the liquid return port 32; in work, the liquid cooling system is connected to the liquid inlet 31 and the liquid return port 32 through the joint.

[0035] The cooling flow channel 13 is a meandering sink provided on the lower side of the base plate 1, after the cooling flow channel 13 is provided, the conduction plane 11 is fixed to the lower side of the base plate 1 by friction welding, realizing the sealing of the cooling flow channel 13. The adapter block 2 front side is provided with a liquid inlet cavity 21, a liquid return cavity 22, the liquid inlet cavity 21, the liquid return cavity 22 is an elongated groove, the upper part of the elongated groove is opposite and communicated with the liquid inlet 31, the liquid return port 32, the lower part of the elongated groove is provided with a through hole 23 corresponding to the two ends of the cooling flow channel 13, the through hole 23 is staggered with the liquid inlet 31, the liquid return port 32, avoiding direct opposite.

[0036] In work;

[0037] The lower side of the base plate 1 directly contacts the conduction plane 11 of the cooling member, and is fixed relative to the cooling member through the connecting plate 3; the heat of the cooling member is transmitted to the base plate 1 through the conduction plane 11; the cooling flow channel 13 is connected to the liquid cooling system through the liquid inlet 31 and the liquid return port 32 on the connecting plate 3, the liquid cooling medium circulates in the cooling flow channel 13 inside the base plate 1, and the heat of the base plate 1 is taken away; in addition, the cooling fan blows against the cooling fins 12 on the base plate 1, further improving the heat dissipation efficiency of the base plate 1; the utility model first reduces the temperature of the cooling member by liquid, and then realizes air exchange by the characteristics of air flow to further reduce the temperature of the cooling member, realizing effective cooling of the cooling member in a shorter time.

[0038] Obviously, those skilled in the art can make various modifications and variations to the utility model without departing from the spirit and scope of the utility model. Thus, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and their equivalent technologies, the utility model also intends to include these modifications and variations.

Claims

1. A mixed air-cooled and water-cooled heat dissipation plate, comprising a base plate (1), Characterized in that: the lower side of the base plate (1) is a conductive plane (11), the upper side of the base plate (1) is provided with heat dissipation fins (12), and the front end of the base plate (1) is provided with an adapter block (2) protruding from the base plate (1); the front end surface of the base plate (1) is fixed with a connecting plate (3) which is fixedly connected with the adapter block (2); wherein the connecting plate (3) is provided with a liquid inlet (31) and a liquid return port (32) opposite to the adapter block (2); the adapter block (2) is provided with a liquid inlet cavity (21) and a liquid return cavity (22) corresponding to the liquid inlet (31) and the liquid return port (32), respectively; the base plate (1) is provided with a cooling flow channel (13) therein, and the two ends of the cooling flow channel (13) are respectively communicated to the corresponding liquid inlet cavity (21) and liquid return cavity (22).

2. The hybrid air and water cooling plate of claim 1, wherein: The surface of the connecting plate (3) is provided with a positioning sink (33) opposite to the adapter block (2), and the liquid inlet (31) and the liquid return port (32) are provided at the bottom of the positioning sink (33).

3. The hybrid air and water cooling plate of claim 2, wherein: The periphery of the liquid inlet (31) and the liquid return port (32) is provided with uniformly distributed threaded holes (34).

4. The hybrid air and water cooling plate of claim 1, wherein: The periphery of the connecting plate (3) exceeds the base plate (1), and the periphery of the connecting plate (3) is provided with a connecting hole (35).

5. The hybrid air and water cooling plate of claim 1, wherein: The liquid inlet cavity (21) and the liquid return cavity (22) are elongated grooves provided on the front side surface of the adapter block (2), and the bottom of the elongated groove is provided with a through hole (23) communicated with the cooling flow channel (13); the through hole (23) is staggered with the liquid inlet (31) and the liquid return port (32) vertically.

6. The hybrid air and water cooling panel according to claim 1, wherein: The base plate (1) and the adapter block (2) are of an integrated structure.

7. The hybrid air and water cooling panel according to claim 6, wherein: The base plate (1) and the adapter block (2) are fixedly connected with the connecting plate (3) by friction welding.

8. The hybrid air and water cooling plate of claim 1, wherein: The rear end of the base plate (1) is provided with a positioning protrusion (14).

Images