Thermal resistance test auxiliary device of heat dissipation MOSFET

Abstract

The utility model belongs to the technical field of thermal resistance testing, and particularly relates to a thermal resistance testing auxiliary device of a heat dissipation MOSFET, which comprises a test board, a lifting rotating plate and a driving mechanism, a liquid cooling plate is fixedly arranged at the top of the test board, and at least two heat sinks are arranged at the top of the liquid cooling plate at equal intervals; the lifting rotating plate lifts and is rotatably located above the test board, and a mounting frame is arranged on the lifting rotating plate and located above each heat sink. When the PCB needs to be turned over, the servo double-head motor can be started to drive the driving rod to rotate, and the screw rod can be driven to rotate through the driving bevel gear and the follow-up bevel gear, so that after the lifting rotating plate ascends, the worm is controlled to rotate through the driving piece, and the connecting rod and the lifting rotating plate are driven to integrally turn over by 180 degrees through the worm gear; and then the servo double-head motor is started to reversely control the driving rod to rotate, so that the lifting rotating plate descends, and the technical problems that a plurality of double-sided heat dissipation MOSFETs are inconvenient to test and the PCB is inconvenient to turn over are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat resistance test technical field, concretely is a heat resistance test auxiliary device of heat dissipation MOSFET. BACKGROUND

[0002] The power device MOSFET will produce a large amount of heat in the work, and the working temperature of MOSFET can be predicted or monitored to carry out overheating protection in time, and the working reliability is increased. Generally, the surface-mounted SMT power device MOSFET adopts TO package, and the chip junction Die transmits heat to the bottom heat sink for heat dissipation when working. In order to improve the heat dissipation performance of MOSFET, the chip manufacturer designs the double-sided heat dissipation MOSFET of DSOP package, and the existing publication (announcement) No. CN219532987U discloses a heat resistance test auxiliary device of double-sided heat dissipation MOSFET, which comprises a liquid cooling plate, a heat sink, a PCB circuit board, a heat insulation pad and a pressing clamp.

[0003] The above-mentioned patent has certain inconvenience in use. First, only one double-sided heat dissipation MOSFET can be tested at a time, and when there are many double-sided heat dissipation MOSFETs to be tested, the test is inconvenient. Secondly, when one side is tested, the PCB circuit board needs to be turned over by 180° to test the other side, which increases the disassembly and assembly steps and reduces the test efficiency. Therefore, a heat resistance test auxiliary device of heat dissipation MOSFET needs to be developed. CONTENT OF THE UTILITY MODEL

[0004] The purpose of this part is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part and the abstract of the specification and the utility model name to avoid obscuring the purpose of this part, the abstract of the specification and the utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] To solve the above technical problems, according to one aspect of the utility model, the utility model provides the following technical scheme:

[0006] A heat resistance test auxiliary device of heat dissipation MOSFET comprises:

[0007] A test table is fixedly provided with a liquid cooling plate on the top, and at least two heat sinks are equidistantly arranged on the top of the liquid cooling plate.

[0008] The lifting and rotating plate is lifted and rotated above the test table, mounting frames are arranged above each heat sink on the lifting and rotating plate, double-sided heat dissipation MOSFETs are arranged on the inner side of the mounting frames and are detachably arranged by clamping mechanisms, the double-sided heat dissipation MOSFETs are welded on the PCB circuit board, the thickness of the double-sided heat dissipation MOSFETs is not less than the thickness of the lifting and rotating plate and the clamping mechanisms, and the convexes on the surface of the heat sink are in contact with the bottom surface of the double-sided heat dissipation MOSFETs after penetrating through the PCB circuit board.

[0009] The driving mechanism is arranged on the test table and is used for driving the lifting and rotating plate to ascend, then driving all the PCB circuit boards to overturn 180° and then descending, the driving mechanism comprises "L"-shaped fixing frames which are fixed on the side walls of the test table in a left-right symmetry mode, vertical lead screws are rotationally arranged on the inner side walls of the fixing frames, lifting blocks are slidingly arranged on the inner side walls of the fixing frames in a lifting and abutting mode, the upper and lower walls of the lifting blocks are screw-connected with the rod bodies of the lead screws, a connecting rod is rotationally arranged on the side wall of the lifting block close to the lifting and rotating plate through a bearing seat, the other end of the connecting rod is fixed on the side wall of the lifting and rotating plate, an "L"-shaped mounting frame is arranged on the side of the lifting block close to the connecting rod, a worm wheel is fixedly arranged on the rod body of the connecting rod, and a worm is rotationally arranged on the side wall of the mounting frame and is engaged with the worm wheel.

[0010] As a preferred scheme of the heat resistance test auxiliary device for the heat dissipation MOSFET, the clamping mechanism comprises sliding rods which slidingly penetrate the front side walls of the mounting frames, clamping plates are fixedly arranged on one end of the sliding rods, springs are fixedly arranged between the clamping plates and the inner side walls of the mounting frames, the rod bodies of the sliding rods are spaced apart from the inner side of the spring, the spring pushes the clamping plates to abut against one side of the double-sided heat dissipation MOSFET, and all the sliding rods are provided with a pulling plate at the end away from the clamping plate.

[0011] As a preferred scheme of the heat resistance test auxiliary device for the heat dissipation MOSFET, the lead angle of the worm is less than the equivalent friction angle between the meshing gear teeth of the worm wheel, and the worm and the worm wheel have self-locking property.

[0012] As a preferred scheme of the heat resistance test auxiliary device for the heat dissipation MOSFET, a driving member is arranged on the side wall of the mounting frame and is used for controlling the rotation of the worm.

[0013] As a preferred scheme of the heat resistance test auxiliary device for the heat dissipation MOSFET, the driving mechanism further comprises a servo double-head motor which is fixed in the middle of the bottom wall of the test table, a driving bevel gear is connected to the output shaft of the servo double-head motor through a driving rod, the lower end of the lead screw extends and rotationally penetrates the bottom wall of the fixing frame and is provided with a follower bevel gear which is engaged with the driving bevel gear.

[0014] As a preferred form of the heat dissipation MOSFET thermal resistance test auxiliary device, the bottom wall of the test table is fixedly provided with a support, and the rod body of the driving rod is rotatably penetrated through the side wall of the support through a bearing sleeve.

[0015] The utility model discloses the beneficial effect is: when need to turn over PCB circuit board, can start servo double -end motor drive driving rod rotation, through driving bevel gear and follow -up bevel gear can drive screw rod rotation, thereby make the lift rotary plate rise, then through the drive member control worm rotation, through worm wheel drive connecting rod and lift rotary plate whole law overturn 180, again start servo double -end motor reverse control driving rod rotation, make the lift rotary plate drop down, thereby solve the technical problem of inconvenient test multiple double -sided heat dissipation MOSFET and inconveniently turn over PCB circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the utility model will be described in detail below with the drawings and detailed implementation, obviously, the drawings in the following description are only some implementation of the utility model, and for the ordinary skilled person in the art, under the premise of not paying the creative labor, other drawings can also be obtained according to these drawings. Wherein:

[0017] Figure 1 It is the structural schematic diagram of the utility model;

[0018] Figure 2 It is the utility model Figure 1 It is the structural schematic diagram of the side elevation direction;

[0019] Figure 3 It is the structural schematic diagram of the lift rotary plate and clamping mechanism of the utility model;

[0020] Figure 4 It is the structural schematic diagram of the driving mechanism part component of the utility model;

[0021] Figure 5 It is the structural schematic diagram of the utility model lift rotary plate after rising.

[0022] In the drawing: test table 100, liquid cooling plate 101, heat sink 102, boss 103, lift rotary plate 200, mounting frame 201, clamping plate 203, slide rod 202, spring 204, pull plate 205, driving mechanism 300, fixed frame 301, screw rod 302, lifting block 303, mounting frame 304, connecting rod 305, worm wheel 306, worm 307, drive member 308, servo double -end motor 309, driving rod 310, driving bevel gear 311, follow -up bevel gear 312, support 313, double -sided heat dissipation MOSFET 400. DETAILED DESCRIPTION

[0023] In order to make the above objectives, characteristics and advantages of the present application more apparent, concrete embodiments of the present application will be described in detail below with reference to the drawings.

[0024] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0025] Secondly, the present application is described in detail in combination with the schematic diagram, when the embodiments of the present application are described in detail, in order to facilitate the description, the cross-sectional view of the device structure will be partially enlarged without the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present application here. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in actual production.

[0026] In order to make the objectives, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail below with reference to the drawings.

[0027] Please refer to Figures 1-5 , which shows the structure schematic diagram of the heat resistance test auxiliary device for the heat dissipation MOSFET, please refer to Figures 1-5 , the heat resistance test auxiliary device for the heat dissipation MOSFET is introduced in detail.

[0028] The heat resistance test auxiliary device for the heat dissipation MOSFET comprises a test table 100, a liquid cooling plate 101 is fixedly arranged on the top of the test table 100, and at least two heat sinks 102 are arranged on the top of the liquid cooling plate 101 at equal intervals;

[0029] The lifting and rotating plate 200 is lifted and rotated above the test table 100, a mounting frame 201 is arranged above each heat sink 102 on the lifting and rotating plate 200, a double-sided heat dissipation MOSFET 400 is detachably arranged on the inner side of the mounting frame 201 through a clamping mechanism, the double-sided heat dissipation MOSFET 400 is welded on a PCB circuit board, the thickness of the double-sided heat dissipation MOSFET 400 is not less than the thickness of the lifting and rotating plate 200 and the clamping mechanism, and the boss 103 on the surface of the heat sink 102 is in contact with the bottom surface of the double-sided heat dissipation MOSFET 400 after penetrating through the PCB circuit board;

[0030] The driving mechanism 300 is arranged on the test table 100, and is used for driving the lifting and rotating plate 200 to rise, then driving all the PCB circuit boards to overturn 180° and then descending.

[0031] Embodiment 2

[0032] On the basis of embodiment 1, the clamping mechanism comprises slide rods 202 sliding through the front side walls of each mounting frame 201, a clamping plate 203 is fixedly arranged at one end of the slide rod 202, a spring 204 is fixedly arranged between the clamping plate 203 and the inner side wall of the mounting frame 201, the rod body gap of the slide rod 202 penetrates the inner side of the spring 204, the spring 204 pushes the clamping plate 203 to abut against one side of the double-sided heat dissipation MOSFET 400, and the other end of all the slide rods 202 away from the clamping plate 203 is provided with a pull plate 205. By pushing the clamping plate 203 to abut against one side of the double-sided heat dissipation MOSFET 400 through the spring 204, the other side of the double-sided heat dissipation MOSFET 400 abuts against the inner side wall of the mounting frame 201, so that the double-sided heat dissipation MOSFET 400 can be stabilized when the lifting and turning plate 200 is lifted and turned over.

[0033] Embodiment 3

[0034] On the basis of embodiment 1, the driving mechanism 300 comprises an "L"-shaped fixing frame 301 fixed symmetrically on the side wall of the test table 100, a vertical lead screw 302 is rotationally arranged on the inner side wall of the fixing frame 301, a lifting block 303 is slidingly arranged on the inner side wall of the fixing frame 301, the rod body of the lead screw 302 is screwed through the upper and lower walls of the lifting block 303, a connecting rod 305 is rotationally arranged on the side of the lifting block 303 close to the lifting and turning plate 200 through a bearing seat, the other end of the connecting rod 305 is fixed on the side wall of the lifting and turning plate 200, an "L"-shaped mounting frame 304 is arranged on the side of the lifting block 303 close to the connecting rod 305, a worm wheel 306 is fixedly arranged on the rod body of the connecting rod 305, and a worm 307 meshing with the worm wheel 306 is rotationally arranged on the side wall of the mounting frame 304.

[0035] The lead angle of the worm 307 is smaller than the equivalent friction angle between the meshing gear teeth of the worm wheel 306, and the worm 307 and the worm wheel 306 have self-locking property, so that the connecting rod 305 and the lifting and turning plate 200 are more stable after rotation.

[0036] The driving member 308 can be a hand lever, which drives the worm 307 to rotate manually, or a servo motor with precise control of the number of rotations of the worm 307. The servo motor is fixed on the side wall of the mounting frame 304, and its output shaft is connected to one end of the worm 307 through a shaft coupling, so as to realize precise control of the turning of the connecting rod 305 by one hundred and eighty degrees.

[0037] The driving mechanism 300 further comprises a servo double-head motor 309 fixed in the middle of the bottom wall of the test table 100, an output shaft of the servo double-head motor 309 is connected with a driving bevel gear 311 through a driving rod 310, the lower end of the lead screw 302 extends to rotate through the bottom wall of the fixed frame 301 and is provided with a follow-up bevel gear 312 meshing with the driving bevel gear 311, the bottom wall of the test table 100 is fixedly provided with a support 313, the rod body of the driving rod 310 rotates through the side wall of the support 313 through a bearing sleeve, after the servo double-head motor 309 drives the driving rod 310 to rotate, the lead screw 302 can be driven to ascend or descend through the driving bevel gear 311 and the follow-up bevel gear 312.

[0038] It should be noted that in the above embodiment, there is also a publicly disclosed number: CN219532987U, which discloses a thermal resistance test auxiliary device for double-sided heat dissipation MOSFET, which involves components such as heat insulation pads, pressing clamps, etc. The top surface of the double-sided heat dissipation MOSFET is covered with a heat insulation pad, the pressing clamp abuts against the top of the heat insulation pad, and the bottom of the heat insulation pad is attached to the top surface of the double-sided heat dissipation MOSFET. These components belong to the existing technology disclosed in the prior art, and will not be described here. This paper mainly aims at the technical problems that the prior art is not convenient for testing multiple double-sided heat dissipation MOSFETs and is not convenient for turning over the PCB circuit board.

[0039] In the specific use process, when it is necessary to turn over the PCB circuit board, the servo double-head motor 309 can be started to drive the driving rod 310 to rotate, the lead screw 302 can be driven to rotate through the driving bevel gear 311 and the follow-up bevel gear 312, so that the lifting rotating plate 200 rises, then the driving member 308 controls the worm 307 to rotate, the connecting rod 305 and the lifting rotating plate 200 are driven to turn over 180° as a whole through the worm wheel 306, then the servo double-head motor 309 is started in reverse to control the driving rod 310 to rotate, so that the lifting rotating plate 200 descends, thereby solving the technical problems that it is not convenient to test multiple double-sided heat dissipation MOSFETs and it is not convenient to turn over the PCB circuit board.

[0040] Although the utility model has been described in the foregoing with reference to the embodiments, various improvements can be made and equivalent components can be replaced without departing from the scope of the utility model. In particular, as long as there is no structural conflict, the features in the embodiments disclosed by the utility model can be combined in any way, and the combinations are not described in this specification due to the consideration of omitting the length and saving resources. Therefore, the utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An auxiliary device for testing the thermal resistance of a heat-dissipating MOSFET, characterized in that, include: A test bench (100) is provided with a liquid cooling plate (101) fixedly installed on the top of the test bench (100), and at least two heat sinks (102) are provided at equal intervals on the top of the liquid cooling plate (101). A lifting and rotating plate (200) is located above the test platform (100) and is lifted and rotated. An installation frame (201) is provided on the lifting and rotating plate (200) above each heat sink (102). A double-sided heat dissipation MOSFET (400) is installed on the inner side of the installation frame (201) through a clamping mechanism. The double-sided heat dissipation MOSFET (400) is soldered on the PCB circuit board. The thickness of the double-sided heat dissipation MOSFET (400) is not less than the thickness of the lifting and rotating plate (200) and the clamping mechanism. The boss (103) on the surface of the heat sink (102) passes through the PCB circuit board and contacts the bottom surface of the double-sided heat dissipation MOSFET (400). A drive mechanism (300) is mounted on the test bench (100) to drive the lifting plate (200) to rise, thereby causing all the PCB circuit boards to rotate 180° and then descend. The drive mechanism (300) includes an "L"-shaped fixing frame (301) symmetrically fixed on the side wall of the test bench (100). A vertical lead screw (302) is rotatably mounted on the inner side wall of the fixing frame (301). A lifting block (303) is slidably mounted on the inner side wall of the fixing frame (301). The rod body of the lead screw (302) is screwed through the lifting block. The upper and lower walls of the lifting block (303) are provided with a connecting rod (305) rotatably mounted on the side of the lifting block (303) near the lifting plate (200) via a bearing seat. The other end of the connecting rod (305) is fixed on the side wall of the lifting plate (200). An "L"-shaped mounting bracket (304) is provided on the side of the lifting block (303) near the connecting rod (305). A worm gear (306) is fixedly mounted on the rod body of the connecting rod (305). A worm (307) meshing with the worm gear (306) is rotatably mounted on the side wall of the mounting bracket (304).

2. The thermal resistance testing auxiliary device for a heat-dissipating MOSFET according to claim 1, characterized in that: The clamping mechanism includes a slide rod (202) that slides through the front sidewall of each mounting frame (201). A clamping plate (203) is fixedly installed at one end of the slide rod (202) located in the mounting frame (201). A spring (204) is fixedly installed between the clamping plate (203) and the inner sidewall of the mounting frame (201). The gap of the slide rod (202) passes through the inner side of the spring (204). The spring (204) pushes the clamping plate (203) to abut against the side of the double-sided heat dissipation MOSFET (400). A pull plate (205) is provided at the end of all the slide rods (202) away from the clamping plate (203).

3. The thermal resistance testing auxiliary device for a heat-dissipating MOSFET according to claim 1, characterized in that: The lead angle of the worm (307) is smaller than the equivalent friction angle between the meshing teeth of the worm wheel (306), and the worm (307) and the worm wheel (306) have self-locking properties.

4. The thermal resistance testing auxiliary device for a heat-dissipating MOSFET according to claim 1, characterized in that: The mounting bracket (304) has a drive component (308) on its side wall for controlling the rotation of the worm gear (307).

5. The thermal resistance testing auxiliary device for a heat-dissipating MOSFET according to claim 1, characterized in that: The drive mechanism (300) also includes a servo dual-head motor (309) fixed in the middle of the bottom wall of the test bench (100). The output shaft of the servo dual-head motor (309) is connected to a drive bevel gear (311) through a drive rod (310). The lower end of the lead screw (302) extends and rotates through the bottom wall of the fixed frame (301) and is provided with a follower bevel gear (312) that meshes with the drive bevel gear (311).

6. The thermal resistance testing auxiliary device for a heat-dissipating MOSFET according to claim 5, characterized in that: The bottom wall of the test bench (100) is fixedly provided with a bracket (313), and the rod body of the drive rod (310) rotates through the side wall of the bracket (313) via a bearing sleeve.

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