Boost device

Abstract

The utility model discloses a boosting device. The boosting device comprises a power unit assembly, a main loop assembly and a control loop assembly, the power unit assembly comprises a plurality of boost modules which are arranged in parallel, and each boost module comprises a plurality of boost circuits which are arranged in parallel; the main loop assembly comprises a low-voltage side loop and a high-voltage side loop, the input end of the low-voltage side loop is connected with the low-voltage module, the output end of the low-voltage side loop is connected with the input end of each boosting module, the input end of the high-voltage side loop is connected with the output ends of the boosting modules, and the output end of the high-voltage side loop is connected with the high-voltage module; the output end of the control loop assembly is connected with the power unit assembly. On the basis, low-voltage current can be boosted in a plurality of boosted circuits, and due to the adoption of a plurality of boosted modules and boosted circuits which are connected in parallel, even if one or more components break down, other components can still work, so that the reliability of the whole boosted device is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of electrical equipment, and particularly relates to a voltage boosting device. BACKGROUND

[0002] With the continuous development of electric vehicle technology, various devices of different voltage levels are arranged in the electric vehicle, and the current output by the power supply of the electric vehicle is of a fixed level. In order to better adapt to various devices, the DC-DC voltage boosting device is needed to boost the current output by the power supply, so that various devices can normally operate. Therefore, the DC-DC voltage boosting device is a key device to ensure the normal operation of devices in the vehicle.

[0003] With the increase of the use time of the vehicle, the vehicle may encounter impact, jolt and other situations during use, which may cause the voltage boosting electronic components (switching tubes, diodes, relays, etc.) inside the DC-DC voltage boosting device to fall off, connection failure and other situations, thereby causing the performance of the voltage boosting device to decrease or fail, and affecting the normal operation of the entire vehicle.

[0004] At present, in order to reduce the failure probability of the DC-DC voltage boosting device, the arrangement position of internal parts of the voltage boosting device can be changed to reduce the influence of the external environment on the function of the parts. The patent with the publication number CN220830380U proposes a voltage boosting device, a voltage boosting charging system and a vehicle. The voltage boosting device includes a shell and a voltage boosting circuit, and the voltage boosting circuit includes a positive relay and a negative relay. The voltage boosting circuit is arranged inside the shell, and the positive relay and the negative relay are arranged in a staggered manner. The voltage boosting charging system includes a voltage boosting device, a motor, a bridge and a battery module. The positive output end of the voltage boosting device is connected with the motor neutral point of the motor, the winding end of the motor is connected with the alternating current end of the bridge, the positive direct current end of the bridge is connected with the positive electrode of the battery module, and the negative direct current end of the bridge is connected with the negative output end of the voltage boosting device and the negative electrode of the battery module. The above patent increases the installation stability of the positive relay and the negative relay by arranging the positive relay and the negative relay in a staggered manner, reduces the possibility of loosening and falling off of the parts, and improves the reliability of voltage boosting of the voltage boosting device. However, the voltage boosting device involves multiple electronic components and multiple complex connection relationships. Once other electronic components or connection relationships are loose or fall off, the entire voltage boosting device will still fail, and the voltage boosting device in the above patent is still unstable and unreliable. CONTENT OF THE UTILITY MODEL

[0005] The application provides a voltage boosting device, which improves the reliability of boosting low-voltage current.

[0006] According to a first aspect of the present application, a voltage boosting device is provided, the device comprising:

[0007] a power unit assembly, the power unit assembly comprising a plurality of voltage boosting modules arranged in parallel, each voltage boosting module comprising a plurality of voltage boosting circuits arranged in parallel;

[0008] a main circuit assembly, the main circuit assembly comprising a low voltage side circuit and a high voltage side circuit, an input of the low voltage side circuit being connected to the low voltage module, an output of the low voltage side circuit being connected to an input of each voltage boosting module respectively, an input of the high voltage side circuit being connected to an output of the voltage boosting module, an output of the high voltage side circuit being connected to the high voltage module;

[0009] a control circuit assembly, an output of the control circuit assembly being connected to the power unit assembly.

[0010] Optionally, the voltage boosting device comprises:

[0011] a mounting bracket, each voltage boosting module being mounted side by side on one side of the mounting bracket;

[0012] a heat dissipation assembly, the heat dissipation assembly being mounted on a side of the mounting bracket away from the voltage boosting modules, and the heat dissipation assembly abutting against the voltage boosting modules.

[0013] Optionally, the heat dissipation assembly comprises:

[0014] a heat sink, the heat sink being mounted on the mounting bracket and abutting against the voltage boosting modules;

[0015] a radiator, the radiator being arranged on a side of the heat sink and used for cooling the heat sink.

[0016] Optionally, the control circuit assembly comprises:

[0017] a first mounting substrate, the first mounting substrate being mounted on the mounting bracket, a first protection cavity being formed between the first mounting substrate and the mounting bracket, and the voltage boosting modules being arranged in the first protection cavity;

[0018] a control unit, the control unit being mounted on the first mounting substrate and being communicatively connected to the voltage boosting modules.

[0019] Optionally, the control circuit assembly comprises:

[0020] a power supply, the power supply being connected to the control unit and the heat dissipation assembly respectively.

[0021] Optionally, the low voltage side circuit comprises:

[0022] a first current sensor, an output of the first current sensor being connected to an input of the voltage boosting module;

[0023] A low-voltage input relay, an input end of the low-voltage input relay being connected with the low-voltage module, and an output end of the low-voltage input relay being connected with an input end of the first current sensor;

[0024] The main circuit assembly comprises a second mounting substrate;

[0025] The first current sensor, the low-voltage input relay and the high-voltage side circuit are mounted on the second mounting substrate, the second mounting substrate is mounted on the mounting support, a second protection cavity is formed between the second mounting substrate and the mounting support, and the voltage boosting module is arranged in the second protection cavity.

[0026] Optionally, the low-voltage side circuit comprises:

[0027] A first filter plate is arranged in parallel on a low-voltage circuit main circuit between the low-voltage input relay and the low-voltage module.

[0028] Optionally, the high-voltage side circuit comprises:

[0029] A second current sensor, an input end of the second current sensor being connected with the voltage boosting module, and an output end of the second current sensor being connected with the high-voltage module.

[0030] Optionally, the high-voltage side circuit further comprises:

[0031] A fuse, two ends of the fuse being connected with the second current sensor and the high-voltage module respectively.

[0032] Optionally, the high-voltage side circuit further comprises:

[0033] A second filter plate is arranged in parallel on a high-voltage circuit main circuit between the fuse and the high-voltage module.

[0034] The technical scheme provided by the embodiment of the application at least brings the following beneficial effects:

[0035] The embodiment of the present application provides a boosting device, which can comprise: a power unit assembly, a main loop assembly and a control loop assembly; the power unit assembly comprises a plurality of boosting modules arranged in parallel, each of the boosting modules comprises a plurality of boosting circuits arranged in parallel; the main loop assembly comprises a low-voltage side loop and a high-voltage side loop, an input end of the low-voltage side loop is connected with a low-voltage module, an output end of the low-voltage side loop is connected with an input end of each of the boosting modules, an input end of the high-voltage side loop is connected with an output end of the boosting module, and an output end of the high-voltage side loop is connected with a high-voltage module; and an output end of the control loop assembly is connected with the power unit assembly. Based on this, the low-voltage current can be boosted in the plurality of boosting circuits by arranging a plurality of boosting modules in parallel in the power unit assembly and arranging a plurality of boosting circuits in parallel in each of the boosting modules, so that even if one or more components fail, other components can still work, thereby improving the reliability of the whole boosting device.

[0036] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0037] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments consistent with the present application and, together with the specification, serve to explain the principles of the present application, and do not constitute an undue limitation on the present application.

[0038] Figure 1 is a structural schematic diagram of a boosting device according to an exemplary embodiment;

[0039] Figure 2 is a structural schematic diagram of a main loop assembly in a boosting device according to an exemplary embodiment;

[0040] Figure 3 is a structural schematic diagram of a main loop assembly in a boosting device according to an exemplary embodiment;

[0041] Figure 4 is another structural schematic diagram of a boosting device according to an exemplary embodiment;

[0042] Figure 5 is still another structural schematic diagram of a boosting device according to an exemplary embodiment.

[0043] LEGEND:

[0044] Legend Name Legend Name 1 Power unit assembly 2 Main circuit assembly 3 Control circuit assembly 4 Boost module 5 Mounting bracket 6 Radiator fin 7 Radiator 8 First mounting substrate 9 Control unit 10 Power supply 11 First current sensor 12 Low-voltage input relay 13 Second mounting substrate 14 First filter board 15 Second current sensor 16 Fuse 17 Second filter board 18 Low-voltage side input copper bar 19 High-voltage side output copper bar 20 High-voltage side total positive copper bar 21 Low-voltage side total positive copper bar 22 Total negative copper bar 23 Binding rod DETAILED DESCRIPTION

[0045] In the description of the application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0046] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection, or communication; it can be directly connected, or indirectly connected through intermediate medium, or the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0047] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. In the description of the specification, the description referring to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application.

[0048] In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In the following description, many specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure can also be implemented in other ways different from the description; obviously, the embodiments described in the specification are only part of the embodiments of the present disclosure, not all the embodiments.

[0049] In order to more clearly understand the above-mentioned purposes, features and advantages of the present disclosure, the schemes of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0050] Based on this, the application provides a voltage boosting device. First, the voltage boosting device provided by the embodiment of the application is introduced.

[0051] Figure 1 The structural schematic diagram of the voltage boosting device provided by one embodiment of the application is shown; Figure 2 The structural schematic diagram of the main loop component in the voltage boosting device provided by one embodiment of the application is shown; Figure 3 The structural schematic diagram of the main loop component in the voltage boosting device provided by one embodiment of the application is shown; Figure 4 Another structural schematic diagram of the voltage boosting device provided by one embodiment of the application is shown; Figure 5 Still another structural schematic diagram of the voltage boosting device provided by one embodiment of the application is shown. As Figures 1-5 The voltage boosting device can include the following structures:

[0052] Embodiment 1;

[0053] The voltage boosting device can include:

[0054] The power unit component 1 includes a plurality of voltage boosting modules 4 arranged in parallel, and each voltage boosting module 4 includes a plurality of voltage boosting circuits arranged in parallel;

[0055] The main loop component 2 includes a low-voltage side loop and a high-voltage side loop, the input end of the low-voltage side loop is connected with the low-voltage module, the output end of the low-voltage side loop is connected with the input end of each voltage boosting module 4, the input end of the high-voltage side loop is connected with the output end of the voltage boosting module 4, and the output end of the high-voltage side loop is connected with the high-voltage module;

[0056] The control loop component 3 is connected with the power unit component 1.

[0057] The low-voltage current flows into the voltage boosting device from the low-voltage module, flows into the input end of the low-voltage side loop, and then flows to the power unit component 1 from the output end of the low-voltage side loop. The power unit component 1 is provided with a plurality of voltage boosting modules 4 arranged in parallel, so that the low-voltage current flowing to any one of the plurality of voltage boosting modules 4 can complete the voltage boosting of the low-voltage current. The voltage boosting module 4 is provided with a plurality of voltage boosting circuits arranged in parallel, and each voltage boosting circuit can perform the voltage boosting operation on the low-voltage current. Therefore, the low-voltage current in the voltage boosting module 4 can be boosted by the plurality of voltage boosting circuits respectively, so as to obtain a high-voltage current. The high-voltage current is output to the high-voltage module through the high-voltage side loop.

[0058] By connecting the control loop with the power unit component 1, the operation of each voltage boosting module 4 in the power unit component 1 can be controlled by the control loop component 3, and the low-voltage current can be controlled to flow to different voltage boosting modules 4 for voltage boosting.

[0059] Based on the above embodiment, by arranging multiple boost modules 4 in parallel in the power unit assembly 1, and arranging multiple boost circuits in parallel in each boost module 4 to perform the boost operation, the low-voltage current can be boosted in multiple boost circuits. Since multiple parallel boost modules 4 and boost circuits are used, even if one or several components fail, the other components can still continue to work, thereby improving the reliability of the entire boost device.

[0060] As an example, the low-voltage module can be a module connected to the boost device for sending a low-voltage current to the boost device, and the high-voltage module can be a module for receiving a high-voltage current to work; the low-voltage side circuit can further include a low-voltage side input copper bar 18, and the low-voltage module is connected to the low-voltage side circuit by connecting with the low-voltage side input copper bar 18; the high-voltage side circuit can further include a high-voltage side output copper bar 19, and the high-voltage side circuit is connected to the high-voltage module by the high-voltage side output copper bar 19. Specifically, the low-voltage module can be a vehicle-mounted storage battery, and the high-voltage module can be an inverter for driving a load motor.

[0061] As an example, the power unit assembly 1 includes 4 parallel boost modules 4, and each boost module 4 has 8 parallel boost circuits. Each boost module 4 works independently. This design makes the system have high redundancy and can improve the availability of the system. When one of the four boost modules 4 fails and stops, the other three boost modules 4 can continue to run, and the whole machine can run without power reduction. In each boost module 4, if less than half of the boost branches fail, the boost module 4 will stop using half of the boost modules 4. When 4 boost branches fail, the boost module 4 runs at 1 / 2 power. Specifically, the boost circuit can be a boost boost circuit, which is a powerful and widely used DC-DC converter that can convert low-voltage DC signals to high-voltage DC signals to provide stable power supply 10 for various electronic devices.

[0062] As an example, the power unit assembly 1 can further include a high-voltage side total positive copper bar 20, a low-voltage side total positive copper bar 21, and a total negative copper bar 22. The high-voltage side positive poles of each power module are connected to each other through the high-voltage side total positive copper bar 20, the low-voltage side positive poles of each power module are connected to each other through the low-voltage side total positive copper bar 21, and the negative poles of each power module are connected to each other through the low-voltage side total positive copper bar 21. By connecting the positive poles and negative poles of multiple power modules together through positive copper bars and negative copper bars, modular design can be achieved, cable connections can be reduced, and assembly efficiency can be improved.

[0063] Optionally, in an example, the boost device further comprises:

[0064] The mounting bracket 5 is installed on one side of the mounting bracket 5.

[0065] The heat dissipation assembly is installed on the side of the mounting bracket 5 away from the boost module 4, and the heat dissipation assembly is attached to the boost module 4.

[0066] By providing the mounting bracket 5, the boost module 4 can be installed on one side of the mounting bracket 5, and the heat dissipation assembly can be installed on the other side of the mounting bracket 5, so that the heat dissipation assembly can be attached to the boost module 4. Thus, when the boost module 4 is operating, the heat generated by the boost module 4 can be carried away by the heat dissipation assembly through heat transfer, so that the boost module 4 can operate at a rated temperature.

[0067] Optionally, in an example, the heat dissipation assembly comprises:

[0068] The heat dissipation fin 6 is installed on the mounting bracket 5 and attached to the boost module 4.

[0069] The heat sink 7 is provided on one side of the heat dissipation fin 6 for cooling the heat dissipation fin 6.

[0070] The heat dissipation fin 6 is a sheet structure, which increases the contact area with the boost module 4 by being attached to the boost module 4, so that the heat dissipation fin 6 can better conduct the heat generated by the boost module 4, and the heat sink 7 is provided on one side of the heat dissipation fin 6, so that the heat conducted by the heat dissipation fin 6 can be further cooled by the heat sink 7, thereby improving the cooling efficiency of the heat dissipation assembly.

[0071] Specifically, the heat dissipation fin 6 can be a fin structure, which is an important structure form for improving heat transfer efficiency. It can significantly improve the heat transfer efficiency of the heat exchanger by increasing the heat transfer area and enhancing the turbulence effect.

[0072] The heat sink 7 can be a fan, which has a simple structure, is easy to purchase, and has excellent heat dissipation performance, and can well cool the heat dissipation fin 6.

[0073] Optionally, in an example, the control loop assembly 3 comprises:

[0074] The first mounting substrate 8 is installed on the mounting bracket 5, and the first mounting substrate 8 and the mounting bracket 5 form a first protection cavity, and the boost module 4 is placed in the first protection cavity.

[0075] The control unit 9 is installed on the first mounting substrate 8, and the control unit 9 is in communication connection with the boost module 4.

[0076] By setting the first mounting base plate 8, a first protective cavity can be formed between the first mounting base plate 8 and the mounting bracket 5. Placing the boost module 4 in the first protective cavity allows the mounting bracket 5 and the first mounting base plate 8 to jointly protect the boost module 4, thereby improving the protection effect of the boost module 4.

[0077] By mounting the control unit 9 on the first mounting base plate 8, the low-voltage current can be controlled by the control unit 9 to perform voltage boosting operations in each boost module 4, thereby realizing voltage boosting of the entire boosting device.

[0078] Cable tie rods 23 are provided on both sides of the control unit 9. The cable tie rods 23 can make full use of the narrow space inside the booster device and facilitate the fixing of the line.

[0079] Alternatively, in one example, the control loop component 3 may further include:

[0080] Power supply 10 is connected to control unit 9 and heat dissipation component respectively. By connecting power supply 10 to control unit 9 and heat dissipation component, power supply 10 can provide low voltage power supply to control unit 9 and heat dissipation component, thereby ensuring normal operation of control unit 9 and heat dissipation component.

[0081] Example 2:

[0082] Optionally, the low-voltage side circuit includes:

[0083] The first current sensor 11, the output terminal of the first current sensor 11 is connected to the input terminal of the boost module 4;

[0084] The low-voltage input relay 12 has its input terminal connected to the low-voltage module and its output terminal connected to the input terminal of the first current sensor 11.

[0085] The main circuit assembly 2 includes: a second mounting base plate 13;

[0086] The first current sensor 11, the low-voltage input relay 12, and the high-voltage side circuit are all mounted on the second mounting base 13. The second mounting base 13 is mounted on the mounting bracket 5. A second protective cavity is formed between the second mounting base 13 and the mounting bracket 5. The boost module 4 is placed in the second protective cavity.

[0087] The first current sensor 11 is arranged to obtain the current input information of the low-voltage current in the low-voltage side loop, so that the low-voltage current can be boosted according to the current input information. The low-voltage input relay 12 can be used for switching the input circuit in the no-load condition. The second current sensor 15 and the low-voltage input relay 12 are arranged on the second mounting substrate 13, and the second mounting substrate 13 is arranged on the mounting bracket 5, so that the mounting stability of the second current sensor 15, the low-voltage input relay 12 and the high-voltage side loop can be improved. In the embodiment, the first current sensor 11 can be a non-contact Hall sensor, and the circuit in the low-voltage side loop can not be in direct contact with the first current sensor 11.

[0088] Similarly, the second mounting substrate 13 is arranged to form a second protection cavity between the second mounting substrate 13 and the mounting bracket 5. The boost module 4 is arranged in the second protection cavity, so that the mounting bracket 5 and the second mounting substrate 13 can jointly protect the boost module 4, and the protection effect of the boost module 4 is improved. The first protection cavity and the second protection cavity can be in communication to jointly protect the boost module 4.

[0089] Optionally, in an example, the low-voltage side loop can further include:

[0090] The first filter plate 14 is arranged in parallel on the low-voltage circuit main loop between the low-voltage input relay 12 and the low-voltage module.

[0091] The first filter plate 14 is arranged in parallel between the low-voltage input relay 12 and the low-voltage module. Through the filtering effect of the first filter plate 14, only the harmonic current can be absorbed by the first filter plate 14, so that the noise in the input low-voltage current can be effectively filtered out, and a more pure power supply 10 environment is provided, which is conducive to the stable operation of the boost module 4.

[0092] In the above-mentioned embodiment 2, the structures in the above-mentioned embodiment 1 are included, and the processes in the above-mentioned embodiment 1 can be implemented, and the same technical effects can be achieved. To avoid repetition, details are not described here.

[0093] Embodiment 3:

[0094] Optionally, in an example, the high-voltage side loop can include:

[0095] The second current sensor 15 is arranged to obtain the current input information of the low-voltage current in the low-voltage side loop, so that the low-voltage current can be boosted according to the current input information. The low-voltage input relay 12 can be used for switching the input circuit in the no-load condition. The second current sensor 15 and the low-voltage input relay 12 are arranged on the second mounting substrate 13, and the second mounting substrate 13 is arranged on the mounting bracket 5, so that the mounting stability of the second current sensor 15, the low-voltage input relay 12 and the high-voltage side loop can be improved. In the embodiment, the first current sensor 11 can be a non-contact Hall sensor, and the circuit in the low-voltage side loop can not be in direct contact with the first current sensor 11.

[0096] By setting the second current sensor 15, the current output information of the high-voltage current in the high-voltage side loop can be obtained. In the embodiment, the first current sensor 11 can be a non-contact Hall sensor, and the circuit in the high-voltage side loop can not be in direct contact with the first current sensor 11.

[0097] Optionally, in an example, the high-voltage side loop can further include:

[0098] The fuse 16 is connected with the second current sensor 15 and the high-voltage module at both ends.

[0099] By setting the fuse 16, the short circuit protection of the circuit in the high-voltage side loop can be realized, thereby improving the safety of the high-voltage side loop.

[0100] Optionally, in an example, the high-voltage side loop can further include:

[0101] The second filter board 17 is arranged in parallel on the high-voltage circuit main loop between the fuse 16 and the high-voltage module.

[0102] The second filter board 17 is arranged in parallel between the fuse 16 and the high-voltage module. Through the filtering effect of the second filter board 17, the normal high-voltage current in the high-voltage side loop will not flow through, and only the harmonic will be absorbed by the second filter board 17, thereby effectively filtering out the noise in the output high-voltage current, providing a more pure power supply 10 environment, which is conducive to the stable operation of the high-voltage module.

[0103] In the above embodiment 3, each structure in the above embodiment 1 and / or 2 is included, and each process of the above embodiment 1 and / or 2 can be realized, and the same technical effects can be achieved. To avoid repetition, details are not described here.

[0104] The above is only a specific implementation of the present application, and those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system, module and unit described above can refer to the corresponding process in the foregoing method embodiments, which will not be described here. It should be understood that the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed in the present application, and these modifications or replacements should be covered within the protection scope of the present application.

Claims

1. A voltage boosting device, characterized by, The device comprises: a power unit assembly comprising a plurality of boost modules arranged in parallel, each of the boost modules comprising a plurality of boost circuits arranged in parallel; a main loop assembly comprising a low-voltage side loop and a high-voltage side loop, an input end of the low-voltage side loop being connected with a low-voltage module, an output end of the low-voltage side loop being connected with an input end of each of the boost modules, an input end of the high-voltage side loop being connected with an output end of the boost module, and an output end of the high-voltage side loop being connected with a high-voltage module; a control loop assembly, an output end of the control loop assembly being connected with the power unit assembly.

2. The apparatus of claim 1, wherein, The boost device comprises: a mounting bracket, each of the boost modules being arranged side by side on one side of the mounting bracket; a heat dissipation assembly, the heat dissipation assembly being arranged on a side of the mounting bracket away from the boost modules, and the heat dissipation assembly being in abutment with the boost modules.

3. The apparatus of claim 2, wherein, The heat dissipation assembly comprises: a heat sink, the heat sink being arranged on the mounting bracket and in abutment with the boost modules; a heat radiator, the heat radiator being arranged on one side of the heat sink and used for cooling the heat sink.

4. The apparatus of claim 2, wherein, The control loop assembly comprises: a first mounting substrate, the first mounting substrate being arranged on the mounting bracket, a first protection cavity being formed between the first mounting substrate and the mounting bracket, and the boost modules being arranged in the first protection cavity; a control unit, the control unit being arranged on the first mounting substrate and in communication connection with the boost modules.

5. The apparatus of claim 4, wherein, The control loop assembly comprises: a power supply, the power supply being connected with the control unit and the heat dissipation assembly respectively.

6. The apparatus of claim 2, wherein, The low-voltage side loop comprises: a first current sensor, an output end of the first current sensor being connected with an input end of the boost module; a low-voltage input relay, an input end of the low-voltage input relay being connected with the low-voltage module, and an output end of the low-voltage input relay being connected with an input end of the first current sensor. The main loop assembly comprises: a second mounting substrate; 7. The apparatus of claim 6, wherein, the first current sensor, the low-voltage input relay, and the high-voltage side loop are all arranged on the second mounting substrate, the second mounting substrate being arranged on the mounting bracket, a second protection cavity being formed between the second mounting substrate and the mounting bracket, and the boost modules being arranged in the second protection cavity. The low-voltage side loop comprises:

8. The apparatus of claim 6, wherein, a first filter board, the first filter board being arranged in parallel on a low-voltage circuit main loop between the low-voltage input relay and the low-voltage module. The high-voltage side loop comprises:

9. The apparatus of claim 8, wherein, a second current sensor, an input end of the second current sensor being connected with the boost module, and an output end of the second current sensor being connected with the high-voltage module. The high-voltage side loop further comprises:

10. The apparatus of claim 9, wherein, a fuse, two ends of the fuse being connected with the second current sensor and the high-voltage module respectively. The high-voltage side loop further comprises: a second filter board, the second filter board being arranged in parallel on a high-voltage circuit main loop between the fuse and the high-voltage module.

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