Powder inner cavity of atomic layer deposition equipment

Abstract

The utility model belongs to the technical field of atomic layer deposition, and relates to a powder inner cavity of atomic layer deposition equipment, which comprises a shell, an inner cavity, a powder inlet and a powder outlet, the cover plate is arranged in the accommodating cavity; the inner container is arranged on the cover plate, and a preset distance is formed between the inner container and the inner wall of the containing cavity; and the accommodating cavity is connected with a reaction chamber of the atomic layer deposition equipment. The powder inner cavity of the atomic layer deposition equipment is compatible with existing planar atomic layer deposition equipment, and powder coating can be carried out without equipment transformation; the powder inner cavity is connected with the atomic layer deposition equipment outer cavity through screws, so that disassembly and maintenance are convenient; and the number of filter screens can be adjusted to be compatible with powder with different particle sizes.

Description

TECHNICAL FIELD

[0001] The utility model relates to atomic layer deposition technical field especially relates to a powder inner chamber of atomic layer deposition equipment. BACKGROUND

[0002] There are various powder surface coating or cladding methods, among which the widely used methods are chemical vapor deposition (CVD) and atomic layer deposition (ALD).

[0003] Chemical vapor deposition is a method of introducing one or more gas precursors into a reaction chamber at the same time, reacting in a gas phase environment, and finally growing a thin film on the surface of the material. Atomic layer deposition is a special chemical vapor deposition technology, which realizes the deposition of materials in the form of single atomic layer by alternately introducing gas precursors into the reaction chamber in the form of pulses and chemisorption reaction on the surface of the deposited material. Atomic layer deposition (ALD) technology, as an excellent coating technology, is widely used in powder surface passivation and surface modification due to its high purity, uniformity and good preservation of the deposited thin film, and is widely used in LED, energy storage, solar energy and many other fields.

[0004] Atomic layer deposition of thin film coating on powder must simultaneously realize the dispersion of powder and complete coating. The main technical methods at present are fluidized bed, vibration, pulse pressure method, rotation method and mechanical stirring method.

[0005] However, the above-mentioned methods all require special powder atomic layer deposition equipment, and planar atomic layer deposition equipment cannot perform powder thin film coating. Fluidized bed, vibration, rotation method and mechanical stirring method may damage the powder or thin film, thereby affecting the coating effect. The pulse pressure method has poor dispersion effect and high requirements for pressure control of the equipment. UTILITY MODEL CONTENT

[0006] Therefore, the utility model provides a powder inner chamber of atomic layer deposition equipment.

[0007] Specifically, the utility model is realized by the following technical scheme:

[0008] According to the first aspect of the utility model, a powder inner chamber of atomic layer deposition equipment is provided, which comprises:

[0009] A shell is provided with a containing cavity in the shell;

[0010] A cover plate is arranged in the containing cavity.

[0011] The inner container is arranged on the cover plate and is spaced apart from the inner wall of the accommodating cavity by a preset distance; the accommodating cavity is connected with a reaction chamber of an atomic layer deposition device.

[0012] Optionally, the shell comprises a cavity and a cavity cover, wherein the edge positions of the cavity and the cavity cover are connected and form the accommodating cavity therebetween, and the edge of the cover plate is connected with the inner wall of the cavity.

[0013] Optionally, an air inlet is arranged on the bottom wall of the cavity, and the air inlet is connected with an air inlet hole of the reaction chamber.

[0014] Optionally, an air outlet is arranged on the bottom wall of the cavity, and the air outlet is connected with an air outlet hole of the reaction chamber.

[0015] Optionally, the inner container comprises an upper baffle ring arranged on the cover plate, and an upper outlet on the upper baffle ring is connected with the accommodating cavity.

[0016] Optionally, the inner container further comprises a main body connected with the lower bottom wall of the upper baffle ring, and the main body is provided with a placing cavity.

[0017] Optionally, the inner container further comprises an upper filter screen arranged between the upper baffle ring and the main body and completely covering the outlet of the placing cavity and the upper outlet.

[0018] Optionally, the inner container further comprises a lower baffle ring connected with the lower bottom wall of the main body, and a lower outlet on the lower baffle ring is connected with the placing cavity.

[0019] Optionally, the inner container further comprises a lower filter screen arranged between the lower baffle ring and the main body and completely covering the outlet of the placing cavity and the lower outlet.

[0020] Optionally, the air inlet and the air outlet are arranged on two sides of the inner container, respectively.

[0021] The technical scheme provided by the utility model has at least the following beneficial effects:

[0022] The powder inner cavity of the atomic layer deposition device provided by the application is compatible with the existing planar atomic layer deposition device, and powder coating can be performed without equipment modification; the powder inner cavity is connected with the outer cavity of the atomic layer deposition device through a screw, and is convenient to disassemble and maintain; the mesh number of the filter screen can be adjusted, and different particle size powders are compatible. BRIEF DESCRIPTION OF DRAWINGS

[0023] The drawings incorporated into the specification and constituting a part of the specification show embodiments consistent with the present application and, together with the specification, serve to explain the principles of the present application.

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the related technical description will be briefly introduced. Obviously, for those skilled in the art, other drawings can also be obtained from these drawings without any creative labor.

[0025] Figure 1 A structural schematic diagram of a powder inner cavity of an atomic layer deposition equipment provided by the embodiment of the present application is shown in the figure.

[0026] Figure 2 A structural schematic diagram of an inner container in a powder inner cavity of an atomic layer deposition equipment provided by the embodiment of the present application is shown in the figure.

[0027] Figure 3 A structural schematic diagram of a cavity in a powder inner cavity of an atomic layer deposition equipment provided by the embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative labor are within the protection scope of the present application.

[0029] Figure 1 A powder inner cavity of an atomic layer deposition equipment suitable for the embodiments of the present application is shown schematically.

[0030] Referring to Figures 1-3 The present application provides a powder inner cavity of an atomic layer deposition equipment, which comprises:

[0031] A shell is provided with an accommodating cavity inside;

[0032] A cover plate 103 is arranged in the accommodating cavity;

[0033] An inner container 104 is arranged on the cover plate 103 and spaced apart from the inner wall of the accommodating cavity by a preset distance; the accommodating cavity is connected with a reaction chamber of an atomic layer deposition equipment.

[0034] In the embodiments of the present application, during operation, the powder inner cavity is installed inside the outer cavity of the atomic layer deposition equipment, the powder is placed in the middle position inside the inner container 104, the inner container 104 is placed in the hole of the cover plate 103, and the containing cavity is connected with the gas inlet hole and the gas outlet hole of the outer cavity of the atomic layer deposition equipment. During the powder coating process, the gas phase precursor enters the inner container 104 and reacts with the powder inside to perform adsorption, and the excess precursor and by-products are extracted outside the cavity. The present application relates to a specific design in the field of atomic layer deposition technology, namely a powder inner cavity of an atomic layer deposition equipment. The main purpose is to be compatible with existing planar atomic layer deposition equipment, so that the powder coating process does not need to be greatly modified.

[0035] Housing: This is the basic structure of the powder inner cavity, which has a containing cavity inside for installing other components.

[0036] Cover plate: arranged in the containing cavity as a support platform for the inner container.

[0037] Inner container: installed on the cover plate and maintaining a certain preset distance from the inner wall of the containing cavity. This design ensures that the powder in the inner container can uniformly receive the precursor gas in the atomic layer deposition process.

[0038] Features and functions: compatibility: the design of the powder inner cavity is compatible with existing planar atomic layer deposition equipment, which means that the powder coating function can be realized without the need for large-scale modification or upgrading of the equipment. Easy to disassemble and maintain: the powder inner cavity is connected to the outer cavity of the atomic layer deposition equipment through screws, which not only ensures the stability of the connection, but also greatly facilitates the disassembly and maintenance of the equipment. Adjustable filter screen: the design mentioned that the mesh size of the filter screen can be adjusted, which makes the powder inner cavity compatible with different particle sizes of powder. Users can choose the appropriate mesh size of the filter screen according to actual needs to ensure that the powder can smoothly enter and uniformly distribute in the inner container.

[0039] Connection and function realization: the containing cavity is connected with the reaction chamber of the atomic layer deposition equipment, which ensures that the precursor gas can smoothly enter the powder inner cavity and deposit on the surface of the powder in the inner container. Through atomic layer deposition technology, the precursor gas is alternately deposited on the surface of the powder in the form of a monolayer, forming the required coating or cladding layer.

[0040] The powder inner cavity design of the atomic layer deposition equipment provided by the present application not only has high compatibility, but also has the characteristics of easy disassembly, easy maintenance and adjustable filter screen. These characteristics make the design have wide application prospects in the field of powder coating, especially in the case of needing to be compatible with different particle sizes of powder, which can better reflect its advantages.

[0041] Exemplarily, the shell comprises a cavity 100 and a cavity cover 101, wherein the edge positions of the cavity 100 and the cavity cover 101 correspond to connection and form the accommodating cavity between the two, and the edge of the cover plate 103 is connected with the inner wall of the cavity 100.

[0042] In the embodiment of the present application, the edge positions of the cavity 100 and the cavity cover 101 are fastened by screws, and the accommodating cavity is formed between the two.

[0043] Exemplarily, the bottom wall of the cavity 100 is provided with an air inlet 102, and the air inlet 102 is connected with the air inlet hole of the reaction chamber.

[0044] In the embodiment of the present application, the air inlet 102 is used for connecting the air inlet hole of the reaction chamber of the atomic layer deposition device, and is used for inputting gas.

[0045] Exemplarily, the bottom wall of the cavity 100 is provided with an air outlet 105, and the air outlet 105 is connected with the air outlet hole of the reaction chamber.

[0046] In the embodiment of the present application, the air outlet 105 is used for connecting the air outlet hole of the reaction chamber of the atomic layer deposition device, and is used for extracting gas.

[0047] Exemplarily, the inner container 104 comprises an upper baffle ring 200, an upper filter screen 201, a main body 202, a lower filter screen 203 and a lower baffle ring 204, wherein the upper baffle ring 200 is arranged on the cover plate 103, the upper outlet on the upper baffle ring 200 is connected with the accommodating cavity, the main body 202 is connected with the lower bottom wall of the upper baffle ring 200 correspondingly, the main body 202 is provided with a placing cavity, the upper filter screen 201 is arranged between the upper baffle ring 200 and the main body 202, and completely covers the outlet of the placing cavity and the upper outlet, the lower baffle ring 204 is connected with the lower bottom wall of the main body 202 correspondingly, the lower outlet on the lower baffle ring 204 is connected with the placing cavity, and the lower filter screen 203 is arranged between the lower baffle ring and the main body 202, and completely covers the outlet of the placing cavity and the lower outlet.

[0048] In the embodiment of the present application, the powder is arranged on the main body 202 and located between the upper filter screen 201 and the lower filter screen 203, and the gas contacts and reacts with the powder through the upper filter screen 201 and the lower filter screen 203.

[0049] Exemplarily, the air inlet 102 and the air outlet 105 are arranged on the two sides of the inner container 104 respectively.

[0050] In the embodiment of the present application, the air inlet 102 and the air outlet 105 arranged on the two sides of the inner container 104 can guide the gas to move in a predetermined direction inside the accommodating cavity, so as to prevent the gas from moving in disorder.

[0051] In this embodiment, the cavity cover 101 and the cavity 100 form a closed containing cavity, and the inner container 104 is placed in the containing cavity for coating.

[0052] In this embodiment, the powder is placed inside the main body 202 and between the upper filter screen 201 and the lower filter screen 203, and a closed space is formed by the upper ring 200 and the lower ring 204. In addition, the cavity cover 101 and the cavity 100 form a closed space by natural pressure fitting, and the upper ring 200, the upper filter screen 201, the lower filter screen 203, and the lower ring 204 are connected by threads to ensure the air tightness of the inner container 104 as a whole, facilitate disassembly, and reduce maintenance costs.

[0053] In this embodiment, the outside of the powder inner cavity is an outer cavity (not shown in the figure) of an atomic layer deposition device, and the powder is placed inside the powder inner cavity for coating. The outer cavity provides a uniform temperature field and a vacuum environment. The reaction chamber is a cross-flow reaction chamber, one side of which is a gas inlet hole and the other side is a gas outlet hole. The gas inlet hole 102 of the powder inner cavity is connected to the gas inlet hole of the reaction chamber, and the gas outlet hole 105 is connected to the gas outlet hole of the reaction chamber.

[0054] In this embodiment, the cavity cover 101 and the cavity 100 are both made of stainless steel or aluminum alloy material, and the surfaces are polished surfaces after polishing treatment.

[0055] In this embodiment, the cover plate 103 and the cavity 100 are connected by bolts, which facilitates later maintenance and cleaning, has a simple and practical structure, and greatly saves production costs.

[0056] In this embodiment, the cavity 100 is provided with a gas outlet hole 102 on one side of the bottom wall, which is used to connect the gas outlet hole of the atomic layer deposition reaction chamber, and the gas is removed through the gas outlet hole of the reaction chamber.

[0057] In this embodiment, the gas outlet hole 105 in the cavity 100 is in a circular shape with a hole diameter of 30 mm.

[0058] In this embodiment, the cavity 100 is provided with a gas inlet hole 102 on one side of the bottom wall, which is used to connect the gas inlet hole of the atomic layer deposition reaction chamber.

[0059] In this embodiment, the cover plate 103 is installed in the cavity 100 and forms a gas guide channel with the inner wall of the cavity 100. The gas inlet hole 102 of the cavity guides the reaction gas precursor into the inner container 104 for powder coating.

[0060] In this embodiment, the cover plate 103 has three circular holes on one side with a diameter of 20 mm for placing the inner container 104. The inner container 104 is in contact with the cover plate 103 and does not contact the inner wall of the cavity 100.

[0061] In this embodiment, the gas inlet 102 of the cavity 100 adopts a circular shape with a hole diameter of 10 mm.

[0062] In this embodiment, the powder is placed inside the main body 203 between the upper filter screen 202 and the lower filter screen 204.

[0063] In this embodiment, the upper ring 200 and the lower ring 204 of the inner container 104 are made of stainless steel or aluminum alloy material, and the surface is a polished surface after polishing treatment.

[0064] In this embodiment, the inner container 104 has a diameter of 25 mm and a height of 12 mm.

[0065] In this embodiment, the upper filter screen 201 is fixed by the threads between the upper ring 200 and the main body 202, which can facilitate later maintenance and cleaning, has a simple and practical structure, and can greatly save production costs.

[0066] In this embodiment, the lower filter screen 203 is fixed by the threads between the lower ring 204 and the main body 202, which can facilitate later maintenance and cleaning, has a simple and practical structure, and can greatly save production costs.

[0067] In this embodiment, the upper filter screen 201 and the lower filter screen 203 have a mesh size of 1800 mesh and 2000 mesh.

[0068] In this embodiment, during operation, the powder cavity is installed inside the outer cavity of the atomic layer deposition equipment, the powder is placed in the middle position inside the inner container 104, the inner container 104 is placed in the hole of the cover plate 103, the gas inlet 102 of the cavity 100 is connected to the gas inlet hole of the outer cavity of the atomic layer deposition equipment, and the gas outlet 105 of the cavity 100 is connected to the gas outlet hole of the outer cavity of the atomic layer deposition equipment. During the powder coating process, the gas phase precursor enters the inner container 104 through the gas inlet 102 of the cavity 100 and reacts with the powder inside to adsorb, and the excess precursor and by-products enter the gas outlet 105 through the upper filter screen 200 and are extracted outside.

[0069] The following is a further analysis and summary of the design of the powder cavity of the atomic layer deposition equipment:

[0070] 1. Powder cavity structure

[0071] Shell:

[0072] Cavity 100: connected with the cavity cover 101 through the screws at the edge position to form a closed containing cavity.

[0073] Cavity cover 101: cooperates with the cavity 100 to ensure the sealing of the containing cavity.

[0074] Inlet 102: Located at the bottom wall of the cavity 100, used to connect the gas inlet hole of the reaction chamber, input gas.

[0075] Exhaust port 105: Also located at the bottom wall of the cavity 100, connected with the exhaust hole of the reaction chamber, used to extract gas.

[0076] Cover plate 103: The edge is connected with the inner wall of the cavity 100, forming a gas guide channel. It is provided with a round hole for placing the inner container 104.

[0077] Inner container 104:

[0078] Upper retaining ring 200: Provided on the cover plate 103, the upper outlet thereof is connected with the containing cavity.

[0079] Upper filter screen 201: Located between the upper retaining ring 200 and the main body 202, covering the outlet of the placing cavity and the upper outlet.

[0080] Main body 202: Connected with the upper retaining ring 200 and the lower retaining ring 204, forming a closed space for placing powder.

[0081] Lower filter screen 203: Located between the lower retaining ring 204 and the main body 202, covering the outlet of the placing cavity and the lower outlet.

[0082] Lower retaining ring 204: Connected with the main body 202, the lower outlet thereof is connected with the placing cavity.

[0083] 2. Design features and functions

[0084] Compatibility: The powder inner cavity design is compatible with existing atomic layer deposition equipment, without the need for large-scale modification. Sealing: The cavity cover 101 and the cavity 100 form a closed space through natural pressure fitting, and the components of the inner container 104 are connected through threads, ensuring air tightness. Easy maintenance: The inner container 104 and the cover plate 103 are connected by bolts, facilitating later maintenance and cleaning. Adjustable filter screen: The mesh number of the upper filter screen 201 and the lower filter screen 203 can be adjusted, compatible with powder of different particle sizes. Gas guiding: The inlet 102 and the exhaust port 105 are arranged on both sides of the inner container 104, guiding the gas to move in a predetermined direction.

[0085] 3. Working principle

[0086] The powder is placed inside the main body 202 of the inner container 104, between the upper filter screen 201 and the lower filter screen 203. The gas phase precursor enters the inner container 104 through the inlet 102 of the cavity 100, and reacts and adsorbs with the powder. The excess precursor and by-products pass through the upper filter screen 201 into the exhaust port 105 and are extracted out of the cavity.

[0087] The powder inner cavity design of the atomic layer deposition equipment has high compatibility, sealing, easy maintenance and filter screen adjustability. Through accurate gas guiding and optimized structure design, the smooth progress of the powder coating process is ensured. At the same time, stainless steel or aluminum alloy materials and polishing treatment are used to improve the durability and aesthetics of the equipment. The powder inner cavity of the atomic layer deposition equipment provided in the application is compatible with the existing planar atomic layer deposition equipment, and powder coating can be carried out without equipment modification; the powder inner cavity is connected with the outer cavity of the atomic layer deposition equipment through screws, which is convenient for disassembly and maintenance; the mesh number of the filter screen can be adjusted to be compatible with powder of different particle sizes.

[0088] It should be noted that in the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0089] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0090] In addition, the terms "mounting", "setting", "provided with", "connecting", "connected" should be understood broadly. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0091] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0092] The above description is merely that of a specific implementation of the present application, which enables those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Accordingly, the present application is not to be limited to these embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A powder interior of an atomic layer deposition apparatus, characterized by, The utility model relates to a shell, which is provided with a containing cavity inside; a cover plate is arranged in the containing cavity; an inner container is arranged on the cover plate and is spaced apart from the inner wall of the containing cavity by a preset distance; and the containing cavity is connected with a reaction chamber of an atomic layer deposition device. The shell comprises a cavity and a cavity cover, wherein the edge positions of the cavity and the cavity cover are connected and form the containing cavity therebetween, and the edge of the cover plate is connected with the inner wall of the cavity. An air inlet is arranged on the bottom wall of the cavity, and the air inlet is connected with an air inlet hole of the reaction chamber. An air outlet is arranged on the bottom wall of the cavity, and the air outlet is connected with an air outlet hole of the reaction chamber.

2. The powder interior of an atomic layer deposition apparatus according to claim 1, characterized in that, The inner container comprises an upper retaining ring arranged on the cover plate, and an upper outlet on the upper retaining ring is connected with the containing cavity.

3. The powder interior of an atomic layer deposition apparatus according to claim 2, characterized in that, The inner container further comprises a main body connected with the lower bottom wall of the upper retaining ring, and the main body is provided with a placing cavity.

4. The powder interior of an atomic layer deposition apparatus according to claim 3, characterized in that, The inner container further comprises an upper filter screen arranged between the upper retaining ring and the main body and completely covering the outlet of the placing cavity and the upper outlet.

5. The powder interior of an atomic layer deposition apparatus according to claim 1, wherein, The inner container further comprises a lower retaining ring connected with the lower bottom wall of the main body, and a lower outlet on the lower retaining ring is connected with the placing cavity.

6. The powder interior of an atomic layer deposition apparatus according to claim 5, characterized in that, The inner container further comprises a lower filter screen arranged between the lower retaining ring and the main body and completely covering the outlet of the placing cavity and the lower outlet.

7. The powder interior of an atomic layer deposition apparatus according to claim 6, characterized in that, The air inlet and the air outlet are arranged on the two sides of the inner container, respectively.

8. The powder interior of an atomic layer deposition apparatus according to claim 6, characterized in that, ​ 9. The powder interior of an atomic layer deposition apparatus according to claim 8, characterized in that, ​ 10. The powder interior of an atomic layer deposition apparatus according to claim 4, characterized in that, ​

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