Semiconductor test transfer device

Abstract

The utility model discloses a semiconductor test transfer device. The semiconductor test transfer device comprises a lamp box base, an upper cover and a base which are sequentially stacked from top to bottom, at least one independent space for accommodating a semiconductor is formed by the three parts in the height direction; a needle mold assembly is arranged below the base, a semiconductor is placed on the upper surface of the needle mold assembly, and test points on the semiconductor are in one-to-one correspondence with needle holes in the needle mold assembly in position; a space is formed in the upper cover, and a cavity is defined by the space and the needle mold assembly; a through hole is formed in the middle of the pressing block, and the through hole is located right above the semiconductor; an air exhaust channel connected with an air source is formed in the side wall of the lamp box base, and the air exhaust channel is communicated with the cavity, so that the pressing block compresses and adsorbs the semiconductor and drives the semiconductor to move. The semiconductor test transfer device has the beneficial effects that the air exhaust channel is arranged on the semiconductor test transfer device, and air is exhausted from an external air source to the cavity, so that the semiconductor is adsorbed on the lower surface of the pressing block while being pressed by the pressing block, namely, the pressing block can be used for pressing and adsorbing the semiconductor simultaneously, so that the semiconductor is stably adsorbed, and the test efficiency is improved. And the semiconductor is accurately placed at a specified position through linear movement, so that the movement stability and placement accuracy of the semiconductor are improved.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing and transportation technology, and in particular relates to a semiconductor testing transfer device. Background Technology

[0002] In the semiconductor manufacturing industry, chip testing and transfer are two critical steps that directly impact product quality and production efficiency. Currently, semiconductor chip testing and transfer primarily employ methods such as... Figure 1 The clamping block structure shown is used in conjunction with a known nozzle structure for peripherals (not shown in the figure). During testing, the clamping block is used to press and stabilize the semiconductor chip, ensuring the accuracy of the test. During transfer, the semiconductor chip is picked up by the nozzle and placed in the designated position using a ejector tool.

[0003] Although the existing clamping and nozzle combination method has achieved semiconductor chip testing and transfer to a certain extent, the following problems exist in practical applications:

[0004] 1. Position deviation problem: During the material throwing process, due to the limitations of the mechanical structure and the instability of operation, the placement position of semiconductor chips is prone to deviation, thus affecting the placement accuracy.

[0005] 2. Structural complexity: Existing technologies require the simultaneous use of both pressing blocks and suction nozzles, which complicates the entire system and increases maintenance difficulty and cost.

[0006] 3. Operational efficiency: The need to operate the briquetting and suction nozzles separately limits operational efficiency, especially in large-scale production where this limitation becomes more pronounced.

[0007] To address the aforementioned issues, designing a semiconductor testing transfer device that improves placement accuracy, simplifies structure, and enhances operational efficiency is a crucial technical problem that those skilled in the art must solve. Utility Model Content

[0008] The purpose of this invention is to solve the above-mentioned problems existing in the prior art and to provide a semiconductor testing transfer device.

[0009] The objective of this utility model is achieved through the following technical solution:

[0010] A semiconductor testing transfer device includes a light box base, a top cover, and a base stacked sequentially from top to bottom; the three components form at least one independent space in the height direction for accommodating the semiconductor; a pin mold assembly extending into the base is disposed below it, the semiconductor is placed on the upper surface of the pin mold assembly, and the test points on the semiconductor correspond one-to-one with the pin holes on the pin mold assembly, so that the pin mold assembly can test the semiconductor; a space for placing a testing device is provided inside the top cover, and the space and the pin mold assembly form a cavity for placing a pressure block; a through hole is centrally disposed on the pressure block, and the through hole is located directly above the semiconductor; an air extraction channel connected to an air source is formed on the side wall of the light box base, and the air extraction channel communicates with the cavity, so that the pressure block presses and adsorbs the semiconductor, causing the semiconductor to move.

[0011] Preferably, the space is provided with a first lens base for placing the detection camera. The first lens base has a convex cross-section. Its top end penetrates the upper cover, and a first sealing ring is provided between the first lens base and the upper cover. The bottom end of the first lens base abuts against the base and the needle mold assembly. A hollow partition plate is provided inside the first lens base, and the hollow part is coaxially arranged with the through hole. The detection camera is located on the upper surface of the partition plate.

[0012] Preferably, the first light-diffusing plate is located above the detection camera and is fixedly connected to the first lens base; at least one opening is formed on the upper edge of the first lens base; during the transfer process, the air in the cavity is discharged from the opening and the air extraction channel, so that the semiconductor is adsorbed onto the lower surface of the pressing block.

[0013] Preferably, the pressure block and the partition plate are connected by bolts, and the lower surface of the partition plate and the pressure block are also sealed together by a second sealing ring.

[0014] Preferably, a hot air channel is formed on the side wall between two adjacent independent spaces on the upper cover, and a heat source is connected to the outside of the hot air channel.

[0015] Preferably, the needle mold assembly includes a PCB board, a needle plate, and a floating plate; the PCB board is detachably installed in the base and flush with the lower surface of the base; the needle plate is located on the upper surface of the PCB board and bolted to the PCB board; the floating plate is located on the upper surface of the needle plate, and the semiconductor and the pressure block are placed on the upper surface of the floating plate; a set of pinholes for easy probe penetration is formed on the needle plate and / or the floating plate, and the pinholes correspond one-to-one with the solder joints on the PCB board and the test points on the semiconductor.

[0016] Preferably, a second lens base for placing a detection camera is formed on the light box base; the upper surface of the second lens base abuts against the light box through a sealing gasket; and a first positioning pin is inserted downward from the light box into the light box base.

[0017] Preferably, the light box is equipped with a lighting lamp, and a second light-diffusing plate is installed at the bottom of the light box, with the second light-diffusing plate located above the second lens base.

[0018] Preferably, the second positioning pin is inserted from the lower surface of the upper cover into the light box base; and the upper cover is formed with a concave-convex structure that connects it to the base.

[0019] The advantages of this utility model's technical solution are mainly reflected in:

[0020] An air extraction channel is set on the semiconductor testing transfer device, and an external air source is used to extract air into the cavity, so that the pressure block can press the semiconductor and adsorb the semiconductor on its lower surface at the same time. That is, the pressure block can press and adsorb the semiconductor at the same time to achieve stable adsorption of the semiconductor, and the semiconductor can be accurately placed in the designated position by linear movement, thereby improving the stability of semiconductor movement and placement accuracy.

[0021] A needle mold assembly is installed inside the base. The probes in the needle mold assembly connect the test points on the semiconductor to the corresponding solder points on the PCB board. At the same time, a detection camera is used to detect the continuity of the test points on the semiconductor in real time to ensure the accuracy of the detection.

[0022] First and second light-diffusing plates are respectively installed on the base and top cover of the light box to form a set of parallel lights from the light source inside the light box, so as to illuminate the semiconductor directly above it, effectively avoiding blind spots and improving detection accuracy. Attached Figure Description

[0023] Figure 1 : Structural diagram of the background technology of this utility model;

[0024] Figure 2 : A perspective view of a preferred embodiment of the present invention;

[0025] Figure 3 : A partially hidden exploded view of a preferred embodiment of this utility model;

[0026] Figure 4 Cross-sectional view of a preferred embodiment of this utility model;

[0027] Figure 5 This utility model Figure 4 Enlarged view of section A. Detailed Implementation

[0028] The purpose, advantages, and features of this utility model will be illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of applying the technical solutions of this utility model, and all technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this utility model.

[0029] In the description of the solution, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Also, in the description of the solution, with the operator as a reference, the direction closer to the operator is the proximal end, and the direction farther from the operator is the distal end.

[0030] like Figure 2 As shown, this utility model discloses a semiconductor testing transfer device, including a light box base 1, a top cover 2, and a base 3 stacked sequentially from top to bottom. The light box base 1 has a second lens base 11 for placing a testing camera. The upper surface of the second lens base 11 abuts against the light box 12 via a sealing gasket 102. The sealing gasket 102 seals the light box base 1 and the light box 12 together, and a first positioning pin is inserted downwards from the light box 12 into the light box base 1 to ensure the connection stability between the light box 12 and the light box base 1.

[0031] Furthermore, such as Figure 3 As shown, a lighting lamp is installed inside the light box 12, and a second light-diffusing plate 121 is installed at the bottom of the light box 12, with the second light-diffusing plate 121 located above the second lens base 11. The second light-diffusing plate 121 forms a set of parallel lights from the lighting lamp inside the light box, illuminating directly above the semiconductor, effectively avoiding blind spots and improving detection accuracy.

[0032] The second positioning pin is inserted into the lamp box base 1 from the lower surface of the upper cover 2; and the upper cover 2 has a convex-concave structure that connects it to the base 3. The lamp box base 1, upper cover 2, and base 3 each have at least one independent space in the height direction for accommodating the semiconductor. By providing multiple independent spaces on the semiconductor testing and transfer device to facilitate semiconductor testing, batch testing and transfer of semiconductors can be completed, improving detection and transfer efficiency.

[0033] like Figures 3 to 5 As shown, a needle mold assembly 31 extending into the base 3 is disposed below it. The semiconductor is placed on the upper surface of the needle mold assembly 31, and the test points on the semiconductor correspond one-to-one with the positions of the pinholes 310 on the needle mold assembly 31, so that the needle mold assembly 31 can test the semiconductor.

[0034] Specifically, such as Figures 4 to 5 As shown, the needle mold assembly 31 includes a PCB board 311, a needle plate 312, and a floating plate 313. The PCB board 311 is detachably mounted within the base 3 and flush with the lower surface of the base 3. The needle plate 312 is located on the upper surface of the PCB board 311 and is bolted to the PCB board 311. The floating plate 313 is located on the upper surface of the needle plate 312, and the semiconductor and the pressure block 21 within the upper cover 2 are placed on the upper surface of the floating plate 313. Further, a set of pinholes 310 are formed on the needle plate 312 and / or the floating plate 313 to facilitate probe penetration. Each pinhole 310 corresponds one-to-one with a solder joint on the PCB board 311 and a test point on the semiconductor. By electrically connecting the probes to the solder joints on the PCB board and the test points on the semiconductor, and observing whether each test point on the semiconductor is conductive, the semiconductor can be tested.

[0035] like Figure 3 As shown, the upper cover 2 has a space 20 for placing the testing device. The space 20 and the needle mold assembly 31 form a cavity for placing the pressure block 21. A through hole 210 is centrally located on the pressure block 21, and the through hole 210 is directly above the semiconductor. During testing, the conductivity of the semiconductor is observed through the through hole 210. The shape of the through hole 210 in the pressure block 21 matches the shape of the test area on the semiconductor, and its lower surface is always in contact with the semiconductor.

[0036] Furthermore, a first lens mount 22 for placing a detection camera is provided within the space 20. (Combined with...) Figure 4 and Figure 5 As shown, the first lens base 22 has a convex cross-section; its top end penetrates the upper cover 2, and a first sealing ring 201 is provided between the first lens base 22 and the upper cover 2. The bottom end of the first lens base 22 abuts against the base 3 and the needle mold assembly 31. A hollow partition plate 221 is provided inside the first lens base 22, and the hollow part is coaxially arranged with the through hole 210; the detection camera is located on the upper surface of the partition plate 221.

[0037] Furthermore, the pressure block 21 and the partition plate 221 are connected by bolts, and the lower surface of the partition plate 221 is also sealed to the pressure block 21 by a second sealing ring 202. The first sealing ring 201 and the second sealing ring 202 form a relatively sealed space, which facilitates the subsequent vacuuming of the space to achieve semiconductor adsorption.

[0038] like Figure 3 and Figure 5 As shown, an air extraction channel 101 connected to an air source is formed on the side wall of the light box base 1. The air extraction channel 101 communicates with the cavity 20 so that the pressing block 21 presses and adsorbs the semiconductor, thereby moving the semiconductor. The air source can be a known structure, including an air pump, which will not be described in detail here.

[0039] Furthermore, such as Figure 3 As shown, a first light-diffusing plate 23 is located above the detection camera and is fixedly connected to the first lens base 22. At least one opening 220 is formed on the upper edge of the first lens base 22. The light emitted from the light source is directed to the semiconductor by the first light-diffusing plate 23, forming parallel light that effectively avoids blind spots and ensures the accuracy of the detection results. Before the transfer process, air in the cavity 20 is first discharged through the opening 220 and the suction channel 101 by an air source, so that the semiconductor is adsorbed onto the lower surface of the pressure block 21. Two lens bases are provided on the semiconductor testing transfer device, corresponding to two different models of detection cameras or semiconductors, to meet testing requirements at different heights.

[0040] A hot air channel 203 is formed on the sidewall between two adjacent independent spaces on the upper cover 2, and a heat source is connected to the outside of the hot air channel 203. Heat is transferred into the upper cover 2 through the external heat source to increase the temperature inside the cavity 20 and meet the testing requirements of different semiconductors.

[0041] This utility model has many other embodiments. All technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this utility model.

Claims

1. A semiconductor testing transfer device, characterized in that: The device includes a lightbox base (1), a top cover (2), and a base (3) stacked from top to bottom; the three components form at least one independent space in the height direction for accommodating the semiconductor; a pin mold assembly (31) extending into the base (3) is provided below it, the semiconductor is placed on the upper surface of the pin mold assembly (31), and the test points on the semiconductor correspond one-to-one with the pin holes (310) on the pin mold assembly (31) so that the pin mold assembly (31) can test the semiconductor; the top cover (2) The interior is provided with a space (20) for placing the detection device. The space (20) and the needle mold assembly (31) form a cavity for placing the pressure block (21). A through hole (210) is provided in the center of the pressure block (21), and the through hole (210) is located directly above the semiconductor. An air extraction channel (101) connected to an air source is formed on the side wall of the lamp box base (1). The air extraction channel (101) is connected to the cavity so that the pressure block (21) presses and adsorbs the semiconductor, thereby driving the semiconductor to move.

2. The semiconductor testing transfer device according to claim 1, characterized in that: The space (20) is provided with a first lens base (22) for placing the detection camera. The first lens base (22) has a convex cross-section. Its top end penetrates the upper cover (2), and a first sealing ring (201) is provided between the first lens base (22) and the upper cover (2). The bottom end of the first lens base (22) abuts against the base (3) and the needle mold assembly (31). A hollow partition plate (221) is provided inside the first lens base (22), and the hollow part is coaxially arranged with the through hole (210). The detection camera is located on the upper surface of the partition plate (221).

3. The semiconductor testing transfer device according to claim 2, characterized in that: The first light-diffusing plate (23) is located above the detection camera and is fixedly connected to the first lens base (22); the upper edge of the first lens base (22) has at least one opening (220); during the transfer process, the air in the cavity is discharged from the opening (220) and the air extraction channel (101) so that the semiconductor is adsorbed onto the lower surface of the pressure block (21).

4. The semiconductor testing transfer device according to claim 2, characterized in that: The pressure block (21) and the partition plate (221) are connected by bolts, and the lower surface of the partition plate (221) and the pressure block (21) are also sealed together by a second sealing ring (202).

5. The semiconductor testing transfer device according to claim 1, characterized in that: A hot air channel (203) is formed on the side wall between two adjacent independent spaces on the upper cover (2), and a heat source is connected to the outside of the hot air channel (203).

6. The semiconductor testing transfer device according to claim 1, characterized in that: The needle mold assembly (31) includes a PCB board (311), a needle plate (312), and a floating plate (313); the PCB board (311) is detachably installed in the base (3) and is flush with the lower surface of the base (3); the needle plate (312) is located on the upper surface of the PCB board (311) and is bolted to the PCB board (311); the floating plate (313) is located on the upper surface of the needle plate (312), and the semiconductor and the pressure block (21) are placed on the upper surface of the floating plate (313); a set of pin holes (310) are formed on the needle plate (312) and / or the floating plate (313) to facilitate the penetration of the probe, and the pin holes (310) correspond one-to-one with the solder joints on the PCB board (311) and the test points on the semiconductor.

7. The semiconductor testing transfer device according to claim 1, characterized in that: A second lens base (11) for placing a detection camera is formed on the light box base (1); the upper surface of the second lens base (11) abuts against the light box (12) through a sealing gasket (102); a first positioning pin is inserted downward from the light box (12) into the light box base (1).

8. The semiconductor testing transfer apparatus according to claim 7, characterized in that: The light box (12) is equipped with a lighting lamp, and a second light distribution plate (121) is installed at the bottom of the light box (12), and the second light distribution plate (121) is located above the second lens base (11).

9. The semiconductor testing transfer device according to claim 1, characterized in that: The second positioning pin is inserted from the lower surface of the upper cover (2) into the light box base (1); and the upper cover (2) is formed with a concave-convex structure that connects it to the base (3).

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