Adsorption mechanism and adsorption device

Abstract

The utility model provides an adsorption mechanism and an adsorption device. The adsorption mechanism comprises a base plate, an adsorption assembly and an air blowing assembly. The substrate includes a suction side. The adsorption side is defined as the side, facing the silicon wafer to be adsorbed, of the substrate. The adsorption assembly is arranged on the substrate. The adsorption assembly has an adsorption part. The adsorption part is arranged on the adsorption side. The adsorption part is configured to adsorb a silicon wafer. The blowing assembly is arranged on the substrate. The blowing assembly is provided with a blowing part. The blowing part is arranged on the adsorption side. The air blowing part is configured to blow air to the silicon wafer. And the adsorption part and the blowing part act on the silicon wafers on the same side of the substrate. According to the adsorption mechanism and the adsorption device provided by the invention, silicon wafers can be adsorbed conveniently.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon wafer transfer, in particular to an adsorption mechanism and an adsorption device. BACKGROUND

[0002] When the silicon wafer is placed in the carrier, the silicon wafer can be attached to the carrier, and a negative pressure can be formed between the attached surfaces of the two, so that the silicon wafer is adsorbed to the carrier. At this time, if the adsorption mechanism needs to take out the silicon wafer from the carrier, the adsorption mechanism needs a larger adsorption force, and the operation is not convenient. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application provides an adsorption mechanism and an adsorption device to facilitate the adsorption of the silicon wafer.

[0004] An embodiment of the present application provides an adsorption mechanism. The adsorption mechanism comprises a substrate, an adsorption assembly and a blowing assembly. The substrate comprises an adsorption side. The adsorption side is defined as a side of the substrate facing the silicon wafer to be adsorbed. The adsorption assembly is arranged on the substrate. The adsorption assembly has an adsorption part. The adsorption part is arranged on the adsorption side. The adsorption part is configured to adsorb the silicon wafer. The blowing assembly is arranged on the substrate. The blowing assembly has a blowing part. The blowing part is arranged on the adsorption side. The blowing part is configured to blow air to the silicon wafer. The adsorption part and the blowing part act on the silicon wafer located on the same side of the substrate.

[0005] In some embodiments of the present application, the adsorption side has an adsorption area. In the direction perpendicular to the adsorption side, the projection of the adsorption part is located in the adsorption area, and the projection of the blowing part is at least partially located outside the adsorption area, so that the blowing part is configured to face the edge of the silicon wafer to be adsorbed.

[0006] In some embodiments of the present application, in the direction perpendicular to the adsorption side, the blowing part is lower than the adsorption part.

[0007] In some embodiments of the present application, in the direction perpendicular to the adsorption side, the adsorption part protrudes from the adsorption side.

[0008] In some embodiments of the present application, the substrate further has a back side and a circumferential side. The adsorption side and the back side are arranged opposite to each other. The circumferential side is connected between the adsorption side and the back side.

[0009] In some embodiments of the present application, the adsorption assembly further comprises an adsorption connector arranged on the circumferential side. The adsorption connector is configured to be connected with an external air extraction structure. An air suction channel is arranged in the substrate, and the air suction channel is communicated with the adsorption connector and the adsorption part.

[0010] In some embodiments of the present application, the blowing assembly further comprises a blowing connector arranged on the circumferential side. The blowing connector is configured to be connected with an external air blowing structure. A blowing channel is arranged in the substrate, and the blowing channel is communicated with the blowing connector and the blowing part.

[0011] In some embodiments of the present application, the adsorption joint and the blowing joint are located on opposite sides of the substrate.

[0012] In some embodiments of the present application, the substrate is provided with a guide groove. The blowing assembly includes a cover plate. The cover plate is provided on the guide groove. The cover plate is provided with a hole to form a blowing part. The guide groove is configured to supply air to the blowing part.

[0013] In some embodiments of the present application, the substrate is provided with a hollow part penetrating through both sides. The adsorption assembly includes an adsorption head. The adsorption head is provided with a hole to form an adsorption part. The adsorption head is provided in the hollow part. And the adsorption head is movably connected with the substrate.

[0014] In some embodiments of the present application, the adsorption assembly further includes an elastic member. The elastic member is provided in the hollow part. The elastic member connects the substrate and the adsorption head.

[0015] An embodiment of the present application provides an adsorption device. The adsorption device includes a connecting seat and at least one adsorption mechanism as described in any of the above embodiments. The substrate is connected with the connecting seat. The connecting seat is moved to drive the substrate to move.

[0016] In the present application, the adsorption assembly and the blowing assembly are both provided on the adsorption side of the substrate, which can move with the substrate to facilitate the adsorption or blowing of the silicon wafer on the same side of the substrate. Before the silicon wafer is adsorbed by the adsorption part, the blowing part can blow air to the silicon wafer to make the silicon wafer deviate from the side surface of the carrier to be adsorbed, and the air flow on the surface of the silicon wafer is disturbed. The air flow disturbed on the surface of the silicon wafer can generate Bernoulli effect, so that the silicon wafer slightly separates from the carrier, the gap between the adhering surfaces of the silicon wafer and the carrier becomes larger, thereby weakening the adsorption force of the carrier on the silicon wafer, which is conducive to the adsorption of the silicon wafer by the adsorption part to transfer the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope.

[0018] Figure 1 The structural schematic diagram of the adsorption device provided in an embodiment of the present application is shown in FIG. 1.

[0019] Figure 2 The structural schematic diagram of the adsorption mechanism in an embodiment of the present application is shown in FIG. 2. Figure 1 The structural schematic diagram of the adsorption mechanism in an embodiment of the present application is shown in FIG. 2.

[0020] Figure 3 The structural schematic diagram of the adsorption mechanism in an embodiment of the present application is shown in FIG. 2. Figure 2 The structural schematic diagram of the adsorption mechanism in an embodiment of the present application is shown in FIG. 2.

[0021] Explanation of main element symbols:

[0022] 100, adsorption mechanism;

[0023] 10, substrate; 11, suction side; 111, suction area; 112, guide groove; 12, back side; 13, peripheral side; 14, hollow part;

[0024] 20, suction assembly; 21, suction connector; 22, suction head; 221, suction part; 23, elastic member; 24, adapter; 25, hose;

[0025] 30, blowing assembly; 31, blowing connector; 32, cover plate; 321, blowing part;

[0026] 200, suction device; 201, connecting seat. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments of the present application.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0029] The embodiments of the present application provide a suction mechanism. The suction mechanism comprises a substrate, a suction assembly and a blowing assembly. The substrate comprises a suction side. The suction side is defined as the side of the substrate facing the silicon wafer to be sucked. The suction assembly is arranged on the substrate. The suction assembly has a suction part. The suction part is arranged on the suction side. The suction part is configured to suck the silicon wafer. The blowing assembly is arranged on the substrate. The blowing assembly has a blowing part. The blowing part is arranged on the suction side. The blowing part is configured to blow air to the silicon wafer. The suction part and the blowing part act on the silicon wafer located on the same side of the substrate.

[0030] The suction assembly and the blowing assembly are arranged on the suction side of the substrate and can move with the substrate to facilitate the suction or blowing of the silicon wafer on the same side of the substrate. Before the suction part sucks the silicon wafer, the blowing part can blow air to the silicon wafer to disturb the air flow away from the side surface of the carrier to which the silicon wafer is attracted. The air flow disturbing the surface of the silicon wafer can generate Bernoulli effect, so that the silicon wafer slightly separates from the carrier along with the air flow, the gap between the adhering surfaces of the silicon wafer and the carrier becomes larger, thereby weakening the suction force of the carrier on the silicon wafer, which is conducive to the suction of the silicon wafer by the suction part to transfer the silicon wafer.

[0031] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0032] Reference is made to Figure 1 and Figure 2An embodiment of the present application provides an adsorption mechanism 100 and an adsorption device 200 for adsorbing a silicon wafer (not shown in the figure).

[0033] In the related art, a carrier is generally provided to load or move a silicon wafer to be processed, being processed or after processing. The carrier can be a flower basket, a quartz boat, a graphite frame, an aluminum frame or other slot type tooling, etc. The silicon wafer can be a square silicon wafer or a rectangular silicon wafer, etc. The silicon wafer can be a complete whole piece or a half piece or other size piece after cutting.

[0034] In the related art, the placement of the silicon wafer in the carrier (for example, a graphite boat, etc.) is generally divided into two types. One is vertical placement, and the other is horizontal placement. When the silicon wafer is vertically placed in the carrier, the vertical silicon wafer and the vertical bearing structure (for example, a boat page) of the carrier do not completely fit, so the adsorption mechanism 100 is easy to adsorb the silicon wafer and take it out of the carrier. However, when the silicon wafer is horizontally placed in the carrier, the silicon wafer is tightly fitted with the horizontal bearing structure (for example, a boat page) of the carrier under the action of gravity, and there is almost no air between the two fitted surfaces, forming a negative pressure, which firmly adsorbs the silicon wafer on the boat page. If the adsorption mechanism 100 is used to adsorb the surface of the silicon wafer at this time, the adsorption force of the adsorption mechanism 100 can be much smaller than the adsorption force of the carrier on the silicon wafer, and the silicon wafer cannot be adsorbed and moved out of the carrier. In the present application, the adsorption mechanism 100 can weaken the adsorption force of the carrier on the silicon wafer before adsorbing the silicon wafer, so that the silicon wafer is easily adsorbed.

[0035] In some embodiments, the adsorption device 200 includes a connecting seat 201 and at least one adsorption mechanism 100. The adsorption mechanism 100 is connected to the connecting seat 201, and the movement of the adsorption mechanism 100 is controlled by moving the connecting seat 201, so as to drive the movement of the adsorbed silicon wafer.

[0036] In some embodiments, the adsorption mechanism 100 is provided with a plurality of adsorption mechanisms 100, and each adsorption mechanism 100 is connected to the connecting seat 201. By moving the connecting seat 201, a plurality of silicon wafers can be moved, thereby improving the transfer efficiency of the silicon wafers.

[0037] Referring to Figure 2 and Figure 3 In some embodiments, the adsorption mechanism 100 includes a substrate 10, an adsorption assembly 20 and a blowing assembly 30. The adsorption assembly 20 is arranged on the substrate 10. The adsorption assembly 20 has an adsorption part 221. The adsorption part 221 is configured to adsorb the silicon wafer. The blowing assembly 30 is arranged on the substrate 10. The blowing assembly 30 has a blowing part 321. The blowing part 321 is configured to blow air to the silicon wafer. The adsorption part 221 and the blowing part 321 act on the silicon wafer located on the same side of the substrate 10.

[0038] The adsorption assembly 20 and the blowing assembly 30 are arranged on the substrate 10 and can move with the substrate 10 to facilitate adsorption or blowing of the silicon wafer on the same side of the substrate 10. Before the silicon wafer is adsorbed by the adsorption portion 221, the blowing portion 321 can blow air to the silicon wafer to make the silicon wafer deviate from the airflow on the side surface adsorbed by the carrier. The airflow disturbing the surface of the silicon wafer can generate Bernoulli effect, so that the silicon wafer slightly deviates from the carrier, the gap between the adhered surfaces of the silicon wafer and the carrier is enlarged, and thus the adsorption force of the carrier on the silicon wafer is weakened, so that the adsorption portion 221 is more easily adsorbed to the silicon wafer to transfer the silicon wafer.

[0039] In some embodiments, the substrate 10 is connected to the connecting seat 201 to facilitate the movement of the adsorption mechanism 100 and the adsorbed silicon wafer by moving the connecting seat 201, so that the silicon wafer can be transferred. When the adsorption mechanism 100 is provided in plurality, the plurality of substrates 10 are respectively connected to the connecting seat 201.

[0040] In some embodiments, the substrate 10 has an adsorption side 11. The adsorption side 11 is defined as the side of the substrate 10 facing the silicon wafer to be adsorbed. The adsorption portion 221 is arranged on the adsorption side 11. The blowing portion 321 is arranged on the adsorption side 11.

[0041] In some embodiments, the substrate 10 further has a back side 12 and a circumferential side 13. The adsorption side 11 and the back side 12 are arranged opposite to each other. The circumferential side 13 is connected between the adsorption side 11 and the back side 12. When a plurality of substrates 10 are arranged, the plurality of substrates 10 are arranged in sequence, and in adjacent two substrates 10, the adsorption side 11 of one substrate 10 faces the back side 12 of the other substrate 10.

[0042] In some embodiments, the adsorption side 11 has an adsorption area 111. In the direction perpendicular to the adsorption side 11 (such as the reverse direction of the X direction shown in the figure), the projection of the adsorption portion 221 is located within the adsorption area 111, and the projection of the blowing portion 321 is at least partially located outside the adsorption area 111, so that the blowing portion 321 is configured to face the edge of the silicon wafer to be adsorbed.

[0043] The position of the adsorption portion 221 is located within the adsorption area 111, and the position of the blowing portion 321 is located outside the adsorption area 111. The adsorption portion 221 needs to adsorb the silicon wafer, so the blowing portion 321 can be closer to the edge of the silicon wafer than the adsorption portion 221. By making the blowing portion 321 face the edge of the silicon wafer, the blowing portion 321 blows air to the edge of the silicon wafer, which requires a smaller air flow than the middle of the silicon wafer, and it is easier to weaken the adsorption force of the carrier on the silicon wafer.

[0044] It can be understood that in some embodiments, the adsorption area 111 is not a fixed range, and it can be sufficient to make the blowing portion 321 face the edge of the silicon wafer to be adsorbed.

[0045] In some embodiments, the air blowing part 321 blows air vertically to the silicon wafer, so as to reduce the possibility of the silicon wafer translation when the silicon wafer is blown up. In other embodiments, the air blowing part 321 can blow air obliquely to the silicon wafer.

[0046] In some embodiments, along the direction perpendicular to the adsorption side 11 (such as the X direction shown in the figure), the air blowing part 321 is lower than the adsorption part 221. The adsorption part 221 can be closer to the silicon wafer than the air blowing part 321, which is conducive to avoiding the structure of the air blowing part 321 blocking the silicon wafer from being attached to the adsorption part 221, and also makes the generation position of the adsorption air flow closer to the silicon wafer than the generation position of the air blowing air flow, which is conducive to reducing the air flow required for adsorbing the silicon wafer.

[0047] In some embodiments, along the direction perpendicular to the adsorption side 11 (such as the X direction shown in the figure), the adsorption part 221 protrudes from the adsorption side 11. The adsorption part 221 can be closer to the silicon wafer than the base plate 10, so that when the adsorption part 221 adsorbs the silicon wafer, there is a gap between the silicon wafer and the adsorption side 11 of the base plate 10, reducing the area between the silicon wafer and the base plate 10 that is adsorbed, thereby facilitating the silicon wafer to separate from the adsorption part 221.

[0048] Referring to Figure 1 and Figure 2 In some embodiments, the adsorption assembly 20 further comprises an adsorption connector 21. The adsorption connector 21 is arranged on the circumferential side 13. The adsorption connector 21 is configured to be connected with an external air extraction structure. An air suction channel (not shown in the figure) is arranged in the base plate 10. The air suction channel is in communication with the adsorption connector 21 and the adsorption part 221. The air suction channel can be a hole arranged in the base plate 10.

[0049] The air suction channel is located inside the base plate 10 and the adsorption connector 21 is located on the circumferential side 13, which reduces the structural interference between the adsorption side 11 and the silicon wafer when providing the air flow required for the adsorption part 221 to adsorb the silicon wafer, and is conducive to shortening the distance between the silicon wafer and the adsorption side 11, thereby reducing the air flow required for adsorbing the silicon wafer. Moreover, this arrangement of the adsorption connector 21 and the air suction channel can avoid occupying the space between two adjacent base plates 10, so that the adsorption device 200 can adsorb more silicon wafers in a certain space, thereby improving the space utilization.

[0050] As an exemplary example, the external air extraction structure can be a vacuum air pump or the like.

[0051] In some embodiments, the air blowing assembly 30 further comprises an air blowing connector 31. The air blowing connector 31 is arranged on the circumferential side 13. The air blowing connector 31 is configured to be connected with an external air blowing structure. An air blowing channel (not shown in the figure) is arranged in the base plate 10. The air blowing channel is in communication with the air blowing connector 31 and the air blowing part 321. The air blowing channel can be a hole arranged in the base plate 10.

[0052] The air blowing passage is located inside the base plate 10 and the air blowing connector 31 is located at the peripheral side 13. When the air blowing part 321 is provided with the air flow required for blowing the silicon wafer, the structural interference between the adsorption side 11 and the silicon wafer is reduced, which is conducive to shortening the distance between the silicon wafer and the adsorption side 11, thereby reducing the air flow required for blowing the silicon wafer. And the air blowing connector 31 and the air suction passage in this arrangement can avoid occupying the space between the two adjacent base plates 10, so that the silicon wafer adsorption device 200 can adsorb more silicon wafers in a certain space, improving the space utilization.

[0053] As an exemplary example, the external air blowing structure can be an air blowing pump or the like.

[0054] Referring to Figure 2 and Figure 3 In some embodiments, the adsorption connector 21 and the air blowing connector 31 are located at opposite sides of the base plate 10. The adsorption connector 21 and the air blowing connector 31 are arranged opposite to each other, which is conducive to reducing the interference between the adsorption mechanism 100 and the external air suction structure and the external air blowing structure when they are connected to each other. It is convenient for the adsorption connector 21 to be quickly and stably connected to the external air suction structure, and for the air blowing connector 31 to be quickly and stably connected to the external air blowing structure. When a plurality of base plates 10 are arranged in sequence, the external air suction structure and the external air blowing structure are connected to each adsorption connector 21 and each air blowing connector 31 from both sides, respectively. The overall connection structure is clearer and more understandable, and is convenient for maintenance.

[0055] In some embodiments, the base plate 10 is provided with a guide groove 112. The air blowing assembly 30 includes a cover plate 32. The cover plate 32 is arranged on the guide groove 112. The cover plate 32 is provided with a hole to form an air blowing part 321. The guide groove 112 is configured to supply air to the air blowing part 321.

[0056] The cover plate 32 is arranged on the guide groove 112 to form a passage for supplying air to the air blowing part 321. The structure is simple, convenient to set, and convenient to modify on the basis of the existing structure.

[0057] It can be understood that, in some embodiments, the guide groove 112 is arranged on the adsorption side 11 of the base plate 10.

[0058] It can be understood that, in some embodiments, the cover plate 32 is welded to the base plate 10, which is time-saving in connection and has good sealing performance. In other embodiments, the cover plate 32 can be adhered to the base plate 10; or after the sealing member is arranged, the cover plate 32 is fixed to the base plate 10 by screws or buckles.

[0059] In some embodiments, the cover plate 32 is provided with a plurality of holes to form a plurality of air blowing parts 321. The plurality of air blowing parts 321 are arranged along the same edge of the silicon wafer to reduce the difficulty of blowing the edge of the silicon wafer.

[0060] In some embodiments, the guide groove 112 is communicated with the blowing channel and the blowing joint 31.

[0061] In other embodiments, the substrate 10 is provided with a hole communicated with the blowing channel to form the blowing part 321; or, a pipe is provided on the adsorption side 11 of the substrate 10, and the pipe is provided with a hole to form the blowing part 321.

[0062] In some embodiments, the substrate 10 is provided with a hollow part 14 penetrating through both sides. The adsorption assembly 20 comprises an adsorption head 22. The adsorption head 22 is provided with a hole to form an adsorption part 221. The adsorption head 22 is arranged in the hollow part 14, and the adsorption head 22 is movably connected with the substrate 10. The adsorption head 22 can be various types of suction nozzles or various types of suction discs, etc. The hollow part 14 penetrates through the adsorption side 11 and the back side 12.

[0063] After the silicon wafer is blown up by the blowing part 321, the adsorption part 221 is easier to adsorb the silicon wafer. The adsorption head 22 is movably connected with the substrate 10 through the hollow part 14, so that when the silicon wafer is adsorbed by the adsorption force and clings to the adsorption head 22, the adsorption head 22 can be buffered by moving relative to the hollow part 14, thereby reducing the impact between the silicon wafer and the adsorption mechanism 100. In addition, during the movement of the adsorption mechanism 100, the acting force between the silicon wafer and the adsorption mechanism 100 is alleviated, which is beneficial to avoid damaging the silicon wafer.

[0064] In some embodiments, the adsorption head 22 is provided with a plurality of holes to form a plurality of adsorption parts 221, so as to improve the stability of the adsorption head 22 in adsorbing the silicon wafer.

[0065] In some embodiments, the adsorption assembly 20 further comprises an elastic member 23. The elastic member 23 is arranged in the hollow part 14. The elastic member 23 connects the substrate 10 and the adsorption head 22.

[0066] The adsorption head 22 is connected with the substrate 10 through the elastic member 23. The adsorption head 22 can move relative to the substrate 10 through the elastic deformation of the elastic member 23. After the adsorption head 22 is impacted, the impact is transmitted to the elastic member 23 to make the elastic member 23 elastically deform, thereby absorbing the impact. Then, the elastic member 23 restores the deformation, so that the adsorption head 22 can be returned to the original position, so as to maintain the silicon wafer at a set position.

[0067] In some embodiments, the elastic member 23 is a spring, which is simple to set and stable in work. In other embodiments, the elastic member 23 can also be a rubber member or an elastic connecting arm, etc. The elastic connecting arm can elastically deform at least in the direction between the adsorption side 11 and the back side 12 (such as the X direction shown in the figure and the reverse direction).

[0068] In some embodiments, a plurality of elastic members 23 are provided. Each of the plurality of elastic members 23 is connected to the suction head 22. The connection position of the plurality of elastic members 23 to the suction head 22 can be at the corner of a triangle or at the corner of a rectangle or at other positions of other shapes.

[0069] In some embodiments, the suction assembly 20 further comprises a connector 24 and a hose 25. The connector 24 is provided on the base plate 10 and is in communication with the suction passage. The hose 25 connects the connector 24 and the suction head 22 so as to maintain the communication between the suction head 22 and the suction passage when the suction head 22 moves relative to the base plate 10.

[0070] It can be understood that in some embodiments, a plurality of suction heads 22 are provided. At least some of the plurality of suction heads 22 are in communication with each other through the hose 25 so as to allow each of the plurality of suction heads 22 to move independently relative to the base plate 10 and to save the number of connectors 24.

[0071] In some embodiments, the working principle of the suction mechanism 100 is as follows:

[0072] The base plate 10 drives the suction side 11 to be opposite to the silicon wafer to be sucked and drives the air blowing part 321 to be towards the edge of the silicon wafer. The air blowing part 321 blows air to the silicon wafer so as to slightly separate the silicon wafer from the carrier. Then, the suction part 221 generates a suction air flow so as to suck the silicon wafer. After the silicon wafer is sucked, the air blowing part 321 stops blowing air.

[0073] In the present application, the two relative fixedly arranged parts are not necessarily detachable, but are intended to mean that the two relative fixedly arranged parts can move together in the use state of the suction mechanism 100 or the suction device 200.

[0074] In addition, those skilled in the art should understand that the above embodiments are only used to illustrate the present application, but not as a limitation to the present application, and any suitable modification and change to the above embodiments within the scope of the spirit of the present application are within the scope of the present application.

Claims

1. An adsorption mechanism characterized by, The application relates to a substrate for adsorbing a silicon wafer, comprising: a substrate, comprising an adsorption side, the adsorption side being defined as a side of the substrate facing a silicon wafer to be adsorbed; an adsorption assembly arranged on the substrate, the adsorption assembly having an adsorption part arranged on the adsorption side and configured to adsorb the silicon wafer; and a blowing assembly arranged on the substrate, the blowing assembly having a blowing part arranged on the adsorption side and configured to blow air to the silicon wafer, the adsorption part and the blowing part acting on the silicon wafer located on the same side of the substrate.

2. The suction mechanism according to claim 1, wherein The adsorption side has an adsorption area, in a direction perpendicular to the adsorption side, a projection of the adsorption part is located in the adsorption area, and a projection of the blowing part is at least partially located outside the adsorption area, so that the blowing part is configured to face an edge of the silicon wafer to be adsorbed.

3. The suction mechanism according to claim 1, wherein In a direction perpendicular to the adsorption side, the blowing part is lower than the adsorption part.

4. The suction mechanism according to claim 1, wherein In a direction perpendicular to the adsorption side, the adsorption part protrudes from the surface of the adsorption side.

5. The suction mechanism according to claim 1, wherein The substrate further has a back side and a circumferential side, the adsorption side and the back side are arranged opposite to each other, and the circumferential side is connected between the adsorption side and the back side. The adsorption assembly further comprises an adsorption connector arranged on the circumferential side, the adsorption connector is configured to be connected with an external air extraction structure, the substrate is provided with an air suction channel, and the air suction channel is communicated with the adsorption connector and the adsorption part; and / or The blowing assembly further comprises a blowing connector arranged on the circumferential side, the blowing connector is configured to be connected with an external air blowing structure, the substrate is provided with an air blowing channel, and the air blowing channel is communicated with the blowing connector and the blowing part.

6. The suction mechanism according to claim 5, wherein The adsorption connector and the blowing connector are located on opposite sides of the substrate.

7. The adsorption mechanism according to any one of claims 1 to 6, wherein The substrate is provided with a guide groove, the blowing assembly comprises a cover plate arranged on the guide groove, the cover plate is provided with a hole to form the blowing part, and the guide groove is configured to supply air to the blowing part.

8. The suction mechanism according to claim 1, wherein The substrate is provided with a hollow part penetrating through both sides, the adsorption assembly comprises an adsorption head, the adsorption head is provided with a hole to form the adsorption part, the adsorption head is arranged in the hollow part, and the adsorption head is movably connected with the substrate.

9. The suction mechanism according to claim 8, wherein The adsorption assembly further comprises an elastic member arranged in the hollow part, and the elastic member connects the substrate and the adsorption head.

10. An adsorption device, characterized by The application further relates to a connecting seat connected with the substrate, and the connecting seat is moved to drive the substrate to move.

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