Diode simulation load device

By designing a diode-simulated load device, and utilizing the electrical characteristics and heat dissipation structure of diodes, the heat conduction and heat dissipation problem in high-power power supply testing was solved, achieving safe and efficient power supply testing and calibration.

CN223692501UActive Publication Date: 2025-12-19XIAMEN HUALIAN ELECTRONIC SCI TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202423047817.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-12-19
Estimated Expiration
2034-12-11

AI Technical Summary

Technical Problem

Existing high-power power supply testing devices have insufficient heat conduction and heat dissipation capabilities, leading to overheating and damage of electronic load instruments. They also have poor safety and high costs. Furthermore, existing analog load devices are not suitable for testing high-power drive power supplies.

Method used

Design a diode-simulated load device that utilizes the electrical characteristics of diodes, such as low forward resistance and high reverse resistance, to form a simulated load by connecting multiple diode devices in series. Combined with a heat sink aluminum plate and a circulating water channel, it can be used for heat dissipation and cooling, and is suitable for testing power supplies of different power levels.

Benefits of technology

It enables efficient and safe testing of both high- and low-power power supplies, avoids overheating damage to diode devices, reduces testing costs, and provides an efficient and quantifiable testing solution.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223692501U_ABST
    Figure CN223692501U_ABST
Patent Text Reader

Abstract

The utility model discloses a diode simulation load device comprising a load assembly. The load assembly comprises a heat dissipation aluminum plate, a plurality of diode devices are sequentially arranged on the heat dissipation aluminum plate, the diode devices are in bolted connection with the heat dissipation aluminum plate, and the adjacent diode devices are in circuit connection through a series connection structure; the diode device comprises a first diode and a second diode, the bottom ends of the first diode and the second diode are fixed on the aluminum nitride substrate, the cathode of the first diode is electrically connected with the anode of the second diode, and the cathode of the second diode is electrically connected with the anode of the first diode in the adjacent diode device; in the load assembly, the anode of the first diode in the diode device located at the head end is connected with the positive electrode of the detected power supply, and the cathode of the second diode in the diode device located at the tail end is connected with the negative electrode of the detected power supply, so that the test operation of the detected power supply is realized.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of high, low power supply test, especially to a diode simulation load device. BACKGROUND

[0002] The high power supply needs to carry out the precision calibration of current and the test of load capacity, and the existing load test mode is to test through the electronic load instrument, because it does not have good heat conduction, heat dissipation capacity, under the working condition of high power, long time, it can lead to the damage of electronic load instrument due to overheating, its safety is poor and cost is high, the patent number ZL201721900910.0 discloses a kind of simulation load circuit compatible with 12V and 24V automobile power supply system, the simulation load circuit structure is complex, and it can only test 12V, 24V power supply operation, cannot test high-power drive power supply operation, therefore, it is necessary to study a kind of simulation load device applicable to high-power power supply test operation to solve the above problems. SUMMARY

[0003] The utility model aims at above -mentioned problem, provide a kind of diode simulation load device with simple structure, convenient operation.

[0004] To achieve the above object, the technical scheme of the utility model is as follows:

[0005] A diode simulation load device, comprising a load assembly; the load assembly comprises a heat dissipation aluminum plate, and a plurality of diode devices are sequentially arranged on the heat dissipation aluminum plate; the diode devices are bolted to the heat dissipation aluminum plate, and the adjacent diode devices are connected in series to realize circuit connection; the diode device comprises a first diode and a second diode, the first diode and the second diode are fixed at the bottom of an aluminum nitride substrate, the cathode of the first diode is electrically connected to the anode of the second diode, and the cathode of the second diode is electrically connected to the anode of the first diode in the adjacent diode device; in the load assembly, the anode of the first diode in the diode device at the head end is connected to the positive electrode of the power supply to be detected, and the cathode of the second diode in the diode device at the tail end is connected to the negative electrode of the power supply to be detected, so as to realize the test operation of the power supply to be detected.

[0006] Further, the diode simulation load device further comprises a load cabinet, and the load assembly is detachably connected inside the load cabinet; the plurality of load assemblies are arranged at equal intervals along the height direction of the load cabinet.

[0007] Further, a circulating water channel is arranged in the side wall of the load cabinet, the circulating water channel is arranged around the inside of the load cabinet, one end of the circulating water channel is connected in communication with a cold water inlet waterway, and the other end of the circulating water channel is connected in communication with a cooling water outlet waterway.

[0008] Further, the load assembly comprises two heat dissipation aluminum plates arranged side by side, one of the heat dissipation aluminum plates is provided with the first load and the third load which are independent of each other, and the other heat dissipation aluminum plate is provided with the second load and the fourth load which are independent of each other; the first load is composed of two diode devices connected in series to test a 3V / 6A power supply; the second load is composed of four diode devices connected in series to test an 8V / 10A power supply; the third load is composed of 70 diode devices connected in series to test a 160V / 40A power supply; and the fourth load is composed of 85 diode devices connected in series to test a 180V / 50A power supply.

[0009] Further, in the diode device, the cathode of the first diode and the anode of the second diode, and the cathode of the second diode and the anode of the first diode of the adjacent diode device are connected through a zinc-plated copper bar, and the copper bar is fixed by a screw with a spring pad; the anode of the first diode of the diode device at the head end and the positive pole of the power supply to be tested, and the cathode of the second diode of the diode device at the tail end and the negative pole of the power supply to be tested are connected through a multi-core copper wire with zinc-plated copper terminals at both ends; and the diodes on both sides of the heat dissipation aluminum plate are connected through a multi-core copper wire with zinc-plated terminals.

[0010] Further, 0.1mm thick heat-conducting silicone grease is coated between the bottom of the diode device and the heat dissipation aluminum plate, and the diode device is fixed on the heat dissipation aluminum plate by a screw with a spring pad.

[0011] Compared with the prior art, the utility model has the advantages and positive effects that:

[0012] The utility model discloses the working principle of the small forward resistance, the big reverse resistance and the one-way conductivity of diode to form diode device, and through the series structure of multiple diode devices to form the simulation load device to realize the test and calibration operation of high, low power supply, and through the heat dissipation aluminum plate and the circulating water channel to realize the heat dissipation and cooling operation of diode device, avoid the overheat damage of diode device in the test process, and the structure is simple, convenient operation improves the test safety, and effectively reduces the operation cost of high, low power supply test.

[0013] On the other hand, the series connection of different numbers of diode devices can form the simulation load device suitable for different power supply tests, which can meet the test and calibration operation of all low power supply and high power supply, provide efficient and quantifiable test scheme for high, low power supply products, and bring convenience to the product test and calibration of high, low power supply. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0015] Figure 1 The frame logical diagram of the present application;

[0016] Figure 2 The structural schematic diagram of the load assembly. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments only constitute some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor, any modification, equivalent replacement, improvement, etc. should be included in the protection scope of the present application.

[0018] As shown in Figure 1 , Figure 2 The present embodiment discloses a diode analog load device, which comprises a load cabinet, a plurality of load assemblies are detachably connected inside the load cabinet, and the plurality of load assemblies are arranged at equal intervals along the height direction of the load cabinet.

[0019] A circulating water channel is arranged in the side wall of the load cabinet, the circulating water channel is arranged around the inside of the load cabinet, one end of the circulating water channel is in communication with the cold water inlet water channel, and the other end of the circulating water channel is in communication with the cooling water outlet water channel. By continuously injecting cold water into the circulating water channel and realizing circulation, the load assemblies in the load cabinet can be cooled.

[0020] The load assembly comprises a heat dissipation aluminum plate, a plurality of diode devices are arranged on the heat dissipation aluminum plate in sequence, the diode devices are screw-connected with the heat dissipation aluminum plate, and the adjacent diode devices are connected in series to realize circuit connection;

[0021] Each load component comprises two heat dissipation aluminum plates arranged side by side, one of the heat dissipation aluminum plates is provided with independent first load and third load, and the other heat dissipation aluminum plate is provided with independent second load and fourth load; the first load is composed of two diode devices in series to test 3V / 6A power supply; the second load is composed of four diode devices in series to test 8V / 10A power supply; the third load is composed of 70 diode devices in series to test 160V / 40A power supply; and the fourth load is composed of 85 diode devices in series to test 180V / 50A power supply.

[0022] The diode device comprises a first diode and a second diode, the first diode and the second diode are fixed on an aluminum nitride substrate, the cathode of the first diode is electrically connected with the anode of the second diode through a zinc-plated copper bar, and the cathode of the second diode is electrically connected with the anode of the first diode in the adjacent diode device through a zinc-plated copper bar; in the load component, the anode of the first diode in the diode device at the head end is connected with the positive pole of the power supply to be tested through a multi-core copper wire with a zinc-plated copper terminal, and the cathode of the second diode in the diode device at the tail end is connected with the negative pole of the power supply to be tested through a multi-core copper wire with a zinc-plated copper terminal, so as to realize the test operation on the power supply to be tested.

[0023] The bottom end of the diode device and the heat dissipation aluminum plate are coated with 0.1mm thick heat-conducting silicone grease to improve the heat dissipation effect of the diode; the aluminum nitride substrate and the heat dissipation aluminum plate are fixedly connected through a screw with a spring pad.

[0024] The utility model discloses a load cabinet is used to install multiple load components, and the load component is provided with the simulation load suitable for different power supply test operation, so that when the large and small power supply test operation is carried out, multiple large and small power supplies can be directly connected with multiple simulation loads on the load cabinet in the form of a row or a group, the simultaneous test and calibration operation of multiple large and small power supplies are realized, and the test rate and test convenience of large and small power supplies are improved, and the structure makes the circulating water channel in the load cabinet can simultaneously cool multiple simulation loads, avoids the high-temperature damage phenomenon during simulation load test, and further improves the use effect of the utility model.

[0025] The utility model discloses a working principle of the electrical characteristic of diode forward resistance very small, reverse resistance very big and one -way conductivity is used to form diode device, and through the series structure of multiple diode devices to form analog load device to realize the test and calibration operation of big, small power supply, and its through the heat dissipation aluminum plate, circulating water channel to realize the heat dissipation, cooling operation of diode device, avoids the phenomenon that diode device appears overheat damage in the testing process, and its simple structure, convenient operation improves the test security, and effectively reduces the operation cost of driving power supply test job.

[0026] On the other hand, the utility model discloses a series connection of different numbers of diode devices can form analog load device suitable for different power supply test, and it can satisfy the test, calibration job of all small power, big power supply, provides high -efficient and quantifiable test scheme for big, small power supply product, brings the convenience to the product test and calibration of big, small power supply.

Claims

1. A diode analog load device, characterized by: The diode analog load device comprises a load assembly; the load assembly comprises a heat dissipation aluminum plate, a plurality of diode devices are sequentially arranged on the heat dissipation aluminum plate, the diode devices are screw-connected with the heat dissipation aluminum plate, and adjacent diode devices are connected in series to realize circuit connection; the diode device comprises a first diode and a second diode, the first diode and the second diode are fixed at the bottom of an aluminum nitride substrate, the cathode of the first diode is electrically connected with the anode of the second diode, and the cathode of the second diode is electrically connected with the anode of the first diode in the adjacent diode device; in the load assembly, the anode of the first diode in the diode device at the head end is connected with the positive pole of the power supply to be detected, and the cathode of the second diode in the diode device at the tail end is connected with the negative pole of the power supply to be detected, so as to realize the test operation on the power supply to be detected.

2. The diode analog load device of claim 1, wherein: The diode analog load device further comprises a load cabinet, the load assembly is detachably connected in the load cabinet, and the plurality of load assemblies are equidistantly arranged along the height direction of the load cabinet.

3. The diode analog load device of claim 2, wherein: A circulating water channel is arranged in the side wall of the load cabinet, the circulating water channel is arranged around the inside of the load cabinet, one end of the circulating water channel is connected with the cold water inlet waterway, and the other end of the circulating water channel is connected with the cooling water outlet waterway.

4. The diode analog load device of claim 1, wherein: The load assembly comprises two heat dissipation aluminum plates arranged side by side, a first load and a third load are arranged on one of the heat dissipation aluminum plates, a second load and a fourth load are arranged on the other heat dissipation aluminum plate, the first load is composed of two diode devices connected in series to test a 3V / 6A power supply, the second load is composed of four diode devices connected in series to test an 8V / 10A power supply, the third load is composed of 70 diode devices connected in series to test a 160V / 40A power supply, and the fourth load is composed of 85 diode devices connected in series to test a 180V / 50A power supply.

5. The diode analog load device of claim 1, wherein: the first diode is a Schottky diode; and the second diode is a Schottky diode. In the diode device, the cathode of the first diode and the anode of the second diode, and the cathode of the second diode and the anode of the first diode in the adjacent diode device are connected through a zinc-plated copper bar; the anode of the first diode in the diode device at the head end and the positive pole of the power supply to be detected, and the cathode of the second diode in the diode device at the tail end and the negative pole of the power supply to be detected are connected through a multi-core copper wire with two zinc-plated copper terminals at two ends.

6. The diode analog load device of claim 1, wherein: A 0.1mm-thick heat-conducting silicone grease is coated between the bottom of the diode device and the heat dissipation aluminum plate, and the diode device is fixed on the heat dissipation aluminum plate through a screw with a spring pad.

Citation Information

Patent Citations

  • Compatible 12V and 24V power supply system of automobile's simulation load circuit

    CN207908960U