Chip resistor

Abstract

The utility model discloses a chip resistor, which relates to the technical field of chip resistors and comprises a substrate, two ends of the upper side surface of the substrate are respectively provided with a positive electrode, two ends of the lower side surface of the substrate are respectively provided with a back electrode, and the positive electrodes and the back electrodes are respectively provided with a prefabricated groove. Side electrodes are arranged on the outer sides of the prefabricated grooves, net-shaped pins are fixedly connected to the side electrodes, and the net-shaped pins are correspondingly arranged in the prefabricated grooves. According to the resistor disclosed by the utility model, the prefabricated grooves are formed in the positive electrode and the back electrode, and the net-shaped pins are inserted and fixed in the prefabricated grooves, so that the conductive effect of the resistor is remarkably enhanced, and the connection stability between the pins and the electrodes is also greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to chip resistor technical field, specifically a kind of chip resistor. BACKGROUND

[0002] Chip resistor has become the indispensable component of various electronic products, the performance of product, application range are closely related to the characteristic parameters of chip resistor applied in it to some extent, and if the application range of product is to be expanded, product performance is improved etc., it is still necessary to start from chip resistor, with the improvement of scientific and technological level, chip resistor has also been developed greatly, but there are still some problems that need to be optimized.

[0003] The chip resistor with publication number CN209388803U provides a kind of chip resistor, including: a ceramic substrate and two resistance layers on the two surfaces of ceramic substrate, two resistance layers are connected in series through side guide on the side wall of ceramic substrate, can be applicable to thick film high resistance product.The above-mentioned application has series resistance arranged on the two opposite surfaces of wafer chip, and has the beneficial effect of increasing the flexibility of resistance design.

[0004] However, the above-mentioned patent lacks heat dissipation for chip resistor in the implementation process, which causes chip resistor to accumulate a large amount of heat when running, and further causes damage to chip resistor, secondly, chip resistor is easily impacted and vibrated by external environment in complex working environment, and further chip resistor can be damaged. UTILITY MODEL CONTENT

[0005] To solve the problems proposed in the above background art, the utility model provides a kind of chip resistor.

[0006] The purpose of the utility model can be realized by the following technical solutions:

[0007] A kind of chip resistor, including substrate, one positive electrode is respectively arranged on the upper side of the two ends of the substrate, one back electrode is respectively arranged on the lower side of the two ends of the substrate, prefabricated groove is set up on the positive electrode and back electrode, side electrode is set up on the outside of prefabricated groove, net-like pin is fixedly connected on the side electrode, and the net-like pin is correspondingly arranged in the inside of prefabricated groove.

[0008] As a further preferred of the technical scheme: the upper side of the substrate is fixedly provided with heat dissipation fin, and a plurality of second buffer blocks are arranged between the heat dissipation fin and the substrate.

[0009] As a further preferred of the technical scheme: the outside of the heat dissipation fin is provided with second protective layer, and the outside of the second protective layer is provided with first protective layer.

[0010] As a further preferred embodiment of this technical solution, an insulating plate is provided between the two back electrodes.

[0011] As a further preferred embodiment of this technical solution: the lower end of the insulating plate is provided with a shock-absorbing pad, and the lower end of the shock-absorbing pad is fixedly connected with a plurality of No. 1 buffer pad blocks.

[0012] As a further preferred embodiment of this technical solution: a conductive layer is provided on the outer side of the side electrode, the conductive layer including a tin-lead plating layer and a nickel plating layer, the tin-lead plating layer being disposed on the outer side of the nickel plating layer.

[0013] As a further preferred embodiment of this technical solution, the mesh pins and the prefabricated grooves are of the same size and shape.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. In this utility model, by setting pre-made grooves on the positive electrode and the back electrode, and inserting and fixing the mesh pins into the pre-made grooves, not only is the conductivity of the resistor significantly enhanced, but the connection stability between the pins and the electrodes is also greatly improved.

[0016] 2. In this utility model, the added second buffer pad between the heat dissipation fins and the substrate not only optimizes the heat conduction path and improves the heat dissipation efficiency of the chip resistor during operation, but also reduces the impact of external vibration on the substrate through the buffer pad.

[0017] 3. In this utility model, the second protective layer of alumina material effectively resists physical wear in the external environment due to its high hardness and wear resistance, while the first protective layer of polyurethane material further enhances the insulation, corrosion resistance and moisture resistance of the resistor.

[0018] 3. In this utility model, the shock-absorbing pad and the first buffer pad provided at the lower end of the insulating substrate serve as key buffering elements, effectively absorbing the vibration energy generated by the chip resistor when subjected to external impact, and significantly reducing the risk of damage to the internal structure of the resistor caused by these impacts. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a partial structural diagram of the present invention. Figure One ;

[0021] Figure 3 This is a partial exploded view of the structure of this utility model;

[0022] Figure 4 This is a partial structural diagram of the present invention. Figure Two .

[0023] Legend: 1, substrate; 2, positive electrode; 3, back electrode; 4, insulating plate; 5, shock pad; 6, No. 1 buffer pad; 7, No. 1 protective layer; 8, No. 2 protective layer; 9, heat dissipation fin; 10, No. 2 buffer pad; 11, side electrode; 12, tin-lead plating layer; 13, mesh-shaped pin; 14, prefabricated groove; 15, nickel plating layer. DETAILED DESCRIPTION

[0024] The technical solutions of the present application will be described clearly and completely below in conjunction with the embodiments, and obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0025] Embodiment one:

[0026] Please refer to Figures 1-4 The present application provides a chip resistor, which comprises a substrate 1, two positive electrodes 2 are respectively arranged on the two ends of the upper side of the substrate 1, two back electrodes 3 are respectively arranged on the two ends of the lower side of the substrate 1, prefabricated grooves 14 are arranged on the positive electrodes 2 and the back electrodes 3, side electrodes 11 are arranged on the outer sides of the prefabricated grooves 14, mesh-shaped pins 13 are fixedly connected to the side electrodes 11, and the mesh-shaped pins 13 are correspondingly arranged in the prefabricated grooves 14.

[0027] Specifically, by inserting the mesh-shaped pins 13 into the prefabricated grooves 14 and then welding or fixing with glue, on the one hand, the conductivity effect can be improved, and on the other hand, the fixing effect is better, so that the side electrodes 11 are not easy to be separated from the positive electrodes 2 or the back electrodes 3, thereby avoiding the problem of poor contact of the chip resistor.

[0028] In this embodiment, an insulating plate 4 is arranged between the two back electrodes 3, a conductive layer is arranged on the outer side of the side electrode 11, the conductive layer comprises a tin-lead plating layer 12 and a nickel plating layer 15, the tin-lead plating layer 12 is arranged on the outer side of the nickel plating layer 15, and the size and shape of the mesh-shaped pin 13 are the same as those of the prefabricated groove 14.

[0029] Embodiment two:

[0030] On the basis of embodiment one, a heat dissipation fin 9 is fixedly arranged on the upper side of the substrate 1, and a plurality of No. 2 buffer pads 10 are arranged between the heat dissipation fin 9 and the substrate 1, wherein the arrangement of the heat dissipation fin 9 effectively improves the heat dissipation efficiency of the chip resistor during the working process, can rapidly conduct the heat generated in the resistor to the external environment, and reduces the operating temperature of the resistor, and the No. 2 buffer pads 10 can be made of rubber and provide buffering, so as to avoid that the substrate 1 is damaged by external vibration.

[0031] Example three:

[0032] On the basis of example one, the outer side of the heat dissipation fin 9 is provided with a second protective layer 8, the outer side of the second protective layer 8 is provided with a first protective layer 7, wherein the second protective layer 8 can be aluminum oxide material, has very high hardness and wear resistance, can further enhance the wear resistance of the resistor, the first protective layer 7 can be polyurethane material, has good insulation, corrosion resistance and moisture resistance.

[0033] Example four:

[0034] On the basis of example one, the lower end of the insulating plate 4 is provided with a shock pad 5, the lower end of the shock pad 5 is fixedly connected with a plurality of first buffer blocks 6, wherein the shock pad 5 and the first buffer block 6 are existing products, because of the material, can absorb the vibration of the chip resistor when impacted, protect the chip resistor from being damaged.

[0035] The above examples are only used to illustrate the technical method of the utility model and not to limit, although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the utility model can be modified or replaced equivalently without departing from the spirit and scope of the technical method of the utility model.

Claims

1. A chip resistor comprising a substrate (1), characterized in that: The upper side of the substrate (1) is provided with one positive electrode (2) at each end, the lower side of the substrate (1) is provided with one back electrode (3) at each end, the positive electrode (2) and the back electrode (3) are provided with prefabricated slots (14), the outer side of the prefabricated slots (14) is provided with side electrodes (11), the side electrodes (11) are fixedly connected with mesh pins (13), and the mesh pins (13) are correspondingly arranged in the prefabricated slots (14).

2. A chip resistor according to claim 1, wherein The upper side of the substrate (1) is fixedly provided with heat dissipation fins (9), and a plurality of second buffer pads (10) are arranged between the heat dissipation fins (9) and the substrate (1).

3. A chip resistor according to claim 2, wherein The outer side of the heat dissipation fins (9) is provided with a second protective layer (8), and the outer side of the second protective layer (8) is provided with a first protective layer (7).

4. The chip resistor of claim 1, wherein The two back electrodes (3) are provided with an insulating plate (4).

5. A chip resistor according to claim 4, wherein The lower end of the insulating plate (4) is provided with a shock pad (5), and the lower end of the shock pad (5) is fixedly connected with a plurality of first buffer pads (6).

6. A chip resistor as defined in claim 1, wherein The outer side of the side electrode (11) is provided with a conductive layer, the conductive layer comprises a tin-lead plating layer (12) and a nickel plating layer (15), and the tin-lead plating layer (12) is arranged on the outer side of the nickel plating layer (15).

7. The chip resistor of claim 1, wherein The size and shape of the mesh pin (13) and the prefabricated slot (14) are the same.

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