Silicon wafer reinspection equipment

Abstract

The utility model relates to the technical field of silicon wafer detection, and provides silicon wafer reinspection equipment, which comprises a rack provided with a conveying mechanism for conveying stacked silicon wafers; the normalizing mechanism comprises a four-edge shaping assembly and a pressing exhaust assembly which are arranged on the rack, the four-edge shaping assembly is used for normalizing the positions and the orientations of the silicon wafers on the conveying mechanism, and the pressing exhaust assembly is used for abutting against and exhausting air in the stacked silicon wafers; the four-edge detection mechanism is arranged on the rack, is positioned on two sides of the conveying mechanism, and is used for carrying out quality detection on the side edges of the stacked silicon wafers on the conveying mechanism; and the four-corner detection mechanism is arranged on the rack, is positioned on two sides of the conveying mechanism, and is used for carrying out quality detection on chamfers of the stacked silicon wafers on the conveying mechanism. The silicon wafer reinspection equipment can automatically detect the side edges and the chamfers of the silicon wafer, replaces a current manual detection mode, is consistent in detection standard, can avoid the condition of missing detection or false detection, and greatly improves the detection accuracy and efficiency.

Description

Technical Field

[0001] This application relates to the field of silicon wafer inspection technology, and more specifically, to a silicon wafer re-inspection device. Background Technology

[0002] Silicon wafers, as an important industrial raw material, are widely used in the production of products such as solar cells and circuit boards. Therefore, strict quality control is required before silicon wafers leave the factory to ensure the quality of solar cells, circuit boards, and other products made from silicon wafers.

[0003] Currently, after silicon wafers are cut by the slicing machine and pass through the debinding machine, insertion washing machine, and sorting machine, the four sides and four corners of the stacked silicon wafers need to be re-inspected. The inspection items include silicon drop, edge chipping, scratches, and dirt. At present, the main inspection method is manual inspection. Due to uncontrollable factors such as personnel turnover and inconsistent manual inspection standards, there are cases of missed or false detections, resulting in relatively low accuracy and efficiency of the inspection.

[0004] Therefore, existing technologies still need improvement and development. Utility Model Content

[0005] The purpose of this application is to propose a silicon wafer re-inspection device to solve the technical problem that the accuracy and efficiency of silicon wafer re-inspection using existing technologies are relatively low.

[0006] To achieve the above objectives, the technical solution adopted in this application is: to provide a silicon wafer re-inspection device, comprising:

[0007] For detecting stacked silicon wafers, characterized in that it comprises:

[0008] A rack, on which a conveying mechanism for conveying stacked silicon wafers is provided;

[0009] The straightening mechanism includes a four-sided straightening assembly and a downward pressure exhaust assembly mounted on the frame. The four-sided straightening assembly is used to straighten the position and orientation of the silicon wafers on the conveying mechanism, and the downward pressure exhaust assembly is used to press down and expel air from the stacked silicon wafers.

[0010] The four-sided inspection mechanism is installed on the frame and located on both sides of the conveying mechanism, and is used to inspect the sides of the stacked silicon wafers on the conveying mechanism.

[0011] The four-corner inspection mechanism is installed on the frame and located on both sides of the conveying mechanism, and is used to inspect the chamfers of the stacked silicon wafers on the conveying mechanism.

[0012] Furthermore, the downward pressure exhaust assembly includes:

[0013] A gantry frame is mounted on the frame, and the gantry frame includes a crossbeam located above the conveying mechanism;

[0014] The first driving device is mounted on the crossbeam;

[0015] A pressure plate is connected to the first driving device, which drives the pressure plate to reciprocate between a first position and a second position in a vertical direction. In the first position, the pressure plate moves away from the stacked silicon wafers, and in the second position, the pressure plate presses against the top of the stacked silicon wafers.

[0016] Furthermore, the lower pressure plate includes a first pressure plate, a second pressure plate, a guide rod, and a reset elastic element. One side of the first pressure plate is connected to the first driving device, and the second pressure plate is elastically connected to the other side of the first pressure plate through the reset elastic element. The second pressure plate is used to press against the stacked silicon wafers.

[0017] In some embodiments, the quadrilateral shaping component includes:

[0018] The second drive unit is mounted on the frame;

[0019] A leveling plate is connected to the second driving device, which drives the leveling plate to reciprocate between a third position and a fourth position in a horizontal direction. In the third position, the leveling plate moves away from the stacked silicon wafers, and in the fourth position, the leveling plate presses against the four sides of the stacked silicon wafers.

[0020] Furthermore, the quadrilateral shaping assembly also includes a lifting assembly, which includes a third drive device mounted on the frame and located below the conveying mechanism. The third drive device is connected to a lifting plate facing the conveying mechanism. A second drive device is located on top of the lifting plate. The third drive device is used to drive the lifting plate to reciprocate between a fifth position and a sixth position in the vertical direction. When the lifting plate is in the fifth position, the shaping plate is located below the conveying mechanism. When the lifting plate is in the sixth position, the shaping plate is located above the conveying mechanism.

[0021] In some embodiments, the lifting plate is provided with a plurality of second driving devices, and the aligning plates on the plurality of second driving devices form a aligning area. When the lifting plate is in the sixth position, the stacked silicon wafers are located within the aligning area.

[0022] Furthermore, the quadrilateral detection mechanism includes a first moving component and a line scan camera and a line scan light source disposed on the first moving component. The first moving component is used to drive the line scan camera and the line scan light source to reciprocate along a first direction, which is perpendicular to the extension direction of the conveying mechanism.

[0023] In some embodiments, the four-corner detection mechanism includes a second moving component and an area array camera and an area array light source disposed on the second moving component. The second moving component is used to drive the area array camera and the area array light source to reciprocate along a second direction, which is set at a non-perpendicular angle to the extension direction of the conveying mechanism.

[0024] Furthermore, the conveying mechanism includes a first conveying device and a second conveying device. Both the first and second conveying devices include a rolling belt and a drive motor for rotating the rolling belt. The first and second conveying devices are connected along the conveying direction. The first conveying device is located outside the frame, and the second conveying device is located inside the frame. The straightening mechanism, the four-sided detection mechanism, and the four-corner detection mechanism are arranged sequentially along the second conveying device.

[0025] In some embodiments, the drive motor is a servo motor.

[0026] The beneficial effects of the silicon wafer re-inspection equipment provided in this application are at least as follows: the silicon wafer re-inspection equipment of this application can automatically inspect the sides and chamfers of silicon wafers, replacing the current manual inspection method. The inspection standards are consistent, which can avoid missed or false inspections, and the accuracy and efficiency of the inspection are greatly improved.

[0027] The four-sided shaping component can neatly align the sides of the stacked silicon wafers, and the downward venting component can squeeze out the air between the individual silicon wafers in the stack, eliminating the gaps between the silicon wafers. This improves the accuracy of the test, makes the test results more accurate and reliable, and reduces the risk of false detection. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A perspective view of the silicon wafer re-inspection equipment provided in the embodiments of this application;

[0030] Figure 2 This is a schematic diagram of the structure of the downward-pressure exhaust assembly provided in the embodiments of this application;

[0031] Figure 3 This is a schematic diagram of the structure of the quadrilateral shaping component provided in the embodiments of this application;

[0032] Figure 4 This is a schematic diagram of the four-sided detection mechanism provided in the embodiments of this application;

[0033] Figure 5 This is a schematic diagram of the four-corner detection mechanism provided in the embodiments of this application;

[0034] Figure 6 This is a schematic diagram of the conveying mechanism provided in an embodiment of this application.

[0035] The following are the labeling elements in the figure:

[0036] 1. Rack;

[0037] 2. Conveying mechanism; 21. First conveying device; 22. Second conveying device; 23. Rolling belt; 24. Drive motor;

[0038] 3. Four-sided shaping assembly; 31. Second drive device; 32. Leveling plate; 33. Third drive device; 34. Lifting plate;

[0039] 4. Lower pressure exhaust assembly; 41. Gantry frame; 42. Crossbeam; 43. First drive device; 44. Lower pressure plate; 45. First pressure plate; 46. Second pressure plate; 47. Guide rod; 48. Reset elastic element;

[0040] 5. Four-sided detection mechanism; 51. First moving component; 52. Line scan camera; 53. Line scan light source;

[0041] 6. Four-corner detection mechanism; 61. Second moving component; 62. Area array camera; 63. Area array light source;

[0042] 7. Stacking silicon wafers. Detailed Implementation

[0043] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0044] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0045] The silicon wafer re-inspection equipment of this application embodiment is described below with reference to the accompanying drawings.

[0046] Please see Figure 1 , Figure 1 A perspective view of the silicon wafer re-inspection equipment of this application is shown. The silicon wafer re-inspection equipment is used to inspect stacked silicon wafers 7, wherein stacked silicon wafers 7 refers to multiple silicon wafers stacked together.

[0047] Continue reading Figure 1 The silicon wafer re-inspection equipment includes a frame 1, a straightening mechanism, a four-sided inspection mechanism 5, and a four-corner inspection mechanism 6. The frame 1 is equipped with a conveying mechanism 2 for conveying stacked silicon wafers 7.

[0048] The straightening mechanism includes a four-sided straightening component 3 and a downward pressure exhaust component 4 mounted on the frame 1. The four-sided straightening component 3 is used to straighten the position and orientation of the silicon wafers on the conveying mechanism 2, and the downward pressure exhaust component 4 is used to press down and expel air from the stacked silicon wafers 7.

[0049] The four-sided inspection mechanism 5 is installed on the frame 1 and located on both sides of the conveying mechanism 2, and is used to inspect the quality of the sides of the stacked silicon wafers 7 on the conveying mechanism 2.

[0050] The four-corner inspection mechanism 6 is installed on the frame 1 and located on both sides of the conveying mechanism 2, and is used to inspect the chamfers of the stacked silicon wafers 7 on the conveying mechanism 2.

[0051] The procedure for re-inspecting stacked silicon wafers 7 is as follows:

[0052] Place the silicon wafer on the conveying mechanism 2;

[0053] The conveying mechanism 2 moves the stacked silicon wafers 7 to the straightening mechanism. The four-sided straightening component 3 straightens the four sides of the stacked silicon wafers 7, aligning the sides of the multiple stacked silicon wafers. Then, the downward venting component 4 presses against the top of the stacked silicon wafers 7 to expel the air between each silicon wafer and eliminate gaps.

[0054] The conveying mechanism 2 drives the stacked silicon wafers 7 to continue moving. The four-sided inspection mechanism 5 is used to inspect the quality of the sides of the stacked silicon wafers 7; the four-corner inspection mechanism 6 is used to inspect the quality of the chamfers of the stacked silicon wafers 7. The inspection items include, but are not limited to, silicon drop, chipping, scratches, and dirt.

[0055] The conveying mechanism 2 drives the stacked silicon wafers 7 to continue moving, and the stacked silicon wafers 7 are removed from the production line.

[0056] The silicon wafer re-inspection equipment of this application can automatically inspect the sides and chamfers of silicon wafers, replacing the current manual inspection method. The inspection standards are consistent, which can avoid missed or false inspections, and the accuracy and efficiency of the inspection are greatly improved.

[0057] Furthermore, in the photovoltaic industry, the quality of silicon wafers directly affects the performance of the final product. Therefore, the inspection and handling of silicon wafers during production requires extreme precision. If stacked silicon wafers are misaligned during inspection or there are gaps between them, measuring tools will be unable to accurately read key parameters of the wafers, such as thickness and flatness. This will affect subsequent quality assessments, potentially leading to qualified products being mistakenly identified as unqualified, or worse, defective products failing to be identified.

[0058] In automated inspection systems, the positional information of each silicon wafer is crucial for tracking and recording product quality. If the silicon wafers are misaligned, the relevant data (such as position coordinates) will become unreliable, affecting batch management and traceability.

[0059] Before inspecting the stacked silicon wafers 7, the silicon wafer retesting equipment of this application can align the sides of the stacked silicon wafers 7 by means of the four-sided shaping component 3, and squeeze out the air between each silicon wafer in the stacked silicon wafers 7 by means of the downward venting component 4, thereby eliminating the gaps between the silicon wafers. This allows the stacked silicon wafers 7 to achieve edge alignment and no gaps between them during inspection, thereby improving the inspection accuracy, making the inspection results more accurate and reliable, and reducing the risk of false detection.

[0060] Further, see Figure 1 and Figure 2 The downward pressure exhaust assembly 4 includes a gantry frame 41, a first drive device 43, and a downward pressure plate 44. The gantry frame 41 is mounted on the frame 1 and includes a crossbeam 42 located above the conveying mechanism 2. The first drive device 43 is mounted on the crossbeam 42. The downward pressure plate 44 is connected to the first drive device 43, which drives the downward pressure plate 44 to reciprocate between a first position and a second position in a vertical direction. In the first position, the downward pressure plate 44 moves away from the stacked silicon wafers 7, and in the second position, the downward pressure plate 44 presses against the top of the stacked silicon wafers 7.

[0061] When the conveying mechanism 2 moves the stacked silicon wafers 7 to below the pressure exhaust assembly 4, the first driving device 43 drives the pressure plate 44 from the first position to the second position. The pressure plate 44 presses against the top of the stacked silicon wafers 7. Through the pressure, the stacked silicon wafers are pressed together, air is discharged, and gaps are eliminated.

[0062] The first driving device 43 is a cylinder with a cylinder rod. The lower pressure plate 44 is connected to the cylinder rod. After the cylinder is started, it drives the cylinder rod to move relative to each other in the vertical direction, so that the lower pressure plate 44 switches between the first position and the second position.

[0063] Further, see Figure 2 The lower pressure plate 44 includes a first pressure plate 45, a second pressure plate 46, a guide rod 47, and a reset elastic member 48. One side of the first pressure plate 45 is connected to the cylinder rod, and the second pressure plate 46 is elastically connected to the other side of the first pressure plate 45 through the reset elastic member 48. The second pressure plate 46 is used to press the stacked silicon wafers 7.

[0064] Since the second pressure plate 46 has a certain degree of hardness, and the silicon wafer has very high requirements for surface quality, if the instantaneous pressure is too large after the first pressure plate 45 presses against the silicon wafer, it is easy to cause impact damage to the silicon wafer. This application provides a reset elastic element 48 between the first pressure plate 45 and the second pressure plate 46. When the second pressure plate 46 abuts against the silicon wafer, if the abutting force reaches the strength threshold of the reset elastic element 48, the reset elastic element 48 will automatically contract, thereby reducing the force applied to the silicon wafer, achieving a buffering effect, and reducing the risk of damage to the silicon wafer.

[0065] Furthermore, the reset elastic element 48 includes a reset spring. The first pressure plate 45 and the second pressure plate 46 are polyurethane plates. Polyurethane plates are softer than metal plates, and the soft material can reduce friction and impact with the silicon wafer, thus reducing material damage.

[0066] Furthermore, a guide hole is provided on the first pressure plate 45, and a guide bearing is provided in the guide hole. One end of the guide rod 47 is fixedly connected to the second pressure plate 46, and the other end is connected to the guide bearing. The guide rod 47 can move relative to the guide bearing along the length direction. After the second pressure plate 46 presses against the silicon wafer, if the pressure between the second pressure plate 46 and the silicon wafer is greater than the strength threshold of the reset elastic member 48, then the reset elastic member 48 contracts, and the second pressure plate 46 and the guide rod 47 move towards the first pressure plate 45 along the direction of the guide shaft. When the pressure between the second pressure plate 46 and the silicon wafer is less than the strength threshold of the reset elastic member 48, the reset elastic member 48 resets, and the second pressure plate 46 and the first pressure plate 45 return to their original distance.

[0067] In some implementations, see Figure 1 and Figure 3The four-sided shaping assembly 3 includes a second driving device 31 and a straightening plate 32. The second driving device 31 is mounted on the frame 1. The straightening plate 32 is connected to the second driving device 31. The second driving device 31 is used to drive the straightening plate 32 to reciprocate between a third position and a fourth position in the horizontal direction. When the straightening plate 32 is in the third position, it moves away from the stacked silicon wafer 7. When the straightening plate 32 is in the fourth position, it presses against the four sides of the stacked silicon wafer 7.

[0068] When the conveying mechanism 2 moves the stacked silicon wafers 7 to the position of the four-sided shaping component 3, the second driving device 31 drives the straightening plate 32 from the third position to the fourth position. The straightening plate 32 presses against the side of the stacked silicon wafers 7, and the side of the stacked silicon wafers is aligned by the pressure.

[0069] Furthermore, the second drive device 31 is also a cylinder, and a cylinder rod is provided on the cylinder. The leveling plate 32 is connected to the cylinder rod. After the cylinder is started, it drives the cylinder rod to move relative to each other in the horizontal direction, so that the leveling plate 32 switches between the third position and the fourth position.

[0070] Further, see Figure 3 The four-sided shaping assembly 3 also includes a lifting assembly, which includes a third drive device 33 mounted on the frame 1 and located below the conveying mechanism 2. The third drive device 33 is connected to a lifting plate 34 facing the conveying mechanism 2. A second drive device 31 is mounted on top of the lifting plate 34. The third drive device 33 is used to drive the lifting plate 34 to reciprocate between the fifth and sixth positions in the vertical direction. When the lifting plate 34 is in the fifth position, the shaping plate 32 is located below the conveying mechanism 2. When the lifting plate 34 is in the sixth position, the shaping plate 32 is located above the conveying mechanism 2.

[0071] In other words, when no straightening is performed, the four-sided straightening component 3 is located below the conveying mechanism 2, and the straightening plate 32 will not block the stacked silicon wafers 7 moving on the conveying mechanism 2. When the stacked silicon wafers 7 move to the straightening position, the third drive device 33 of the lifting component is activated, driving the lifting plate 34 to rise, so that the straightening plate 32 rises and reaches the position of horizontal alignment with the stacked silicon wafers 7. Then, the second drive device 31 drives the straightening plate 32 to straighten and align the sides of the stacked silicon wafers 7.

[0072] Furthermore, the lifting plate 34 is provided with four second driving devices 31, and the regularization plates 32 on the four second driving devices 31 form a regularization area. When the lifting plate 34 is in the sixth position, the stacked silicon wafers 7 are located in the regularization area.

[0073] Of course, more second drive devices 31 can be set on the lifting plate 34, such as five, six, seven, or eight second drive devices 31, or even fewer, such as two or three second drive devices 31, to accommodate silicon wafers of different shapes.

[0074] In some implementations, see Figure 1 and Figure 4 The four-sided detection mechanism 5 includes a first moving component 51 and a line scan camera 52 and a line scan light source 53 mounted on the first moving component 51. The first moving component 51 is used to drive the line scan camera 52 and the line scan light source 53 to reciprocate along a first direction, which is perpendicular to the extension direction of the conveying mechanism 2.

[0075] By combining the line scan camera 52 with the line scan light source 53, the concentrated and high-intensity light provided by the line scan light source 53 enables the line scan camera 52 to capture clearer and more detailed image information, ensuring image quality even in high-speed environments, thereby improving the reliability and efficiency of the overall system during detection.

[0076] The first moving component 51 can adjust the relative distance between the line scan camera 52, the line scan light source 53, and the silicon wafer in real time, so that the line scan camera 52 and the line scan light source 53 are in the optimal detection position.

[0077] Further, see Figure 1 and Figure 5 The four-corner detection mechanism 6 includes a second moving component 61 and an area array camera 62 and an area array light source 63 disposed on the second moving component 61. The second moving component 61 is used to drive the area array camera 62 and the area array light source 63 to reciprocate along a second direction, which is set at a non-perpendicular angle to the extension direction of the conveying mechanism 2.

[0078] In this embodiment, the silicon wafer is a square silicon wafer. When the first moving component 51 drives the line scan camera 52 and the line scan light source 53 to move back and forth along the first direction, the line scan camera 52 and the line scan light source 53 can be directly facing the side of the silicon wafer. When the second moving component 61 drives the area scan camera 62 and the area scan light source 63 to move back and forth along the second direction, the area scan camera 62 and the area scan light source 63 can be aligned with the chamfer position of the silicon wafer, making the detection area more accurate and further improving the detection accuracy.

[0079] In some implementations, see Figure 1 and Figure 6 The conveying mechanism 2 includes a first conveying device 21 and a second conveying device 22. Both the first conveying device 21 and the second conveying device 22 include a rolling belt 23 and a drive motor 24 for driving the rolling belt 23 to rotate. The first conveying device 21 and the second conveying device 22 are connected along the conveying direction. The first conveying device 21 is located outside the frame 1, and the second conveying device 22 is located inside the frame 1. The straightening mechanism, the four-sided detection mechanism 5, and the four-corner detection mechanism 6 are arranged sequentially along the second conveying device 22.

[0080] The first conveying device 21 is set outside the frame 1 to facilitate the loading and placement of silicon wafers. When not in use for inspection, the first conveying device 21 can be placed in other locations to reduce the space occupied by the silicon wafer re-inspection equipment and make storage more convenient.

[0081] Furthermore, the drive motor 24 is a servo motor. Servo motors can precisely control position, speed, and torque, providing very high position resolution to ensure that moving parts reach the designated position, and can maintain extremely high repeatability in multiple runs, further improving the accuracy of positioning during detection, thereby improving detection precision.

[0082] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A silicon wafer re-inspection device for inspecting stacked silicon wafers, characterized in that, The application relates to a silicon wafer stack alignment device. The device comprises: a rack, a conveying mechanism arranged on the rack for conveying a silicon wafer stack; a four-side alignment assembly arranged on the rack and used for aligning the position and orientation of the silicon wafer stack on the conveying mechanism; a four-side detection assembly arranged on the rack and located on both sides of the conveying mechanism and used for detecting the side edges of the silicon wafer stack on the conveying mechanism; 2. The silicon wafer review apparatus of claim 1, wherein a four-corner detection assembly arranged on the rack and located on both sides of the conveying mechanism and used for detecting the chamfer of the silicon wafer stack on the conveying mechanism. The four-side alignment assembly comprises: a gantry arranged on the rack, the gantry comprising a beam located above the conveying mechanism; a first driving device arranged on the beam; 3. The silicon wafer review apparatus of claim 2, wherein, a pressing plate connected to the first driving device, the first driving device being used for driving the pressing plate to reciprocate along a vertical direction between a first position and a second position, the pressing plate being away from the silicon wafer stack at the first position and pressing the top of the silicon wafer stack at the second position.

4. The silicon wafer review apparatus of claim 1, wherein The pressing plate comprises a first pressing plate, a second pressing plate, a guide rod and a reset elastic member, one side of the first pressing plate being connected to the first driving device, the second pressing plate being elastically connected to the other side of the first pressing plate through the reset elastic member, and the second pressing plate being used for pressing the silicon wafer stack. The four-side alignment assembly further comprises a jacking assembly, the jacking assembly comprising a third driving device arranged on the rack and located below the conveying mechanism, the third driving device being connected to a jacking plate facing the conveying mechanism, the second driving device being arranged on the top of the jacking plate, and the third driving device being used for driving the jacking plate to reciprocate along a vertical direction between a fifth position and a sixth position, the jacking plate being located below the conveying mechanism at the fifth position and being located above the conveying mechanism at the sixth position. The jacking plate is provided with a plurality of second driving devices, and the jacking plates on the plurality of second driving devices surround to form an alignment area, the silicon wafer stack being located in the alignment area when the jacking plate is located at the sixth position.

5. The silicon wafer review apparatus of claim 4, wherein, The four-side detection assembly comprises a first moving assembly, a line array camera and a line scanning light source arranged on the first moving assembly, the first moving assembly being used for driving the line array camera and the line scanning light source to reciprocate along a first direction, the first direction being perpendicular to the extending direction of the conveying mechanism.

6. The silicon wafer review apparatus of claim 5, wherein, ​ 7. The silicon slice review apparatus of claim 1 wherein, ​ 8. The silicon slice review apparatus of claim 1 wherein, The four-corner detection mechanism comprises a second moving assembly, a surface array camera and a surface array light source arranged on the second moving assembly, and the second moving assembly is used to drive the surface array camera and the surface array light source to reciprocate along a second direction, and the second direction is arranged at a non-perpendicular angle with the extension direction of the conveying mechanism.

9. The silicon slice review apparatus of claim 1 wherein, The conveying mechanism comprises a first conveying device and a second conveying device, and the first conveying device and the second conveying device each comprise a rolling belt and a driving motor used to drive the rolling belt to rotate, the first conveying device and the second conveying device are butted along a conveying direction, the first conveying device is located outside the rack, the second conveying device is located inside the rack, and the sizing mechanism, the four-side detection mechanism and the four-corner detection mechanism are sequentially arranged along the second conveying device.

10. The silicon wafer review apparatus of claim 9, wherein, The driving motor is a servo motor.

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