PCB packaging mechanism for LDO

Abstract

The utility model discloses a PCB packaging mechanism for an LDO, and relates to the field of circuit boards. The PCB packaging mechanism for the LDO comprises a packaging medium, a heat dissipation assembly is arranged in the packaging medium and comprises a top layer copper foil, a bottom layer copper foil and a heat conduction piece, and the top layer copper foil is arranged on one side of the packaging medium; the bottom copper foil is arranged on the other side of the packaging medium; the heat conduction piece is installed between the top layer copper foil and the bottom layer copper foil. According to the PCB packaging mechanism for the LDO, the top-layer copper foil is fixedly welded together with the bonding pad of the pin and used for adsorbing heat generated when the heat bonding pad is used, the heat conduction piece is arranged on the PCB in a penetrating mode, meanwhile, the bottom-layer copper foil is arranged on the other side of the PCB, and the heat penetrates through the PCB and is conducted to the bottom-layer copper foil through the heat conduction piece, so that heat transfer is formed, and the heat transfer efficiency is improved. The bottom copper foil is arranged outside, so that heat is dissipated quickly, the purpose of quick heat dissipation is achieved, the service life can be effectively prolonged, and meanwhile the risk of accidents is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely is a kind of PCB packaging mechanism for LDO. BACKGROUND

[0002] LDO is also known as low dropout linear regulator, it is a kind of integrated circuit voltage regulator, the advantage is with extremely low self-noise and higher power supply rejection ratio, the disadvantage is conversion efficiency, generally between 60% to 75%, specific efficiency depends on the difference between input voltage and output voltage, during its production and processing, electronic component is usually packaged into the assembly that meets the standard shape and pin layout, then welding is carried out on PCB.

[0003] And the working principle of LDO is to reduce power supply voltage to the required output voltage to maintain the stability of output voltage, therefore, the greater the difference between input voltage and output voltage, the greater the loss is, simultaneously, the greater the output current is, the greater the loss is, in actual application process, the conversion efficiency of LDO is generally between 60% to 75%, the rest energy loss is released in the form of heat, therefore, heat dissipation problem needs to be considered in electronic product design to avoid the influence of high temperature on circuit, and the PCB packaging of traditional LDO is basically the same as other electronic component packaging, which leads to the surface of the same in use to accumulate a large amount of heat, high temperature not only affects service life, but also leads to accident, therefore, a kind of PCB packaging mechanism for LDO is provided. UTILITY MODEL CONTENTS

[0004] In view of the defects of prior art, the utility model provides a kind of PCB packaging mechanism for LDO, solve the problem that the PCB packaging of traditional LDO is basically the same as other electronic component packaging, which leads to the surface of the same in use to accumulate a large amount of heat, high temperature not only affects service life, but also leads to accident.

[0005] To achieve the above object, the utility model is realized by the following technical scheme: a kind of PCB packaging mechanism for LDO, including packaging medium, the packaging medium is provided with heat dissipation component, the heat dissipation component includes;

[0006] Top copper foil, it is arranged in one side of packaging medium for adsorbing heat;

[0007] Bottom copper foil, it is arranged in the other side of packaging medium for heat dissipation;

[0008] Thermal conductive part, it is installed between top copper foil and bottom copper foil for heat transfer.

[0009] Preferably, the outer surface of the packaging medium is provided with a via hole, the heat conducting member is arranged in the via hole, and the two ends of the heat conducting member are fixedly assembled with the top copper foil and the bottom copper foil respectively.

[0010] Preferably, the two ends of the heat conducting member are fixedly welded with the top copper foil and the bottom copper foil respectively.

[0011] Preferably, the heat conducting member is fixed between the top copper foil and the bottom copper foil by stamping, and the two ends of the heat conducting member are formed into two anti-dropping terminals by stamping deformation, which can ensure effective contact with the top copper foil and the bottom copper foil and has good anti-dropping effect, and welding is not needed, thereby avoiding damage to the PCB during welding.

[0012] Preferably, the packaging medium is a PCB.

[0013] Preferably, one side of the PCB is fixedly provided with a solder pad, and the top copper foil is fixedly welded with the solder pad.

[0014] Preferably, the outer surface of the solder pad is fixedly provided with a pin by tin soldering.

[0015] Preferably, the heat conducting member is made of pure copper material with a thermal conductivity not less than 380 W / (m·K).

[0016] Preferably, the heat conducting member is in a spiral structure, is provided with a through heat conducting channel in the inside, and the inner wall of the heat conducting channel is provided with a heat conducting convex rib extending in the spiral direction.

[0017] Preferably, the heat conducting member is composed of an outer copper pipe and an inner diamond particle, and the particle size of the diamond particle is 50-100 microns.

[0018] The utility model discloses a kind of PCB packaging mechanisms for LDO, and it has the beneficial effects as follows:

[0019] The LDO PCB packaging mechanism is characterized in that a top copper foil is arranged on one side of the PCB, the top copper foil is fixedly welded with the pads of the pins, is used for adsorbing a large amount of heat generated by the pads during use, then a heat conduction piece is arranged through the PCB, a bottom copper foil is arranged on the other side of the PCB, heat is conducted to the bottom copper foil through the heat conduction piece, heat transfer is formed, the bottom copper foil is arranged outside, heat is quickly dissipated, the purpose of quick heat dissipation is achieved, the service life is effectively improved, and the risk of accidents is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0021] Figure 1 It is an enlarged view of the overall bottom connecting seat of the present application.

[0022] Figure 2 It is an enlarged view of the overall bottom connecting seat of the present application. Figure 2 It is an enlarged view of the overall bottom connecting seat of the present application.

[0023] Figure 3 It is an enlarged view of the overall bottom connecting seat of the present application.

[0024] In the figure: 1, packaging medium; 12, via hole; 13, pad; 14, pin; 2, heat dissipation assembly; 21, bottom copper foil; 22, heat conduction piece; 23, top copper foil; 24, anti-dropping terminal. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application is described clearly and completely. Obviously, the described embodiments are some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0026] The embodiment of the application provides a PCB packaging mechanism for an LDO, and solves the problem that the conventional PCB packaging mechanism for an LDO is basically the same as other electronic component packaging mechanisms, which causes a large amount of heat to be accumulated on the surface during use, the high temperature affects the service life and causes accidents, in order to solve the above problems, a top copper foil is arranged on one side of a PCB, the top copper foil is fixedly welded with a pad of a pin, is used for adsorbing a large amount of heat generated by the pad during use, a heat conduction piece is arranged to penetrate the PCB, meanwhile, a bottom copper foil is arranged on the other side of the PCB, heat is conducted to the bottom copper foil through the heat conduction piece, so that heat transfer is formed, the bottom copper foil is arranged outside, so that heat is quickly dissipated, the purpose of quick heat dissipation is achieved, the service life is effectively prolonged, and the risk of accidents is reduced.

[0027] In order to better understand the above technical solutions, the above technical solutions will be described in detail in combination with the drawings of the specification and specific embodiments.

[0028] The utility model embodiment discloses a PCB packaging mechanism for LDO.

[0029] Embodiment one,

[0030] According to the accompanying Figure 1 The PCB packaging mechanism for LDO shown in Fig. 3 comprises a packaging medium 1, a heat dissipation assembly 2 is arranged in the packaging medium 1, and the heat dissipation assembly 2 comprises:

[0031] A top copper foil 23 is arranged on one side of the packaging medium 1 and is used for adsorbing heat;

[0032] A bottom copper foil 21 is arranged on the other side of the packaging medium 1 and is used for dissipating heat;

[0033] A heat conduction piece 22 is installed between the top copper foil 23 and the bottom copper foil 21 and is used for heat transfer.

[0034] A via hole 12 is formed in the outer surface of the packaging medium 1, the heat conduction piece 22 is arranged to penetrate the via hole 12, and the two ends of the heat conduction piece 22 are fixedly assembled with the top copper foil 23 and the bottom copper foil 21 respectively.

[0035] The two ends of the heat conduction piece 22 are fixedly welded with the top copper foil 23 and the bottom copper foil 21 respectively.

[0036] The packaging medium 1 is a PCB.

[0037] A pad 13 is fixedly arranged on one side of the PCB, and the top copper foil 23 is fixedly welded with the pad 13.

[0038] A pin 14 is fixedly arranged on the outer surface of the pad 13 by tin soldering.

[0039] The heat conducting member 22 is made of pure copper material with a heat conductivity coefficient not less than 380 W / (m·K).

[0040] The heat conducting member 22 is in a spiral structure, and a heat conducting channel is arranged in the heat conducting member 22, and the inner wall of the heat conducting channel is provided with a heat conducting rib extending in the spiral direction.

[0041] The heat conducting member 22 is composed of an outer copper tube and an inner diamond particle, and the particle size of the diamond particle is 50-100 microns.

[0042] In the embodiment, the top copper foil 23 is arranged on one side of the PCB board, and the top copper foil 23 is fixedly welded with the pad 13 of the pin 14, so as to adsorb the large amount of heat generated by the heat pad 13 in use. Then, the heat conducting member 22 is arranged through the PCB board, and the bottom copper foil 21 is arranged on the other side of the PCB board. The heat is conducted through the PCB board to the bottom copper foil 21 through the heat conducting member 22, so as to form heat transfer. The bottom copper foil 21 is arranged outside, so that the heat is quickly dissipated, thereby achieving the purpose of rapid heat dissipation, effectively improving the service life, and reducing the risk of accidents.

[0043] Meanwhile, the via is an existing structure on the PCB board, and the heat conducting member 22 is assembled by using the existing structure, so as to avoid structural damage to the PCB board caused by excessive modification. The heat conducting member 22 is made of pure copper, has good heat conductivity, is in a ring-shaped tubular shape, and increases the heat conducting area in the limited space. The middle part of the heat conducting member 22 is hollow, and the hollow structure is beneficial to the up-and-down flow of air flow, further increases the heat dissipation effect, and realizes the heat conduction through the PCB board to the outside without greatly increasing the area and thickness of the PCB board, so as to achieve good heat dissipation effect.

[0044] Embodiment two,

[0045] According to the embodiment shown in Fig. Figure 1 The heat dissipation assembly 2 comprises a top copper foil 23, a heat conducting member 22 and a bottom copper foil 21.

[0046] The top copper foil 23 is arranged on one side of the packaging medium 1 for adsorbing heat.

[0047] The bottom copper foil 21 is arranged on the other side of the packaging medium 1 for heat dissipation.

[0048] The heat conducting member 22 is arranged between the top copper foil 23 and the bottom copper foil 21 for heat transfer.

[0049] The heat conducting member 22 is fixed between the top copper foil 23 and the bottom copper foil 21 by stamping.

[0050] The two ends of the heat conducting member 22 are formed into two anti-disengagement terminals 24 by stamping deformation.

[0051] In the embodiment, when the heat-conducting member 22 is assembled between the top copper foil 23 and the bottom copper foil 21, the heat-conducting member 22 is installed in a two-end punching form, so that the two ends of the heat-conducting member 22 are formed into two anti-falling terminals 24 through punching deformation, which can ensure effective contact with the top copper foil 23 and the bottom copper foil 21 and also play a good anti-falling effect, without welding, so as to avoid damage to the PCB during welding.

[0052] The basic principle and main features of the utility model and the advantages of the utility model are shown and described above. The skilled in the art should understand that the utility model is not limited by the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principle of the utility model, and various changes and improvements of the utility model can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The scope of protection of the utility model is defined by the appended claims and their equivalents.

Claims

1. A PCB packaging mechanism for LDO comprising a packaging medium (1), characterized in that, The packaging medium (1) is provided with a heat dissipation assembly (2), the heat dissipation assembly (2) comprises; The top layer copper foil (23) is arranged on one side of the packaging medium (1) for absorbing heat; The bottom layer copper foil (21) is arranged on the other side of the packaging medium (1) for heat dissipation; The heat conduction piece (22) is installed between the top layer copper foil (23) and the bottom layer copper foil (21) for heat transfer; The outer surface of the packaging medium (1) is provided with a via hole (12), the heat conduction piece (22) is arranged in the via hole (12), and the two ends of the heat conduction piece (22) are fixedly assembled with the top layer copper foil (23) and the bottom layer copper foil (21) respectively.

2. The PCB packaging mechanism for LDO as claimed in claim 1, wherein, The two ends of the heat conduction piece (22) are fixedly welded with the top layer copper foil (23) and the bottom layer copper foil (21) respectively.

3. The PCB packaging mechanism for LDO as claimed in claim 1, wherein, The heat conduction piece (22) is fixed between the top layer copper foil (23) and the bottom layer copper foil (21) by stamping.

4. The PCB packaging mechanism for LDO as claimed in claim 3, wherein, The two ends of the heat conduction piece (22) are formed into two anti-disengagement terminals (24) by stamping deformation.

5. The PCB packaging mechanism for LDO as claimed in claim 1, wherein, The packaging medium (1) is a PCB board.

6. The PCB packaging mechanism for LDO as claimed in claim 5 wherein, One side of the PCB board is fixedly provided with a solder pad (13), and the top layer copper foil (23) is fixedly welded with the solder pad (13).

7. The PCB packaging mechanism for LDO as claimed in claim 6 wherein, The outer surface of the solder pad (13) is fixedly provided with a pin (14) by tin soldering.

8. The PCB packaging mechanism for LDO as claimed in claim 1, wherein, The heat conduction piece (22) is made of pure copper material with a thermal conductivity not less than 380 W / (m·K).

9. The PCB packaging mechanism for LDO as claimed in claim 1, wherein, The heat conduction piece (22) is a spiral structure, and a heat conduction channel is arranged in the heat conduction piece (22), and the inner wall of the heat conduction channel is provided with a heat conduction convex rib extending in the spiral direction.

10. The PCB packaging mechanism for LDO as claimed in claim 1, wherein, The heat conduction piece (22) is composed of an outer layer copper pipe and an inner layer diamond particle, and the particle size of the diamond particle is 50-100 microns.

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