Chip coating clamp
By setting a cold-short U-shaped tube in the placement mechanism of the chip coating fixture and using coolant for cooling, the problems of slow evaporation coating speed and low efficiency are solved, and a high-efficiency film formation effect is achieved.
Patent Information
- Application Number
- CN202520100239.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2035-01-16
AI Technical Summary
In existing technologies, evaporation coating has low speed and efficiency, resulting in poor film quality.
Two sets of cold-short U-shaped tubes are set in the placement mechanism of the chip coating fixture. The cold-short U-shaped tubes are fixedly connected by pipes. Coolant enters the cold-short U-shaped tubes through the liquid inlet pipe to cool the chip. High-temperature material vapor quickly adheres to the chip surface to form a film.
It improves the speed and efficiency of coating and enhances the quality of film formation.
Smart Images

Figure CN223705719U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip coating technology, specifically a chip coating fixture. Background Technology
[0002] Chip coating is a key process in semiconductor manufacturing, mainly used for surface treatment of microelectronic devices such as integrated circuits, semiconductor devices, and sensors to improve their performance and protect their structure. Evaporation coating is a physical vapor deposition (PVD) technology that involves heating solid materials to high temperatures, causing them to evaporate into a gaseous state, and then condensing them on the surface of a substrate to form a thin film.
[0003] Evaporation coating involves heating a material to evaporate it and depositing it on the surface of a substrate to form a thin film. However, in order to quickly adhere the film to the chip surface during the film formation process, we can adopt a cold-notch method to improve the quality and efficiency of film formation. Therefore, we propose a chip coating fixture. Utility Model Content
[0004] To address the shortcomings of existing technologies, this invention provides a chip coating fixture. By incorporating two sets of cold-slot U-shaped tubes within the placement mechanism, which are fixedly connected by a pipe, coolant enters the two sets of cold-slot U-shaped tubes through the inlet pipe after the material vapor has covered the chip surface. This coolant begins to cool the chip within the placement plate. Subsequently, the high-temperature material vapor quickly adheres to the chip surface to form a film, thereby improving the speed and efficiency of coating. Finally, the coolant flows out from the outlet pipe. This design significantly improves the quality of evaporative coating and solves the problems mentioned earlier.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A chip coating fixture includes a base, on which an air intake mechanism is mounted. The air intake mechanism includes an air intake platform, which is fixedly mounted on the base by four sets of bolts. The air intake platform has several first mounting holes. A storage mechanism is mounted above the air intake platform, which includes a storage plate. A support rod is fixedly mounted in each of the first mounting holes. The storage plate is fixedly connected to the support rod. A storage groove is formed in the middle of the storage plate. A limiting strip is fixedly mounted in the storage groove. A chip is placed on the limiting strip. Two sets of cold-notch U-tubes are fixedly mounted on the storage plate. The two sets of cold-notch U-tubes are fixedly connected by a pipe. One set of cold-notch U-tubes is fixedly connected to a liquid inlet pipe, and the other set of cold-notch U-tubes is fixedly connected to a liquid outlet pipe. Several limiting protrusions are fixedly mounted on the storage plate, and the limiting protrusions are in close contact with the cold-notch U-tubes.
[0007] Preferably, the air intake mechanism further includes a threaded column, a limiting hole and several second mounting holes are provided on the air intake platform, the threaded column is fixedly installed in the limiting hole, a limiting column is fixedly installed in the second mounting holes, a rotating ring is threadedly connected to the threaded column, a guide plate is rotatably installed below the rotating ring, the guide plate is slidably connected to the limiting column, several guide grooves are provided on the guide plate, and the limiting column is fixedly connected to the placement plate.
[0008] Preferably, the air intake platform has two sets of first air intake holes on both the front and rear sides, two sets of second air intake holes and two sets of third air intake holes on both the left and right sides, and four sets of first air outlet slots, two sets of second air outlet slots and two sets of third air outlet slots on the top of the air intake platform. The first air intake holes are connected to the first air outlet slots, the second air intake holes are connected to the second air outlet slots, and the third air intake holes are connected to the third air outlet slots.
[0009] Preferably, the shelf is equipped with two sets of limiting components. Each limiting component includes a short post, which is fixedly installed on the shelf. A rotating plate is rotatably installed above the short post. A limiting shaft is slidably installed on the rotating plate. A washer is fixedly installed at the bottom of the limiting shaft. A limiting spring is fitted on the limiting shaft.
[0010] Preferably, a plurality of support columns are fixedly installed at the bottom of the base, and anti-slip pads are fixedly installed at the bottom of the support columns.
[0011] Preferably, a plurality of anti-slip strips are fixedly installed on the rotating ring. Beneficial effects
[0012] This invention provides a chip coating fixture. Compared with the prior art, it has the following advantages:
[0013] 1. This chip coating fixture features two sets of cold-slot U-shaped tubes within the placement mechanism, which are fixedly connected by pipes. When material vapor covers the chip surface, coolant enters the two sets of cold-slot U-shaped tubes through the inlet pipe to begin cooling the chip in the placement plate. Subsequently, the high-temperature material vapor quickly adheres to the chip surface to form a film, thereby improving the speed and efficiency of coating. Finally, the coolant flows out from the outlet pipe. This design significantly improves the quality of evaporative coating.
[0014] 2. This chip coating fixture has an air inlet platform with a first air inlet, a second air inlet, and a third air inlet, as well as corresponding first, second, and third air outlet slots. The vapor of the film-forming material can enter through multiple air inlets and then be sprayed onto the chip with the help of a guide plate, which greatly improves the efficiency of film formation. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the main structure of the present utility model;
[0016] Figure 2 This is a schematic diagram of the air intake mechanism of this utility model;
[0017] Figure 3 This is a schematic diagram of the air intake platform of this utility model;
[0018] Figure 4 This is a top view of the storage mechanism of this utility model;
[0019] Figure 5 A top view of the storage mechanism of this utility model without the chip;
[0020] Figure 6 This is a top view of the storage mechanism of this utility model;
[0021] Figure 7 This utility model Figure 5 Enlarged diagram of point A in the middle.
[0022] In the diagram: 1. Base; 2. Support column; 3. Air intake mechanism; 4. Storage mechanism; 5. Air intake platform; 6. Guide plate; 7. Threaded column; 8. Limiting column; 9. Limiting component; 10. Rotary ring; 11. First mounting hole; 12. First air intake hole; 13. Second air intake hole; 14. Third air intake hole; 15. First air outlet slot; 16. Second air outlet slot; 17. Third air outlet slot; 18. Limiting hole; 19. Second mounting hole; 20. Storage plate; 21. Cold-cut U-shaped tube; 22. Support rod; 23. Limiting protrusion; 24. Chip; 25. Storage slot; 26. Limiting strip; 27. Liquid inlet pipe; 28. Liquid outlet pipe; 29. Short column; 30. Rotating plate; 31. Limiting shaft; 32. Gasket; 33. Limiting spring. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] Please see Figures 1-7This utility model provides a technical solution: a chip coating fixture, including a base 1, an air intake mechanism 3 mounted on the base 1, the air intake mechanism 3 including an air intake platform 5, the air intake platform 5 being fixedly mounted on the base 1 by four sets of bolts, the air intake platform 5 having a plurality of first mounting holes 11, a storage mechanism 4 mounted above the air intake platform 5, the storage mechanism 4 including a storage plate 20, a support rod 22 fixedly mounted in the first mounting holes 11, the storage plate 20 being fixedly connected to the support rod 22, a storage groove 25 being opened in the middle of the storage plate 20, a limiting strip 26 fixedly mounted in the storage groove 25, a chip 24 being placed on the limiting strip 26, two sets of cold-drilled U-shaped tubes 21 fixedly mounted on the storage plate 20, the two sets of cold-drilled U-shaped tubes 21 being fixedly connected by pipes, one set of cold-drilled U-shaped tubes 21 being fixedly connected to a liquid inlet pipe 27, and the other set of cold-drilled U-shaped tubes 21 being fixedly connected to a liquid outlet pipe 28, the storage plate 20... The intake mechanism 3 also includes a threaded column 7. The intake platform 5 has a limit hole 18 and several second mounting holes 19. The threaded column 7 is fixedly installed in the limit hole 18, and the limit column 8 is fixedly installed in the second mounting holes 19. The threaded column 7 is threadedly connected to a rotating ring 10. A guide plate 6 is rotatably installed below the rotating ring 10. The guide plate 6 is slidably connected to the limit column 8. Several guide grooves are opened on the guide plate 6. The limit column 8 is fixedly connected to the placement plate 20. Two sets of limit components 9 are installed on the placement plate 20. The limit components 9 include short columns 29. The short columns 29 are fixedly installed on the placement plate 20. A rotating plate 30 is rotatably installed above the short columns 29. A limit shaft 31 is slidably installed on the rotating plate 30. A gasket 32 is fixedly installed at the bottom of the limit shaft 31. A limit spring 33 is fitted on the limit shaft 31.
[0025] In use, first rotate the rotating ring 10 as needed. Then, under the action of the threaded column 7 and the limiting column 8, the guide plate 6 begins to move up and down. Adjust the guide plate 6 to a suitable position, then place the chip 24 on the limiting strip 26 in the placement slot 25. Then rotate the rotating plate 30 to place the pad 32 above the chip 24. Then, under the action of the limiting spring 33 and the limiting shaft 31, the pad 32 presses the chip 24. Subsequently, place this device in a vacuum environment to begin evaporation coating on the chip 24. After coating for a period of time, coolant is introduced into the two sets of cooling U-shaped tubes 21 through the liquid inlet pipe 27. Then, the coated chip 24 is cooled. As the temperature decreases, the material vapor on the surface of the chip 24 begins to form a film quickly and is firmly deposited on the surface of the chip 24, thereby accelerating the coating speed and efficiency.
[0026] Two sets of first air inlets 12 are provided on the front and rear sides of the air intake platform 5. Two sets of second air inlets 13 and two sets of third air inlets 14 are provided on the left and right sides of the air intake platform 5. Four sets of first air outlet slots 15, two sets of second air outlet slots 16 and two sets of third air outlet slots 17 are provided on the top of the air intake platform 5. The first air inlets 12 are connected to the first air outlet slots 15, the second air inlets 13 are connected to the second air outlet slots 16, and the third air inlets 14 are connected to the third air outlet slots 17.
[0027] In use, material vapor is introduced into the first air inlet 12, the second air inlet 13 and the third air inlet 14, and then the material vapor is ejected from the corresponding first air outlet 15, the second air outlet 16 and the third air outlet 17. Under the action of the guide plate 6, the material vapor is sprayed onto the surface of the chip 24.
[0028] Several support columns 2 are fixedly installed at the bottom of the base 1, and anti-slip pads are fixedly installed at the bottom of the support columns 2; the support columns 2 are used to support the entire device, and the anti-slip pads can improve the stability of the device during operation.
[0029] Several anti-slip strips are fixedly installed on the swivel ring 10 to increase friction.
[0030] Working principle: In use, first, rotate the rotating ring 10 as needed. Then, under the action of the threaded column 7 and the limiting column 8, the guide plate 6 begins to move up and down to adjust the guide plate 6 to a suitable position. Then, place the chip 24 on the limiting strip 26 in the placement slot 25. Then, rotate the rotating plate 30 to place the pad 32 above the chip 24. Then, under the action of the limiting spring 33 and the limiting shaft 31, the pad 32 presses the chip 24. Subsequently, place this device in a vacuum environment to begin evaporation coating on the chip 24. Material vapor is introduced into the first air inlet 12, the second air inlet 13 and the third air inlet 14. Then, the material vapor is sprayed out from the corresponding first air outlet 15, the second air outlet 16 and the third air outlet 17. Under the action of the guide plate 6, the material vapor is sprayed onto the surface of the chip 24.
[0031] After coating for a period of time, coolant is introduced into two sets of cooling U-shaped tubes 21 through the inlet pipe 27. Then, the coated chip 24 is cooled. As the temperature decreases, the material vapor on the surface of the chip 24 begins to form a film quickly and is firmly coated on the surface of the chip 24, thereby accelerating the coating speed and efficiency.
[0032] Among them, the support column 2 is used to support the entire device, and the anti-slip pad at the bottom of the support column 2 can improve the stability of the device during operation; several anti-slip strips on the rotating ring 10 can be used to increase the friction between the worker's palm and the rotating ring 10.
[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A chip coating fixture, comprising a base (1), characterized in that: An air intake mechanism (3) is installed on the base (1). The air intake mechanism (3) includes an air intake platform (5). The air intake platform (5) is fixedly installed on the base (1) by four sets of bolts. Several first mounting holes (11) are opened on the air intake platform (5). A storage mechanism (4) is installed above the air intake platform (5). The storage mechanism (4) includes a storage plate (20). A support rod (22) is fixedly installed in the first mounting holes (11). The storage plate (20) is fixedly connected to the support rod (22). A storage groove (25) is opened in the middle of the storage plate (20). A limiting strip (26) is fixedly installed in the storage slot (25), and a chip (24) is placed on the limiting strip (26). Two sets of cold-dip U-shaped tubes (21) are fixedly installed on the storage plate (20). The two sets of cold-dip U-shaped tubes (21) are fixedly connected by a pipe. One set of cold-dip U-shaped tubes (21) is fixedly connected to an inlet pipe (27), and the other set of cold-dip U-shaped tubes (21) is fixedly connected to an outlet pipe (28). Several limiting protrusions (23) are fixedly installed on the storage plate (20). The limiting protrusions (23) are in close contact with the cold-dip U-shaped tubes (21).
2. The chip coating fixture according to claim 1, characterized in that: The air intake mechanism (3) also includes a threaded column (7). The air intake platform (5) has a limiting hole (18) and several second mounting holes (19). The threaded column (7) is fixedly installed in the limiting hole (18). The limiting column (8) is fixedly installed in the second mounting hole (19). A rotating ring (10) is threadedly connected to the threaded column (7). A guide plate (6) is rotatably installed below the rotating ring (10). The guide plate (6) is slidably connected to the limiting column (8). Several guide grooves are provided on the guide plate (6). The limiting column (8) is fixedly connected to the placement plate (20).
3. The chip coating fixture according to claim 1, characterized in that: The air intake platform (5) has two sets of first air intake holes (12) on its front and rear sides. The air intake platform (5) has two sets of second air intake holes (13) and two sets of third air intake holes (14) on its left and right sides. The air intake platform (5) has four sets of first air outlet slots (15), two sets of second air outlet slots (16) and two sets of third air outlet slots (17) on its upper side. The first air intake hole (12) is connected to the first air outlet slot (15), the second air intake hole (13) is connected to the second air outlet slot (16), and the third air intake hole (14) is connected to the third air outlet slot (17).
4. The chip coating fixture according to claim 1, characterized in that: Two sets of limiting components (9) are installed on the shelf (20). The limiting components (9) include a short column (29), which is fixedly installed on the shelf (20). A rotating plate (30) is rotatably installed above the short column (29). A limiting shaft (31) is slidably installed on the rotating plate (30). A gasket (32) is fixedly installed at the bottom of the limiting shaft (31). A limiting spring (33) is fitted on the limiting shaft (31).
5. A chip coating fixture according to claim 1, characterized in that: The base (1) has several support columns (2) fixedly installed at its bottom, and the support columns (2) have anti-slip pads fixedly installed at their bottoms.
6. A chip coating fixture according to claim 2, characterized in that: Several anti-slip strips are fixedly installed on the rotating ring (10).