Reaction plate constant-temperature heating module for gene synthesizer
By using a heating rod and a temperature sensor in the gene synthesizer, combined with a heat insulation plate and a sealing gasket, the problem of temperature difference in the reaction chip was solved, achieving more uniform temperature control and improving reaction efficiency and accuracy.
Patent Information
- Application Number
- CN202423262073.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-27
AI Technical Summary
In existing gene synthesizers, temperature differences exist at different locations on the reaction chip during the heating process, affecting the reaction effect.
The heating rod and temperature sensor are used together to heat the composite board at a constant temperature through the heating block, and the temperature difference and the influence of the external environment are reduced by the heat insulation plate and sealing gasket.
This achieves temperature uniformity in the reaction chip, improves reaction efficiency and accuracy, and reduces the influence of the external environment on temperature.
Smart Images

Figure CN223705571U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of gene synthesizer, in particular to a reaction plate constant temperature heating module for gene synthesizer. BACKGROUND
[0002] Gene synthesizer is an automatic instrument designed for synthesizing oligonucleotides similar in structure to DNA or RNA, generally applied to solid-phase synthesis, each time adding a nucleotide to the growing oligonucleotide chain, each nucleotide added is reacted with the corresponding purine or pyrimidine base derivative using the same chemical reaction, and the chemical reaction and operation details vary with different instruments. When the reaction chip is reacting, a certain temperature needs to be maintained, and in general, a heating rod is used for heating, but the above-mentioned method is easy to cause the reaction chip at different positions to have temperature difference, affecting the reaction of the reaction chip. CONTENT OF THE UTILITY MODEL
[0003] In order to improve the above-mentioned problems, the present application provides a reaction plate constant temperature heating module for gene synthesizer.
[0004] The reaction plate constant temperature heating module for gene synthesizer provided by the present application adopts the following technical scheme:
[0005] A reaction plate constant temperature heating module for gene synthesizer, comprising a synthesis plate and a heating block, a plurality of reaction cavities for placing reaction chips are formed on the synthesis plate, a heating groove for embedding the synthesis plate is formed on the heating block, and a heating rod and a temperature sensor are arranged on the heating block.
[0006] By adopting the above-mentioned technical scheme, the operator can put the synthesis plate into the heating groove, heat the heating block through the heating rod, detect the temperature of the heating block through the temperature sensor, so as to heat the synthesis plate to the appropriate temperature, reduce the possibility of temperature difference of the reaction chip in the reaction cavity at different positions, and facilitate the reaction of the reaction chip.
[0007] Preferably, a heat insulation plate is further included, the heat insulation plate is located between the synthesis plate and the heating block, and a through hole for the synthesis plate to pass through is formed on the heat insulation plate.
[0008] By adopting the above-mentioned technical scheme, the heat insulation plate can separate part of the synthesis plate from the heating block, reduce the possibility of the operator contacting the heating block when taking out the synthesis plate, and facilitate the taking out of the heating block.
[0009] Preferably, a first notch is formed on the synthesis plate, and a second notch is formed on the heat insulation plate.
[0010] By adopting the above-mentioned technical scheme, the first notch can facilitate the operator to contact the synthesis plate, and the second notch can facilitate the operator to take out the synthesis plate.
[0011] Preferably, the heating block is provided with a sealing gasket, and the sealing gasket is in abutment with the synthetic plate.
[0012] By adopting the above technical scheme, the sealing gasket can improve the sealing degree of the synthetic plate in the heating groove, reduce the influence of the external environment on the temperature of the synthetic plate, and facilitate heating of the synthetic plate to a suitable temperature.
[0013] Preferably, a gasket groove is formed in the heating block, and the gasket groove is used for embedding the sealing gasket.
[0014] By adopting the above technical scheme, the gasket groove can provide installation space for the sealing gasket, and can also limit the installation position of the sealing gasket, thereby facilitating installation of the sealing gasket.
[0015] Preferably, a first installation groove is formed in the heating block, the first installation groove is used for embedding the heating rod, and a first jack screw is arranged on the heating block, one end of the first jack screw is in abutment with the heating block and the heating rod.
[0016] By adopting the above technical scheme, the first installation groove can provide installation space for the heating rod, and can also limit the installation position of the heating rod, and the first jack screw can fix the heating rod in the first installation groove, thereby achieving fixed installation of the heating rod and facilitating heating of the heating block by the heating rod.
[0017] Preferably, a second installation groove is formed in the heating block, the second installation groove is used for embedding the temperature sensor, and a second jack screw is arranged on the heating block, one end of the second jack screw is in abutment with the heating block and the temperature sensor.
[0018] By adopting the above technical scheme, the second installation groove can provide installation space for the heating rod, and can also limit the installation position of the temperature sensor, and the second jack screw can fix the temperature sensor in the second installation groove, thereby achieving fixed installation of the temperature sensor and facilitating detection of the temperature of the heating block by the temperature sensor.
[0019] Preferably, a connecting bolt is arranged on the synthetic plate, the connecting bolt passes through the synthetic plate and the heat insulation plate in sequence, the connecting bolt is threadedly connected with the heating block, and the connecting bolt is in abutment with the synthetic plate.
[0020] By adopting the above technical scheme, when the synthetic plate needs to be installed, an operator can move the synthetic plate through the through hole into the heating groove, and then screw in the connecting bolt. The connecting bolt can limit the synthetic plate, so that the synthetic plate is fixed in the heating groove, thereby achieving installation of the synthetic plate.
[0021] In summary, the present application has at least one of the following beneficial technical effects:
[0022] 1. Through the setting of the heating rod and the temperature measuring sensor, the operator can put the synthetic plate into the heating groove, heat the heating block through the heating rod, detect the temperature of the heating block through the temperature measuring sensor, so that the heating block is heated to the appropriate temperature, so that the synthetic plate is heated to the appropriate temperature, and the possibility of temperature difference of the reaction chip in the reaction chamber at different positions is reduced, and the reaction of the reaction chip is facilitated.
[0023] 2. Through the setting of the sealing gasket, the sealing gasket can improve the sealing degree of the synthetic plate in the heating groove, reduce the influence of the external environment on the temperature of the synthetic plate, and facilitate the synthetic plate to be heated to the appropriate temperature. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 It is the overall structure schematic diagram for embodying the constant temperature heating module in the embodiment of the application.
[0025] Figure 2 It is the explosion structure schematic diagram for embodying the constant temperature heating module in the embodiment of the application.
[0026] Figure 3 It is the cross-sectional structure schematic diagram for embodying the heating block in the embodiment of the application.
[0027] Figure 4 It is the explosion structure schematic diagram for embodying the heating rod, the temperature measuring sensor, the sealing gasket and the heating block in the embodiment of the application.
[0028] BRIEF DESCRIPTION OF DRAWINGS 1. Synthetic plate; 11, reaction chamber; 12, first notch; 13, connecting bolt; 2, heating block; 21, heating groove; 22, gasket groove; 23, first mounting groove; 24, first jack; 25, second mounting groove; 26, second jack; 3, heating rod; 4, temperature measuring sensor; 5, heat insulation plate; 51, through hole; 52, second notch; 6, sealing gasket. DETAILED DESCRIPTION
[0029] In order to make the purpose, characteristics and advantages of the application more obvious and easy to understand, the technical solutions in the embodiments of the application will be described clearly and completely in combination with the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the application.
[0030] The following will be described in combination with the drawings in the embodiments of the application. Figures 1-4 The application will be further described in detail.
[0031] The embodiment of the application discloses a reaction plate constant temperature heating module for gene synthesis instrument, which comprises a synthetic plate, a heating block, a heating rod, a temperature measuring sensor, a heat insulation plate and a sealing gasket. Figure 1As shown, it comprises synthetic plate 1, heating block 2 and heat insulation plate 5, heat insulation plate 5 is located between synthetic plate 1 and heating block 2, one side of heat insulation plate 5 and heating block 2 are attached; the number of synthetic plate 1 is two, a plurality of reaction cavities 11 for placing reaction chip are formed on synthetic plate 1.
[0032] As shown in Figure 1 and 2 , the cross section of synthetic plate 1 is T-shaped, heating groove 21 for embedding synthetic plate 1 is formed on heating block 2, through hole 51 for passing synthetic plate 1 is formed on heat insulation plate 5; connecting bolt 13 is arranged on synthetic plate 1, connecting bolt 13 is screwed with heating block 2 after passing synthetic plate 1 and heat insulation plate 5 in sequence. When it is needed to install synthetic plate 1, the operator moves synthetic plate 1, makes synthetic plate 1 pass through through hole 51 and embeds in heating groove 21, and then rotates connecting bolt 13, so that connecting bolt 13 is screwed with heating block 2 after passing synthetic plate 1 and heat insulation plate 5 in sequence, and connecting bolt 13 is rotated to abut with synthetic plate 1, connecting bolt 13 can limit synthetic plate 1, so that synthetic plate 1 is fixed in heating groove 21, thereby achieving the installation of synthetic plate 1. First notch 12 is formed on synthetic plate 1, second notch 52 is formed on heat insulation plate 5, first notch 12 can facilitate the operator to contact synthetic plate 1, and second notch 52 can facilitate the operator to take out synthetic plate 1.
[0033] As shown in Figure 3 and 4 , sealing washer 6 is arranged on heating block 2, washer groove 22 is formed on heating block 2 and located at the notch of heating groove 21, washer groove 22 is for embedding sealing washer 6, and sealing washer 6 abuts with the lower surface of synthetic plate 1 when synthetic plate 1 is embedded in heating groove 21. Washer groove 22 can provide installation space for the installation of sealing washer 6, and can limit the installation position of sealing washer 6, so as to achieve the installation of sealing washer 6. Sealing washer 6 can improve the sealing degree when synthetic plate 1 is located in heating groove 21, reduce the influence of external environment on the temperature of synthetic plate 1, and facilitate the heating of synthetic plate 1 to appropriate temperature.
[0034] As shown in Figure 3 and 4As shown in the figure, the two sides of the heating block 2 are provided with heating rods 3 and temperature measuring sensors 4, the number of heating rods 3 on one side of the heating block 2 is three, the number of temperature measuring sensors 4 on one side of the heating block 2 is two, and the temperature measuring sensors 4 are located between the adjacent two heating rods 3. The heating block 2 is provided with a first installation groove 23 for embedding the heating rod 3, and the heating block 2 is provided with a first jack 24, one end of the first jack 24 abuts against the heating block 2 and the heating rod 3. When it is necessary to install the heating rod 3, the operator moves the heating rod 3 into the first installation groove 23, the first installation groove 23 can provide installation space for the heating rod 3, and can also limit the installation position of the heating rod 3, and then the first jack 24 is screwed in, so that the first jack 24 abuts against the heating rod 3, the first jack 24 can exert force on the heating rod 3, so that the heating rod 3 is fixed in the first installation groove 23, realizing the fixed installation of the heating rod 3, and facilitating the heating of the heating block 2 by the heating rod 3.
[0035] As shown in the figure, Figure 3 and 4 The heating block 2 is provided with a second installation groove 25 for embedding the temperature measuring sensor 4, and the heating block 2 is provided with a second jack 26, one end of the second jack 26 abuts against the temperature measuring sensor 4 after passing through the heating block 2. When it is necessary to install the temperature measuring sensor 4, the operator moves the temperature measuring sensor 4 into the second installation groove 25, the second installation groove 25 can provide installation space for the temperature measuring sensor 4, and can also limit the installation position of the temperature measuring sensor 4, and then the second jack 26 is screwed in, so that the second jack 26 abuts against the temperature measuring sensor 4, the second jack 26 can exert force on the temperature measuring sensor 4, so that the temperature measuring sensor 4 is fixed in the second installation groove 25, realizing the fixed installation of the temperature measuring sensor 4, and facilitating the detection of the temperature of the heating block 2 by the temperature measuring sensor 4.
[0036] The implementation principle of the reaction plate constant temperature heating module for the gene synthesizer according to the embodiment of the application is as follows:
[0037] The operator inserts the synthesis plate 1 into the embedding heating groove 21, and screws in the connecting bolt 13, so that the synthesis plate 1, the heat insulation plate 5 and the heating block 2 are relatively fixed; the operator moves the heating rod 3 into the first installation groove 23, and screws in the first jack 24, so that the heating rod 3 is fixed in the first installation groove 23; the operator moves the temperature measuring sensor 4 into the second installation groove 25, and screws in the second jack 26, so that the temperature measuring sensor 4 is fixed in the second installation groove 25. The heating rod 3 can heat the heating block 2, and the temperature measuring sensor 4 can detect the temperature of the heating block 2, so that the heating block 2 is heated to an appropriate temperature, so that the synthesis plate 1 is heated to an appropriate temperature, the possibility of temperature difference of the reaction chip in the reaction cavity 11 at different positions is reduced, and the reaction of the reaction chip is facilitated.
[0038] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: all equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.
Claims
1. A reaction plate constant temperature heating module for a gene synthesizer, characterized in that: The utility model relates to a synthesis board (1) and heating block (2) are included, a plurality of reaction cavities (11) for reaction chip placement are set up on synthesis board (1), heating groove (21) for synthesis board (1) embedding is set up on heating block (2), heating rod (3) and temperature sensor (4) are equipped on heating block (2).
2. The constant temperature heating module for reaction plate of gene synthesizer according to claim 1, characterized in that: It also includes an insulating plate (5) between the synthesis plate (1) and the heating block (2), and a through hole (51) is provided on the insulating plate (5) for the synthesis plate (1) to pass through.
3. The constant temperature heating module for reaction plate of gene synthesizer according to claim 2, characterized in that: A first notch (12) is provided on the synthesis plate (1), and a second notch (52) is provided on the insulating plate (5).
4. The constant temperature heating module for reaction plate of gene synthesizer according to claim 1, characterized in that: A sealing gasket (6) is provided on the heating block (2), and the sealing gasket (6) abuts against the synthesis plate (1).
5. The constant temperature heating module for reaction plate of gene synthesizer according to claim 4, characterized in that: A gasket groove (22) is provided on the heating block (2) for the sealing gasket (6) to embed.
6. The constant temperature heating module for a reaction plate of a gene synthesizer according to claim 1, characterized in that: A first mounting groove (23) is provided on the heating block (2) for the heating rod (3) to embed, and a first jack (24) is provided on the heating block (2), one end of the first jack (24) abutting against the heating block (2) and the heating rod (3).
7. The constant temperature heating module for a reaction plate of a gene synthesizer according to claim 1, characterized in that: A second mounting groove (25) is provided on the heating block (2) for the temperature sensor (4) to embed, and a second jack (26) is provided on the heating block (2), one end of the second jack (26) abutting against the heating block (2) and the temperature sensor (4).
8. The constant temperature heating module for a reaction plate of a gene synthesizer according to claim 2, characterized in that: A connecting bolt (13) is provided on the synthesis plate (1), the connecting bolt (13) sequentially passing through the synthesis plate (1) and the insulating plate (5), the connecting bolt (13) and the heating block (2) being threadedly connected, and the connecting bolt (13) and the synthesis plate (1) abutting against each other.