Electroplating equipment

Abstract

The utility model discloses electroplating equipment. The electroplating equipment comprises a shell, a clamp and an air pressure adjusting device, the machine shell is provided with a containing cavity for containing electroplating liquid, a ventilation channel communicated with the containing cavity is formed in the machine shell, and the position of the ventilation channel in the height direction of the machine shell is higher than the liquid level of the electroplating liquid. The air pressure adjusting device is communicated with the ventilation channel. Wherein in the electroplating process of the to-be-plated part, the to-be-plated part and the clamp divide the containing cavity into two sub-cavities, the two sub-cavities are communicated only through the through hole of the to-be-plated part, and the air pressure adjusting device periodically pressurizes or depressurizes at least one of the two sub-cavities through the ventilation channel. According to the electroplating equipment disclosed by the utility model, the forced flow of the electroplating liquid in the through hole in the to-be-electroplated part can be accurately regulated and controlled, the flow efficiency of the electroplating liquid in the through hole is improved, and meanwhile, the exchange speed and the flow direction of the electroplating liquid in the through hole can be periodically controlled, so that the electroplating effect can be improved; and the thickness difference of the plating layer in the hole caused by one-way flow of the electroplating liquid is avoided.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to an electroplating device. Background Technology

[0002] With the widespread use of artificial intelligence, the demand for high-performance chips and their packaging technologies has increased dramatically. Packaging substrates are essential components for high-performance chip packaging. As chip sizes increase, the requirements for the size and density of packaging substrates also become more stringent, leading to a corresponding increase in the aspect ratio of vias on the core board of the packaging substrate. Simply using spraying and air convection to achieve mass transfer of the electroplating solution within the vias is insufficient. Related technologies often employ forced exchange of the electroplating solution within the vias through liquid level differences. However, the flow rate of the electroplating solution within the vias cannot be controlled, reducing the electroplating effect. Utility Model Content

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide an electroplating device that facilitates control of the flow efficiency of the electroplating solution in through-holes, helps improve the electroplating effect, and avoids differences in plating thickness within the holes caused by unidirectional flow of the electroplating solution.

[0004] An electroplating apparatus according to an embodiment of the present invention includes: a housing having a cavity for holding electroplating solution, a venting channel communicating with the cavity being formed on the housing, the venting channel being positioned higher than the level of the electroplating solution in the height direction of the housing; a clamp, at least a portion of which is disposed within the cavity, the clamp being used to clamp a workpiece to be plated; and a pressure regulating device communicating with the venting channel; wherein, during the electroplating process of the workpiece to be plated, the workpiece to be plated and the clamp divide the cavity into two sub-cavities, the two sub-cavities being connected only through a through-hole in the workpiece to be plated, and the pressure regulating device periodically pressurizing or depressurizing at least one of the two sub-cavities through the venting channel.

[0005] According to the electroplating equipment of this utility model embodiment, by periodically pressurizing or depressurizing at least one of the two sub-cavities, a pressure difference is generated between the two sub-cavities. This facilitates precise control of the forced flow of the electroplating solution within the through-holes on the workpiece to be plated, improving the flow efficiency of the electroplating solution within the through-holes. At the same time, it helps to control the periodic changes in the exchange rate and flow direction of the electroplating solution within the through-holes, thereby helping to improve the electroplating effect and avoiding differences in plating thickness within the holes caused by unidirectional flow of the electroplating solution.

[0006] According to some embodiments of the present invention, the housing includes: a shell, one side of which is open in the height direction; a cover, which is disposed on the open side of the shell, and the cover and the shell together define the receiving cavity; and a vent pipe, which is disposed at one end of the shell adjacent to the cover, the vent pipe having a ventilation channel, the inlet end of the ventilation channel being connected to the air pressure regulating device, and the outlet end of the ventilation channel facing the cover.

[0007] According to some embodiments of the present invention, the clamp is interference-fitted with the receiving cavity; and / or, a locking device is provided inside the housing, the locking device being used to fix the position of the clamp.

[0008] According to some embodiments of the present invention, the liquid level of the electroplating solution includes a maximum liquid level and a minimum liquid level, the position of the ventilation channel in the height direction of the housing is higher than the maximum liquid level, and the upper surface of the workpiece to be plated in the height direction of the housing is lower than the minimum liquid level.

[0009] According to some embodiments of the present invention, each of the sub-cavities is provided with an anode element, and the anode element is arranged parallel to the workpiece to be plated.

[0010] According to some embodiments of the present invention, a liquid port is formed on the housing, the liquid port is located between the workpiece to be plated and the anode, and the receiving cavity is connected to the liquid storage component through the liquid port.

[0011] According to some embodiments of the present invention, the electroplating equipment further includes a circulation pump, which is disposed between the liquid inlet and the liquid storage device.

[0012] According to some embodiments of this utility model, there are two ventilation channels and two liquid ports, and the two ventilation channels and two liquid ports are respectively connected to the two sub-cavities.

[0013] According to some embodiments of the present invention, the electroplating equipment further includes: at least one stirring device, which is disposed between the anode and the workpiece to be plated.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0016] Figure 1 This is a schematic diagram of an electroplating apparatus according to an embodiment of the present utility model;

[0017] Figure 2 This is a schematic diagram of an electroplating apparatus according to an embodiment of the present invention, wherein the cover is not shown;

[0018] Figure 3 This is a schematic diagram of the periodic change of the liquid level of the electroplating solution in the electroplating equipment according to an embodiment of the present invention.

[0019] Figure label:

[0020] 100: Electroplating equipment;

[0021] 1: Housing; 11: Receiving cavity; 111: Sub-cavity; 12: Shell; 13: Cover; 14: Vent pipe; 141: Vent passage; 15: Liquid port; 2: Clamp; 3: Locking device; 4: Anode component;

[0022] 200: Liquid level; 201: Highest liquid level; 202: Lowest liquid level;

[0023] 300: Part to be plated; 301: Through hole. Detailed Implementation

[0024] The following is for reference. Figures 1-3 Description of an electroplating apparatus 100 according to an embodiment of the present utility model.

[0025] like Figures 1-3 As shown, the electroplating equipment 100 according to an embodiment of the present invention includes a housing 1, a clamp 2, and an air pressure regulating device (not shown).

[0026] Specifically, the housing 1 has a cavity 11 for holding electroplating solution, and a venting channel 141 communicating with the cavity 11 is formed on the housing 1. The venting channel 141 is positioned above the electroplating solution level 200 in the height direction of the housing 1. At least part of the clamp 2 is disposed in the cavity 11, and the clamp 2 is used to hold the workpiece 300 to be plated. A pressure regulating device is connected to the venting channel 141. During the electroplating process of the workpiece 300, the workpiece 300 and the clamp 2 divide the cavity 11 into two sub-cavities 111. The two sub-cavities 111 are connected only through the through hole 301 of the workpiece 300. The pressure regulating device periodically pressurizes or depressurizes at least one of the two sub-cavities 111 through the venting channel 141.

[0027] For example, in Figures 1-3In the example, the workpiece 300 to be plated is housed within the receiving cavity 11, which facilitates full immersion of the workpiece 300 in the electroplating solution, thereby enabling electroplating treatment of the workpiece 300 through the electroplating solution. The receiving cavity 11 is divided into two parts (i.e., two sub-cavities 111) by the workpiece 300 to be plated and the fixture 2. The electroplating solution in the two sub-cavities 111 can only be exchanged (flowed) through the through-hole 301 on the workpiece 300. This ensures the electroplating effect and sufficiency of the electroplating solution on the workpiece 300, while also facilitating periodic pressurization or depressurization of the two sub-cavities 111 to increase the efficiency of electroplating.

[0028] Reference Figure 3 The pressure regulating device can periodically pressurize or depressurize one of the two sub-cavities 111 through the ventilation channel 141; or, the pressure regulating device can periodically pressurize or depressurize both sub-cavities 111 through the ventilation channel 141. No specific limitation is made here. The aforementioned periodic pressurization or depressurization creates a pressure difference between the two sub-cavities 111, which facilitates the periodic exchange of the electroplating solution within the two sub-cavities 111. This achieves periodic forced flow of the electroplating solution in the through-hole 301 of the workpiece 300 (from the high-pressure side to the low-pressure side), thereby achieving forced exchange of the electroplating solution in the high aspect ratio through-hole 301 of the workpiece 300, improving mass transfer and exchange efficiency. Simultaneously, the periodic forced flow of the electroplating solution avoids the problem of uneven plating in the through-hole 301 caused by unidirectional flow of the electroplating solution.

[0029] Specifically, the venting channel 141 is positioned higher than the electroplating solution level 200 along the height of the housing 1. This prevents the electroplating solution from entering the venting channel 141 or even the pressure regulating device, thus ensuring the stability of pressure application and depressurization. This guarantees the reliability and stability of electroplating the workpiece 300, ensures the safety of the electroplating equipment 100, and extends its service life. Simultaneously, by adjusting the gas pressure difference in the sub-cavities 111 at the top of the electroplating solution on both sides of the workpiece 300, the flow rate of the electroplating solution in the through-hole 301 can be accurately controlled, thereby achieving precise control of the electroplating solution's transmission within the through-hole 301.

[0030] Optionally, a vacuum can be drawn inside the receiving cavity 11 to avoid poor wetting of the electroplating solution in the through hole 301 on the workpiece 300 to be plated.

[0031] Therefore, firstly, by adjusting the gas pressure difference between the two sub-cavities 111 of the electroplating equipment 100, the flow rate of the electroplating solution within the through-hole 301 of the workpiece 300 can be precisely controlled. This not only ensures a consistent flow rate but also allows for the modulation of specific flow rate change curves as needed. Secondly, by adjusting the pressure of the two sub-cavities 111 of the electroplating equipment 100, a pressure difference is created within each cavity, which facilitates the periodic change of the flow direction of the electroplating solution within the through-hole 301. Since the pressure difference is precisely adjustable, the periodicity of the flow direction change of the electroplating solution within the through-hole 301 is precisely adjustable. Thirdly, the forced exchange of electroplating solution within the through-hole 301, achieved through pressure difference, with controllable flow rate and periodicity of direction change, is more suitable for pulse electroplating, further improving the electroplating uniformity of the workpiece 300 with its high aspect ratio through-hole 301.

[0032] Furthermore, the electroplating method can be direct current electroplating, pulse electroplating, or a combination of pulse and direct current electroplating. No specific limitations are made here.

[0033] According to the electroplating equipment 100 of this utility model embodiment, by periodically pressurizing or depressurizing at least one of the two sub-cavities 111, a pressure difference is generated between the two sub-cavities 111. This facilitates precise control of the forced flow of the electroplating solution within the through hole 301 on the workpiece 300, improves the flow efficiency of the electroplating solution within the through hole 301, and helps to control the periodic changes in the exchange rate and flow direction of the electroplating solution within the through hole 301. This helps to improve the electroplating effect and avoid differences in the plating thickness within the hole caused by unidirectional flow of the electroplating solution.

[0034] According to some embodiments of this utility model, refer to Figures 1-3 The housing 1 includes a housing 12, a cover 13, and a vent pipe 14. One side of the housing 12 is open in the height direction. The cover 13 is located on the open side of the housing 12, and the cover 13 and the housing 12 together define a receiving cavity 11. The vent pipe 14 is located at one end of the housing 12 adjacent to the cover 13. The vent pipe 14 has a venting channel 141, the inlet end of which is connected to a pressure regulating device, and the outlet end of which faces the cover 13. The cooperation between the housing 12 and the cover 13 facilitates the placement of the workpiece 300 to be plated from the open side of the housing 12 into the receiving cavity 11, and the clamp 2 is used to hold the workpiece 300 to improve the stability of the workpiece 300. At the same time, the cooperation between the cover and the housing 12 facilitates the creation of a vacuum environment within the receiving cavity 11.

[0035] The placement of the vent pipe 14 facilitates ensuring that the vent channel 141 is positioned above the electroplating solution level 200 in the height direction of the housing 1, thereby improving the reliability of electroplating and pressurization / depressurization. The pressure regulating device can introduce gas into the space above the liquid level 200 in the corresponding sub-cavity 111 through the air inlet of the vent channel 141 to increase the pressure within the sub-cavity 111. Simultaneously, the pressure regulating device can extract at least a portion of the gas from the space above the liquid level 200 in the corresponding sub-cavity 111 through the air outlet of the vent channel 141 to reduce the pressure within the sub-cavity 111. This creates a pressure difference between the sub-cavities 111 on both sides of the workpiece 300, allowing the electroplating solution to flow from the sub-cavity 111 with higher pressure through the through-hole 301 of the workpiece 300 to the sub-cavity 111 with lower pressure, thus promoting the formation of a stable plating layer within the through-hole 301.

[0036] The air inlet and outlet of the vent pipe 14 can face the electroplating solution, or the end of the air inlet and outlet of the vent pipe 14 away from the air pressure regulating device can face away from the surface of the electroplating solution. For example, it can face the cover 13 (i.e. away from the surface of the electroplating solution).

[0037] The gas introduced into the receiving cavity 11 by the gas pressure regulating device can be air or other gases, such as nitrogen or argon.

[0038] Furthermore, the clamp 2 is interference-fitted with the receiving cavity 11. This interference fit increases the tightness of the connection between the clamp 2 and the inner wall of the housing 12, thereby improving the sealing between the clamp 2 and the inner wall of the housing 12, and thus ensuring that the electroplating solution flows between the two sub-cavities 111 only through the through hole 301 of the workpiece to be plated 300.

[0039] The housing 12 is equipped with a locking device 3, which is used to fix the position of the clamp 2. The locking device 3 is located in the circumferential direction of the clamp 2. When the workpiece 300 to be plated and the clamp 2 are placed in the receiving cavity 11, the locking device 3 locks the edge of the clamp 2, thereby achieving a seal and preventing the electroplating solution on both sides of the workpiece 300 from flowing through the gap between the clamp 2 and the inner wall of the housing 12, thus helping to ensure the electroplating efficiency of the workpiece 300.

[0040] According to some embodiments of this utility model, refer to Figures 1-3The electroplating solution level 200 includes a maximum level 201 and a minimum level 202. The venting channel 141 is positioned above the maximum level 201 along the height direction of the housing 1, while the upper surface of the workpiece 300 to be plated is below the minimum level 202 along the height direction of the housing 1. When the pressure regulating device pressurizes one sub-cavity 111 through the venting channel 141, and / or depressurizes another sub-cavity 111 through the venting channel 141, a pressure difference is created between the two sub-cavities 111. The electroplating solution level 200 in the sub-cavity 111 with higher pressure is higher, and the highest height the electroplating solution can reach along the height direction of the housing 1 is the maximum level 201; the electroplating solution level 200 in the sub-cavity 111 with lower pressure is lower, and the lowest height the electroplating solution can reach along the height direction of the housing 1 is the minimum level 202. The ventilation channel 141 is higher than the highest liquid level 201 in the height direction of the housing 1, further ensuring the safety of the ventilation channel 141 and the air pressure regulating device during the electroplating process. The upper surface of the workpiece 300 to be plated is lower than the lowest liquid level 202 in the height direction of the housing 1. This ensures that the liquid level 200 of the electroplating solution is always on the fixture 2, so that the workpiece 300 is always immersed in the electroplating solution during the periodic changes in the liquid levels 200 on both sides of the workpiece 300, which helps to ensure the uniformity of electroplating.

[0041] According to some embodiments of this utility model, each sub-cavity 111 is provided with an anode element 4, which is arranged parallel to the workpiece 300 to be plated. Electroplating is a process that uses the principle of electrolysis to deposit a thin coating on the surface of the workpiece 300 to improve its appearance, increase its corrosion resistance, enhance its hardness, or impart other properties. During the electroplating process, an electric current passes through the electroplating solution (which usually contains ions of the metal to be deposited), causing the metal ions to be reduced to metal on the cathode (i.e., the workpiece 300) and deposited on its surface. Anode elements 4, parallel to the workpiece 300, are provided on both sides of the workpiece 300 at a certain distance from it.

[0042] The two anodes 4 can have the same size, material and structure to increase the uniformity of the coating.

[0043] Furthermore, referring to Figure 1 and Figure 3 A liquid outlet 15 is formed on the housing 1, located between the workpiece 300 to be plated and the anode 4. The receiving cavity 11 is connected to the liquid storage unit through the liquid outlet 15. Thus, after the workpiece 300 to be plated is placed, the electroplating solution in the liquid storage unit can be introduced into the receiving cavity 11 through the liquid outlet 15 to facilitate subsequent electroplating of the workpiece 300; or, after the electroplating operation is completed, the electroplating solution in the receiving cavity 11 can be discharged into the liquid storage unit through the liquid outlet 15 to facilitate the removal of the plated workpiece.

[0044] The liquid outlet 15 can be located at the bottom or the top of the receiving cavity 11, without specific limitation. Preferably, the liquid outlet 15 is located near the bottom of the workpiece 300, especially away from the bottom of the workpiece 300.

[0045] Furthermore, the electroplating equipment 100 also includes a circulation pump (not shown), which is located between the liquid inlet 15 and the liquid storage unit. The circulation pump helps to control the speed at which the electroplating solution is introduced from the liquid storage unit into the receiving cavity 11 or exported from the receiving cavity 11 to the liquid storage unit, thus ensuring that the flow rate of the electroplating solution being introduced or exported meets the usage requirements of the electroplating equipment 100.

[0046] According to some embodiments of this utility model, refer to Figure 1 and Figure 3 There are two ventilation channels 141 and two liquid outlets 15, which are respectively connected to two sub-cavities 111. This configuration allows for separate control of the introduction or export of electroplating solution in the two sub-cavities 111, thereby assisting in the adjustment of the electroplating solution level 200 on both sides of the workpiece 300 to be plated, and further assisting in the control of forced exchange of electroplating solution within the through hole 301.

[0047] According to some embodiments of the present invention, the electroplating equipment 100 further includes at least one stirring device (not shown in the figure), which is disposed between the anode 4 and the workpiece 300 to be plated. This arrangement facilitates the stirring and mixing of the electroplating solution between the anode 4 and the workpiece 300, improving the uniformity of the electroplating solution and thus enhancing the uniformity of the electroplated coating. The stirring device can be a nozzle or a scraper; no specific limitation is made here.

[0048] Specifically, refer to Figure 3 The actual use of electroplating equipment 100 includes the following steps:

[0049] (1) When the workpiece 300 to be plated and the fixture 2 are placed into the receiving cavity 11, the receiving cavity 11 is sealed by the cooperation of the cover 13 and the housing 12, and then the receiving cavity 11 is evacuated (not shown in the figure).

[0050] (2) Add electroplating solution. Due to the presence of the through hole 301 on the workpiece 300, the liquid level 200 of the electroplating solution on both sides of the workpiece 300 is the same.

[0051] (3) Pressurize the sub-cavity 111 on the left side of the workpiece to be plated 300. The liquid level 200 of the electroplating solution in the left sub-cavity 111 drops. The electroplating solution is forced to flow to the right through the through hole 301 of the workpiece to be plated 300. The liquid level 200 of the electroplating solution in the right sub-cavity 111 rises.

[0052] (4) Pressurize the sub-cavity 111 on the right side of the workpiece to be plated 300, and at the same time, depressurize the sub-cavity 111 on the left side. The liquid level 200 of the electroplating liquid in the sub-cavity 111 on the right side drops, and the electroplating liquid is forced to flow to the left through the through hole 301 of the workpiece to be plated 300. The liquid level 200 of the electroplating liquid in the sub-cavity 111 on the left side rises.

[0053] (5) Repeat step (3), pressurize the sub-cavity 111 on the left side of the workpiece to be plated 300, and at the same time, depressurize the sub-cavity 111 on the right side. The liquid level 200 of the electroplating liquid in the sub-cavity 111 on the left side drops, and the electroplating liquid is forced to flow to the right through the through hole 301 of the workpiece to be plated 300. The liquid level 200 of the electroplating liquid in the sub-cavity 111 on the right side rises.

[0054] (6) Repeat step (4).

[0055] Other configurations and operations of the electroplating equipment 100 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0056] In the description of this utility model, it should be understood that the terms "center", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0057] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0058] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0059] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electroplating device, characterized in that, include: The housing has a cavity for holding electroplating solution, and a venting channel is formed on the housing that communicates with the cavity. The venting channel is positioned above the level of the electroplating solution in the height direction of the housing. A clamp, at least a portion of which is disposed within the receiving cavity, is used to clamp the workpiece to be plated; A pressure regulating device, wherein the pressure regulating device is connected to the ventilation channel; During the electroplating process of the workpiece to be plated, the workpiece to be plated and the fixture divide the receiving cavity into two sub-cavities. The two sub-cavities are connected only through the through hole of the workpiece to be plated. The air pressure regulating device periodically pressurizes or depressurizes at least one of the two sub-cavities through the air passage.

2. The electroplating equipment according to claim 1, characterized in that, The housing includes: A housing, one side of which is open in the height direction; A cover, the cover being disposed on the open side of the housing, the cover and the housing together defining the receiving cavity; A vent pipe is provided at one end of the housing adjacent to the cover. The vent pipe has a venting channel. The inlet end of the venting channel is connected to the air pressure regulating device, and the outlet end of the venting channel faces the cover.

3. The electroplating equipment according to claim 2, characterized in that, The clamp is interference-fitted with the receiving cavity; and / or, the housing is provided with a locking device for fixing the position of the clamp.

4. The electroplating equipment according to claim 1, characterized in that, The electroplating solution has a maximum liquid level and a minimum liquid level. The venting channel is located above the maximum liquid level in the height direction of the housing, and the upper surface of the workpiece to be plated is below the minimum liquid level in the height direction of the housing.

5. The electroplating equipment according to any one of claims 1-4, characterized in that, Each of the sub-cavities is provided with an anode element, which is arranged parallel to the workpiece to be plated.

6. The electroplating equipment according to claim 5, characterized in that, A liquid inlet is formed on the housing, and the liquid inlet is located between the workpiece to be plated and the anode. The receiving cavity is connected to the liquid storage unit through the liquid inlet.

7. The electroplating equipment according to claim 6, characterized in that, Also includes: A circulation pump is disposed between the liquid inlet and the liquid storage device.

8. The electroplating equipment according to claim 6, characterized in that, There are two ventilation channels and two liquid inlets, and the two ventilation channels and two liquid inlets are respectively connected to the two sub-cavities.

9. The electroplating equipment according to claim 5, characterized in that, Also includes: At least one stirring device is provided between the anode and the workpiece to be plated.

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