Chemical polishing device

Abstract

The utility model discloses a chemical polishing device, and relates to the technical field of polishing. The chemical polishing device comprises a supporting piece, a polishing rotation driving device and a fixing tool. The output end of the polishing rotation driving device is connected with the fixing tool, the polishing rotation driving device can drive the fixing tool to rotate, and the fixing tool is used for installing a workpiece; the polishing rotation driving device is arranged on the supporting piece in an up-down overturning mode and drives the fixing tool to overturn up and down. According to the chemical polishing device, in the chemical polishing process, a workpiece can be automatically moved through the polishing rotation driving device, the consistency in the chemical polishing process is enhanced, and the probability that abnormal clamping occurs due to the fact that the polishing device is not affected by the abrasion state of a polishing pad in the polishing process is reduced; and the position relation between the fixing tool and the chemical polishing disc can be conveniently and uniformly adjusted and maintained, and the polishing quality and efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to polishing technical field, especially a kind of chemical polishing device. BACKGROUND

[0002] Cadmium Zinc Telluride (CZT) is a kind of wide band gap II-VI compound semiconductor material, and its photoelectric property is excellent, which is the preferred epitaxial substrate material for preparing high-performance HgCdTe infrared detector. With the continuous development of infrared detector, the size and surface quality of CZT wafer, the best substrate material for manufacturing infrared devices, are required higher and higher. Chemical polishing process is the last step in the whole CdZnTe surface processing process, and plays a crucial role in obtaining high-quality surface.

[0003] In the chemical polishing process of CZT substrate, the main purpose is to remove the damage layer caused by chemical mechanical polishing or mechanical polishing process on the wafer surface, and at the same time to provide a fresh, clean and undamaged epitaxial surface for growing mercury telluride film. In the polishing process, chemical corrosion plays a dominant role, and there is a slight mechanical action for removing the surface oxide layer. During polishing, the wafer and the chemical polishing disc are filled with pure chemical reagents without abrasive, which directly reacts with the wafer surface to form an oxide layer that is relatively easy to remove. At the same time, the chemical polishing disc rotates and physically rubs with the wafer surface, removing the oxide layer and further removing the mechanical damage layer and invisible defects on the wafer surface.

[0004] In an existing polishing process, a hand-held clamp clamps the workpiece for polishing on a chemical polishing disc, and the polishing process has poor consistency, so it is difficult to ensure the polishing quality.

[0005] Therefore, how to improve the polishing quality is a technical problem to be solved by those skilled in the art at present. UTILITY MODEL CONTENT

[0006] Therefore, the utility model aims to provide a chemical polishing device, which can improve the polishing quality.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0008] A chemical polishing device comprises a support, a polishing rotary drive device and a fixing tool. The output end of the polishing rotary drive device is connected to the fixing tool, the polishing rotary drive device can drive the fixing tool to rotate, and the fixing tool is used for mounting a workpiece. The polishing rotary drive device is arranged on the support in an up-down tilting manner and drives the fixing tool to tilt up and down.

[0009] Preferably, the fixing tool comprises an adsorption device, and a first connecting surface of the adsorption device is used for adsorbing the workpiece.

[0010] Preferably, a mounting groove is further arranged on the first connecting surface to mount the workpiece.

[0011] Preferably, the adsorption device comprises a waxless plate, and the first connecting surface is arranged on the waxless plate.

[0012] Preferably, the fixing tool further comprises a rigid supporting plate, and a second connecting surface opposite to the first connecting surface on the waxless plate is fixedly connected to the supporting plate.

[0013] Preferably, the fixing tool is detachably fixed to the polishing rotary driving device.

[0014] Preferably, an output end of the polishing rotary driving device is further provided with a clamping tool, and the clamping tool clamps and fixes the fixing tool.

[0015] Preferably, the supporting member comprises a turnover shaft.

[0016] The polishing rotary driving device is rotationally connected to the turnover shaft to be turned up and down relative to the turnover shaft.

[0017] Alternatively, the polishing rotary driving device is fixedly connected to the turnover shaft, and the turnover shaft is rotatable to drive the polishing rotary driving device to turn up and down.

[0018] Preferably, a rotation center line Y of the output end of the polishing rotary driving device is perpendicular to a turnover center line X of the supporting member relative to the turnover shaft.

[0019] Preferably, the chemical polishing device further comprises a chemical polishing disc connected with a position adjusting device to adjust the relative position between the chemical polishing disc and the fixing tool.

[0020] The chemical polishing device comprises a supporting member, a polishing rotary driving device and a fixing tool.

[0021] The chemical polishing device can automatically drive the workpiece to move during the chemical polishing process, thereby enhancing the consistency during the chemical polishing process, reducing the probability of abnormal jamming caused by the polishing pad wear state during the polishing process, and facilitating unified adjustment and maintenance of the positional relationship between the fixing tool and the chemical polishing disc. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced as follows. Obviously, the drawings described below are only part of the embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of the provided drawings.

[0023] Figure 1 The specific embodiment one of the chemical polishing device provided by the present application is a structure schematic view of the structure of the polishing rotary driving device and the output end thereof after being flipped upward as a whole.

[0024] Figure 2 The specific embodiment one of the chemical polishing device provided by the present application is a structure schematic view of the structure of the polishing rotary driving device and the output end thereof after being flipped downward as a whole.

[0025] Figure 3 The specific embodiment one of the chemical polishing device provided by the present application is a structure schematic view of the structure during chemical polishing.

[0026] Reference signs:

[0027] Supporting member 1, flipping shaft 11;

[0028] Polishing rotary driving device 2, clamping tool 21;

[0029] Fixed tool 3, wax-free plate 31, first connecting surface 311, mounting groove 3111, second connecting surface 312, supporting plate 32, adsorption device 33;

[0030] Workpiece 4;

[0031] Chemical polishing disc 5;

[0032] Flipping center line X, rotating center line Y. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] The core of the present application is to provide a chemical polishing device, which can improve the polishing quality.

[0035] The specific embodiment one of the chemical polishing device provided by the present application is described below with reference to Figures 1 to 3, including a support 1, a polishing rotary driving device 2 and a fixing tool 3.

[0036] The output end of the polishing rotary driving device 2 is connected to the fixing tool 3, and the polishing rotary driving device 2 can drive the fixing tool 3 to rotate, and the fixing tool 3 is used to install a workpiece 4. The workpiece 4 is specifically a CZT substrate; according to actual needs, it can also be applied to the polishing of other workpieces 4. By starting the polishing rotary driving device 2, the fixing tool 3 and the workpiece 4 thereon can be driven to rotate for polishing. The polishing rotary driving device 2 is specifically a motor.

[0037] The polishing rotary driving device 2 is arranged on the support 1 to be able to flip up and down and drive the fixing tool 3 to flip up and down, and specifically can rotate 180° or 360° around the corresponding flipping center line X. Specifically, when the polishing rotary driving device 2 flips up and down, the orientation of the output end of the polishing rotary driving device 2 can change synchronously, such as shown in Figure 1 When the polishing rotary driving device 2 flips up, the output end of the polishing rotary driving device 2 can specifically face upward, facilitating the installation of the workpiece 4, such as shown in Figure 2 After the output end of the polishing rotary driving device 2 and the workpiece 4 are flipped down to face the chemical polishing disc 5, subsequent chemical polishing operations can be performed.

[0038] During chemical polishing, after the workpiece 4 is fixed to the fixing tool 3, the workpiece 4 is flipped to a set position and cooperates with the chemical polishing disc 5, there is a chemical reagent between the chemical polishing disc 5 and the workpiece 4, and the polishing rotary driving device 2 drives the fixing tool 3 and the workpiece 4 thereon to rotate, the workpiece 4 rubs against the chemical polishing disc 5, realizing chemical polishing of the workpiece 4.

[0039] Such a chemical polishing device can automatically move the workpiece 4 during chemical polishing by the polishing rotary driving device 2, enhancing consistency during chemical polishing, reducing the probability of abnormal jamming during polishing due to the polishing pad wear state and the like, and the positional relationship between the fixing tool 3 and the chemical polishing disc 5 is also convenient for unified adjustment and maintenance, which can improve the polishing quality and efficiency.

[0040] In the fixing tool 3, as shown in Figure 2 The fixing tool 3 includes an adsorption device 33, and a first connecting surface 311 of the adsorption device 33 is used to adsorb and fix the workpiece 4 to avoid damaging the workpiece 4.

[0041] Specifically, as shown in Figure 1 and Figure 2As shown, the first connecting surface 311 is further provided with a mounting groove 3111 to mount the workpiece 4, which can improve the positioning effect of the workpiece 4. The mounting groove 3111 can be matched with the size of the workpiece 4 to avoid the movement of the workpiece 4 in the mounting groove 3111; in addition, after mounting, the workpiece 4 protrudes from the notch of the mounting groove 3111 to ensure that the workpiece 4 can be smoothly polished.

[0042] Specifically, the adsorption device 33 includes a waxless plate 31, and the first connecting surface 311 is arranged on the waxless plate 31, specifically, the end surface away from the polishing rotary driving device 2. The waxless plate 31 has adsorption force and can be made of polyurethane material, which is corrosion-resistant and has certain adsorption force. During polishing, the first connecting surface 311 on the waxless plate 31 is adsorbed and fixed to the workpiece 4 through adsorption force, has good adsorption performance, can reduce the introduction of foreign matters in the polishing process, ensures the adsorption force between the workpiece 4 and the fixing tool 3, and avoids the corrosion abnormality caused by the falling of the substrate from the fixing tool 3.

[0043] The fixing tool 3 further includes a rigid support plate 32, and a second connecting surface 312 opposite to the first connecting surface 311 on the waxless plate 31 is fixedly connected to the support plate 32.

[0044] Specifically, the support plate 32 provides support for the waxless plate 31. Specifically, the support plate 32 can be made of a glass plate, and in other embodiments, can also be made of other rigid plastic plates. The support plate 32 and the waxless plate 31 can be adhesively fixed.

[0045] Of course, in other embodiments, the adsorption device 33 can also use a negative pressure vacuum air suction device to adsorb and fix the workpiece 4; or in other embodiments, the fixing tool 3 can also fix the workpiece 4 through adhesion, clamping, clamping and the like.

[0046] To further facilitate the feeding and discharging, the fixing tool 3 is detachably fixed to the polishing rotary driving device 2, so that when feeding and discharging, the fixing tool 3 can be detached from the polishing rotary driving device 2 to mount or dismount the workpiece 4 on the fixing tool 3, which is convenient to operate and can reduce the damage to the workpiece 4 during feeding and discharging.

[0047] Specifically, as shown in Figs. Figure 1 and Figure 2 The output end of the polishing rotary driving device 2 is further provided with a clamping tool 21, which clamps and fixes the fixing tool 3, so that the fixing tool 3 is detachably connected to the output end of the polishing rotary driving device 2, which is convenient to operate. The clamping tool 21 clamps the support plate 32 to ensure the reliability of clamping. In addition, the clamping tool 21 can be provided with an adjusting member to adjust the clamping action and clamping force of the clamping tool 21. In addition, according to actual needs, the size of the clamping tool 21 can be adjusted; the support plate 32 and the waxless plate 31 can have multiple specifications.

[0048] At this time, the polishing rotary driving device 2 clamps the polishing fixture 21 and the substrate to rotate for etching and polishing, and the support plate 32 and the waxless plate 31 hold the substrate and provide slight pressure during the polishing process.

[0049] Of course, in other embodiments, the fixed fixture 3 can also be directly detachably connected to the output end of the polishing rotary driving device 2.

[0050] In the support 1, the support 1 includes a turnover shaft 11, and the polishing rotary driving device 2 and the connected structure are overturned as a whole through the turnover shaft 11 to facilitate the taking and placing of the substrate and the adsorption device 33, and the structure is simple. The polishing rotary driving device 2 is rotationally connected to the turnover shaft 11 to be overturned up and down relative to the turnover shaft 11. The turnover shaft 11 can be fixed at a set position or on a device, and specifically, its axial direction can be kept horizontal, or in other embodiments, its axial direction has a certain angle relative to the horizontal direction according to needs, and the axis of the turnover shaft 11 is the turnover center line X of the polishing rotary driving device 2 for overturning up and down.

[0051] When overturning, the worker can manually push the polishing rotary driving device 2 to overturn around the turnover shaft 11, and damping can be set between the turnover shaft 11 and the polishing rotary driving device 2, so that it is not necessary to always manually hold the polishing rotary driving device 2 to position, and the relative position relationship between the turnover shaft 11 and the polishing rotary driving device 2 can be kept after overturning under the action of damping force; or, a locking structure can also be arranged between the turnover shaft 11 and the polishing rotary driving device 2 to lock the relative position of the turnover shaft 11 and the polishing rotary driving device 2 after the turnover shaft 11 and the polishing rotary driving device 2 are relatively rotated by a set angle.

[0052] Alternatively, the polishing rotary driving device 2 is fixedly connected to the turnover shaft 11, and the turnover shaft 11 rotates to drive the polishing rotary driving device 2 to overturn up and down around the turnover center line X. At this time, the turnover shaft 11 is rotationally connected to other fixed structure, and a damping member can also be added between the turnover shaft 11 and the fixed structure to realize positioning.

[0053] Of course, in other embodiments, the support 1 can also include a turnover driving device, and the polishing rotary driving device 2 or the turnover shaft 11 is connected to the turnover driving device to realize automatic overturning of the polishing rotary driving device 2.

[0054] In the polishing rotary driving device 2, as shown in Figure 2As shown, the rotation center line Y of the output end of the polishing rotary drive device 2 and the rotation center line X of the support member 1 are perpendicular to the rotation center line X of the rotation shaft 11. In this case, when the rotation center line X is set horizontally, the rotation center line Y is set vertically, and the workpiece 4 rotates around this rotation center line Y, facilitating accurate positioning of the workpiece 4 and the chemical polishing disk 5. Alternatively, the rotation center line X and the rotation center line Y can also be other angle relationships greater than 0.

[0055] The chemical polishing apparatus also includes a chemical polishing disc 5, such as Figure 3 As shown, the chemical polishing disc 5 is connected to a position adjustment device, specifically including a lifting drive device, to adjust the relative position of the chemical polishing disc 5 and the fixed fixture 3.

[0056] Among them, such as Figure 3 As shown, after the workpiece 4 is installed in the fixed fixture 3, it can be flipped down to a designated position. The chemical polishing disc 5 is located below the workpiece 4. The position adjustment device drives the chemical polishing disc 5 to move and adjust the positional relationship between the chemical polishing disc 5 and the workpiece 4 to meet the requirements of chemical polishing. For example, before the substrate comes into contact with the chemical polishing disc 5 below, the vertical distance between the chemical polishing disc 5 and the substrate can be adjusted as needed. After that, the polishing rotation drive device 2 drives the substrate to rotate to perform chemical polishing.

[0057] Of course, in other embodiments, the support 1 may also include a mobile device to adjust the overall displacement of the polishing rotary drive 2 and the components connected thereto.

[0058] The working principle of the chemical polishing device in this embodiment includes: first, bonding the wax-free plate 31 to the support plate 32; placing the substrate into the mounting groove 3111 of the wax-free plate 31 to adsorb the substrate; rotating the flip shaft 11 to make the clamping surface of the clamping fixture 21 face upwards; placing the support plate 32 into the clamping fixture 21; controlling the knob on the clamping fixture 21 to clamp the support plate 32; rotating the flip shaft 11 to make the surface of the substrate to be polished face downwards; adjusting the positional relationship with the chemical polishing disk 5; setting the required rotation speed and rotation time of the polishing rotary drive device 2; simultaneously turning the switch of the polishing rotary drive device 2 and the switch of the chemical polishing disk 5 below to start the polishing operation; after the operation is completed, the polishing rotary drive device 2 automatically stops; rotating the flip shaft 11 to make the clamping surface of the clamping fixture 21 face upwards; removing the support plate 32; removing the substrate; and completing the operation.

[0059] The chemical polishing device in the embodiment can efficiently remove damage, can comprehensively make up for the poor consistency of the polishing process of the traditional polishing method, can improve the damage removal efficiency of the chemical polishing, can eliminate the risk points caused by the change of the surface state of the polishing pad in the process, can meet the strict requirements of different epitaxial processes on the quality of the substrate, can improve the market competitiveness and user satisfaction of the product, meanwhile, the device has simple structure, low manufacturing cost, high applicability and simple operation method, is suitable for substrates of different sizes, the overall appearance of the equipment is made of corrosion-resistant and non-abrasive materials, and the equipment itself does not affect the polishing process.

[0060] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be intervening elements. When an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can be present. In addition, the terms "a", "an", and "the" are intended to include both singular and plural forms, unless the context clearly indicates otherwise.

[0061] The terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate an orientation or positional relationship based on the orientation or position shown in the drawings, and are used only for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated.

[0062] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application.

[0063] The embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other.

[0064] The chemical polishing device provided by the present application has been described in detail. The principles and implementation methods of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the method and core idea of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A chemical polishing apparatus characterized by comprising: Including support (1), polishing rotation driving device (2) and fixed tooling (3), the output end of polishing rotation driving device (2) is connected with fixed tooling (3), polishing rotation driving device (2) can drive fixed tooling (3) rotation, fixed tooling (3) is used to install workpiece (4), polishing rotation driving device (2) can be set up on support (1) and drive fixed tooling (3) upside down.

2. The chemical polishing apparatus according to claim 1, wherein The fixed tooling (3) includes an adsorption device (33), and a first connecting surface (311) of the adsorption device (33) is used for adsorbing a workpiece (4).

3. The chemical polishing apparatus according to claim 2, wherein The first connecting surface (311) is further provided with a mounting groove (3111) for mounting the workpiece (4).

4. The chemical polishing apparatus according to claim 2, wherein The adsorption device (33) includes a waxless plate (31), and the first connecting surface (311) is arranged on the waxless plate (31).

5. The chemical polishing apparatus according to claim 4, wherein The fixed tooling (3) further includes a rigid support plate (32), and a second connecting surface (312) opposite to the first connecting surface (311) of the waxless plate (31) is fixedly connected to the support plate (32).

6. The chemical polishing apparatus according to any one of claims 1 to 5, wherein The fixed tooling (3) is detachably fixed to the polishing rotation driving device (2).

7. The chemical polishing apparatus according to any one of claims 1 to 5, wherein The output end of the polishing rotation driving device (2) is further provided with a clamping tool (21), and the clamping tool (21) clamps and fixes the fixed tooling (3).

8. The chemical polishing apparatus according to any one of claims 1 to 5, wherein The support (1) includes a turnover shaft (11). The polishing rotation driving device (2) is rotationally connected to the turnover shaft (11) to be turned upside down relative to the turnover shaft (11). Alternatively, the polishing rotation driving device (2) is fixedly connected to the turnover shaft (11), and the turnover shaft (11) is rotated to drive the polishing rotation driving device (2) to be turned upside down.

9. The chemical polishing apparatus according to claim 8, wherein The rotation center line (Y) of the output end of the polishing rotation driving device (2) is perpendicular to the turnover center line (X) of the support (1) relative to the turnover shaft (11).

10. The chemical polishing apparatus according to any one of claims 1 to 5, wherein Further comprising a chemical polishing disc (5), the chemical polishing disc (5) is connected with a position adjusting device to adjust the relative position of the chemical polishing disc (5) and the fixed tooling (3).

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