Semiconductor precision test probe
By designing a precision semiconductor test probe and employing a power source and transmission structure to precisely control the probe's pressing force and direction, the problem of difficult-to-control operation by manual means was solved, thus achieving accuracy and safety in switch-on testing.
Patent Information
- Application Number
- CN202520287700.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-22
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2035-02-22
AI Technical Summary
During the switch power-on test, existing technology relies on manual operation, which makes it difficult to accurately control the magnitude and direction of the applied force, and can easily lead to measurement errors or component damage.
A precision semiconductor test probe was designed, comprising an upper cover, a bonding component, a pressing component, and a power component. The pressing force and direction of the probe are precisely controlled through a power source and a transmission structure to ensure accurate contact between the probe and the switch plate.
This technology enables precise energization testing of switch plates, avoiding component damage caused by excessive force and improving testing accuracy and safety.
Smart Images
Figure CN223711681U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the field of probe, especially relates to semiconductor precision test probe. BACKGROUND
[0002] In the process of conducting the on-off test, it is crucial to ensure accurate and safe operation. The specific operation steps are as follows:
[0003] First, the preparation stage needs to properly place the probe of the test equipment. The role of the probe is to simulate the working state of the switch contact point in actual use, so as to verify whether its electrical performance meets the standard. Therefore, before starting the test, it is necessary to ensure that the probe is in full contact with both ends of the switch tablet. This step requires the operator to be meticulous and ensure that the probe position is accurate to avoid measurement errors caused by poor contact.
[0004] The next key step is to apply pressure to the protrusion in the middle part of the tablet. This action aims to simulate the actual dynamic process when the user operates the switch, and by pressing the convex part, the circuit is closed, and the power-on detection is completed. It should be noted that the size and direction of the force need to be properly controlled to ensure enough pressure to close the circuit and avoid excessive force to damage the components. This work currently relies on manual operation, emphasizing the importance of the operator's skill level.
[0005] The whole process not only tests the technical proficiency of the operator, but also requires them to have good attention and patience. Because any minor mistake can lead to inaccurate test results, and even may damage the switch being tested. INVENTION CONTENTS
[0006] The utility model provides semiconductor precision test probe, solves above -mentioned problem.
[0007] In order to solve the above problems, the technical scheme provided by the utility model is as follows: the semiconductor precision test probe is provided with an upper cover body, a lamination assembly for pressing the two ends of the switch pressing sheet, a touch pressure assembly for pressing the middle convex part of the switch pressing sheet, and a power assembly for providing power for the lamination assembly and the touch pressure assembly; the touch pressure assembly is arranged inside the lamination assembly; the power assembly penetrates through the upper cover body and is fixed with the touch pressure assembly and the lamination assembly in sequence; the lamination assembly comprises a lamination outer cylinder and a lamination inner cylinder; the lamination inner cylinder is sleeved on the inner wall of the lamination outer cylinder and is in sliding connection with the lamination outer cylinder; the touch pressure assembly comprises a touch pressure column and a touch pressure cylinder, the touch pressure cylinder is sleeved on the outer wall of the touch pressure column and is in sliding connection with the touch pressure column; the power assembly comprises a power source and a transmission structure; the output end of the power source is fixedly connected with the first position of the transmission structure, the top shaft of the touch pressure column is connected with the second position of the transmission structure, the top of the touch pressure cylinder is fixedly connected with the third position of the transmission structure, and the top of the lamination inner cylinder is fixedly connected with the fourth position of the transmission structure.
[0008] The preferred technical scheme is that the lamination assembly comprises a lamination outer cylinder and a lamination inner cylinder, the outer wall of the lamination outer cylinder is provided with threads, and the inner wall of the lamination outer cylinder is provided with a first sliding groove.
[0009] The preferred technical scheme is that the touch pressure column is a circular cone, a second sliding groove is arranged on the outer wall of the touch pressure column, the touch pressure cylinder is funnel-shaped with a large upper part and a small lower part, the bottom of the touch pressure cylinder is matched with the shape of the middle convex part of the switch pressing sheet, a second sliding block is arranged on the inner wall of the touch pressure cylinder, and the second sliding groove is matched with the second sliding block.
[0010] The preferred technical scheme is that one end of the connecting rod is fixed on the edge of the top of the touch pressure cylinder, and the other end of the connecting rod is fixed at the third position of the transmission structure.
[0011] The preferred technical scheme is that the inner wall of the upper cover body is provided with a first thread, and the outer wall of the lamination outer cylinder is provided with a second thread groove matched with the first thread.
[0012] The preferred technical scheme is that the top of the upper cover body is provided with a mounting hole, the power source is mounted at the mounting hole, and the output end of the power source is fixed with the first position of the transmission structure through the mounting hole.
[0013] The preferred technical scheme is that the top of the upper cover body is further provided with a support cover, the bottom inner wall of the support cover is threadedly connected with the outer wall of the upper part of the upper cover body, and the top of the support cover is fixed with a detection table support wall.
[0014] The beneficial effect of the prior art is that, by using the above scheme, when the output end of the power source is in a retracted state, the output end of the power source pulls up the part at the first position, and the touch pressure cylinder connected with the third position slides downward on the outer wall of the touch pressure column, so that the bottom of the touch pressure cylinder presses the middle convex part of the switch pressing piece; and the fitted inner cylinder connected with the fourth position slides downward in the inside of the fitted outer cylinder, so that the bottom of the fitted inner cylinder presses the two ends of the switch pressing piece, thereby completing the power-on test of the switch pressing piece; the size and direction of the force of the scheme are accurately controlled, which not only ensures sufficient pressure to close the circuit, but also avoids excessive force to damage the components. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings required to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0016] Figure 1 It is a whole structure schematic view one of the utility model;
[0017] Figure 2 It is a whole structure schematic view two of the utility model;
[0018] Figure 3 It is a whole structure schematic view three of the utility model;
[0019] Figure 4 It is a touch pressure assembly schematic view of the utility model;
[0020] Figure 5 It is a fitted assembly schematic view of the utility model;
[0021] According to the above legend: support cover-1;Upper cover body-2;Fitted assembly-3;Power source-22;Touch pressure assembly-23;Transmission structure-25;Touch pressure column-231;Touch pressure cylinder-232;Second sliding groove-233;Connecting rod-234;First position-235;Second position-236;Third position-237;Fourth position-238;Fitted outer cylinder-240;Fitted inner cylinder-241;First sliding groove-242. DETAILED DESCRIPTION
[0022] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. The accompanying drawings show preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.
[0023] It should be noted that when a component is described as being "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is described as being "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "fixed," "integral," "left," "right," and similar expressions used in this specification are for illustrative purposes only, and in the figures, structurally similar units are labeled with the same reference numerals.
[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention.
[0025] like Figures 1-5 As shown, one embodiment of this utility model is: a semiconductor precision test probe; comprising an upper cover 2, a bonding assembly 3 for pressing the two ends of a switch plate, a pressing assembly 23 for pressing the middle protrusion of the switch plate, and a power assembly for providing power to the bonding assembly 3 and the pressing assembly 23; the pressing assembly 23 is disposed inside the bonding assembly 3; the power assembly passes through the upper cover 2 and is fixed to the pressing assembly 23 and the bonding assembly 3 in sequence; the bonding assembly 3 includes a bonding outer cylinder 240 and a bonding inner cylinder 241; the bonding inner cylinder 241 is sleeved on the inner wall of the bonding outer cylinder 240, and the two are slidably connected. The pressure assembly 23 includes a pressure post 231 and a pressure cylinder 232, with the pressure cylinder 232 sleeved on the outer wall of the pressure post 231 and the two slidably connected. The power assembly includes a power source 22 and a transmission structure 25. The output end of the power source 22 is fixedly connected to the first position 235 of the transmission structure 25, the second position 236 of the transmission structure 25 is axially connected to the top of the pressure post 231, the third position 237 of the transmission structure 25 is fixedly connected to the top of the pressure cylinder 232, and the fourth position 238 of the transmission structure 25 is fixedly connected to the top of the inner cylinder 241.
[0026] It should be noted that: through the power source 22 (motor or cylinder, as long as the power device with telescopic function) to the first position 235 of transmission structure 25 down or lift, make the third position 237 and the fourth position 238 of transmission structure 25 part up and down, thus driving the touch pressure cylinder 232 on the outer surface of the touch pressure column 231 up and down, corresponding, synchronous drive the fit inner cylinder 241 on the inner wall of the fit outer cylinder 240 up and down (because the second position of transmission structure 25 part and the top shaft of touch pressure column 231 are connected, so that transmission structure 25 with touch pressure column 231 combination as support point, carry out seesaw form action.) When the output end of power source 22 is retracted, the output end of power source 22 will pull the first position 235 part, corresponding with the third position 237 of touch pressure cylinder 232 on the outer wall of touch pressure column 231 down, make the bottom of touch pressure cylinder 232 press the middle convex part of switch pressing piece; And the fourth position 238 of fit inner cylinder 241 in the inner part of fit outer cylinder 240 down, make the bottom of fit inner cylinder 241 press the two ends of switch pressing piece, so as to complete the test of switch pressing piece.
[0027] Embodiment 2; the fit assembly 3 includes fit outer cylinder 240 and fit inner cylinder 241, the outer wall of the fit outer cylinder 240 is provided with screw thread, the inner wall of the fit outer cylinder 240 is provided with first sliding groove 242; the outer wall of the fit inner cylinder 241 is provided with first sliding block matched with the first sliding groove 242.
[0028] It should be noted that: by the first sliding block in the first sliding groove 242 up and down, so as to realize the fit inner cylinder 241 in the fit outer cylinder 240 inside up and down, when the bottom of fit inner cylinder 241 moves down, with the two ends of switch pressing piece fit fixed, prevent touch pressure assembly 23 in with switch pressing piece middle convex part down, switch pressing piece moves, so as to accurately align and press.
[0029] Embodiment 3; the touch pressure column 231 is a cone, the outer wall of the touch pressure column 231 is provided with second sliding groove 233; the touch pressure cylinder 232 is funnel shaped from big to small, the bottom of the touch pressure cylinder 232 is matched with the shape of the middle convex part of switch pressing piece, the inner wall of the touch pressure cylinder 232 is provided with second sliding block, the second sliding groove 233 is matched with the second sliding block. It should be noted that: by the second sliding block in the second sliding groove 233 up and down, so as to realize the touch pressure cylinder 232 in the outside of touch pressure column 231 up and down, when the bottom of touch pressure cylinder 232 moves down, with the middle convex part of switch pressing piece fit and make it down, so as to make it test.
[0030] The top edge of the pressing cylinder 232 is fixed with one end of the connecting rod 234, and the other end of the connecting rod 234 is fixed at the third position 237 of the transmission structure 25. It should be noted that by fixing one end of the connecting rod 234 at the top edge of the pressing cylinder 232 and the other end of the connecting rod 234 at the third position 237 of the transmission structure 25, when the transmission structure 25 moves up and down, the connecting rod 234 synchronously drives the pressing cylinder 232 to move on the outer wall of the pressing column 231, thereby realizing the pressing and releasing of the middle convex part of the switch pressing tablet.
[0031] In the embodiment 5, the inner wall of the upper cover body 2 is provided with a first thread, and the outer wall of the fitting outer cylinder 240 is provided with a second thread groove matched with the first thread.
[0032] It should be noted that by matching the first thread with the second thread groove, the upper cover body 2 and the fitting outer cylinder 240 are substantially fixed, and the fitting assembly 3 and the pressing assembly 23 are sealed in the inside of the fitting outer cylinder 240, so as to prevent the internal structure from being damaged, and the threaded connection facilitates the maintenance of the fitting assembly 3 and the pressing assembly 23.
[0033] In the embodiment 6, the top of the upper cover body 2 is provided with a mounting hole, and the power source 22 is mounted at the mounting hole, and the output end of the power source 22 is fixed at the first position 235 of the transmission structure 25 through the mounting hole.
[0034] The top of the upper cover body 2 is further provided with a support cover 1, the bottom inner wall of the support cover 1 is threadedly connected with the outer wall of the upper part of the upper cover body 2, and the top of the support cover 1 is fixed with a detection table support wall.
[0035] It should be noted that each of the above technical features can be combined with each other to form various embodiments not listed above, which are all considered to be within the scope of the description of the present application; and for those skilled in the art, the above description can be improved or changed, and all these improvements and changes should belong to the protection scope of the appended claims of the present application.
Claims
1. A semiconductor precision test probe, characterized by; The device comprises an upper cover, a bonding assembly for pressing the two ends of a switch plate, a pressing assembly for pressing the middle protrusion of the switch plate, and a power assembly for providing power to the bonding assembly and the pressing assembly. The pressing assembly is disposed inside the bonding assembly. The power assembly passes through the upper cover and is fixed to the pressing assembly and the bonding assembly in sequence. The bonding assembly includes a bonding outer cylinder and a bonding inner cylinder. The bonding inner cylinder is sleeved on the inner wall of the bonding outer cylinder, and the two are slidably connected. The pressing assembly includes a pressing post and a pressing cylinder. The pressing cylinder is sleeved on the outer wall of the pressing post, and the two are slidably connected. The power assembly includes a power source and a transmission structure. The output end of the power source is fixedly connected to the first position of the transmission structure, the second position of the transmission structure is axially connected to the top of the pressing post, the third position of the transmission structure is fixedly connected to the top of the pressing cylinder, and the fourth position of the transmission structure is fixedly connected to the top of the bonding inner cylinder.
2. The semiconductor precision test probe according to claim 1, wherein; The bonding assembly includes a bonding outer cylinder and a bonding inner cylinder. The outer wall of the bonding outer cylinder is provided with threads, and the inner wall of the bonding outer cylinder is provided with a first sliding groove. The outer wall of the bonding inner cylinder is provided with a first slider that matches the first sliding groove.
3. The semiconductor precision test probe according to claim 1, wherein; The pressure post is a cone, and a second groove is provided on the outer wall of the pressure post; the pressure cylinder is a funnel shape with a larger top and a smaller bottom, and the bottom of the pressure cylinder matches the shape of the middle protrusion of the switch plate. A second slider is provided on the inner wall of the pressure cylinder, and the second groove matches the second slider.
4. The semiconductor precision test probe according to claim 1 or 3, wherein; The top edge of the pressure cylinder is fixed to one end of the connecting rod, and the other end of the connecting rod is fixed to the third position of the transmission structure.
5. The semiconductor precision test probe according to claim 1, wherein; The inner wall of the upper cover is provided with a first thread, and the outer wall of the fitting outer cylinder is provided with a second thread groove that matches the first thread.
6. The semiconductor precision test probe according to claim 1, wherein; The top of the upper cover is provided with a mounting hole, and the power source is installed at the mounting hole. The output end of the power source passes through the mounting hole and is fixed at the first position of the transmission structure.
7. The semiconductor precision test probe according to claim 1, wherein; The top of the upper cover is also provided with a support cover, the bottom inner wall of the support cover is threadedly connected to the upper outer wall of the upper cover, and the top of the support cover is fixed to the support wall of the testing table.