Silicon wafer blanking processing device
By automatically removing the bags and paper from silicon wafers using robotic arms and suction cups, the problems of high labor intensity and silicon wafer damage caused by manual operation are solved, achieving efficient and non-destructive silicon wafer unloading.
Patent Information
- Application Number
- CN202423046124.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2034-12-10
AI Technical Summary
In existing technologies, silicon wafer blanking relies on manual operation, which results in high labor intensity, low efficiency, and easy contamination or damage to the silicon wafers, affecting quality.
The system employs a robotic arm equipped with grippers, a bag-picking section, and a paper-picking section. The robotic arm grasps silicon wafers and uses bag-picking and paper-picking suction cups to automatically remove the bags and paper pieces. Combined with a conveyor line and a receiving box, the system achieves automated processing.
It has automated the silicon wafer unloading process, improved efficiency, reduced the labor intensity of operators, and ensured that the silicon wafers are not contaminated or damaged, thus guaranteeing the quality of the silicon wafers.
Smart Images
Figure CN223722105U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of silicon wafer blanking, especially relates to a silicon wafer blanking treatment device. BACKGROUND
[0002] The silicon wafer is a thin piece made of high-purity crystalline silicon, and existing finished silicon wafers are usually stored in boxes. After the silicon wafers are unpacked, there are bags and paper sheets on the surface of the silicon wafers. To meet the use requirements of the silicon wafers, the silicon wafers need to be subjected to blanking treatment to remove the bags and paper sheets on the surface of the silicon wafers.
[0003] At present, the blanking treatment of the silicon wafers is usually performed by manual operation to remove the bags and paper sheets on the surface of the silicon wafers, that is, the operator manually peels off the bags and paper sheets on the surface of the silicon wafers. This method consumes a large amount of manpower, increases the labor intensity of the operator, and has low efficiency of manual operation. In addition, the silicon wafers are easily contaminated or damaged during the operation process, which affects the quality of the silicon wafers. SUMMARY
[0004] The utility model overcomes the defects of the prior art and provides a silicon wafer blanking treatment device to solve the problems in the prior art.
[0005] To achieve the above-mentioned purpose, the utility model adopts the technical scheme of a silicon wafer blanking treatment device, which comprises
[0006] A mechanical arm is provided with a clamp at the end to grasp the silicon wafer blanking;
[0007] A bag taking part is located in the operation area of the mechanical arm, and the bag taking part comprises a bag taking panel and bag taking suction cups, which are uniformly distributed on the bag taking panel to suck the bags on the silicon wafer;
[0008] A conveying line body is located in the operation area of the mechanical arm, and the conveying line body conveys the silicon wafer after the bags are taken off;
[0009] A paper taking part is located above the conveying line body, and the paper taking part comprises a horizontal movement air cylinder, a paper taking air cylinder, and paper taking suction cups. The horizontal movement air cylinder drives the paper taking air cylinder, and the paper taking air cylinder drives the paper taking suction cups to approach the silicon wafer to adsorb the paper sheet on the surface of the silicon wafer.
[0010] In a preferred embodiment of the utility model, the clamp comprises a mounting plate and a clamping structure. The mounting plate is fixed at the end of the mechanical arm. The clamping structure is in multiple columns and is distributed on the mounting plate. The spacing between adjacent columns of the clamping structure is adjustable.
[0011] In a preferred embodiment of the utility model, the installation plate is provided with a variable distance cylinder, the variable distance cylinder drives a clamping structure, and the distance between adjacent clamping structures is changed.
[0012] In a preferred embodiment of the utility model, the clamping structure comprises a clamping cylinder and a clamping plate, the clamping cylinder drives the clamping plate to clamp a silicon wafer, and the clamping plate is provided with an inductor.
[0013] In a preferred embodiment of the utility model, the installation plate is provided with a detection camera on the side, so as to detect and position the silicon wafer.
[0014] In a preferred embodiment of the utility model, the installation rack is further provided, and the bag taking part and the conveying line body are located on the installation rack.
[0015] In a preferred embodiment of the utility model, the installation rack is provided with a first material collecting box on one side, the bag taking panel is connected with the installation rack through a turnover cylinder, the turnover cylinder drives the bag taking panel to rotate, and the taken bag is guided into the first material collecting box.
[0016] In a preferred embodiment of the utility model, the installation rack is provided with a second material collecting box on one side, the second material collecting box corresponds to the position of the paper taking part, so as to guide the taken paper into the second material collecting box.
[0017] The utility model solves the defects in the background art, and has the following beneficial effects:
[0018] The silicon wafer unloading treatment device can quickly peel and take off the bag and the paper on the surface of the silicon wafer during the unloading process of the silicon wafer, does not need manual operation, improves the processing efficiency, reduces the labor intensity of the operator, does not cause pollution or damage to the silicon wafer, and guarantees the quality of the silicon wafer. ACCURACY OF DRAWINGS
[0019] The utility model will be further described in connection with the drawings and embodiments;
[0020] Figure 1 It is the whole structure schematic diagram of preferred embodiment of the utility model;
[0021] Figure 2 It is the structure schematic diagram of preferred embodiment of the utility model clamp;
[0022] Figure 3 It is the structure schematic diagram of preferred embodiment of the utility model bag taking part;
[0023] Figure 4 It is the structure schematic diagram of preferred embodiment of the utility model paper taking part;
[0024] Fig. 10, mechanical arm; 11, clamp; 111, mounting plate; 112, clamping structure; 1121, clamping cylinder; 1122, clamping plate; 20, bag taking part; 21, bag taking panel; 22, bag taking suction cup; 30, conveying line body; 40, paper taking part; 41, horizontal movement cylinder; 42, paper taking cylinder; 43, paper taking suction cup; 50, distance changing cylinder; 60, sensor; 70, detection camera; 80, mounting frame; 81, first receiving box; 82, second receiving box; 90, overturning cylinder. DETAILED DESCRIPTION
[0025] In the following, a plurality of embodiments of the present application will be disclosed with reference to the drawings. For the purpose of clear illustration, many details of the embodiments will be described in the following description. However, it should be understood that these details of the embodiments should not be used to limit the present application. That is, in some embodiments of the present application, these details of the embodiments are not necessary. In addition, for the purpose of simplifying the drawings, some commonly used structures and components will be shown in the drawings in a simple schematic manner.
[0026] In addition, in the present application, the description such as "first", "second", etc. is only for the purpose of description, and does not mean to particularly indicate the order or sequence, nor to limit the present application. It is merely for the purpose of distinguishing components or operations described by the same technical terms. It should not be understood as indicating or implying the relative importance of the technical features indicated or the number of technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of a person skilled in the art. When the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.
[0027] The present embodiment provides a silicon wafer unloading treatment device, which realizes rapid unloading treatment of silicon wafers, can quickly peel off and take down the bags and paper sheets on the surface of the silicon wafers during the unloading process of the silicon wafers, does not need manual operation, improves the processing efficiency while reducing the labor intensity of the operator, and will not cause pollution or damage to the silicon wafers, thereby ensuring the quality of the silicon wafers.
[0028] In combination Figures 1 to 4 As shown in the drawings, the silicon wafer unloading treatment device of the present embodiment includes a mechanical arm 10, a bag taking part 20, a conveying line body 30, and a paper taking part 40. The silicon wafer is clamped by the mechanical arm 10, the mechanical arm 10 moves the silicon wafer to the bag taking part 20, the bag taking part 20 takes down the bag on the silicon wafer, then the mechanical arm 10 moves the silicon wafer to the conveying line body 30, and the paper taking part 40 on the conveying line body 30 takes down the paper sheet on the surface of the silicon wafer, that is, the unloading treatment of the silicon wafer is completed.
[0029] In the embodiment, the silicon wafer discharging treatment device further comprises a mounting rack 80, the bag taking part 20 and the conveying line body 30 are located on the mounting rack 80, and the mounting rack 80 is provided with a first material collecting box 81 and a second material collecting box 82 on the side surface, the first material collecting box 81 corresponds to the position of the bag taking part 20, and the bag taking part 20 is used for collecting the bag taken from the silicon wafer, and the second material collecting box 82 corresponds to the position of the paper taking part 40, and the paper taking part 40 is used for collecting the paper taken from the silicon wafer.
[0030] In combination Figure 1 with Figure 2 , the mechanical arm 10 of the embodiment is provided with a clamp 11 at the end to grasp the silicon wafer, the clamp 11 comprises a mounting plate 111 and a plurality of clamping structures 112, the mounting plate 111 is fixed to the end of the mechanical arm 10, the clamping structures 112 are distributed in multiple columns on the mounting plate 111, the spacing between the adjacent clamping structures 112 is adjustable, the clamping structure 112 comprises a clamping cylinder 1121 and a clamping plate 1122, the clamping cylinder 1121 drives the clamping plate 1122 to clamp the silicon wafer, and the inductor 60 is arranged on the clamping plate 1122, the clamping structures 112 of the embodiment are distributed in two columns, the spacing between the two clamping structures 112 is adjustable, the clamping plate 1122 is driven by the clamping cylinder 1121, the two clamping plates 1122 moving towards each other clamp the silicon wafer, the inductor 60 on the clamping plate 1122 can determine whether the silicon wafer is grasped, and the clamp 11 is driven by the mechanical arm 10 after the silicon wafer is grasped, so that the silicon wafer is transferred.
[0031] In the embodiment, the mounting plate 111 is provided with a variable-distance cylinder 50, the variable-distance cylinder 50 drives a clamping structure 112 to change the spacing between the adjacent clamping structures 112, so that the silicon wafer is conveniently placed into the conveying line body 30.
[0032] Further, the mounting plate 111 is provided with a detection camera 70 on the side surface to detect and position the silicon wafer, the silicon wafer is visually detected by the detection camera 70 before the silicon wafer is grasped, so that whether the silicon wafer is in a grasping position is determined, and then the grasping operation is performed.
[0033] In combination Figure 1 with Figure 3 , the bag taking part 20 of the embodiment is located in the operation area of the mechanical arm 10, the bag taking part 20 comprises a bag taking panel 21 and a bag taking suction cup 22, the bag taking suction cup 22 is uniformly distributed on the bag taking panel 21 to suck the bag on the silicon wafer, when the mechanical arm 10 transfers the silicon wafer to the bag taking position, the bag taking suction cup 22 is used for sucking the bag on the surface of the silicon wafer, and then the mechanical arm 10 transfers the silicon wafer to another position, so that the bag taking operation is realized.
[0034] In the embodiment, the bag taking panel 21 is connected with the mounting frame 80 through the turnover cylinder 90, the turnover cylinder 90 drives the bag taking panel 21 to rotate, and the removed bag is guided into the first material collecting box 81. After the bag is sucked by the bag sucking disc 22, the turnover cylinder 90 turns over the bag taking panel 21, so that the bag sucking disc 22 faces the first material collecting box 81, and then the bag sucking disc 22 is decompressed, and the bag is directly guided into the first material collecting box 81.
[0035] In combination Figure 1 With Figure 4 As shown in the figure, the paper taking part 40 of the embodiment is located above the conveying line body 30, the paper taking part 40 includes a horizontal moving cylinder 41, a paper taking cylinder 42 and a paper taking sucking disc 43. The horizontal moving cylinder 41 drives the paper taking cylinder 42, the paper taking cylinder 42 drives the paper taking sucking disc 43 to approach the silicon wafer, the paper on the surface of the silicon wafer is sucked, and the silicon wafer is conveyed on the conveying line body 30. When the silicon wafer stops, the horizontal moving cylinder 41 of the paper taking part 40 drives the paper taking cylinder 42 to be above the silicon wafer, the paper taking cylinder 42 drives the paper taking sucking disc 43 to approach the silicon wafer, the paper taking sucking disc 43 sucks the paper on the silicon wafer, and then the paper taking cylinder 42 and the horizontal moving cylinder 41 are reset, the paper is moved to the second material collecting box 82, and the paper taking process of the silicon wafer is completed.
[0036] In the embodiment, the conveying line body 30 is provided with a blocking cylinder, the silicon wafer is blocked and positioned by the blocking cylinder, and then the paper taking process is performed.
[0037] In actual use, the silicon wafer is grabbed by the mechanical arm 10, is first moved to the bag taking position, is taken by the bag taking part 20, is placed on the conveying line body 30 after the bag taking is completed, and is conveyed. When the silicon wafer is moved to the paper taking position and stops, the paper on the surface of the silicon wafer is taken by the paper taking part 40.
[0038] In summary, the silicon wafer unloading treatment device of the embodiment realizes rapid unloading treatment of the silicon wafer, can rapidly strip and take the bag and the paper on the surface of the silicon wafer in the silicon wafer unloading process, does not need manual operation, improves the treatment efficiency, reduces the labor intensity of the operator, and does not cause pollution or damage to the silicon wafer, so that the quality of the silicon wafer is guaranteed.
[0039] While the present application has been described with reference to various embodiments, it will be understood that many modifications and variations of the present application are possible, as they will occur to those skilled in the art in the scope of the application. That is, the methods, systems, or devices discussed above are examples. It is contemplated that various configurations can be made without parting from the scope of the application. For example, the method can be performed in a different order or the various stages can be combined or omitted. Also, features described with respect to certain configurations can be combined in a variety of other configurations. Different aspects and elements of configurations can be combined in similar ways. Also, a person of ordinary skill in the art will recognize various elements from the description can be implemented in hardware, software, firmware, middleware, code, or any combination thereof. Moreover, some of what has been described above can be performed remotely by a remote computing device. When implemented in software, the functions can be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media include both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media can be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Also, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, or twisted pair, then the coaxial cable, fiber optic cable, or twisted pair are included in the definition of medium. Disk and disc, as used herein, include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), and Blu-Ray® disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.
[0040] In the description specific details have been set forth in order to provide a thorough understanding of the exemplary configurations including implementations. However, configurations can be practiced without some of the specific details, for example, well-known circuits, processes algorithms, structures, and techniques have not been described in detail because such details are already well known. The description is only provided to illustrate example configurations and is not limitative of the scope, applicability, or configurations of claims. Rather, the above description of configurations will provide those skilled in the art with an enabling description that can be used in conjunction with the appended claims to im plement and use the described technologies. Various changes to the function and arrangements of elements can be made without departing from the spirit or scope of the disclosure.
[0041] Moreover, although each of the operations can be described as a sequential process, many of the operations can occur in parallel, or concurrently. In addition, the order of the operations can be rearranged. A process might have other steps not discussed herein. Further, examples of the methods can be implemented by hardware, software, firmware, middleware, code, or any combination thereof. When implemented in software, code, or code segments, the program code or code segments can be stored in a non-transitory computer-readable medium such as a storage medium. Storage media can be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer.
[0042] In view of the above, it will be seen that the details set forth in the above description of the application are considered as illustrative only of the principles of the application and not limiting. It is therefore intended that there be as many changes and modifications as can be thought of by those ordinarily skilled in the art, keeping within the spirit and scope of the application. Accordingly, what is desired to be secured by Letters Patent is the subject matter as follows:
Claims
1. A silicon wafer feeding and processing device, characterized in that, include A robotic arm (10) is provided with a gripper (11) at its end to grab silicon wafers. Bag-taking section (20), the bag-taking section (20) is located in the operating area of the robotic arm (10), the bag-taking section (20) includes a bag-taking panel (21) and a bag-taking suction cup (22), the bag-taking suction cup (22) is evenly distributed on the bag-taking panel (21) to pick up the bags on the silicon wafer; A conveyor line (30) is located within the operating area of the robotic arm (10) and conveys the silicon wafers after they have been bagged. The paper taking part (40) is located above the conveyor line (30). The paper taking part (40) includes a transverse cylinder (41), a paper taking cylinder (42), and a paper taking suction cup (43). The transverse cylinder (41) drives the paper taking cylinder (42), and the paper taking cylinder (42) drives the paper taking suction cup (43) to approach the silicon wafer and adsorb the paper on the surface of the silicon wafer.
2. The silicon wafer feeding and processing device according to claim 1, characterized in that, The fixture (11) includes a mounting plate (111) and a clamping structure (112). The mounting plate (111) is fixed to the end of the robotic arm (10). There are multiple clamping structures (112) arranged in multiple columns on the mounting plate (111). The spacing between adjacent columns of clamping structures (112) is adjustable.
3. The silicon wafer feeding and processing device according to claim 2, characterized in that, A variable pitch cylinder (50) is provided on the mounting plate (111), which drives one of the clamping structures (112) to change the spacing between adjacent clamping structures (112).
4. The silicon wafer feeding and processing device according to claim 2, characterized in that, The clamping structure (112) includes a clamping cylinder (1121) and a clamping plate (1122). The clamping cylinder (1121) drives the clamping plate (1122) to clamp the silicon wafer. A sensor (60) is provided on the clamping plate (1122).
5. A silicon wafer feeding and processing device according to claim 2, characterized in that, A detection camera (70) is provided on the side of the mounting plate (111) to detect and position the silicon wafer.
6. The silicon wafer feeding and processing device according to claim 1, characterized in that, It also includes a mounting frame (80), on which the bag taking part (20) and the conveyor line (30) are located.
7. A silicon wafer feeding and processing device according to claim 6, characterized in that, A first receiving box (81) is provided on one side of the mounting frame (80). The bag taking panel (21) is connected to the mounting frame (80) through a flip cylinder (90). The flip cylinder (90) drives the bag taking panel (21) to rotate and guide the removed bag into the first receiving box (81).
8. A silicon wafer feeding and processing device according to claim 6, characterized in that, A second receiving box (82) is provided on one side of the mounting frame (80). The second receiving box (82) corresponds to the position of the paper taking part (40) so as to guide the paper pieces taken out into the second receiving box (82).