Semiconductor loading and unloading transmission device

Abstract

The utility model discloses a semiconductor feeding and discharging transmission device which comprises a feeding and discharging device. The feeding and discharging device is composed of a workbench, a first moving mechanism and a second moving mechanism, the first moving mechanism and the second moving mechanism are installed on the two sides of the upper end of the workbench, the first moving mechanism and the second moving mechanism are composed of frame lead screws and lead screw nuts, and the lead screw nuts are installed at the bottom end of the lifting mechanism. A machining table is installed at the upper end of the lifting mechanism, and a clamping mechanism is installed on the upper side of the machining table. The thread directions of the lead screws in the first moving mechanism and the second moving mechanism are opposite, when the first moving mechanism feeds the machining table forwards, the machining table on the upper side of the second moving mechanism moves backwards for discharging, and when the first moving mechanism and the second moving mechanism move the machining table, the machining table on the upper side of the second moving mechanism moves backwards for discharging. The lifting mechanism can drive the machining table on the upper sides of the first moving mechanism and the second moving mechanism to move upwards and downwards.

Description

TECHNICAL FIELD

[0001] The utility model relates to material transmission technical field, concretely is a kind of semiconductor feeding and discharging transmission device. BACKGROUND

[0002] Semiconductor refers to the material that the conductivity is between conductor and insulator at room temperature.Semiconductor has wide application in radio, television and temperature measurement.Diode is the device made of semiconductor.Semiconductor refers to the material that the conductivity is between conductor and insulator at room temperature.Semiconductor has wide application in radio, television and temperature measurement.Diode is the device made of semiconductor.Semiconductor is the material that the conductivity can be controlled, and the range can be from insulator to conductor.From the angle of science and technology or economic development, the importance of semiconductor is very huge.Most of electronic products, such as computer, mobile phone or digital recorder, have close relation with semiconductor.The common semiconductor materials are silicon, germanium, gallium arsenide etc., and silicon is the most influential one in commercial application among various semiconductor materials.Semiconductor needs to be fed and discharged in the process of processing, and needs to use transmission device in the process of feeding and discharging.

[0003] Chinese patent number CN202121695974.8 discloses a material disc feeding mechanism, which comprises a feeding bin provided with a feeding port and a discharging port, a first supporting strip is arranged on the side of the feeding bin away from the discharging port, and two supporting blocks are arranged on the side of the feeding bin close to the discharging port; an auxiliary device comprises a horizontal driving device and a second supporting strip arranged on one side of the discharging port, the horizontal driving device is used for driving the second supporting strip to enter or exit the feeding bin, and the upper surface of the second supporting strip is flush with the upper surface of the supporting block when the second supporting strip enters the feeding bin. By setting the horizontal driving device in the auxiliary device, the feeding and discharging can be realized.

[0004] When the utility model is used, the feeding and discharging will occupy more time, and the speed of feeding and discharging is affected. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a kind of semiconductor feeding and discharging transmission device to solve the problems in prior art.

[0006] To achieve the above object, the utility model provides the following technical scheme: A semiconductor feeding and discharging transmission device, including feeding and discharging device, the feeding and discharging device is composed of workbench, first mobile mechanism and second mobile mechanism, first mobile mechanism and second mobile mechanism are installed on both sides positions of workbench upper end, first mobile mechanism and second mobile mechanism are composed of frame screw rod and screw rod nut, the frame is installed on workbench upper side, the screw rod is rotatably installed in the frame, the screw rod nut is rotatably installed on the screw rod upper side, the screw rod one end passes through the frame and is installed on transmission mechanism one side position, power mechanism is installed on the other side of transmission mechanism one end, the screw rod nut is installed on the lifting mechanism bottom, the lifting mechanism upper end is installed with processing platform, the processing platform upper side is installed with clamping mechanism.

[0007] Preferably, the lifting mechanism is composed of mounting frame and first telescopic rod, the first telescopic rod bottom end is installed on the mounting frame upper side, the mounting frame is installed on the screw rod nut upper side, and the first telescopic rod upper end is installed on the processing platform bottom end position.

[0008] Preferably, the transmission mechanism is composed of synchronous belt, synchronous wheel and protective shell, the synchronous wheel is installed on the screw rod one end position, the synchronous belt is wrapped on the synchronous wheel outer side position, and the protective shell is installed on the workbench one side position synchronous wheel outer side position.

[0009] Preferably, the power mechanism is composed of motor and transmission, and the motor is installed on the transmission one side position.

[0010] Preferably, the clamping mechanism is composed of clamping plate and second telescopic rod, the second telescopic rod is installed on the processing platform inside four positions, and the clamping plate is installed on the second telescopic rod front section position.

[0011] Preferably, rubber pads are arranged on the inner side of the clamping plate, and the rubber pads are pasted on the inner side of the clamping plate by adhesive.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] 1, the screw thread direction of first mobile mechanism and second mobile mechanism inside is opposite, when first mobile mechanism carries out feeding to processing platform forward, the processing platform on the upper side of second mobile mechanism will move backward to carry out discharging, when first mobile mechanism and second mobile mechanism move to processing platform, the lifting mechanism will drive the processing platform on the upper side of first mobile mechanism and second mobile mechanism to move upward and downward, avoid the phenomenon that processing platform appears to hit in the process of moving, so that can feed and discharge on one side to the material processing, promote the speed of material processing;

[0014] 2、 transmission mechanism in use, through the power mechanism to drive one of the synchronous rotation, synchronous wheel will be through the synchronous belt drive another synchronous rotation;

[0015] 3、 lifting mechanism in use, through the installation frame to install the first telescopic rod, through the first telescopic rod drive processing platform to move up and down;

[0016] 4、 clamping mechanism in use, through the switch to open the second telescopic rod, the second telescopic rod will drive the clamping plate to move, through the clamping plate to workpiece clamping fixed. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings are included to provide a further understanding of the present application, and are incorporated in and constitute a part of the specification, illustrate embodiments of the present application, and are used to explain the present application, and do not constitute a limitation on the present application. In the drawings:

[0018] Figure 1 is a structural diagram of the present application;

[0019] Figure 2 is a structural diagram of the present application side view;

[0020] Figure 3 is a structural diagram of the first moving mechanism and the second moving mechanism of the present application;

[0021] Figure 4 is a structural diagram of the clamping mechanism of the present application.

[0022] In the drawings: 1, feeding and discharging device; 2, workbench; 3, first moving mechanism; 4, second moving mechanism; 5, first telescopic rod; 6, processing platform; 7, power mechanism; 8, transmission mechanism; 9, transmission; 10, motor; 11, protective shell; 12, clamping plate; 13, second telescopic rod; 14, clamping mechanism; 15, synchronous wheel; 16, synchronous belt; 17, screw nut; 18, screw; 19, mounting bracket; 20, rubber pad; 21, lifting mechanism; 22, frame. DETAILED DESCRIPTION

[0023] The technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the present application.

[0024] Please refer to Figure 1 , Figure 2 , Figure 3 ,Figure 4 The utility model discloses an embodiment of a kind of semiconductor feeding and discharging transmission devices, including feeding and discharging device 1;Feeding and discharging device 1 is by workbench 2, first moving mechanism 3 and second moving mechanism 4 are formed, first moving mechanism 3 and second moving mechanism 4 are installed on the upper end both sides position of workbench 2, first moving mechanism 3 and second moving mechanism 4 are by frame 22 screw rod 18 and screw nut 17 are formed, frame 22 is installed on the upper side of workbench 2, screw rod 18 is rotatably installed in frame 22 interior, screw nut 17 is rotatably installed on the upper side of screw rod 18, screw rod 18 one end passes through frame 22 and is installed in the one side position of transmission mechanism 8, transmission mechanism 8 one end other side is provided with power mechanism 7, screw nut 17 is installed in lifting mechanism 21 bottom end, lifting mechanism 21 upper end is provided with processing table 6, processing table 6 upper side is provided with clamping mechanism 14.

[0025] Lifting mechanism 21 is by mounting bracket 19 and first telescopic link 5 are formed, first telescopic link 5 bottom end is installed on the upper side of mounting bracket 19, mounting bracket 19 is installed on the upper side of screw nut 17, first telescopic link 5 upper end is installed in the bottom end position of processing table 6, lifting mechanism 21 when in use, first telescopic link 5 is installed by mounting bracket 19, and processing table 6 is moved up and down by first telescopic link 5.

[0026] Transmission mechanism 8 is by synchronous belt 16, synchronous pulley 15 and protection shell 11 are formed, synchronous pulley 15 is installed in the one end position of screw rod 18, synchronous belt 16 is wrapped in the outer side position of synchronous pulley 15, protection shell 11 is installed in the one side position of workbench 2 synchronous pulley 15 outer side position, transmission mechanism 8 when in use, one of synchronous pulley 15 is rotated by power mechanism 7, and another synchronous pulley 15 is rotated synchronously by synchronous belt 16 with synchronous pulley 15.

[0027] Power mechanism 7 is by motor 10 and transmission 9 are formed, motor 10 is installed in the one side position of transmission 9, power mechanism 7 when in use, motor 10 is started by switch, and transmission 9 is operated by motor 10, and the rotation speed of motor 10 is integrated in output by transmission 9.

[0028] Clamping mechanism 14 is by clamping plate 12 and second telescopic link 13 are formed, second telescopic link 13 is installed in the four around positions of processing table 6, clamping plate 12 is installed in the front section position of second telescopic link 13, clamping mechanism 14 when in use, second telescopic link 13 is started by switch, and clamping plate 12 is moved by second telescopic link 13, and workpiece is clamped and fixed by clamping plate 12;Rubber pad 20 is arranged in the inner side position of clamping plate 12, rubber pad 20 is pasted in the inner side position of clamping plate 12 by adhesive, and the texture of rubber pad 20 is relatively soft, can increase the friction between clamping plate 12 and material when clamping plate 12 clamps workpiece, so that clamping plate 12 clamps workpiece more stably.

[0029] The working principle and use process of the utility model: when using, the material tray is placed on the upper side of the machining table 6 on the first moving mechanism 3, the material tray is fixed by the clamping mechanism 14, the power mechanism 7 is started through the switch, the power mechanism 7 will drive the transmission mechanism 8 to run, the transmission mechanism 8 will drive the screw rod 18 inside the first moving mechanism 3 and the second moving mechanism 4 to rotate, the screw rod 18 inside the first moving mechanism 3 and the second moving mechanism 4 is opposite in the thread direction, when the first moving mechanism 3 moves the machining table 6 forward to feed, the machining table 6 on the upper side of the second moving mechanism 4 will move backward to unload, when the first moving mechanism 3 and the second moving mechanism 4 move the machining table 6, the lifting mechanism 21 will drive the machining table 6 on the upper side of the first moving mechanism 3 and the second moving mechanism 4 to move upward and downward, avoid the phenomenon that the machining table 6 collides in the process of moving, so that the material can be processed while feeding and discharging, the speed of material processing is improved.

[0030] Finally, it should be noted that: the above is only the preferred embodiment of the utility model, and is not used to limit the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can modify the technical scheme recorded in the foregoing embodiments, or equivalent replacement to part of the technical features. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A semiconductor loading and unloading transfer device, comprising a loading and unloading device (1); characterized in that: The feeding and discharging device (1) is composed of a workbench (2), a first moving mechanism (3) and a second moving mechanism (4), the first moving mechanism (3) and the second moving mechanism (4) are installed on both sides of the upper end of the workbench (2), the first moving mechanism (3) and the second moving mechanism (4) are composed of a frame (22), a lead screw (18) and a lead screw nut (17), the frame (22) is installed on the upper side of the workbench (2), the lead screw (18) is rotatably installed in the frame (22), the lead screw nut (17) is rotatably installed on the upper side of the lead screw (18), one end of the lead screw (18) penetrates through the frame (22) and is installed on one side of a transmission mechanism (8), the other end of the transmission mechanism (8) is provided with a power mechanism (7), the lead screw nut (17) is installed at the bottom end of a lifting mechanism (21), the upper end of the lifting mechanism (21) is provided with a machining table (6), and the upper side of the machining table (6) is provided with a clamping mechanism (14).

2. The semiconductor loading and unloading transfer device of claim 1, wherein: The lifting mechanism (21) is composed of a mounting bracket (19) and a first telescopic rod (5), the first telescopic rod (5) is installed at the upper side of the mounting bracket (19), the mounting bracket (19) is installed at the upper side of the lead screw nut (17), and the first telescopic rod (5) is installed at the bottom end of the machining table (6).

3. The semiconductor loading and unloading transfer device of claim 1, wherein: The transmission mechanism (8) is composed of a synchronous belt (16), a synchronous wheel (15) and a protective shell (11), the synchronous wheel (15) is installed at one end of the lead screw (18), the synchronous belt (16) is wrapped around the outer side of the synchronous wheel (15), and the protective shell (11) is installed at one side of the workbench (2) and outside the synchronous wheel (15).

4. The semiconductor loading and unloading transfer device of claim 1, wherein: The power mechanism (7) is composed of a motor (10) and a speed changer (9), and the motor (10) is installed at one side of the speed changer (9).

5. The semiconductor loading and unloading transfer device of claim 1, wherein: The clamping mechanism (14) is composed of a clamping plate (12) and a second telescopic rod (13), the second telescopic rod (13) is installed at the periphery of the machining table (6), and the clamping plate (12) is installed at the front section of the second telescopic rod (13).

6. The semiconductor loading and unloading transfer device of claim 5, wherein: Rubber pads (20) are arranged at the inner side of the clamping plate (12), and the rubber pads (20) are adhered to the inner side of the clamping plate (12) by adhesive.

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