Single-interface module with double-interface function and intelligent card thereof

Abstract

The utility model discloses a single-interface module with a double-interface function, which comprises an insulating substrate provided with a first chip, a second chip, a first antenna non-contact point and a second antenna non-contact point. The first antenna non-contact point and the second antenna non-contact point deposit a conducting medium to a preset non-welding disc area of the insulating substrate through combined coating, so that a non-welding disc is formed on the surface of the insulating substrate; one side of the copper foil is connected with the insulating substrate; the insulating base band is connected with one side of the copper foil, the insulating base band and the copper foil form a substrate carrier band of the chip, the insulating base band is provided with a plurality of first contact points, first non-contact points and second non-contact points, the first non-contact points are respectively connected with the first chip and the first antenna non-contact points, and the second non-contact points are respectively connected with the second chip and the second antenna non-contact points. And the second non-contact point is respectively connected with the second chip and the second antenna non-contact point. According to the technical scheme of the embodiment, the double-interface conduction function is achieved through the single-interface module, and the packaging cost of the intelligent card is effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of smart card structure technology, and in particular to a single-interface module and its chip with dual-interface function. Background Technology

[0002] In existing technologies, dual-interface high-security modules use a double-sided copper-clad carrier tape as the substrate, integrating both contact and contactless communication methods. Because the manufacturing process of dual-interface high-security modules requires double-sided copper cladding and nickel and gold plating, the process is complex and the material requirements are high, resulting in a high packaging cost. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a single-interface module and its chip with dual-interface functionality, which can reduce the chip packaging cost.

[0004] On one hand, the single-interface module with dual-interface functionality according to an embodiment of the present invention includes:

[0005] According to some embodiments of the present invention, the insulating substrate is provided with a plurality of reserved holes, which are used to set the first antenna non-contact point, the second antenna non-contact point, the first contact point, the first non-contact point and the second non-contact point.

[0006] According to some embodiments of this utility model, conductive colloid is provided in most of the reserved holes.

[0007] According to some embodiments of the present invention, a plurality of first contact points are all disposed within the interface position range specified in the ISO7816 standard, and the plurality of first contact points correspond to the interface position specified in the ISO7816 standard.

[0008] According to some embodiments of the present invention, the first non-contact point and the first chip are connected to the second non-contact point and the second chip using an arc-shaped process.

[0009] According to some embodiments of the present invention, each of the first antenna non-contact points, the second antenna non-contact points, and the first and second non-contact points are mutually insulated.

[0010] According to some embodiments of the present invention, the surface of the insulating substrate is covered with UV encapsulating adhesive.

[0011] On the other hand, this utility model embodiment also provides a smart card, including:

[0012] The single-interface module with dual-interface functionality as described in the first aspect embodiment above.

[0013] The single-interface module with dual-interface functionality according to the embodiments of this utility model has at least the following beneficial effects:

[0014] An insulating substrate is provided with a first chip, a second chip, a first antenna non-contact point, and a second antenna non-contact point. The first and second antenna non-contact points are formed on the surface of the insulating substrate by coating, liquid phase deposition, and solid phase deposition of conductive media to a pre-defined non-soldering pad area. The non-soldering pads are used to conduct electricity to the insulating substrate. A copper foil is connected to the insulating substrate on one side. An insulating base tape is connected to one side of the copper foil, and the insulating base tape and the copper foil form the substrate carrier tape of the chip. The insulating base tape is provided with a plurality of first contact points, a plurality of first non-contact points, and a plurality of second non-contact points. The first non-contact points are respectively connected to the first chip and the first antenna non-contact point, and the second non-contact points are respectively connected to the second chip and the second antenna non-contact point. According to the technical solution of this embodiment, the substrate carrier tape does not need to be copper-clad on both sides. By combining coating, liquid phase deposition, and solid phase deposition of conductive media, non-soldering pads are made on a single board, enabling a single interface module to achieve dual-interface conduction function, thereby reducing the packaging cost of smart cards.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the overall structure of a single-interface module with dual-interface functionality according to an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the non-contact point of the antenna in an embodiment of this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the copper foil and insulating substrate according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the structure of the first contact point, the first non-contact point, and the second non-contact point in an embodiment of the present invention. Detailed Implementation

[0021] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0022] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0024] Reference Figures 1 to 4 This utility model embodiment provides a single-interface module with dual-interface functionality, including an insulating substrate 100. The insulating substrate 100 is provided with a first chip 110, a second chip 120, a first antenna non-contact point 130, and a second antenna non-contact point 140. The first antenna non-contact point 130 and the second antenna non-contact point 140 are coated with a conductive medium through a combination of coating, liquid phase deposition, and solid phase deposition to a preset non-soldering pad area on the insulating substrate 100, so that a non-soldering pad is formed on the surface of the insulating substrate 100. The non-soldering pad is used to allow the insulating substrate 100 to pass through; copper foil 2 One side of the copper foil 200 is connected to the insulating substrate 100; the insulating base tape 300 is connected to one side of the copper foil 200, and the insulating base tape 300 and the copper foil 200 form the substrate carrier tape of the chip. The insulating base tape 300 is provided with a plurality of first contact points 310, a plurality of first non-contact points 320 and second non-contact points 330. The first non-contact points 320 are respectively connected to the first chip 110 and the first antenna non-contact point 130, and the second non-contact points 330 are respectively connected to the second chip 120 and the second antenna non-contact point 140. According to the technical solution of this embodiment, the substrate carrier tape does not need to be copper-clad on both sides. By combining coating, liquid phase deposition and solid phase deposition of conductive media, non-pads are made on a single board, so that the single interface module can realize dual interface conduction function, thereby reducing the packaging cost of smart cards.

[0025] It should be noted that the first antenna non-contact point 130 and the second antenna non-contact point 140 are formed by combining coating, liquid phase deposition, and solid phase deposition of conductive media onto a pre-defined non-soldering pad area of ​​the insulating substrate 100. This non-soldering pad technology allows a conductive path to be formed on the surface of the insulating substrate 100, reducing signal loss and interference caused by traditional soldering methods. Simultaneously, the connection between the copper foil 200 and the insulating baseband 300 provides a stable electrical signal transmission path, further improving signal transmission efficiency. This embodiment optimizes the layout of multiple contact points and non-contact points without affecting the functionality of the single-interface module, ensuring that multiple contact points and non-contact points are located on the same side of the insulating substrate 100. Only a certain number of non-contact points need to be set during the fabrication of the base carrier, eliminating the need for copper plating on both sides of the insulating substrate 100, thus reducing manufacturing processes. Furthermore, the chip is attached to the insulating base carrier by high-temperature curing, while the conductive medium is converted into a solid phase and bonded to the non-contact pads and specific areas of the bonding surface, forming an integral part of the non-contact antenna contact with the base carrier, thereby achieving double-sided conductivity.

[0026] The insulating substrate 100 is provided with a plurality of reserved holes, which are used to set the first antenna non-contact point 130, the second antenna non-contact point 140, the first contact point 310, the first non-contact point 320 and the second non-contact point 330.

[0027] It should be noted that the pre-drilled holes not only serve for component installation but also for electrical connection and isolation. Through the conductive medium within the holes, components can be electrically connected to other circuits or components on the insulating substrate 100. Simultaneously, the material of the insulating substrate 100 ensures electrical isolation between components, preventing signal interference and short circuits. The pre-drilled holes simplify the module manufacturing process and reduce manufacturing costs. They allow personnel to quickly adjust the hole layout according to actual needs without complex custom processing. Furthermore, the pre-drilled hole design enhances the module's versatility and upgradeability. Personnel can quickly adjust the module's configuration and functions based on market demands and technological advancements to meet evolving application requirements.

[0028] All reserved holes are fitted with conductive adhesive. It should be noted that after copper plating, nickel plating, and gold plating on the insulating substrate 100, etching is used to divide the surface of the insulating substrate 100 into several first contact points 310, first non-contact points 320, and second non-contact points 330. By combining coating, liquid phase deposition, and solid phase deposition of conductive media, the non-contact hole grooves are filled, and a conductive adhesive layer of a specific area and thickness is formed on the bonding surface, serving as the first antenna non-contact point 130 and the second antenna non-contact point 140. Simultaneously, the device performs the chip placement and dispensing operations in parallel, reducing the smart card packaging process and waiting time. Further, through high-temperature curing, the chip is attached to the insulating substrate carrier tape. At the same time, the conductive medium is converted into a solid phase, firmly adhering to the non-contact pads and specific areas of the bonding surface, forming an integral non-contact antenna contact with the substrate carrier tape, thereby achieving double-sided conductivity.

[0029] Several first contact points 310 are all located within the interface position range specified in the ISO 7816 standard, and these first contact points 310 correspond to the interface positions specified in the ISO 7816 standard. It should be noted that...

[0030] It's important to note that smart cards compliant with ISO 7816 standards are compatible with various card readers, thus expanding their application scope. Whether in finance, transportation, identity authentication, or other fields, smart cards can be easily integrated into existing card reader systems without additional adaptation or modification. Precisely configured contact points ensure efficient data transmission between the smart card and the reader. Guided by a clock signal, data can be transmitted stably and quickly between the smart card and the reader, meeting the needs of various application scenarios.

[0031] The first non-contact point 320 and the first chip 110 are connected to the second non-contact point 330 and the second chip 120 using an arc-shaped process.

[0032] It's important to note that the curved connection design ensures a stable and reliable physical connection between the contactless points and the chip, enabling efficient signal transmission. Curved connections effectively avoid signal reflection, attenuation, and interference issues that can occur with straight connections, thus ensuring the quality and stability of module signal transmission. This reduces chip failures and downtime caused by connection problems. Furthermore, curved connections offer more flexible spatial layout options. By optimizing the layout, the module can utilize space resources more effectively, improving overall performance and efficiency.

[0033] Each of the first antenna non-contact point 130, the second antenna non-contact point 140, the first non-contact point 320, and the second non-contact point 330 is mutually insulated.

[0034] It's important to note that the mutual insulation between the contactless points effectively prevents signal interference. This insulation ensures that each contactless point operates independently without interference, thus improving the overall system performance. Insulation also enhances system stability. Since there is no electrical connection between the contactless points, a fault or damage to one point will not affect other points. This ensures stable module operation and reduces maintenance costs. Furthermore, the mutual insulation between the contactless points makes fault identification and resolution easier during smart card maintenance and management. When a problem occurs at a contactless point, it can be inspected and repaired individually without requiring extensive inspection and repair of the entire smart card.

[0035] The surface of the insulating substrate 100 is covered with UV encapsulating adhesive.

[0036] It should be noted that the film formed after the UV encapsulating adhesive cures has extremely high resistivity and dielectric strength, which can significantly improve the insulation performance of the single-interface module. The cured UV encapsulating adhesive film has good sealing and water resistance, effectively preventing moisture and dust and other contaminants from penetrating into the single-interface module, thereby extending the module's service life and improving the product's reliability and stability.

[0037] On the other hand, this utility model embodiment also provides a smart card, including:

[0038] As described in the first aspect above, this is a single-interface module with dual-interface functionality.

[0039] In the description of this specification, references to terms such as "one embodiment," "further embodiment," "some specific embodiments," or "some examples," etc., indicate that a specific feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A single-interface module with dual-interface functionality, characterized in that, include: An insulating substrate is provided with a first chip, a second chip, a first antenna non-contact point, and a second antenna non-contact point. The first antenna non-contact point and the second antenna non-contact point are coated with a conductive medium by a combination of coating, liquid phase deposition, and solid phase deposition to a preset non-soldering pad area of ​​the insulating substrate, so that a non-soldering pad is formed on the surface of the insulating substrate. The non-soldering pad is used to conduct electricity to the insulating substrate. A copper foil, one side of which is connected to the insulating substrate; An insulating base tape is connected to one side of the copper foil. The insulating base tape and the copper foil form a substrate carrier tape for the chip. The insulating base tape is provided with a plurality of first contact points, a plurality of first non-contact points and second non-contact points. The first non-contact points are respectively connected to the first chip and the first antenna non-contact point, and the second non-contact points are respectively connected to the second chip and the second antenna non-contact point.

2. The single-interface module with dual-interface functionality according to claim 1, characterized in that, The insulating substrate is provided with a plurality of reserved holes, which are used to set the first antenna non-contact point, the second antenna non-contact point, the first contact point, the first non-contact point and the second non-contact point.

3. The single-interface module with dual-interface functionality according to claim 2, characterized in that, All of the reserved holes are provided with conductive colloid.

4. The single-interface module with dual-interface functionality according to claim 1, characterized in that, Several first contact points are all located within the interface location range specified in the ISO 7816 standard, and several first contact points correspond to the interface location specified in the ISO 7816 standard.

5. The single-interface module with dual-interface functionality according to claim 1, characterized in that, The first non-contact point and the first chip are connected to the second non-contact point and the second chip using an arc-shaped process.

6. The single-interface module with dual-interface functionality according to claim 1, characterized in that, Each of the first antenna non-contact points, the second antenna non-contact points, and the first and second non-contact points is mutually insulated.

7. The single-interface module with dual-interface functionality according to claim 1, characterized in that, The surface of the insulating substrate is covered with UV encapsulating adhesive.

8. A smart card, characterized in that, include: The single-interface module with dual-interface functionality as described in any one of claims 1 to 7.

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