Package carrier for improving abnormal peeling and electronic equipment
By creating connection grooves and applying an electroplating layer on the surface of the second conductive layer, the problem of cracking or peeling of the conductive layer is solved, improving the reliability of the encapsulation substrate and its resistance to chemical corrosion.
Patent Information
- Application Number
- CN202520098821.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-15
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-15
AI Technical Summary
During the fabrication of the ETS packaging substrate, the conductive layer is prone to cracking or peeling, which affects the reliability of the packaging substrate.
A connecting groove is formed on the surface of the second conductive layer, and an electroplated layer is placed in the connecting groove so that the electroplated layer is connected to the surface of the first conductive layer and the sidewall of the second conductive layer to form a stable stacked structure.
It effectively avoids cracking or peeling between conductive layers, improves the reliability of the packaging substrate, and prevents chemicals from seeping in and damaging the packaging substrate.
Smart Images
Figure CN223744971U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of electronic equipment, and in particular to a package substrate with improved abnormal peeling and electronic equipment. BACKGROUND
[0002] A package substrate (PS) is a high-end product in printed circuit boards. As a carrier for carrying electronic components, the package substrate is used to realize electrical connection between electronic components and is an important component of electronic equipment. The package substrate usually includes an embedded trace substrate (ETS), which is a high-end product in the package substrate category.
[0003] In related technologies, an ETS package substrate usually includes a base plate and a plurality of conductive layers stacked on the base plate.
[0004] However, in the process of preparing the ETS package substrate, the ETS package substrate usually undergoes high-temperature baking. After baking the ETS package substrate, the conductive layer is prone to cracking or peeling off. The cracked or peeled conductive layer is prone to penetrating into the chemical solution in the subsequent wet process, thus affecting the reliability of the ETS package substrate. UTILITY MODEL CONTENT
[0005] The embodiments of the present disclosure provide a package substrate with improved abnormal peeling and electronic equipment, which can improve the problem of cracking or peeling of the film layer in the package substrate and improve the reliability of the package substrate. The technical solution is as follows:
[0006] The embodiments of the present disclosure provide a package substrate with improved abnormal peeling, which includes a base plate, a first conductive layer, a second conductive layer, and an electroplated layer. The first conductive layer and the second conductive layer are sequentially stacked on the surface of the base plate. The surface of the second conductive layer away from the base plate has at least a connecting groove exposing the first conductive layer. The electroplated layer is located on the surface of the second conductive layer away from the base plate and extends into the connecting groove. The electroplated layer in the connecting groove is connected to the surface of the first conductive layer and the sidewall of the second conductive layer.
[0007] In an implementation manner of the embodiments of the present disclosure, the shape of the orthographic projection of the connecting groove on the surface of the base plate includes at least one of a circular ring, a polygon, a circular hole, an elliptical hole, and an arc.
[0008] In another implementation manner of the embodiment of the present disclosure, the surface of the second conductive layer further has a positioning hole penetrating the second conductive layer, the first conductive layer and the substrate plate in sequence; and a shape of a projection of the connecting groove on a plate surface of the substrate plate is a circular ring, and a projection of the positioning hole on the plate surface of the substrate plate is located in the projection of the connecting groove on the plate surface of the substrate plate.
[0009] In another implementation manner of the embodiment of the present disclosure, a ring width of the circular ring is 25 μm to 35 μm.
[0010] In another implementation manner of the embodiment of the present disclosure, a shortest distance from the connecting groove to the positioning hole is 0.2 μm to 0.3 μm.
[0011] In another implementation manner of the embodiment of the present disclosure, the surface of the second conductive layer has a plurality of the connecting grooves, and the plurality of the connecting grooves are arranged in a circle with the center of the positioning hole as the center.
[0012] In another implementation manner of the embodiment of the present disclosure, the connecting groove exposes the plate surface of the substrate plate, and the electroplated layer is further connected with the substrate plate.
[0013] In another implementation manner of the embodiment of the present disclosure, a thickness of the first conductive layer is 10 μm to 20 μm, and a thickness of the second conductive layer is 1 μm to 5 μm.
[0014] In another implementation manner of the embodiment of the present disclosure, the first conductive layer, the second conductive layer and the electroplated layer all include a Cu layer.
[0015] The embodiment of the present disclosure provides an electronic device, which comprises the packaging substrate and an electronic device as described above, and the electronic device is connected with the packaging substrate.
[0016] The technical scheme provided by the embodiment of the present disclosure has at least the following beneficial effects:
[0017] The packaging substrate provided by the embodiment of the present disclosure comprises a substrate plate, a first conductive layer, a second conductive layer and an electroplated layer. The first conductive layer and the second conductive layer are stacked on the substrate plate in sequence, and a connecting groove exposing at least the first conductive layer is formed on a surface of the second conductive layer. The electroplated layer is arranged on the surface of the second conductive layer and extends into the connecting groove, so that the electroplated layer can be connected with the surface of the first conductive layer and the side wall of the second conductive layer through the connecting groove. That is, the electroplated layer is used to bind the stacked conductive layers together, so as to effectively avoid the problem of cracking or peeling between the conductive layers. Even if the packaging substrate is soaked in a chemical solution during subsequent wet processes, the problem of damage to the packaging substrate caused by immersion of the chemical solution is not easy to occur. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the embodiments description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.
[0019] Figure 1 is a top view of a packaging substrate provided by the embodiments of the present disclosure;
[0020] Figure 2 is an AA sectional view provided by the embodiments of the present disclosure; Figure 1
[0021] Figure 3 is a top view of another packaging substrate provided by the embodiments of the present disclosure;
[0022] Figure 4 is a preparation state view of a packaging substrate provided by the embodiments of the present disclosure.
[0023] The various signs in the drawings are explained as follows:
[0024] 10, base material plate;
[0025] 21, first conductive layer; 22, second conductive layer; 23, connecting groove;
[0026] 30, electroplating layer;
[0027] 40, positioning hole. DETAILED DESCRIPTION
[0028] In order to make the purposes, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail with reference to the drawings.
[0029] Unless otherwise defined, technical terms or scientific terms used herein shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first", "second", "third", and the like, as used in the description and the claims of this disclosure do not have any specific meaning, and are merely used to distinguish one component from another. Similarly, the terms "one", "another", and the like, do not limit the quantity of the mentioned objects, and are merely used to distinguish one component from another. The terms "comprise", "comprising", and the like, mean that the elements listed after the terms are included in the subject comprising the elements, and the elements are not excluded, unless otherwise defined. The terms "connect" and "connected", and the like, do not limit the manner of connection, and can include electrical connection, whether direct or indirect. The terms "upper", "lower", "left", "right", "top", "bottom", and the like, are merely used to indicate relative positions, and can change when the absolute positions of the described objects change.
[0030] Figure 1 is a top view of a packaging substrate provided by an embodiment of the disclosure. Figure 2 is Figure 1 is an AA cross-sectional view provided by the disclosure. As shown in Figure 1 , 2 , the packaging substrate comprises a base plate 10, a first conductive layer 21, a second conductive layer 22, and a plating layer 30.
[0031] As shown in Figure 2 , the first conductive layer 21 and the second conductive layer 22 are sequentially stacked on the plate surface of the base plate 10, the surface of the second conductive layer 22 away from the base plate 10 has at least a connecting groove 23 exposing the first conductive layer 21, the plating layer 30 is located on the surface of the second conductive layer 22 away from the base plate 10, and extends into the connecting groove 23, and the plating layer 30 located in the connecting groove 23 is connected with the surface of the first conductive layer 21 and the sidewall of the second conductive layer 22.
[0032] Exemplarily, the connecting groove 23 only exposes the top surface of the first conductive layer 21, that is, the plating layer 30 is connected with the top surface of the first conductive layer 21 when the connecting groove 23 does not extend to the first conductive layer 21 but just penetrates the second conductive layer 22.
[0033] Exemplarily, the plating layer 30 is connected with the top surface of the first conductive layer 21 and the sidewall of the first conductive layer 21 when the connecting groove 23 extends to the first conductive layer 21.
[0034] The packaging board provided by the embodiments of the present disclosure comprises a substrate plate 10, a first conductive layer 21, a second conductive layer 22 and a plating layer 30. The first conductive layer 21 and the second conductive layer 22 are sequentially stacked on the substrate plate 10, at least a connecting groove 23 exposing the first conductive layer 21 is formed on the surface of the second conductive layer 22, and the plating layer 30 is arranged on the surface of the second conductive layer 22 and extends into the connecting groove 23, so that the plating layer 30 can be connected with the surface of the first conductive layer 21 and the sidewall of the second conductive layer 22 through the connecting groove 23. That is, the stacked conductive layers are bound together by the plating layer 30, so that the problem of cracking or peeling between the conductive layers can be effectively avoided. Even if the packaging board is soaked in the chemical solution during the subsequent wet process, the problem of damage to the packaging board caused by the immersion of the chemical solution is not easy to occur.
[0035] Optionally, the shape of the orthographic projection of the connecting groove 23 on the plate surface of the substrate plate 10 comprises at least one of a circular ring, a polygon, a circular hole, an elliptical hole and an arc.
[0036] In the embodiments of the present disclosure, the connecting groove 23 is arranged in various different shapes, so as to change the contact area between the plating layer 30 and the conductive layer, so that the contact between the plating layer 30 and the conductive layer is more stable and reliable.
[0037] For example, when the shape of the connecting groove 23 is a circular ring, the size of the groove formed by the connecting groove 23 on the conductive layer is larger, so that more plating layer 30 can be embedded into the conductive layer and contact with the conductive layer, thereby improving the contact area between the plating layer 30 and the conductive layer.
[0038] For example, when the shape of the connecting groove 23 is a polygon, the total area of the hole formed by the connecting groove 23 on the conductive layer is smaller, so that the connecting groove 23 occupies less area of the conductive layer, so that more space is provided on the conductive layer to form a trace, which is beneficial to realize the energization of each electronic device on the packaging board.
[0039] Optionally, as shown in Figure 1 , 2 The surface of the second conductive layer 22 further comprises a positioning hole 40 sequentially penetrating the second conductive layer 22, the first conductive layer 21 and the substrate plate 10.
[0040] The positioning hole 40 is used for mechanical positioning or optical positioning in the subsequent process of the packaging board.
[0041] Exemplarily, as shown in Figure 1 One connecting groove 23 is formed on the surface of the second conductive layer 22, the shape of the orthographic projection of the connecting groove 23 on the plate surface of the substrate plate 10 is a circular ring, and the orthographic projection of the positioning hole 40 on the plate surface of the substrate plate 10 is located in the orthographic projection of the connecting groove 23 on the plate surface of the substrate plate 10.
[0042] In the above implementation, the connecting groove 23 surrounds the positioning hole 40, so that the connecting groove 23 can expose a larger area of the conductive layer. The plating layer 30 extending into the connecting groove 23 can reliably bind the first conductive layer 21 and the second conductive layer 22 together, improving the connection reliability between the conductive layers.
[0043] In addition, since the connecting groove 23 fully surrounds the positioning hole 40 in the circumferential direction, even if a crack occurs in a partial area between the conductive layers at the position of the positioning hole 40, when the crack extends to the connecting groove 23, it will be blocked by the plating layer 30 fully surrounding the positioning hole 40, thereby avoiding the separation and peeling of the conductive layers to the greatest extent.
[0044] Optionally, as shown in Figure 1 , the ring width of the circular ring is 25 μm to 35 μm. By setting the ring width of the circular ring in the above range, it can be ensured that the size of the connecting groove 23 is large enough to fill a sufficient amount of the plating layer 30, so that the plating layer 30 can more reliably bind the first conductive layer 21 and the second conductive layer 22 together.
[0045] For example, the ring width of the circular ring is 30 μm.
[0046] Optionally, the shortest distance from the connecting groove 23 to the positioning hole 40 is 0.2 μm to 0.3 μm.
[0047] The shortest distance from the connecting groove 23 to the positioning hole 40 can be the distance from the groove wall of the connecting groove 23 closest to the positioning hole 40 to the positioning hole 40. For example, when the connecting groove 23 is a circular ring, the shortest distance from the connecting groove 23 to the positioning hole 40 is the distance from the inner circle of the circular ring to the positioning hole 40.
[0048] By setting the shortest distance from the connecting groove 23 to the positioning hole 40 in the above range, it can be avoided that the distance from the connecting groove 23 to the positioning hole 40 is too close, which affects the strength of the side wall of the positioning hole 40, and the positioning hole 40 is easily damaged. It can also be avoided that the distance from the connecting groove 23 to the positioning hole 40 is too far, which reduces the binding effect of the plating layer 30 on the conductive layer near the positioning hole 40.
[0049] For example, the shortest distance from the connecting groove 23 to the positioning hole 40 is 0.2 μm.
[0050] Figure 3 is another top view of a packaging board provided by an embodiment of the present disclosure. As shown in Figure 3 , the surface of the second conductive layer 22 has a plurality of connecting grooves 23, and the plurality of connecting grooves 23 are arranged in a circumferential direction with the center of the positioning hole 40 as the center.
[0051] For example, as shown in Figure 3 , the surface of the second conductive layer 22 has a plurality of connecting grooves 23 in the shape of a circle.
[0052] Figure 3 The plurality of connection grooves 23 are arranged in a circle Figure 1 Compared with the single connection groove 23 arranged in a circle, the total area of the holes opened on the conductive layer is smaller, which avoids the connection groove 23 occupying more area of the conductive layer, so that more space is available on the conductive layer to form a trace, which is beneficial to realize the electrical connection of the electronic devices on the packaging board.
[0053] Exemplarily, as shown in Figure 3 The diameter of each connection groove 23 can be 25 μm to 35 μm, and the distance between the adjacent two connection grooves 23 can be 10 μm to 30 μm.
[0054] Optionally, as shown in Figure 2 The connection groove 23 exposes the surface of the substrate plate 10, and the electroplated layer 30 is also connected with the substrate plate 10. The connection groove 23 is formed through the first conductive layer 21 and the second conductive layer 22, so that the surface of the substrate plate 10 is exposed, and the electroplated layer 30 can be connected with the surface of the substrate plate 10. In this way, the electroplated layer 30 can not only bind the two conductive layers, but also bind the conductive layers and the substrate plate 10 together, thereby further improving the connection reliability between the layers on the packaging board.
[0055] Optionally, the thickness of the first conductive layer 21 is 10 μm to 20 μm, and the thickness of the second conductive layer 22 is 1 μm to 5 μm.
[0056] Exemplarily, the thickness of the first conductive layer 21 is 18 μm.
[0057] Exemplarily, the thickness of the second conductive layer 22 is 3 μm.
[0058] Optionally, the first conductive layer 21, the second conductive layer 22 and the electroplated layer 30 all include a Cu layer.
[0059] Exemplarily, the first conductive layer 21 and the second conductive layer 22 are both copper foils, and the thicknesses of the two copper foils are different.
[0060] The first conductive layer 21 is a copper foil with a relatively large thickness, which can serve as a carrier for the second conductive layer 22 and protect the second conductive layer 22. The second conductive layer 22 serves as a conductive trace for realizing the electrical connection of the electronic devices on the packaging board.
[0061] In the embodiment of the present disclosure, when the two conductive layers are prepared, the first conductive layer 21 is first formed on the substrate plate 10, and then, when the second conductive layer 22 is prepared, a conductive film with a very small thickness is formed on the surface of the first conductive layer 21 to separate the first conductive layer 21 and the second conductive layer 22, so as to avoid the fusion of the first conductive layer 21 and the second conductive layer 22 into one film layer.
[0062] Exemplarily, the electroplated layer 30 is also a Cu layer, so that the electroplated layer 30 is made of the same material as the conductive layer, and the electroplated layer 30 is more easily connected with the conductive layer, thereby improving the binding effect of the electroplated layer 30 on the conductive layer.
[0063] The preparation process of the packaging board provided by the embodiment of the present disclosure is as follows:
[0064] Firstly, as shown in the figure, a first conductive layer 21 and a second conductive layer 22 are sequentially formed on a substrate plate 10. Figure 4
[0065] The substrate plate 10 can be at least one of a glass fiber plate and an epoxy resin plate. The thickness of the insulating plate is 100 μm to 200 μm.
[0066] Exemplarily, the first conductive layer 21 and the second conductive layer 22 can both be copper foils.
[0067] The thickness of the first conductive layer 21 is 18 μm, and the thickness of the second conductive layer 22 is 3 μm.
[0068] Secondly, as shown in the figure, a connection groove 23 is formed on the second conductive layer 22 by using UV laser. Figure 4
[0069] Exemplarily, the shape of the orthographic projection of the connection groove 23 on the substrate plate 10 can be a circular ring.
[0070] The ring width of the circular ring is 25 μm to 35 μm, and the diameter of the circular ring is 3.5 mm.
[0071] In the embodiment of the present disclosure, by using the characteristics of small spot, high energy density, and high UV absorption rate of bright copper foil of UV laser, the groove can be more efficiently formed on the conductive layer, thereby simplifying the difficulty of preparing the groove on the conductive layer and reducing the cost.
[0072] Thirdly, as shown in the figure, an electroplated layer 30 is electroplated on the surface of the second conductive layer 22, so that the electroplated layer 30 is deposited into the connection groove 23. Figure 4
[0073] The electroplated layer 30 fills the connection groove 23, and the electroplated layer 30 covers the surface of the second conductive layer 22.
[0074] Fourthly, a positioning hole 40 is processed in the area surrounded by the connection groove 23.
[0075] The diameter of the positioning hole 40 can be 3.175 mm.
[0076] The electronic device provided by the embodiment of the present disclosure comprises the packaging board and an electronic device, and the electronic device is connected with the packaging board.
[0077] Exemplarily, the electronic device can be a capacitor, a resistor, an inductor, a transistor, a chip, and the like.
[0078] Exemplarily, the electronic device can be a server, a mobile phone, a computer, a television, a game console, an electronic watch, or any electronic device including a packaging board.
[0079] The above is not any form of limitation on the present disclosure, although the present disclosure has been disclosed as above through examples, however, not to limit the present disclosure, any person skilled in the art, without departing from the technical solution range of the present disclosure, can make some changes or modifications to the above disclosed technical content for equivalent embodiments, but as long as it does not deviate from the technical solution of the present disclosure, any simple modification, equivalent change and modification made to the above examples according to the technical essence of the present disclosure, still belongs to the scope of the technical solution of the present disclosure.
Claims
1. A package substrate, characterized by, The packaging substrate comprises a base plate (10), a first conductive layer (21), a second conductive layer (22) and a plating layer (30); The first conductive layer (21) and the second conductive layer (22) are sequentially laminated on the plate surface of the base plate (10), the surface of the second conductive layer (22) away from the base plate (10) has at least a connecting groove (23) exposing the first conductive layer (21), the plating layer (30) is located on the surface of the second conductive layer (22) away from the base plate (10) and extends into the connecting groove (23), and the plating layer (30) in the connecting groove (23) is connected with the surface of the first conductive layer (21) and the sidewall of the second conductive layer (22).
2. The package board according to claim 1, wherein The shape of the orthographic projection of the connecting groove (23) on the plate surface of the base plate (10) comprises at least one of a circular ring, a polygon, a circular hole, an elliptical hole and an arc.
3. The package board according to claim 2, wherein The surface of the second conductive layer (22) further has a positioning hole (40) sequentially penetrating the second conductive layer (22), the first conductive layer (21) and the base plate (10); The shape of the orthographic projection of the connecting groove (23) on the plate surface of the base plate (10) is a circular ring, and the orthographic projection of the positioning hole (40) on the plate surface of the base plate (10) is located in the orthographic projection of the connecting groove (23) on the plate surface of the base plate (10).
4. The package board according to claim 3, wherein The ring width of the circular ring is 25μm to 35μm.
5. The package board according to claim 3, wherein The shortest distance from the connecting groove (23) to the positioning hole (40) is 0.2μm to 0.3μm.
6. The package board according to claim 3, wherein The surface of the second conductive layer (22) has a plurality of connecting grooves (23), and the plurality of connecting grooves (23) are arranged in a circumferential interval with the center of the positioning hole (40) as the center.
7. The package substrate according to any one of claims 1 to 6, wherein, The connecting groove (23) exposes the plate surface of the base plate (10), and the plating layer (30) is further connected with the base plate (10).
8. The package substrate according to any one of claims 1 to 6, wherein, The thickness of the first conductive layer (21) is 10μm to 20μm, and the thickness of the second conductive layer (22) is 1μm to 5μm.
9. The package substrate according to any one of claims 1 to 6, wherein, The first conductive layer (21), the second conductive layer (22) and the plating layer (30) all comprise a Cu layer.
10. An electronic device, comprising: The electronic device comprises the packaging substrate and an electronic device according to any one of claims 1 to 9, and the electronic device is connected with the packaging substrate.