Case of heat exchange and conduction device
By installing a heat-conducting device inside the chassis, utilizing heat transfer between the hot and cold ends and external heat dissipation devices, the problem of poor heat dissipation in existing technologies is solved, achieving highly efficient server heat dissipation.
Patent Information
- Application Number
- CN202520294116.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-02-21
AI Technical Summary
Existing high-performance servers primarily rely on internal heat dissipation methods, resulting in poor heat dissipation and performance degradation after prolonged use.
Design a chassis with a heat-conducting device. By installing a heat-conducting device inside the chassis, heat can be transferred between the cold and hot ends, and combined with the heat dissipation device outside the chassis, heat can be quickly transferred from the inside to the outside.
It improves the server's heat dissipation efficiency, ensuring that the equipment can effectively dissipate heat when running at high performance, and preventing performance degradation or damage caused by high temperature.
Smart Images
Figure CN223728212U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the machine case technical field of heat exchange device, especially heat exchange device's machine case. BACKGROUND
[0002] The machine case is an important component in computer accessories, mainly used for placing and fixing various computer accessories, and plays the role of supporting, protecting and shielding electromagnetic radiation. The machine case generally includes a shell, a support, various switches and indicator lights on the panel, etc. The shell is usually made of steel plate and plastic materials, which has high hardness and mainly plays the role of protecting the internal components of the machine case. The support is used to fix the mainboard, power supply and various drives to ensure their stable installation in the machine case. The heat exchange device is an effective means to improve the heat dissipation performance of the computer. The heat exchange device mainly includes a heat sink, heat-conducting silicone grease or heat-conducting gasket, etc. They work together to efficiently conduct the heat generated inside the computer to ensure stable operation of the computer.
[0003] The existing high-performance server heat dissipation method mainly relies on active cooling and passive cooling. The heat is mainly concentrated in the internal equipment, which usually needs to use high static pressure and high air volume cooling fans to conduct heat to the outside of the equipment, or use high-temperature-resistant electronic components to prevent the equipment from being damaged due to high temperature.
[0004] Therefore, in view of the above-mentioned problems that the existing heat dissipation method is concentrated in the internal equipment, resulting in poor heat dissipation effect and poor heat dissipation performance for a long time, a machine case with heat exchange device can be designed. By installing the heat exchange device inside the machine case, it has the characteristics of strong universality, high heat transfer efficiency, small size, easy installation, etc. It can quickly conduct heat from the inside of the machine case to the outside of the machine case, or absorb heat from the inside of the machine case to the outside of the machine case, realizing rapid heat dissipation of the high-performance server. UTILITY MODEL CONTENTS
[0005] In order to overcome the problem that the existing heat dissipation method is concentrated in the internal equipment, resulting in poor heat dissipation effect and poor heat dissipation performance for a long time.
[0006] The technical scheme of the utility model is: a machine case with heat exchange device, comprising a machine case shell, an installation block is arranged on one side of the inside of the machine case shell, a heat exchange device is arranged on one side of the installation block, a cold end is arranged on one side of the heat exchange device, hot ends are arranged on the left and right sides of the front end of the cold end, a convection device is arranged at one end of one side of the heat exchange device, a heat-conducting device is arranged at one end of the inside of the machine case shell.
[0007] Preferably, through the external heat dissipation device of the case shell, firstly through the cooling process of the cold end, the cold end absorbs heat to the hot end through the internal device, so that the temperature of the hot end is reduced, and the rapid cooling of the inside of the case is realized through the internal forced convection device of the case shell.
[0008] As preferred, the front end of the case shell is provided with a cabinet door, and a plurality of second mounting holes are uniformly arranged on the surface of the cabinet door.
[0009] As preferred, the front end surface of the case shell is fixedly provided with mounting plates on the left and right sides and the upper and lower ends, and a plurality of first mounting holes are uniformly arranged in the mounting plates.
[0010] As preferred, the cabinet door and the case shell are connected through bolts penetrating the first mounting holes and the second mounting holes and engaging with the internal thread grooves.
[0011] As preferred, the mounting flange is arranged between the hot end and the cold end, and the heat exchange device is connected with the mounting block through the mounting flange.
[0012] As preferred, the inside of the case shell is provided with an inner cavity, and the convection device comprises a shell body, a plurality of uniformly arranged heat pipes are arranged on the four end surfaces of the shell body, and a plurality of uniformly arranged semiconductor heat conducting fins are sleeved on the outside of the heat pipes.
[0013] As preferred, the upper and lower ends of one side of the heat conduction device body are provided with first connecting heads, and the front and rear ends of the heat conduction upper end surface are provided with second connecting heads, and heat conduction connecting pipes are arranged between the two first connecting heads and the two second connecting heads.
[0014] The beneficial effects of the utility model are as follows:
[0015] 1. The heat exchange device case, through the operation of the heat conduction device body, absorbs the heat generated by the heat source, and the heat is transferred to the hot end of one end of the heat exchange device, and then the heat is transferred to the cold end through the internal transmission, and the cold end is arranged in the case shell.
[0016] 2. The heat exchange device case, through the external heat dissipation device of the case shell, firstly through the cooling process of the cold end, the cold end absorbs heat to the hot end through the internal device, so that the temperature of the hot end is reduced, and the rapid cooling of the inside of the case is realized through the internal forced convection device of the case shell. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 The inside structure of the case is shown in the three-dimensional structure schematic view of the utility model.
[0018] Figure 2 The heat exchange device plane structure schematic view of the utility model is shown.
[0019] Figure 3 The heat exchange device plane structure schematic view of the utility model is shown.
[0020] Figure 4 The heat exchange device plane structure schematic view of the utility model is shown.
[0021] Figure 5 The heat exchange device plane structure schematic view of the utility model is shown.
[0022] Mark 1, the machine case shell; 2, the inner chamber; 3, the mounting block; 4, the heat exchange device; 401, the mounting flange; 402, the hot end; 403, the cold end; 5, the mounting plate; 6, the first mounting hole; 7, the box door; 8, the second mounting hole; 9, the convection device; 901, the shell body; 902, the heat pipe; 903, the semiconductor heat conduction sheet; 10, the heat conduction device body; 11, the first connector; 12, the heat conduction connecting pipe; 13, the second connector; 14, the heat conduction. DETAILED DESCRIPTION
[0023] The utility model is further explained in connection with the drawings and examples.
[0024] Please refer to Figures 1-5 The utility model provides a kind of machine case of heat conduction device: a kind of heat exchange device, including machine case shell 1, the inside one side of machine case shell 1 is provided with mounting block 3, the one side of mounting block 3 is provided with heat exchange device 4, the one side of heat exchange device 4 is provided with cold end 403, and the left and right sides of the front end of cold end 403 are provided with hot end 402, and the one end of the one side of heat exchange device 4 is provided with convection device 9, and the front end of convection device 9 is provided with heat conduction device body 10 on the one side of heat exchange device 4, and the one end of the inside of machine case shell 1 is provided with heat conduction 14, and heat is transferred to the hot end 402 of the one end of heat exchange device 4, and hot end 402 absorbs heat and transfers heat to cold end 403 by internal transmission, and cold end 403 is arranged in the heat dissipation device of machine case shell 1 and exports heat outward, to strengthen the effect of heat dissipation.
[0025] Please refer to Figure 1In the embodiment, the front end of the case shell 1 is provided with a cabinet door 7, the surface of the cabinet door 7 is provided with a plurality of uniformly arranged second mounting holes 8, the left and right sides and the upper and lower ends of the front end surface of the case shell 1 are fixedly provided with mounting plates 5, the interiors of the mounting plates 5 are provided with a plurality of uniformly arranged first mounting holes 6, the inner walls of the first mounting holes 6 and the second mounting holes 8 are provided with internal thread grooves, the cabinet door 7 and the case shell 1 are connected through bolts penetrating the first mounting holes 6 and the second mounting holes 8 and engaging with the internal thread grooves, through the operation of the heat conduction device body 10, the heat conduction device body 10 absorbs the heat generated by the heat source, the heat is transferred to the hot end 402 at one end of the heat exchange device 4, the hot end 402 absorbs the heat and transfers the heat to the cold end 403 through the interior, the cold end 403 discharges the heat outward through the heat dissipation device arranged in the case shell 1, thereby enhancing the heat dissipation effect.
[0026] Please refer to Figures 2-5 In the embodiment, the hot end 402 and the cold end 403 are provided with a mounting flange 401, the heat exchange device 4 and the mounting block 3 are connected through the mounting flange 401, the interior of the case shell 1 is provided with an inner cavity 2, the convection device 9 includes a shell body 901, four end surfaces in the shell body 901 are provided with a plurality of uniformly arranged heat pipes 902, the outside of the heat pipes 902 is sleeved with a plurality of uniformly arranged semiconductor heat conduction fins 903, the upper and lower ends of one side of the heat conduction device body 10 are provided with first connecting heads 11, the front and rear ends of the upper end surface of the heat conduction 14 are provided with second connecting heads 13, the two first connecting heads 11 and the two second connecting heads 13 are provided with heat conduction connecting pipes 12, through the external heat dissipation device of the case shell 1, first, the cold end 403 is cooled, the cold end 403 absorbs heat to the hot end 402 through the internal device, so that the temperature of the hot end 402 decreases, the forced convection device 9 in the case shell 1 realizes rapid cooling of the inside of the case.
[0027] In the embodiment, the hot end 402 and the cold end 403 are provided with a mounting flange 401, the heat exchange device 4 and the mounting block 3 are connected through the mounting flange 401, the interior of the case shell 1 is provided with an inner cavity 2, the convection device 9 includes a shell body 901, four end surfaces in the shell body 901 are provided with a plurality of uniformly arranged heat pipes 902, the outside of the heat pipes 902 is sleeved with a plurality of uniformly arranged semiconductor heat conduction fins 903, the upper and lower ends of one side of the heat conduction device body 10 are provided with first connecting heads 11, the front and rear ends of the upper end surface of the heat conduction 14 are provided with second connecting heads 13, the two first connecting heads 11 and the two second connecting heads 13 are provided with heat conduction connecting pipes 12, through the external heat dissipation device of the case shell 1, first, the cold end 403 is cooled, the cold end 403 absorbs heat to the hot end 402 through the internal device, so that the temperature of the hot end 402 decreases, the forced convection device 9 in the case shell 1 realizes rapid cooling of the inside of the case.
[0028] Through the above steps, through the operation of the heat conduction device body 10, the heat generated by the heat source is absorbed by the heat conduction device body 10, and the heat is transferred to the hot end 402 at one end inside the heat exchange device 4. The hot end 402 absorbs heat and transfers heat to the cold end 403 through the inside to solve the problem that the existing heat dissipation mode is all gathered in the internal equipment, resulting in poor heat dissipation effect and long time causing poor heat dissipation performance.
Claims
1. A casing for a heat transfer device, comprising a casing housing (1), characterized in that: One side of the inside of the case shell (1) is provided with a mounting block (3), one side of the mounting block (3) is provided with a heat exchange device (4), one side of the heat exchange device (4) is provided with a cold end (403), the left and right sides of the front end of the cold end (403) are provided with hot ends (402), one end of one side of the heat exchange device (4) is provided with a convection device (9), the front end of the convection device (9) is provided with a heat conduction device body (10) located on one side of the heat exchange device (4), one end of the inside of the case shell (1) is provided with a heat conduction (14).
2. The housing of claim 1, wherein: The front end of the case shell (1) is provided with a box door (7), the surface of the box door (7) is provided with a plurality of uniformly arranged second mounting holes (8).
3. A heat-conducting device changing case according to claim 2, characterized in that: The left and right sides and the upper and lower ends of the front end surface of the case shell (1) are fixedly provided with mounting plates (5), the inside of the mounting plate (5) is provided with a plurality of uniformly arranged first mounting holes (6), the inner walls of the first mounting hole (6) and the second mounting hole (8) are provided with internal thread grooves.
4. The heat-conducting device changing case according to claim 1, characterized by: The box door (7) and the case shell (1) are connected through bolts penetrating the first mounting hole (6) and the second mounting hole (8) and engaging with the internal thread grooves.
5. The heat-conducting device changing case according to claim 1, characterized by: The hot end (402) and the cold end (403) are provided with a mounting flange (401), and the heat exchange device (4) and the mounting block (3) are connected through the mounting flange (401).
6. The heat-conducting device changing case according to claim 1, characterized by: The inside of the case shell (1) is provided with an inner cavity (2), the convection device (9) comprises a shell body (901), four end surfaces inside the shell body (901) are provided with a plurality of uniformly arranged heat pipes (902), and the outside of the heat pipe (902) is sleeved with a plurality of uniformly arranged semiconductor heat conduction fins (903).
7. The heat-conducting device changing case according to claim 1, characterized by: The upper and lower ends of one side of the heat conduction device body (10) are provided with first connecting heads (11), the front and rear ends of the upper end surface of the heat conduction (14) are provided with second connecting heads (13), and the first connecting heads (11) and the second connecting heads (13) are provided with heat conduction connecting pipes (12).