Electronic device

Abstract

The utility model provides an electronic device. The electronic equipment comprises a shell, a first fan and a circuit board assembly. The shell is provided with an air outlet, and the air outlet of the shell is communicated with the internal space and the outside of the shell. The first fan and the circuit board assembly are both installed in the inner space of the shell. The circuit board assembly comprises a circuit board, a first device and a second device, the first device is fixedly connected to the top face of the circuit board, and a first air channel is defined by the first device and the circuit board. An air inlet of the first air duct communicates with an air outlet of the first fan, and an air outlet of the first air duct communicates with an air outlet of the shell. The second device is at least partially located in the first air duct. The distance between the top surface of the first device and the top surface of the circuit board is greater than the distance between the top surface of the second device and the top surface of the circuit board. The layout of the first device is optimized, and the first air channel is defined by the first device, so that air blown out by the first fan can take away heat of the second device in the first air channel, and the heat dissipation effect of the electronic equipment is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and particularly relates to an electronic device. BACKGROUND

[0002] When the electronic device is running, the internal components of the electronic device are prone to heat accumulation in a high-load scenario, which affects the performance of the electronic device. Therefore, improving the heat dissipation efficiency of the internal components of the electronic device has become one of the problems to be solved. In order to meet the requirement of thinness, the electronic device cannot dissipate heat by increasing the fan, but can only rely on a board-level heat dissipation scheme to improve the heat dissipation capacity of the electronic device.

[0003] There are mainly three kinds of existing board-level heat dissipation schemes:

[0004] (1) Large pad device copper leakage through-hole. This scheme is only applicable to devices with large pads and requiring heat dissipation, and can only be applied to a through-hole circuit board.

[0005] (2) Thick copper technology: increase the thickness of the copper layer of the circuit board and reduce the thickness of the dielectric layer of the circuit board under the premise that the thickness of the circuit board remains unchanged. This scheme increases the processing difficulty of the circuit board, and affects the cost and weight of the circuit board.

[0006] (3) Quasi-single layout technology: 0.22mm high 01005 capacitors are used on the circuit board to replace 0.7mm high 0402 capacitors. This scheme is prone to cause difficulty in Power Delivery Network (PDN) design of the circuit board, and affects the stability of the power supply. CONTENT OF THE UTILITY MODEL

[0007] The present application provides an electronic device. The electronic device can improve the heat dissipation efficiency of the components on the circuit board while not affecting the processing and performance of the circuit board by adjusting the arrangement of the components on the circuit board.

[0008] An electronic device is provided. The electronic device includes a housing, a first fan, and a circuit board assembly. The housing has an internal space. The housing is provided with an air outlet. The air outlet of the housing communicates the internal space of the housing and an external space. The first fan and the circuit board assembly are both mounted in the internal space of the housing. The circuit board assembly includes a circuit board, a first device, and a second device. The first device is fixedly connected to a top surface of the circuit board and encloses a first air duct together with the circuit board. The first air duct includes an air inlet and an air outlet. The air inlet of the first air duct communicates the air outlet of the first fan. The air outlet of the first air duct communicates the air outlet of the housing. The second device is at least partially located in the first air duct. In a first direction, a distance between the top surface of the first device and the top surface of the circuit board is greater than a distance between the top surface of the second device and the top surface of the circuit board. The top surface of the first device is a surface of the first device away from the circuit board. The top surface of the second device is a surface of the second device away from the circuit board. The first direction is a thickness direction of the circuit board assembly.

[0009] In the embodiments of the present application, the electronic device optimizes the layout of the first device of the circuit board assembly, encloses the first air duct by the first device of the circuit board assembly, and the first air duct surrounds the second device. The wind blown by the first fan enters the first air duct and carries away the heat of the second device in the first air duct, so that the second device can be cooled. In this way, the heat dissipation efficiency of the second device can be improved, which is conducive to ensuring the reliability of the second device and the electronic device. At the same time, the wind with heat can be blown from the air outlet of the housing to the outside of the electronic device, which is conducive to reducing the shell temperature of the electronic device and improving the user experience. Moreover, the electronic device does not need to additionally set other structures to form the first air duct. The structure of the electronic device is relatively simple.

[0010] In addition, in the first direction, the height of the first device on the circuit board is greater than the height of the second device on the circuit board, so that the first air duct enclosed by the first device can surround the second device, so that the wind blown by the first fan can pass through the first air duct to blow to the second device to carry away the heat of the second device.

[0011] In some embodiments, in the first direction, the distance between the top surface of the first device and the top surface of the circuit board is greater than or equal to 1.5 millimeters, and the distance between the top surface of the second device and the top surface of the circuit board is less than 1.5 millimeters. In this way, the first air duct enclosed by the first device can better surround the second device, so that the wind blown by the first fan can carry away the heat of the second device more quickly.

[0012] In some embodiments, the first air duct includes a first portion and a second portion. The first portion communicates the second portion. The first portion also communicates the air inlet of the first air duct. The second portion also communicates the air outlet of the first air duct. The length extension direction of the first portion intersects the length extension direction of the second portion.

[0013] In the embodiment, the air blown by the first fan first passes through the first part of the first air duct, then changes direction to enter the second part of the first air duct, and then flows from the second part to the air outlet of the shell. It can be understood that by extending the first part and the second part of the first air duct in different directions, the air direction can be changed, so that the air blown by the first fan can be guided to the air outlet of the shell. In this way, the position of the first fan is no longer strictly limited by the position of the air outlet of the shell, and the position of the first fan can be reasonably arranged as needed.

[0014] In some embodiments, the number of air inlets of the first air duct is one, the number of first fans is one, and the air outlet of the first fan is in communication with the air inlet of the first air duct. In this way, the structure of the electronic device is relatively simple, and the cost is relatively low.

[0015] In some embodiments, the number of air inlets of the first air duct is multiple, the air inlets of the multiple first air ducts are arranged at intervals, the number of first fans is multiple, and the air outlets of the multiple first fans correspond to and are in communication with the air inlets of the multiple first air ducts. In this way, it is beneficial to improve the heat dissipation efficiency of the second device in the first air duct, thereby improving the heat dissipation effect.

[0016] In some embodiments, the orientations of the air inlets of the multiple first air ducts are different from each other. In this way, the second device in the first air duct can be blown from different directions, which is beneficial to improve the heat dissipation efficiency of the second device, thereby improving the heat dissipation effect.

[0017] In some embodiments, the circuit board includes a first side edge, a second side edge, a third side edge and a fourth side edge connected in sequence, the first side edge is arranged opposite to the third side edge, the second side edge is arranged opposite to the fourth side edge, the air inlet of at least one first air duct is located on the first side edge, the air inlet of at least one first air duct is located on the third side edge, the second side edge is arranged opposite to the air outlet of the shell, and the air outlet of the first air duct is located on the second side edge; a part of the first device forms a first section, a part of the first device forms a second section, a part of the first device forms a third section, a part of the first device forms a fourth section, and a part of the first device forms a fifth section; the first section and the second section jointly enclose an air inlet of a first air duct, the first section and the third section jointly enclose an air inlet of another first air duct, the fourth section is located on the side of the second section away from the first section, the fifth section is located on the side of the third section away from the first section, and the fourth section and the fifth section jointly enclose an air outlet of the first air duct; at least part of the second device is located in the space jointly enclosed by the first section, the fourth section and the fifth section.

[0018] It can be understood that in the embodiment, the arrangement of the first device and the shape of the first air duct can be set according to the position of the second device on the circuit board. For example, the size and shape of the first air duct can be adjusted by adjusting the extension direction and position of the first segment to the fifth segment, so that the second device can be located in the first air duct.

[0019] In some embodiments, the first segment is arranged along a second direction, the fourth segment is arranged along a third direction, and the fifth segment is arranged along a fourth direction, wherein the second direction, the third direction, and the fourth direction are perpendicular to the first direction; the third direction and the fourth direction are perpendicular to the second direction.

[0020] It can be understood that in the embodiment, at least part of the second device can be located at the middle position of the circuit board. The first air duct can surround the second device, and the space of the first air duct can be small. When the gas flows through the first air duct, the air pressure in the first air duct is large, thereby facilitating to improve the heat dissipation efficiency of the second device.

[0021] In some embodiments, the first segment is arranged along a second direction, the fourth segment is arranged along a third direction, and the fifth segment is arranged along a fourth direction, wherein the second direction, the third direction, and the fourth direction are perpendicular to the first direction; the third direction and the fourth direction are arranged at an angle with the second direction, and point to the second side edge along the direction of the fourth side edge, the fourth segment is close to the fifth segment, and the fifth segment is close to the fourth segment.

[0022] It can be understood that in the embodiment, at least part of the second device can be located at the middle position of the circuit board along the second direction (i.e., the X-axis direction). Along the Y-axis direction (the Y-axis direction is perpendicular to the first direction and the second direction), at least part of the second device can be arranged close to the first segment of the first air duct relative to the air outlet of the first air duct. The first air duct can surround the second device, and the space of the first air duct can be small. When the gas flows through the first air duct, the air pressure in the first air duct is large, thereby facilitating to improve the heat dissipation efficiency of the second device.

[0023] In some embodiments, the first segment is arranged along a second direction, the fourth segment is arranged along a third direction, and the fifth segment is arranged along a fourth direction, wherein the second direction, the third direction, and the fourth direction are perpendicular to the first direction; the third direction and the fourth direction are arranged at an angle with the second direction, and point to the second side edge along the direction of the fourth side edge, the fourth segment is close to the fifth segment, and the fifth segment is close to the fourth segment.

[0024] In the embodiment, it can be understood that at least part of the second device can be arranged close to the first side edge of the circuit board along the second direction (i.e., the X-axis direction) with respect to the third side edge of the circuit board. At least part of the second device can be arranged close to the first section of the first air duct along the Y-axis direction (the Y-axis direction is perpendicular to the first direction and the second direction) with respect to the air outlet of the first air duct. The first air duct can surround the second device, and the space of the first air duct can be small. When the gas flows through the first air duct, the air pressure in the first air duct is large, thereby facilitating to improve the heat dissipation efficiency of the second device.

[0025] In some embodiments, the first section is arranged along the second direction, the fourth section is arranged along the third direction, and the fifth section is arranged along the fourth direction, wherein the second direction, the third direction, and the fourth direction are all perpendicular to the first direction; the third direction is perpendicular to the second direction, the fourth direction is arranged at an angle with respect to the second direction and points to the second side edge along the direction of the fourth side edge, and the fifth section is close to the fourth section.

[0026] In the embodiment, it can be understood that at least part of the second device can be arranged close to the first side edge of the circuit board along the second direction (i.e., the X-axis direction) with respect to the third side edge of the circuit board. At least part of the second device can be arranged close to the first section of the first air duct along the Y-axis direction (the Y-axis direction is perpendicular to the first direction and the second direction) with respect to the air outlet of the first air duct. The first air duct can surround the second device, and the space of the first air duct can be small. When the gas flows through the first air duct, the air pressure in the first air duct is large, thereby facilitating to improve the heat dissipation efficiency of the second device.

[0027] In some embodiments, the circuit board comprises a first side edge, a second side edge, a third side edge, and a fourth side edge connected in sequence, the first side edge is arranged opposite to the third side edge, the second side edge is arranged opposite to the fourth side edge, the second side edge is arranged opposite to the air outlet of the housing, the air inlet of the at least one first air duct is located at the first side edge, the air inlet of the at least one first air duct is located at the third side edge, and the air outlet of the first air duct is located at the second side edge; a part of the first device forms the first section, a part of the first device forms the second section, a part of the first device forms the third section, a part of the first device forms the fourth section, and a part of the first device forms the fifth section; the first section and the second section jointly enclose the air inlet of one first air duct, the first section and the third section jointly enclose the air inlet of another first air duct, the fourth section is located on the side of the second section away from the first section, the fifth section is located on the side of the third section away from the first section, and the fourth section and the fifth section jointly enclose the air outlet of the first air duct; a part of the first section protrudes in the direction of the air outlet of the first air duct, and at least part of the second device is located in the space jointly enclosed by the first section, the fourth section, and the fifth section.

[0028] It can be understood that, in the embodiment, at least part of the second device can be arranged close to the air outlet of the first air duct in the Y-axis direction (the Y-axis direction is perpendicular to the first direction and the second direction) relative to the first section of the first air duct. The first air duct can surround the second device, and the space of the first air duct can be small. When the gas flows through the first air duct, the air pressure in the first air duct is large, thereby facilitating to improve the heat dissipation efficiency of the second device.

[0029] In some embodiments, the electronic device further comprises a second fan mounted in the internal space of the housing; the circuit board assembly further comprises a third device and a fourth device, the third device is fixedly connected to the top surface of the circuit board and surrounds a second air duct with the circuit board, the second air duct is arranged spaced apart from the first air duct; the second air duct comprises an air inlet and an air outlet, the air inlet of the second air duct is communicated with the air outlet of the second fan, and the air outlet of the second air duct is communicated with the air outlet of the housing; the fourth device is at least partially located in the second air duct; in the first direction, the distance between the top surface of the third device and the top surface of the circuit board is greater than the distance between the top surface of the fourth device and the top surface of the circuit board, wherein the top surface of the third device is the surface of the third device away from the circuit board, and the top surface of the fourth device is the surface of the fourth device away from the circuit board.

[0030] In the embodiment, the electronic device optimizes the layout of the third device of the circuit board assembly, surrounds the second air duct with the third device of the circuit board assembly, and the second air duct surrounds the fourth device. The wind blown by the second fan enters the second air duct and carries away the heat of the fourth device in the second air duct, thereby the fourth device can be cooled. In this way, the heat dissipation efficiency of the fourth device can be improved, which is conducive to ensuring the reliability of the fourth device and the electronic device, and the wind with heat can be blown from the air outlet of the housing to the outside of the electronic device, which is conducive to reducing the shell temperature of the electronic device and improving the user experience. Moreover, the electronic device does not need to additionally set other structures to form the second air duct. The structure of the electronic device is relatively simple.

[0031] In some embodiments, the air inlet of the second air duct is arranged spaced apart from the air inlet of the first air duct and faces in different directions; and the air outlet of the second air duct is arranged spaced apart from the air outlet of the first air duct and faces in the same direction.

[0032] In the embodiment, the first air duct and the second air duct are arranged spaced apart, wherein the first fan can cool the second device in the first air duct through the first air duct, and the second fan can cool the fourth device in the second air duct through the second air duct, thereby the second device and the fourth device which are distributed relatively dispersedly can be cooled. Moreover, the first air duct and the second air duct are arranged spaced apart, so that the first air duct and the second air duct can be arranged relatively small. When the gas flows through the first air duct and the second air duct, the air pressure in the first air duct and the second air duct is large, thereby facilitating to improve the heat dissipation efficiency of the second device and the fourth device.

[0033] In some embodiments, the circuit board comprises a first side edge, a second side edge, a third side edge and a fourth side edge connected in sequence, the first side edge is opposite to the third side edge, the second side edge is opposite to the fourth side edge, and the second side edge is opposite to the air outlet of the shell; the air inlet of the first air duct is located at the first side edge, the air inlet of the second air duct is located at the third side edge, and the air outlets of the first air duct and the second air duct are both located at the second side edge.

[0034] In some embodiments, a part of the shell covers the first device, and the electronic device further comprises a filler, which is arranged between the inner wall of the shell and the first device and connects the inner wall of the shell and the first device.

[0035] In the present embodiment, the filler can jointly enclose the first air duct with the first device. The filler can be used to reduce the distance between the top surface of the first device and the bottom plate of the shell, which is conducive to improving the sealing performance of the first air duct and thus improving the heat dissipation effect of the first fan on the second device in the first air duct.

[0036] In some embodiments, the filler comprises a first connecting surface and a second connecting surface, the first connecting surface connects the top surface of the first device, and the second connecting surface connects the inner wall of the shell, and both the first connecting surface and the second connecting surface are perpendicular to the first direction. The first connecting surface is rectangular, the length of the first connecting surface is greater than or equal to 2 mm, and the width of the first connecting surface is greater than or equal to 2 mm. In this way, the connecting area between the filler and the first device is relatively large, and the filler is not easy to fall off from the first device.

[0037] In some embodiments, the filler comprises a first connecting surface and a second connecting surface, the first connecting surface connects the top surface of the first device, and the second connecting surface connects the inner wall of the shell, and both the first connecting surface and the second connecting surface are perpendicular to the first direction. The second connecting surface is rectangular, the length of the second connecting surface is greater than or equal to 2 mm, and the width of the second connecting surface is greater than or equal to 2 mm. In this way, the connecting area between the filler and the inner wall of the shell is relatively large, and the filler is not easy to fall off from the shell.

[0038] In some embodiments, the material of the filler comprises foam, silica gel or plastic. For example, the filler can be foam, which can be processed into the required shape by cutting. The molding of the filler is relatively simple, and the cost is relatively low.

[0039] In some embodiments, the first device comprises a first sub-device and a second sub-device, and in the first direction, the distance between the top surface of the first sub-device and the top surface of the circuit board is greater than the distance between the top surface of the second sub-device and the top surface of the circuit board, wherein the top surface of the first sub-device and the top surface of the second sub-device are both part of the top surface of the first device; and in the length extension direction of the first air duct, the second sub-device is located on one side of the first sub-device.

[0040] It can be understood that, in the embodiment, the distance between the top surface of the first device and the top surface of the circuit board can be from large to small or from small to large along the length extension direction of the first air duct. By respectively centrally arranging the first sub-device and the second sub-device, the shape of the filler is facilitated to be simplified, and thus the forming process of the filler is facilitated to be simplified.

[0041] In some embodiments, the first device includes at least one of a capacitor, an inductor, a connector, a power supply, a fixed hard disk, a memory, a shielding plate, and a shielding cover; and the second device includes at least one of a central processing unit, a graphics processing unit, a memory, and an inductor.

[0042] It can be understood that, in the embodiment, the second device generates more heat than the first device when the electronic device is running, and the second device is a main heat generating device in the electronic device. By arranging the second device in the first air duct, the second device is rapidly cooled by the first fan, and the heat dissipation efficiency of the electronic device is effectively improved.

[0043] In some embodiments, the circuit board is provided with a through hole penetrating through the circuit board along the first direction and communicating with the first air duct. In this way, the gas with heat in the first air duct can flow to the space on the bottom surface side of the circuit board through the through hole of the circuit board, thereby facilitating heat dissipation in the first air duct and improving the heat dissipation efficiency of the second device.

[0044] In some embodiments, the electronic device includes a display device and an input device, the display device and the input device are connected through a rotating shaft, the shell is a housing of the input device, and the air outlet of the shell is located on the side of the shell close to the rotating shaft.

[0045] In the embodiment, the first fan can be arranged in the internal space of the input device. In this way, the internal space of the electronic device is more reasonably utilized. In addition, when a user uses the electronic device, the air outlet of the shell can face away from the user. The position of the air outlet of the shell is more reasonably designed. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0047] FIG. 1 is a structural schematic diagram of an electronic device provided by the embodiment of the present application;

[0048] FIG. 2A is FIG. 1 is a partial structural schematic diagram of the electronic device shown in FIG. 1 from another angle in some embodiments;

[0049] FIG. 2B FIG. 1 is a schematic diagram of a portion of the structure of an electronic device in some embodiments; FIG. 1 FIG. 2 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0050] FIG. 3 FIG. 3 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 2B FIG. 4 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0051] FIG. 4 FIG. 5 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 2A FIG. 6 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0052] FIG. 5 FIG. 7 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 2A FIG. 8 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0053] FIG. 6A FIG. 9 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 2B FIG. 10 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0054] FIG. 6B FIG. 11 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 6A FIG. 12 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0055] FIG. 7 FIG. 13 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 2B FIG. 14 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0056] FIG. 8 FIG. 15 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 7 FIG. 16 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0057] FIG. 9 FIG. 17 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 2B FIG. 18 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0058] FIG. 10 FIG. 19 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 2B FIG. 20 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0059] FIG. 11 FIG. 21 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments; FIG. 2B FIG. 22 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments;

[0060] FIG. 12 FIG. 23 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments. FIG. 2B FIG. 24 is a schematic diagram of a portion of the structure of the electronic device shown in FIG. 1 in some embodiments. DETAILED DESCRIPTION

[0061] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0062] In the description of the embodiments of the present application, it should be noted that unless specifically defined and limited, the terms "mounting", "connecting" should be understood in a broad sense, for example, "connecting" can be detachable connection, or can be non-detachable connection; can be direct connection, or can be indirect connection through intermediate medium. Among them, "fixed connection" refers to the connection of each other and the relative position relationship after connection does not change.

[0063] The orientation language mentioned in the embodiments of the present application, such as "up", "in", "out", "top", "bottom", "side" and the like, is only the direction of the accompanying drawings, therefore, the orientation language used is for better and clearer illustration and understanding of the embodiments of the present application, and is not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the embodiments of the present application.

[0064] In the embodiments of the present application, the terms "first", "second", "third", "fourth" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second", "third", "fourth" can explicitly or implicitly include one or more of the features. The term "multiple" means at least two. The terms "include", "have" and their variants mean "include but are not limited to", unless otherwise specifically emphasized.

[0065] In the embodiments of the present application, "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are in an "or" relationship.

[0066] In the embodiments of the present application, the terms "parallel", "perpendicular" and the like are defined in relation to the current process level, not the absolute strict definition in the mathematical sense, and a small amount of deviation is allowed, and approximate parallel, approximate perpendicular and the like are also allowed. For example, A is parallel to B, which means that A and B are parallel or approximately parallel, and the included angle between A and B can be between 0° and 10°. For another example, A is perpendicular to B, which means that A and B are perpendicular or approximately perpendicular, and the included angle between A and B can be between 80° and 100°.

[0067] Reference or "some embodiments" or "one or more embodiments" or "an embodiment" or "some implementations" described in the specification mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one implementation of the present application. Thus, appearances of the phrase "in some embodiments" or "in other embodiments" or "in other implementations" or "in some implementations" within the specification are not necessarily all referring to the same embodiments, although the features, structures, or characteristics can be combined in one or more implementations. In addition, it is to be appreciated that the use of a limited number of elements in the examples described herein should not be interpreted as a limitation on the scope of the application.

[0068] It can be understood that the specific embodiments described herein merely illustrate the related embodiments, but do not limit the embodiments. In addition, it should be noted that, for the convenience of description, only the parts related to the embodiments are shown in the drawings.

[0069] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0070] The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0071] Please refer to FIG. 1 , FIG. 1 is a structural schematic diagram of an electronic device 100 provided by an embodiment of the present application. The electronic device can be a notebook computer, a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, or other forms of devices provided with a chip. FIG. 1 The electronic device of the embodiment is described by taking a notebook computer as an example. Of course, other types of electronic devices 100 can also adopt similar structures, which will not be described hereinafter.

[0072] In some embodiments, the electronic device 100 can include a display device 10 and an input device 20. The display device 10 and the input device 20 can be relatively opened or relatively folded through a rotating shaft. Exemplarily, FIG. 1 The electronic device 100 shown is in an opened state. The electronic device 100 can be in a folded state, and at this time, the display device 10 and the input device 20 can be stacked.

[0073] For example, the display device 10 may include a housing 11 and a screen 12. The screen 12 may be mounted on the housing 11 of the display device 10, and the housing 11 may be used to support and protect the screen 12. The screen 12 is used to display images, text, and videos, etc. In some examples, the screen 12 may also integrate display functionality and touch sensing functionality. The display function of the screen 12 is used to display text, images, videos, etc., and the touch sensing function of the screen 12 is used to detect the user's touch actions to realize information interaction between humans and machines. For example, the screen 12 may be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, a micro organic light-emitting diode (microorganic light-emitting diode) display, or a quantum dot light-emitting diode (QLED) display, etc.

[0074] For example, the input device 20 may include a housing 21 and a keyboard 22. The keyboard 22 may be mounted on the housing 21 of the input device 20. The housing 21 of the input device 20 may be used to support the keyboard 22. The keys of the keyboard 22 may be exposed relative to the housing 21 of the input device 20. The keyboard 22 may be used to input and interact with the display device 10 for various operations. In this embodiment, the housing 11 of the display device 10 and the housing 21 of the input device 20 may be connected by a hinge, so that the housing 11 of the display device 10 may drive the screen 12 to rotate relative to the input device 20, thereby allowing the electronic device 100 to switch between an open state and a folded state.

[0075] In some other embodiments, the electronic device 100 may not include the input device 20. The electronic device 100 may include a first display device and a second display device, which are connected by a hinge.

[0076] Please refer to the following: FIG. 2A and FIG. 2B , FIG. 2A yes FIG. 1 The illustrated electronic device 100 is shown as a partial structural schematic diagram from another angle in some embodiments. FIG. 2B yes FIG. 1 The electronic device 100 shown is a partial structural schematic diagram from another angle in some embodiments.

[0077] In some embodiments, the electronic device 100 can include a housing 30, a first fan 41, a second fan 42, and a circuit board assembly 50. The housing 30 of the electronic device 100 can be the outer shell 21 of the input device 20. The first fan 41 and the second fan 42 can be arranged using the internal space of the input device 20. In this way, the internal space of the electronic device 100 is utilized more reasonably.

[0078] In other examples, the housing of the electronic device can also be the outer shell 11 of the display device 10. The present application does not strictly limit this. For ease of description, the length direction of the housing 30 is defined as the X-axis direction, the width direction of the housing 30 is defined as the Y-axis direction, and the thickness direction of the housing 30 is defined as the Z-axis direction. The X-axis, Y-axis, and Z-axis directions are perpendicular to each other.

[0079] For example, the housing 30 can include a bottom plate 31 and a cover plate 32. The bottom plate 31 is fixedly connected to the cover plate 32, and the bottom plate 31 and the cover plate 32 together enclose the internal space 33 of the housing 30. It can be understood that the bottom plate 31 can cover the internal space 33 to protect the internal components of the electronic device 100. When the electronic device 100 is in an open state, the bottom plate 31 can be used to support the display device 10. In some examples, the keyboard 22 can be mounted on the cover plate 32 of the housing 30.

[0080] For example, the housing 30 can be provided with an air outlet. The air outlet 322 of the housing 30 can communicate the internal space 33 of the housing 30 with the external space of the housing 30. For example, the air outlet 322 of the housing 30 can be located on the side 321 of the cover plate 32 close to the hinge. In this way, when the user uses the electronic device 100, the air outlet 322 of the housing 30 can face away from the user. The position of the air outlet 322 of the housing 30 is more reasonable. For example, the number of air outlets 322 of the housing 30 can be multiple. The multiple air outlets 322 of the housing 30 are arranged at intervals.

[0081] In some embodiments, the first fan 41, the second fan 42, and the circuit board assembly 50 can be mounted in the internal space 33 of the housing 30. For example, the first fan 41, the second fan 42, and the circuit board assembly 50 can be fixedly connected to the bottom plate 31 of the housing 30. The circuit board assembly 50 can include a chip (not shown in the figure). It can be understood that the chip is an important power device inside the electronic device 100. When the electronic device 100 is running, a large amount of heat is generated inside the chip, and the demand for heat dissipation is large. Therefore, the circuit board assembly 50 needs to have good heat dissipation performance to quickly transfer the heat generated by the chip to the outside of the electronic device 100 to ensure the reliability of the electronic device 100.

[0082] For example, the first fan 41 and the second fan 42 can be located on two opposite sides of the circuit board assembly 50. For example, the first fan 41 and the second fan 42 can be located on two sides of the circuit board assembly 50 along the X-axis direction. In some other examples, the first fan 41 and the second fan 42 can also be located on the same side of the circuit board assembly 50, or the first fan 41 and the second fan 42 can also be located on two adjacent sides of the circuit board assembly 50. The present application does not strictly limit the positions of the first fan 41 and the second fan 42.

[0083] In some embodiments, the first fan 41 can include a plurality of air outlets 410. For example, the number of air outlets 410 of the first fan 41 can be two, which are a first air outlet 411 and a second air outlet 412. The first air outlet 411 and the second air outlet 412 are oriented differently from each other. The first air outlet 411 of the first fan 41 can be oriented towards the circuit board assembly 50. It can be understood that the air blown by the first fan 41 can be blown towards the circuit board assembly 50 through the first air outlet, so as to take away the heat on the circuit board assembly 50, thereby cooling the circuit board assembly 50. The second air outlet 412 of the first fan 41 can be oriented towards the air outlet 322 of the shell 30.

[0084] In some embodiments, the second fan 42 can include a plurality of air outlets 420. For example, the number of air outlets 420 of the second fan 42 can be two, which are a third air outlet 421 and a fourth air outlet 422. The third air outlet 421 and the fourth air outlet 422 are oriented differently from each other. The third air outlet 421 of the second fan 42 can be oriented towards the circuit board assembly 50. It can be understood that the air blown by the second fan 42 can be blown towards the circuit board assembly 50 through the third air outlet, so as to take away the heat on the circuit board assembly 50, thereby cooling the circuit board assembly 50. The fourth air outlet 422 of the second fan 42 can be oriented towards the air outlet 322 of the shell 30.

[0085] In the embodiments of the present application, by setting the first fan 41 and the second fan 42 to blow air to the circuit board assembly 50, the heat dissipation efficiency of the circuit board assembly 50 can be improved, thereby on the one hand, the temperature of the circuit board assembly 50 can be quickly reduced, the reliability of the electronic devices on the circuit board assembly 50 can be ensured, and on the other hand, the shell temperature of the electronic device 100 can be reduced, and the user experience can be improved. In addition, by setting the second fan 42 to blow air to the circuit board assembly 50, the air power can be increased, and the heat dissipation efficiency of the circuit board assembly 50 can be improved.

[0086] In some embodiments, the electronic device 100 can further include a heat conducting component (not shown). The heat conducting component can be connected with the circuit board component 50, and heat transfer can be achieved between the heat conducting component and the circuit board component 50. For example, heat on the circuit board component 50 can be transferred to the heat conducting component.

[0087] In some examples, a part of the heat conducting component can be located between the second air outlet 412 of the first fan 41 and the air outlet 322 of the housing 30. The air blown by the first fan 41 can pass through the second air outlet and blow to the heat conducting component to take away heat on the heat conducting component, so that the heat conducting component can be cooled. In some examples, a part of the heat conducting component can be located between the fourth air outlet 422 of the second fan 42 and the air outlet 322 of the housing 30. The air blown by the second fan 42 can pass through the fourth air outlet and blow to the heat conducting component to take away heat on the heat conducting component, so that the heat conducting component can be cooled.

[0088] Please refer to FIG. 3 to FIG. 5 , FIG. 3 is FIG. 2B the partial structure of the electronic device 100 shown in FIG. 1A, a structure schematic diagram of the electronic device 100 in some embodiments is shown in FIG. 2A, FIG. 4 is FIG. 2A the partial structure of the electronic device 100 shown in FIG. 1A, a partial cross-sectional structure schematic diagram of the electronic device 100 along A-A in some embodiments is shown in FIG. 2B, FIG. 5 is FIG. 2A the partial structure of the electronic device 100 shown in FIG. 1A, a partial cross-sectional structure schematic diagram of the electronic device 100 along B-B in some embodiments is shown in FIG. 2C. Exemplarily, FIG. 3 the first fan 41, the second fan 42 and the circuit board component 50 in some embodiments are shown in FIG. 3.

[0089] In some embodiments, the circuit board component 50 can include a circuit board 51, a first device 52 and a second device 53. The first device 52 and the second device 53 are fixedly connected to the circuit board 51 and electrically connected to the circuit board 51. It can be understood that, FIG. 3 to FIG. 5 only some components included in the electronic device 100 are shown, and the actual shape, actual size, actual position and actual structure of these components are not limited by FIG. 3 to FIG. 5 . For example, the electronic device 100 can have more or fewer components.

[0090] Exemplarily, the circuit board 51 can include a top surface 511 and a bottom surface 512 arranged oppositely. The bottom surface 512 of the circuit board 51 can face the keyboard 22 of the housing 30 (please refer to FIG. 1). The first device 52 and the second device 53 can be fixedly connected to the top surface 511 of the circuit board 51. A portion of the shell 30 can cover the circuit board 51. For example, the bottom plate 31 of the shell 30 can cover the top surface 511 of the circuit board 51, so as to cover the first device 52 and the second device 53.

[0091] In some embodiments, the first device 52 can enclose the first air duct 501 together with the circuit board 51, and at least a portion of the second device 53 can be located in the first air duct 501. It can be understood that the second device 53 can be entirely located in the first air duct 501. The second device 53 can also be partially located in the first air duct 501. For example, the number of the first devices 52 can be multiple, and the multiple first devices 52 can be arranged around the second device 53 on the circuit board 51.

[0092] In the embodiments of the present application, the electronic device 100 optimizes the layout of the first device 52 of the circuit board assembly 50, encloses the first air duct 501 by the first device 52 of the circuit board assembly 50, and the first air duct 501 surrounds the second device 53. In this way, the wind blown by the first fan 41 enters the first air duct 501 and carries away the heat of the second device 53 in the first air duct 501, thereby facilitating the heat dissipation of the second device 53. Moreover, the electronic device 100 does not need to additionally set other structures to form the first air duct 501. The structure of the electronic device 100 is relatively simple. It can be understood that the arrangement of the first device 52 and the shape of the first air duct 501 can be set according to the position of the second device 53 on the circuit board 51, so that the second device 53 can be located in the first air duct 501, and the space of the first air duct 501 is relatively small.

[0093] For example, the first air duct 501 includes an air inlet 5011 and an air outlet 5012. The air inlet 5011 of the first air duct 501 can be communicated with the first air outlet 411 of the first fan 41, and the air outlet 5012 of the first air duct 501 is communicated with the air outlet 322 of the shell 30.

[0094] It can be understood that the first air outlet 411 of the first fan 41 can be arranged opposite to the air inlet 5011 of the first air duct 501. The air outlet 5012 of the first air duct 501 can be arranged opposite to the air outlet 322 of the shell 30. The air blown by the first fan 41 can enter the first air duct 501 through the air inlet 5011 of the first air duct 501, flow to the air outlet 322 of the shell 30 from the air outlet 5012 of the first air duct 501, and finally flow to the outside of the electronic device 100 through the air outlet 322 of the shell 30. In the embodiment of the present application, the air blown by the first fan 41 can carry away the heat of the second device 53 in the first air duct 501, so as to cool the second device 53. In this way, the heat dissipation efficiency of the second device 53 can be improved, which is beneficial to guarantee the reliability of the second device 53 and the electronic device 100. At the same time, the air with heat can be blown to the outside of the electronic device 100 from the air outlet 322 of the shell 30, which is beneficial to reduce the shell temperature of the electronic device 100 and improve the user experience.

[0095] In other embodiments, the air outlet 5012 of the first air duct 501 can also be communicated with the air outlet 322 of the shell 30 through a pipe or the like.

[0096] For example, the first device 52 can include a top surface 521 and a bottom surface 522 arranged oppositely. The bottom surface 522 of the first device 52 is fixedly connected to the top surface 511 of the circuit board 51. The top surface 521 of the first device 52 is a surface of the first device 52 away from the circuit board 51. The second device 53 can include a top surface 531 and a bottom surface 532 arranged oppositely. The bottom surface 532 of the second device 53 is fixedly connected to the top surface 511 of the circuit board 51. The top surface 531 of the second device 53 is a surface of the second device 53 away from the circuit board 51.

[0097] In some embodiments, in a first direction, the distance between the top surface 521 of the first device 52 and the top surface 511 of the circuit board 51 is greater than the distance between the top surface 531 of the second device 53 and the top surface 511 of the circuit board 51. The first direction is the thickness direction of the circuit board assembly 50, that is, the Z-axis direction. It can be understood that the height of the first device 52 on the circuit board 51 is greater than the height of the second device 53 on the circuit board 51, so that the first air duct 501 surrounded by the first device 52 can surround the second device 53, so that the air blown by the first fan 41 can blow to the second device 53 through the first air duct 501 to carry away the heat of the second device 53.

[0098] In some embodiments, the distance between the top surface 521 of the first device 52 and the top surface 511 of the circuit board 51 in the first direction is greater than or equal to 1.5 mm. In this way, the first air duct 501 surrounded by the first device 52 can better surround the second device 53, so that the wind blown by the first fan 41 can quickly take away the heat of the second device 53. In some examples, the first device 52 can include at least one of a capacitor, an inductor, a connector, a power supply, a fixed hard disk, a memory, a shielding plate, and a shielding cover. For example, the first device 52 can be a 1.5 mm high capacitor, a 1.8 mm high inductor, a 2.1 mm high capacitor, a 3 mm high inductor, a 4 mm high inductor, and a 4.6 mm high electrolytic capacitor. In other examples, the first device 52 can also be some structural parts on the circuit board 51.

[0099] In some embodiments, the first device 52 includes a first sub-device 52a and a second sub-device 52b, and the distance between the top surface 521a of the first sub-device 52a and the top surface 511 of the circuit board 51 in the first direction is greater than the distance between the top surface 521b of the second sub-device 52b and the top surface 511 of the circuit board 51. The top surface 521a of the first sub-device 52a is a surface of the first sub-device 52a away from the circuit board 51, and the top surface 521b of the second sub-device 52b is a surface of the second sub-device 52b away from the circuit board 51. The top surface 521a of the first sub-device 52a and the top surface 521b of the second sub-device 52b are both part of the top surface 521 of the first device 52.

[0100] For example, along the length extension direction of the first air duct 501, the second sub-device 52b is located on one side of the first sub-device 52a. It can be understood that the distance between the top surface 521 of the first device 52 and the top surface 511 of the circuit board 51 in the length extension direction of the first air duct 501 can be from large to small, or from small to large, which is not limited in the present application.

[0101] For example, the first device 52 can include a plurality of 1.5 mm high capacitors and a plurality of 1.8 mm high inductors. The plurality of 1.5 mm high capacitors can be arranged in a concentrated manner, the plurality of 1.8 mm high capacitors can be arranged in a concentrated manner, and the plurality of 1.5 mm high capacitors are all located on one side of the plurality of 1.8 mm high inductors. The first device 52 can also include a plurality of 2.1 mm high capacitors, the plurality of 2.1 mm high capacitors can be arranged in a concentrated manner, and can be arranged on the other side of the plurality of 1.8 mm high inductors. In other words, the plurality of 1.8 mm high inductors can be arranged between the plurality of 1.5 mm high capacitors and the plurality of 2.1 mm high capacitors.

[0102] In some embodiments, the distance between the top surface 531 of the second device 53 and the top surface 511 of the circuit board 51 is less than 1.5 mm. In some examples, the second device 53 includes at least one of a central processing unit (CPU), a graphics processing unit (GPU), a memory (e.g., a double data rate synchronous dynamic random access memory (DDR SDRAM), a low power double data rate SDRAM (LPDDR)), and an inductor. It can be understood that the second device 53 is a main heat generating device in the electronic device 100 when the electronic device 100 is running. In the present embodiment, the second device 53 is arranged in the first air duct 501, and the first fan 41 is used to quickly dissipate heat from the second device 53, which can effectively improve the heat dissipation efficiency of the electronic device 100.

[0103] For reference, please see FIG. 4 and FIG. 5 In some embodiments, the electronic device 100 can further include a filler 60. The filler 60 can be arranged between the inner wall of the housing 30 and the first device 52, and connect the inner wall of the housing 30 and the first device 52. In the present embodiment, the filler 60 can jointly enclose the first air duct 501 with the first device 52. The filler 60 can be used to reduce the distance between the top surface 521 of the first device 52 and the bottom plate 31 of the housing 30, which is conducive to improving the sealing performance of the first air duct 501, thereby improving the heat dissipation effect of the first fan 41 on the second device 53 in the first air duct 501. In addition, in the present embodiment, the first sub-device 52a and the second sub-device 52b are arranged separately, which is conducive to simplifying the shape of the filler 60, thereby simplifying the molding process of the filler 60.

[0104] For example, the filler 60 can include a first connecting surface 61 and a second connecting surface 62 arranged oppositely. For example, the first connecting surface 61 and the second connecting surface 62 can be arranged oppositely in a first direction, and the first connecting surface 61 and the second connecting surface 62 are both perpendicular to the first direction. The first connecting surface 61 connects the top surface 521 of the first device 52. The second connecting surface 62 connects the inner wall of the housing 30.

[0105] For example, the first connecting surface 61 can be substantially rectangular. The length of the first connecting surface 61 can be greater than or equal to 2 mm, and the width of the first connecting surface 61 can be greater than or equal to 2 mm. In this way, the connecting area between the filler 60 and the first device 52 is large, and the filler 60 is not easy to fall off from the first device 52.

[0106] For example, the second connecting surface 62 can be substantially rectangular. The length of the second connecting surface 62 can be greater than or equal to 2 mm, and the width of the second connecting surface 62 can be greater than or equal to 2 mm. In this way, the connecting area between the filler 60 and the inner wall of the shell 30 is large, and the filler 60 is not easy to fall off from the shell 30.

[0107] For example, the material of the filler 60 can include foam, silica gel or plastic. For example, the filler 60 can be foam, which can be cut into the required shape. The molding of the filler is simple and the cost is low.

[0108] In other embodiments, a part of the filler 60 can also extend between the plurality of first devices 52 to reduce the gap between the plurality of first devices 52, so as to improve the sealing of the first air duct 501, and thus improve the heat dissipation effect of the second device 53 in the first air duct 501.

[0109] Please refer to FIG. 3 and FIG. 6A , FIG. 6A is FIG. 2B the partial structure of the electronic device 100 shown in some embodiments. It can be understood that FIG. 6A mainly shows the assembly structure diagram of the cover plate 32 of the shell 30 of the electronic device 100, the first fan 41, the second fan 42 and the circuit board assembly 50.

[0110] In some embodiments, the first air duct 501 can include a first part 501a and a second part 501b, and the first part 501a communicates with the second part 501b. For example, FIG. 6A the first part 501a and the second part 501b are schematically divided by dashed lines in FIG. 6A the gas flow direction in the first air duct 501 is schematically shown by dashed arrows in . The first part 501a also communicates with the air inlet 5011 of the first air duct 501. The second part 501b also communicates with the air outlet 5012 of the first air duct 501. The length extension direction of the first part 501a intersects the length extension direction of the second part 501b. For example, the length extension direction of the first part 501a and the length extension direction of the second part 501b can be perpendicular or at an angle. It can be understood that the first part 501a and the second part 501b of the first air duct 501 can extend in different directions.

[0111] In the embodiments of the present application, the air blown by the first fan 41 first passes through the first part 501a of the first air duct 501, then changes direction to enter the second part 501b of the first air duct 501, and then flows from the second part 501b to the air outlet 322 of the shell 30. By extending the first part 501a and the second part 501b of the first air duct 501 in different directions, the air direction can be changed so that the air can blow towards the air outlet 322 of the shell 30.

[0112] For example, the number of air inlets 5011 of the first air duct 501 is one. The number of first fans 41 is one, and the first air outlet 411 of one first fan 41 is in communication with the air inlet 5011 of one first air duct 501. In this way, the structure of the electronic device 100 is relatively simple, and the cost is relatively low.

[0113] In some embodiments, the circuit board assembly 50 further includes a third device 54 and a fourth device 55, the third device 54 is fixedly connected to the top surface 511 of the circuit board 51 and surrounds the second air duct 502 together with the circuit board 51. The second air duct 502 is arranged in a spaced manner with the first air duct 501. For example, the fourth device 55 is at least partially located in the second air duct 502. It can be understood that the fourth device 55 can be entirely located in the second air duct 502 or partially located in the second air duct 502.

[0114] In the embodiments, the electronic device 100 optimizes the layout of the third device 54 of the circuit board assembly 50, uses the third device 54 of the circuit board assembly 50 to surround the second air duct 502, and the second air duct 502 surrounds the fourth device 55. The air blown by the second fan 42 enters the second air duct 502 and carries away the heat of the fourth device 55 in the second air duct 502, so that the fourth device 55 can be cooled. In this way, the heat dissipation efficiency of the fourth device 55 can be improved, which is beneficial to guarantee the reliability of the fourth device 55 and the electronic device 100, and the air with heat can be blown from the air outlet 322 of the shell 30 to the outside of the electronic device 100, which is beneficial to reduce the shell temperature of the electronic device 100 and improve the user experience. Moreover, the electronic device 100 does not need to additionally set other structures to form the second air duct 502. The structure of the electronic device 100 is relatively simple.

[0115] It can be understood that the third device 54 is the same as or similar to the first device 52 in the foregoing embodiments, and other scheme contents of the third device 54 can be referred to the related description of the first device 52, which will not be described herein again. The fourth device 55 is the same as or similar to the second device 53 in the foregoing embodiments, and other scheme contents of the fourth device 55 can be referred to the related description of the second device 53, which will not be described herein again.

[0116] It can be understood that the heat generated by the fourth device 55 is greater than the heat generated by the third device 54 when the electronic device 100 is running, and the fourth device 55 is the main heat generating device in the electronic device 100. By arranging the fourth device 55 in the second air duct 502, the second fan 42 can quickly dissipate heat from the fourth device 55, thereby effectively improving the heat dissipation efficiency of the electronic device 100.

[0117] For example, the second air duct 502 includes an air inlet 5021 and an air outlet 5022. The air inlet 5021 of the second air duct 502 is communicated with the third air outlet 421 of the second fan 42, and the air outlet 5022 of the second air duct 502 is communicated with the air outlet 322 of the housing 30. For example, the number of the second fan 42 is one, and the third air outlet 421 of the second fan 42 is communicated with one air inlet 5021 of the second air duct 502. The air blown by the second fan 42 can enter the second air duct 502 through the air inlet 5021 of the second air duct 502, and carry away the heat of the fourth device 55 in the second air duct 502, and then blow to the air outlet 322 of the housing 30 through the air outlet 5022 of the second air duct 502, thereby achieving heat dissipation of the fourth device 55.

[0118] In some embodiments, in a first direction, the distance between the top surface 551 of the third device 54 and the top surface 511 of the circuit board 51 is greater than the distance between the top surface 551 of the fourth device 55 and the top surface 511 of the circuit board 51, wherein the top surface 551 of the fourth device 55 is the surface of the fourth device 55 away from the circuit board 51, the top surface 551 of the third device 54 is the surface of the third device 54 away from the circuit board 51, and the first direction is the thickness direction of the circuit board assembly 50. It can be understood that in the first direction, the height of the third device 54 on the circuit board 51 is greater than the height of the fourth device 55 on the circuit board 51, so that the second air duct 502 surrounded by the third device 54 can surround the fourth device 55, so that the air blown by the second fan 42 can blow to the fourth device 55 through the second air duct 502 to carry away the heat of the fourth device 55.

[0119] In some embodiments, the third device 54 includes a third sub-device 54a and a fourth sub-device 54b, and in a first direction, the distance between the top surface 541a of the third sub-device 54a and the top surface 511 of the circuit board 51 is greater than the distance between the top surface 541b of the fourth sub-device 54b and the top surface 511 of the circuit board 51. Wherein the top surface 541a of the third sub-device 54a is the surface of the third sub-device 54a away from the circuit board 51, and the top surface 541b of the fourth sub-device 54b is the surface of the fourth sub-device 54b away from the circuit board 51.

[0120] Exemplarily, the fourth sub-device 54b is located at one side of the third sub-device 54a along the length extension direction of the second air duct 502. It can be understood that the distance between the top surface 551 of the third device 54 and the top surface 511 of the circuit board 51 can be from large to small or from small to large along the length extension direction of the second air duct 502, which is not limited in the present application.

[0121] Exemplarily, a part of the filler 60 can be arranged between the inner wall of the shell 30 and the third device 54, and connect the inner wall of the shell 30 and the third device 54. In the embodiment, the filler 60 can jointly enclose the second air duct 502 with the third device 54 and the circuit board 51. The filler 60 can be used to reduce the distance between the top surface 551 of the third device 54 and the inner wall of the shell 30, and is beneficial to improve the sealing performance of the second air duct 502, thereby being beneficial to improve the heat dissipation effect of the fourth device 55 in the second air duct 502 by the second fan 42.

[0122] In some embodiments, the second air duct 502 can include a third part 502a and a fourth part 502b, and the third part 502a communicates with the fourth part 502b. Exemplarily, FIG. 6A In the embodiment, the third part 502a and the fourth part 502b are schematically divided by the dashed line. Exemplarily, FIG. 6A In the embodiment, the gas flow direction in the second air duct 502 is schematically shown by the dashed arrow. The third part 502a also communicates with the air inlet 5021 of the second air duct 502. The fourth part 502b also communicates with the air outlet 5022 of the second air duct 502. The length extension direction of the third part 502a intersects with the length extension direction of the fourth part 502b. For example, the length extension direction of the third part 502a and the length extension direction of the fourth part 502b can be perpendicular or arranged at an angle. It can be understood that the third part 502a and the fourth part 502b of the second air duct 502 can extend in different directions.

[0123] In the embodiment, the wind blown by the first fan 41 first passes through the first part 501a of the first air duct 501, and then changes direction to enter the second part 501b of the first air duct 501, and then flows from the second part 501b to the air outlet 322 of the shell 30. It can be understood that by extending the first part 501a and the second part 501b of the first air duct 501 in different directions, the wind direction can be changed, so that the wind blown by the first fan 41 can be guided to the air outlet 322 of the shell 30. In this way, the position of the first fan 41 is no longer strictly limited by the position of the air outlet 322 of the shell 30, and the position of the first fan 41 can be reasonably arranged as needed.

[0124] In some embodiments, the air inlet 5021 of the second air duct 502 is spaced apart from the air inlet 5011 of the first air duct 501 and faces a different direction. For example, the air inlet 5021 of the second air duct 502 can face a side of the circuit board 51 opposite to the air inlet 5011 of the first air duct 501. The air outlet 5022 of the second air duct 502 is spaced apart from the air outlet 5012 of the first air duct 501 and faces the same direction.

[0125] For example, the circuit board 51 can include a first side 513, a second side 514, a third side 515 and a fourth side 516 connected in sequence. The first side 513 is opposite to the third side 515, and the second side 514 is opposite to the fourth side 516. The second side 514 of the circuit board 51 can be opposite to the air outlet 322 of the housing 30.

[0126] For example, a portion of the second device 53 is disposed close to the first side 513 of the circuit board 51 opposite to the third side 515 and is located in the first air duct 501. A portion of the second device 53 is disposed close to the first side 513 of the circuit board 51 opposite to the first side 513 and is located in the second air duct 502.

[0127] For example, the first air duct 501 can be located on a side of the second air duct 502 away from the third side 515, and the air inlet 5011 of the first air duct 501 can be located on the first side 513 of the circuit board 51. The second air duct 502 can be located on a side of the first air duct 501 away from the first side 513, and the air inlet 5021 of the second air duct 502 can be located on the third side 515 of the circuit board 51. For example, the air outlet 5012 of the first air duct 501 and the air outlet 5022 of the second air duct 502 can both be located on the second side 514 of the circuit board 51.

[0128] In the embodiment, the second devices 53 can be arranged close to the first side edge 513 of the circuit board 51 relative to the third side edge 515 of the circuit board 51, and the fourth devices 55 can be arranged close to the third side edge 515 of the circuit board 51 relative to the first side edge 513 of the circuit board 51. By arranging the first air duct 501 and the second air duct 502, the first fan 41 can cool the second devices 53 in the first air duct 501 through the first air duct 501, and the second fan 42 can cool the fourth devices 55 in the second air duct 502 through the second air duct 502, so that the second devices 53 and the fourth devices 55 which are distributed relatively dispersedly can be cooled. In addition, the first air duct 501 and the second air duct 502 are arranged in a spaced manner, so that the first air duct 501 and the second air duct 502 can be arranged relatively small. When the gas flows through the first air duct 501 and the second air duct 502, the pressure in the first air duct 501 and the second air duct 502 is relatively large, so as to improve the cooling efficiency of the second devices 53 and the fourth devices 55.

[0129] In other embodiments, the air inlet 5011 of the first air duct 501 can also be located at the third side edge 515, the fourth side edge 516 or the joint of the two side edges of the circuit board 51. The air inlet 5021 of the second air duct 502 can also be located at the first side edge 513, the fourth side edge 516 or the joint of the two side edges of the circuit board 51. The application does not make strict limitation on this.

[0130] Please refer to FIG. 6B , FIG. 6B is FIG. 6A the structural schematic diagram of the partial structure of the electronic device 100 shown in FIG. 1.

[0131] In some embodiments, the electronic device 100 can include the first fan 41 and the first air duct 501. It can be understood that in the embodiment, the electronic device 100 can not include the second fan 42 and the second air duct 502. The number of the first fan 41 can be one. The first fan 41 can be located at one side of the first side edge 513 of the circuit board 51, and the first air outlet 411 of the first fan 41 is communicated with the air inlet 5011 of the first air duct 501. In other examples, the number of the first fan 41 can also be multiple. For example, the number of the first fan 41 can be two, and the two first fans 41 can be located at opposite sides of the circuit board assembly 50.

[0132] It can be understood that in the embodiment of the application, the shape of the first air duct 501, the number of air inlets and the position of the air inlet 5011 of the first air duct 501 can be set according to the arrangement of the second devices 53 on the circuit board 51. Therefore, the shape of the first air duct 501 can have various different embodiments. Several structures of the first air duct 501 will be introduced below in combination with related drawings.

[0133] Referring to FIG. 7 , FIG. 7 is FIG. 2B The partial structure of the electronic device 100 shown in FIG. 1A is a structure schematic diagram in other embodiments. The exemplary, FIG. 7 The assembly structure schematic diagram of the cover plate 32 of the shell 30 of the electronic device 100, the first fan 41, and the circuit board assembly 50 is mainly shown. The exemplary, FIG. 7 The gas flow direction in the first air duct 501 is schematically shown by a dashed arrow in the embodiment.

[0134] It can be understood that, FIG. 7 The structure of the electronic device 100 shown in FIG. 1A is substantially the same as the structure of the electronic device 100 shown in FIG. 1B. FIG. 6A The electronic device 100 shown in FIG. 1A can include most of the technical content of the previous embodiments, and the differences between the two are mainly described below. Most of the scheme content of the two is not described again. FIG. 7 In the embodiment, the number of the air inlets 5011 of the first air duct 501 is multiple, and the air inlets 5011 of the multiple first air ducts 501 are arranged at intervals. The number of the first fans 41 is multiple, and the first air outlets 411 of the multiple first fans 41 correspond to and communicate with the air inlets 5011 of the multiple first air ducts 501 one by one. In this way, it is beneficial to improve the heat dissipation efficiency of the second device 53 in the first air duct 501, thereby improving the heat dissipation effect.

[0135] For example, the air inlets 5011 of at least one first air duct 501 can be located at the first side edge 513 of the circuit board 51, the air inlets 5011 of at least one first air duct 501 are located at the third side edge 515, and the air outlet 5012 of the first air duct 501 is located at the second side edge 514. In this way, the second device 53 in the first air duct 501 can be blown from different directions, which is beneficial to improve the heat dissipation efficiency of the second device 53, thereby improving the heat dissipation effect.

[0136] In the embodiment, the number of the air inlets 5011 of the first air duct 501 is two, and the air inlets 5011 of the two first air ducts 501 are arranged at intervals. The number of the first fans 41 is two, and the first air outlets 411 of the two first fans 41 correspond to and communicate with the two air inlets of the first air duct 501 one by one. Among them, the air inlets 5011 of one first air duct 501 can be located at the first side edge 513 of the circuit board 51, and the air inlets 5011 of one first air duct 501 can be located at the third side edge 515 of the circuit board 51. The air outlet 5012 of the first air duct 501 can be located at the second side edge 514 of the circuit board 51.

[0137]

[0138] ​For example, a part of the first device 52 forms the first section 5014, a part of the first device 52 forms the second section 5015, a part of the first device 52 forms the third section 5016, a part of the first device 52 forms the fourth section 5017, and a part of the first device 52 forms the fifth section 5018. The first section 5014 and the second section 5015 jointly enclose an air inlet 5011 of a first air duct 501, and the first section 5014 and the third section 5016 jointly enclose another air inlet 5011 of the first air duct 501. The fourth section 5017 is located on a side of the second section 5015 away from the first section 5014, the fifth section 5018 is located on a side of the third section 5016 away from the first section 5014, and the fourth section 5017 and the fifth section 5018 jointly enclose an air outlet 5012 of the first air duct 501. It can be understood that, in the embodiment of the present application, the size and shape of the first air duct 501 can be adjusted by adjusting the extension direction and position of the first section 5014 to the fifth section 5018, so that the second device 53 can be located in the first air duct 501.

[0139] In some embodiments, the first section 5014, the second section 5015, and the third section 5016 are arranged along a second direction. The fourth section 5017 is arranged along a third direction. The fifth section 5018 is arranged along a fourth direction. For example, the third direction and the fourth direction are both perpendicular to the second direction. For example, the first section 5014, the second section 5015, and the third section 5016 can be arranged along the X-axis direction. The fourth section 5017 and the fifth section 5018 can be arranged along the Y-axis direction. It can be understood that the second section 5015 and the third section 5016 are both arranged in parallel with the first section 5014. In other examples, the second section 5015 can be arranged at an angle with the first section 5014. The third section 5016 can be arranged at an angle with the first section 5014.

[0140] For example, at least part of the second sub-device 52b is located in a space jointly enclosed by the first section 5014, the fourth section 5017, and the fifth section 5018. It can be understood that at least part of the second device 53 can be located at a middle position of the circuit board 51. The first air duct 501 can enclose the second device 53, and the space of the first air duct 501 can be small. When the gas flows through the first air duct 501, the air pressure in the first air duct 501 is large, thereby facilitating the heat dissipation efficiency of the second device 53.

[0141] It can be understood that, without conflict, FIG. 7 The other scheme contents of the first air duct 501 shown can refer to the foregoing FIG. 6A The related description of the first air duct 501 shown will not be repeated here. In the embodiment, the electronic device 100 can not include the second air duct 502.

[0142] Please refer toFIG. 8 , FIG. 8 is FIG. 7 the partial structure of the electronic device 100 shown in FIG. 1A is substantially the same as the structure of the electronic device 100 shown in FIG. 1B. FIG. 8 The structure of the electronic device 100 shown in FIG. 1A is substantially the same as the structure of the electronic device 100 shown in FIG. 1B. FIG. 7 The structure of the electronic device 100 shown in FIG. 1A is substantially the same as the structure of the electronic device 100 shown in FIG. 1B. FIG. 8 The electronic device 100 shown in FIG. 1A can include most of the technical content of the embodiment shown in FIG. 1B, and the following mainly illustrates the differences between the two, and most of the scheme content of the two is not described again. FIG. 7 The electronic device 100 shown in FIG. 1A can include most of the technical content of the embodiment shown in FIG. 1B, and the following mainly illustrates the differences between the two, and most of the scheme content of the two is not described again.

[0143] In the present embodiment, the circuit board 51 can also be provided with a through hole 5019 penetrating through the circuit board 51 along the first direction. The through hole 5019 is in communication with the first air duct 501 and is spaced apart from the second device 53. Illustratively, the through hole 5019 can be located on the side of the second device 53 close to the air outlet 5012 of the first air duct 501. It can be understood that the gas with heat in the first air duct 501 can flow to the space on one side of the bottom surface 512 of the circuit board 51 through the through hole 5019 of the circuit board 51, thereby facilitating heat dissipation in the first air duct 501 and improving the heat dissipation efficiency of the second device 53.

[0144] Illustratively, the through hole 5019 can be a circular through hole. In some other examples, the through hole 5019 can also be rectangular, oval, etc., or the through hole 5019 can also be irregular in shape, and the present application does not strictly limit the shape of the through hole 5019.

[0145] It can be understood that the scheme of providing the through hole 5019 on the circuit board 51 shown in FIG. 1A can also be applied to the structure of the electronic device 100 shown in FIG. 1B. FIG. 8 It can be understood that the scheme of providing the through hole 5019 on the circuit board 51 shown in FIG. 1A can also be applied to the structure of the electronic device 100 shown in FIG. 1B. FIG. 6A It can be understood that the scheme of providing the through hole 5019 on the circuit board 51 shown in FIG. 1A can also be applied to the structure of the electronic device 100 shown in FIG. 1B. FIG. 6B That is, the circuit board 51 in FIG. 1A and FIG. 1B can be provided with a through hole, and the through hole can be in communication with the first air duct 501 and the second air duct 502, thereby facilitating the improvement of the heat dissipation efficiency of the second device 53. FIG. 6A That is, the circuit board 51 in FIG. 1A and FIG. 1B can be provided with a through hole, and the through hole can be in communication with the first air duct 501 and the second air duct 502, thereby facilitating the improvement of the heat dissipation efficiency of the second device 53. FIG. 6B That is, the circuit board 51 in FIG. 1A and FIG. 1B can be provided with a through hole, and the through hole can be in communication with the first air duct 501 and the second air duct 502, thereby facilitating the improvement of the heat dissipation efficiency of the second device 53.

[0146] Please refer to FIG. 9 , FIG. 9 is FIG. 2B the partial structure of the electronic device 100 shown in FIG. 1A is substantially the same as the structure of the electronic device 100 shown in FIG. 1B. FIG. 9 Illustratively, the assembly structure of the cover plate 32 of the shell 30 of the electronic device 100, the first fan 41 and the circuit board assembly 50 is mainly shown. FIG. 9 Illustratively, the gas flow direction in the first air duct 501 is shown by a dashed arrow in FIG. 1A.

[0147] It can be understood that FIG. 9 The structure of the electronic device 100 shown in FIG. 7 Or FIG. 8 The structure of the electronic device 100 shown in FIG. 9 The electronic device 100 shown in FIG. 7 Or FIG. 8 Most of the technical content of the embodiments shown in the above is the same, and the differences between the two will be mainly described below. Most of the same scheme content of the two will not be repeated.

[0148] In the present embodiment, a part of the first device 52 forms the first section 5014, a part of the first device 52 forms the second section 5015, a part of the first device 52 forms the third section 5016, a part of the first device 52 forms the fourth section 5017, and a part of the first device 52 forms the fifth section 5018. Among them, the first section 5014 and the second section 5015 jointly enclose a first air duct 501 inlet 5011, and the first section 5014 and the third section 5016 jointly enclose another first air duct 501 inlet 5011. Among them, the fourth section 5017 is located on the side of the second section 5015 away from the first section 5014, the fifth section 5018 is located on the side of the third section 5016 away from the first section 5014, and the fourth section 5017 and the fifth section 5018 jointly enclose the outlet 5012 of the first air duct 501.

[0149] Among them, the first section 5014, the second section 5015 and the third section 5016 are arranged along the second direction. For example, the first section 5014, the second section 5015 and the third section 5016 can be arranged along the X-axis direction. Among them, the fourth section 5017 is arranged along the third direction, the third direction is arranged at an angle with the second direction, and along the direction of the fourth side edge 516 pointing to the second side edge 514, the fourth section 5017 is close to the fifth section 5018. Among them, the fifth section 5018 is arranged along the fourth direction, the fourth direction is arranged at an angle with the second direction, and along the direction of the fourth side edge 516 pointing to the second side edge 514, and the fifth section 5018 is close to the fourth section 5017. It can be understood that the second section 5015 and the third section 5016 are arranged in parallel with the first section 5014. In other examples, the second section 5015 can also be arranged at an angle with the first section 5014. The third section 5016 can also be arranged at an angle with the first section 5014.

[0150] For example, at least part of the second sub-device 52b is located in the space surrounded by the first section 5014, the fourth section 5017 and the fifth section 5018. It can be understood that, along the X-axis direction, at least part of the second device 53 can be located in the middle part of the circuit board 51. Along the Y-axis direction, at least part of the second device 53 can be located close to the first section 5014 of the first air duct 501 relative to the air outlet 5012 of the first air duct 501. The first air duct 501 can surround the second device 53, and the space of the first air duct 501 can be small. When the gas flows through the first air duct 501, the air pressure in the first air duct 501 is large, thereby facilitating the heat dissipation efficiency of the second device 53.

[0151] Please refer to FIG. 10 , FIG. 10 is FIG. 2B The partial structure of the electronic device 100 shown in FIG. 1 is shown in the structural schematic diagram of another embodiment. For example, FIG. 10 The assembly structure of the cover plate 32 of the shell 30 of the electronic device 100, the first fan 41 and the circuit board assembly 50 is mainly shown. FIG. 10 The gas flow direction in the first air duct 501 is shown by a dashed arrow in the embodiment.

[0152] It can be understood that FIG. 10 The structure of the electronic device 100 shown in FIG. 1 is substantially the same as the structure of the electronic device 100 shown in FIG. 7 or FIG. 8 . FIG. 10 The electronic device 100 shown in FIG. 1 can include most of the technical content of the embodiments shown in FIG. 7 or FIG. 8 . Hereinafter, the differences between the two are mainly described, and most of the scheme contents of the two are not described again.

[0153] In the embodiment, part of the first device 52 forms the first section 5014, part of the first device 52 forms the second section 5015, part of the first device 52 forms the third section 5016, part of the first device 52 forms the fourth section 5017, and part of the first device 52 forms the fifth section 5018. Among them, the first section 5014 and the second section 5015 jointly enclose an air inlet 5011 of a first air duct 501, and the first section 5014 and the third section 5016 jointly enclose an air inlet 5011 of another first air duct 501. Among them, the fourth section 5017 is located on the side of the second section 5015 away from the first section 5014, the fifth section 5018 is located on the side of the third section 5016 away from the first section 5014, and the fourth section 5017 and the fifth section 5018 jointly enclose an air outlet 5012 of the first air duct 501.

[0154] In this configuration, the first segment 5014, the second segment 5015, and the third segment 5016 are arranged along the second direction. For example, the first segment 5014, the second segment 5015, and the third segment 5016 can be arranged along the X-axis direction. The fourth segment 5017 is arranged along the third direction, which forms an angle with the second direction, and points from the fourth side 516 to the second side 514, with the fourth segment 5017 close to the fifth segment 5018. The fifth segment 5018 is arranged along the fourth direction, which is perpendicular to the second direction. It is understood that the second segment 5015 and the third segment 5016 are both arranged parallel to the first segment 5014. In other examples, the second segment 5015 can also be arranged at an angle to the first segment 5014. The third segment 5016 can also be arranged at an angle to the first segment 5014.

[0155] For example, at least a portion of the second sub-device 52b is located within the space enclosed by the first segment 5014, the fourth segment 5017, and the fifth segment 5018. It is understood that, along the X-axis, at least a portion of the second device 53 may be positioned close to the first side 513 of the circuit board 51 relative to the third side 515. Along the Y-axis, at least a portion of the second device 53 may be positioned close to the first segment 5014 of the first air duct 501 relative to the air outlet 5012. The first air duct 501 may surround the second device 53, and the space of the first air duct 501 may be relatively small. When gas flows through the first air duct 501, the air pressure within the first air duct 501 is relatively high, thereby improving the heat dissipation efficiency of the second device 53.

[0156] Please see FIG. 11 , FIG. 11 yes FIG. 2B The illustrated diagram shows a portion of the structure of the electronic device 100 in other embodiments. For example, FIG. 11 This mainly shows a schematic diagram of the assembly structure of the housing 30 cover 32, the first fan 41, and the circuit board assembly 50 of the electronic device 100. For example, FIG. 10 The dashed arrows in the diagram indicate the gas flow direction within the first air duct 501.

[0157] Understandable, FIG. 11 The structure of the electronic device 100 shown is similar to FIG. 7 or FIG. 8 The electronic devices 100 shown have roughly the same structure. FIG. 11 The electronic device 100 shown may include FIG. 7 or FIG. 8 The following mainly describes the differences between the two embodiments, while the most common aspects of the two solutions will not be repeated.

[0158] In the embodiment, a part of the first device 52 forms the first section 5014, a part of the first device 52 forms the second section 5015, a part of the first device 52 forms the third section 5016, a part of the first device 52 forms the fourth section 5017, and a part of the first device 52 forms the fifth section 5018. The first section 5014 and the second section 5015 jointly enclose a first air inlet 5011 of a first air duct 501, and the first section 5014 and the third section 5016 jointly enclose another first air inlet 5011 of the first air duct 501. The fourth section 5017 is located on a side of the second section 5015 away from the first section 5014, the fifth section 5018 is located on a side of the third section 5016 away from the first section 5014, and the fourth section 5017 and the fifth section 5018 jointly enclose a first air outlet 5012 of the first air duct 501.

[0159] The first section 5014, the second section 5015, and the third section 5016 are arranged along a second direction. For example, the first section 5014, the second section 5015, and the third section 5016 can be arranged along the X-axis direction. The fourth section 5017 is arranged along a third direction, and the third direction is perpendicular to the second direction. The fifth section 5018 is arranged along a fourth direction, the fourth direction is arranged at an angle to the second direction, and the fifth section 5018 points to the second side edge 514 along the fourth side edge 516, and the fifth section 5018 is close to the fourth section 5017. It can be understood that the second section 5015 and the third section 5016 are arranged in parallel to the first section 5014. In other examples, the second section 5015 can be arranged at an angle to the first section 5014. The third section 5016 can also be arranged at an angle to the first section 5014.

[0160] For example, at least part of the second sub-device 52b is located in a space jointly enclosed by the first section 5014, the fourth section 5017, and the fifth section 5018. It can be understood that, along the X-axis direction, at least part of the second device 53 can be arranged close to the third side edge 515 of the circuit board 51 relative to the first side edge 513 of the circuit board 51. Along the Y-axis direction, at least part of the second device 53 can be arranged close to the first section 5014 of the first air duct 501 relative to the first air outlet 5012 of the first air duct 501. The first air duct 501 can enclose the second device 53, and the space of the first air duct 501 can be small. When the gas flows through the first air duct 501, the air pressure in the first air duct 501 is large, thereby facilitating the improvement of the heat dissipation efficiency of the second device 53.

[0161] Please refer to FIG. 12 , FIG. 12 is FIG. 2B the structural schematic diagram of the partial structure of the electronic device 100 shown in other embodiments. For example, FIG. 12The assembly structure of the cover plate 32 of the shell 30 of the electronic device 100, the first fan 41 and the circuit board assembly 50 is mainly shown. The example is FIG. 12 The gas flow direction in the first air duct 501 is shown by a dashed arrow.

[0162] It can be understood that, FIG. 12 The structure of the electronic device 100 shown is substantially the same as FIG. 7 Or FIG. 8 The structure of the electronic device 100 shown is substantially the same as FIG. 12 The electronic device 100 shown can include FIG. 7 Or FIG. 8 Most of the technical content of the embodiments shown below will be described below. Most of the same scheme content of the two will not be described again.

[0163] In the present embodiment, a part of the first device 52 forms the first section 5014, a part of the first device 52 forms the second section 5015, a part of the first device 52 forms the third section 5016, a part of the first device 52 forms the fourth section 5017, and a part of the first device 52 forms the fifth section 5018. Among them, the first section 5014 and the second section 5015 jointly enclose a first air inlet 5011 of the first air duct 501, and the first section 5014 and the third section 5016 jointly enclose another first air inlet 5011 of the first air duct 501. Among them, the fourth section 5017 is located on the side of the second section 5015 away from the first section 5014, the fifth section 5018 is located on the side of the third section 5016 away from the first section 5014, and the fourth section 5017 and the fifth section 5018 jointly enclose the air outlet 5012 of the first air duct 501.

[0164] Among them, a part of the first section 5014, the second section 5015 and the third section 5016 are arranged along the second direction. For example, the first section 5014, the second section 5015 and the third section 5016 can be arranged along the X-axis direction. Among them, the fourth section 5017 is arranged along the fourth direction, the fourth direction is arranged at an angle with the second direction, and the fourth section 5017 is close to the fifth section 5018 along the direction of the fourth side edge 516 to the second side edge 514. Among them, the fifth section 5018 is arranged along the fourth direction, the fourth direction is arranged at an angle with the second direction, and the fifth section 5018 is close to the fourth section 5017 along the direction of the fourth side edge 516 to the second side edge 514.

[0165] For example, a portion of the first section 5014 can protrude toward the air outlet 5012 of the first air duct 501. At least a portion of the second sub-device 52b is located in a space enclosed by the first section 5014, the fourth section 5017, and the fifth section 5018. It can be understood that, along the Y-axis direction, at least a portion of the second device 53 can be arranged close to the air outlet 5012 of the first air duct 501 relative to the first section 5014 of the first air duct 501. The first air duct 501 can enclose the second device 53, and the space of the first air duct 501 can be small. When the gas flows through the first air duct 501, the air pressure in the first air duct 501 is large, thereby facilitating the heat dissipation efficiency of the second device 53.

[0166] For example, a middle portion of the first section 5014 can protrude toward the air outlet 5012 of the first air duct 501. It can be understood that, in this embodiment, along the X-axis direction, at least a portion of the second device 53 can be located at the middle portion of the circuit board 51.

[0167] It can be understood that all the above-mentioned drawings are exemplary illustrations of the present application, and do not represent the actual size of the product. The size ratio relationship between the components in the drawings is not intended to limit the actual product of the present application.

[0168] The above merely describes some embodiments of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device (100), characterized by The application relates to a fan device, which comprises a housing (30), a first fan (41) and a circuit board assembly (50), wherein the housing (30) has an internal space (33), the housing (30) is provided with an air outlet (322) which communicates the internal space (33) of the housing (30) with an external space, and the first fan (41) and the circuit board assembly (50) are both installed in the internal space (33) of the housing (30). The circuit board assembly (50) comprises a circuit board (51), a first device (52) and a second device (53), the first device (52) is fixedly connected to the top surface (511) of the circuit board (51) and encloses a first air duct (501) with the circuit board (51), the first air duct (501) comprises an air inlet (5011) and an air outlet (5012), the air inlet (5011) of the first air duct (501) communicates with the air outlet (410) of the first fan (41), and the air outlet (5012) of the first air duct (501) communicates with the air outlet (322) of the housing (30). The second device (53) is at least partially located in the first air duct (501); in a first direction, the distance between the top surface (521) of the first device (52) and the top surface (511) of the circuit board (51) is greater than the distance between the top surface (531) of the second device (53) and the top surface (511) of the circuit board (51), wherein the top surface (521) of the first device (52) is a surface of the first device (52) away from the circuit board (51), the top surface (531) of the second device (53) is a surface of the second device (53) away from the circuit board (51), and the first direction is the thickness direction of the circuit board assembly (50).

2. The electronic device (100) according to claim 1, characterized in that In the first direction, the distance between the top surface (521) of the first device (52) and the top surface (511) of the circuit board (51) is greater than or equal to 1.5 mm, and the distance between the top surface (531) of the second device (53) and the top surface (511) of the circuit board (51) is less than 1.5 mm.

3. The electronic device (100) according to claim 1 or 2, characterized in that, The first air duct (501) comprises a first part (501a) and a second part (501b), the first part (501a) communicates with the second part (501b), the first part (501a) also communicates with the air inlet (5011) of the first air duct (501), and the second part (501b) also communicates with the air outlet (5012) of the first air duct (501). The length extension direction of the first part (501a) intersects the length extension direction of the second part (501b).

4. The electronic device (100) according to claim 1 or 2, characterized in that, The number of the air inlets (5011) of the first air duct (501) is one, the number of the first fans (41) is one, and the air outlet (410) of one first fan (41) communicates with the air inlet (5011) of one first air duct (501).

5. The electronic device (100) according to claim 1 or 2, characterized in that, The first air duct (501) has multiple air inlets (5011), and the multiple air inlets (5011) are arranged at intervals.

6. The electronic device (100) according to claim 5, characterized by The multiple air inlets (5011) of the multiple first air ducts (501) are different in direction.

7. The electronic device (100) according to claim 5, characterized in that, The circuit board (51) comprises a first side (513), a second side (514), a third side (515) and a fourth side (516) connected in sequence, the first side (513) is arranged opposite to the third side (515), the second side (514) is arranged opposite to the fourth side (516), and the second side (514) is arranged opposite to the air outlet (322) of the shell (30); the air inlet (5011) of at least one first air duct (501) is located on the first side (513), the air inlet (5011) of at least one first air duct (501) is located on the third side (515), and the air outlet (5012) of the first air duct (501) is located on the second side (514). Part of the first device (52) forms a first section (5014), part of the first device (52) forms a second section (5015), part of the first device (52) forms a third section (5016), part of the first device (52) forms a fourth section (5017), and part of the first device (52) forms a fifth section (5018); the first section (5014) and the second section (5015) jointly enclose an air inlet (5011) of the first air duct (501), the first section (5014) and the third section (5016) jointly enclose another air inlet (5011) of the first air duct (501), the fourth section (5017) is located on the side of the second section (5015) away from the first section (5014), the fifth section (5018) is located on the side of the third section (5016) away from the first section (5014), and the fourth section (5017) and the fifth section (5018) jointly enclose an air outlet (5012) of the first air duct (501). At least part of the second device (53) is located in the space jointly enclosed by the first section (5014), the fourth section (5017) and the fifth section (5018).

8. The electronic device (100) according to claim 7, characterized by The first section (5014) is arranged along a second direction, the fourth section (5017) is arranged along a third direction, and the fifth section (5018) is arranged along a fourth direction, wherein the second direction, the third direction and the fourth direction are perpendicular to the first direction. The third direction and the fourth direction are both perpendicular to the second direction; or, the third direction and the fourth direction are both arranged at an angle with the second direction, and the fourth direction points to the second side (514) along the fourth side (516), the fourth section (5017) is close to the fifth section (5018), and the fifth section (5018) is close to the fourth section (5017); or, the third direction is arranged at an angle with the second direction, and the fourth direction points to the second side (514) along the fourth side (516), the fourth section (5017) is close to the fifth section (5018), and the fourth direction is perpendicular to the second direction; or, the third direction is perpendicular to the second direction, the fourth direction is arranged at an angle with the second direction, and the fourth direction points to the second side (514) along the fourth side (516), and the fifth section (5018) is close to the fourth section (5017).

9. The electronic device (100) according to claim 5, characterized in that, The circuit board (51) comprises a first side (513), a second side (514), a third side (515) and a fourth side (516) connected in sequence, the first side (513) is arranged opposite to the third side (515), the second side (514) is arranged opposite to the fourth side (516), and the second side (514) is arranged opposite to the air outlet (322) of the shell (30); the air inlet (5011) of at least one first air duct (501) is located on the first side (513), the air inlet (5011) of at least one first air duct (501) is located on the third side (515), and the air outlet (5012) of the first air duct (501) is located on the second side (514); A part of the first device (52) forms a first section (5014), a part of the first device (52) forms a second section (5015), a part of the first device (52) forms a third section (5016), a part of the first device (52) forms a fourth section (5017), and a part of the first device (52) forms a fifth section (5018), the first section (5014) and the second section (5015) jointly enclose an air inlet (5011) of the first air duct (501), the first section (5014) and the third section (5016) jointly enclose another air inlet (5011) of the first air duct (501), the fourth section (5017) is located on a side of the second section (5015) away from the first section (5014), the fifth section (5018) is located on a side of the third section (5016) away from the first section (5014), and the fourth section (5017) and the fifth section (5018) jointly enclose an air outlet (5012) of the first air duct (501); Part of the first section (5014) protrudes towards the direction of the air outlet (5012) of the first air duct (501), and at least part of the second device (53) is located in the space enclosed by the first section (5014), the fourth section (5017) and the fifth section (5018).

10. The electronic device (100) according to claim 1 or 2, characterized in that, The electronic device (100) further comprises a second fan (42) installed in the internal space (33) of the shell (30); The circuit board assembly (50) further comprises a third device (54) and a fourth device (55), the third device (54) is fixedly connected to the top surface (511) of the circuit board (51) and encloses a second air duct (502) with the circuit board (51), the second air duct (502) is arranged separately from the first air duct (501); the second air duct (502) comprises an air inlet (5021) and an air outlet (5022), the air inlet (5021) of the second air duct (502) is communicated with the air outlet (420) of the second fan (42), and the air outlet (5022) of the second air duct (502) is communicated with the air outlet (322) of the shell (30); The fourth device (55) is at least partially located in the second air duct (502); in the first direction, the distance between the top surface (541) of the third device (54) and the top surface (511) of the circuit board (51) is greater than the distance between the top surface (551) of the fourth device (55) and the top surface (511) of the circuit board (51), wherein the top surface (541) of the third device (54) is the surface of the third device (54) away from the circuit board (51), and the top surface (541) of the fourth device (55) is the surface of the fourth device (55) away from the circuit board (51).

11. The electronic device (100) according to claim 10, characterized by The air inlet (5021) of the second air duct (502) is arranged separately from the air inlet (5011) of the first air duct (501) and faces different directions; The air outlet (5022) of the second air duct (502) is arranged separately from the air outlet (5012) of the first air duct (501) and faces the same direction.

12. The electronic device (100) according to claim 11, characterized by The circuit board (51) comprises a first side edge (513), a second side edge (514), a third side edge (515) and a fourth side edge (516) connected in sequence, the first side edge (513) and the third side edge (515) are arranged oppositely, the second side edge (514) and the fourth side edge (516) are arranged oppositely, and the second side edge (514) is arranged opposite to the air outlet (322) of the shell (30); The air inlet (5011) of the first air duct (501) is located at the first side edge (513), the air inlet (5021) of the second air duct (502) is located at the third side edge (515), and the air outlet (5012) of the first air duct (501) and the air outlet (5022) of the second air duct (502) are both located at the second side edge (514).

13. The electronic device (100) according to claim 1 or 2, characterized in that, Part of the shell (30) covers the first device (52), and the electronic equipment (100) further comprises a filling piece (60) arranged between the inner wall of the shell (30) and the first device (52) and connecting the inner wall of the shell (30) and the first device (52).

14. The electronic device (100) according to claim 13, characterized by The filling piece (60) comprises a first connecting surface (61) and a second connecting surface (62), the first connecting surface (61) is connected to the top surface (521) of the first device (52), and the second connecting surface (62) is connected to the inner wall of the shell (30); the first connecting surface (61) and the second connecting surface (62) are both perpendicular to the first direction. The first connecting surface (61) is rectangular, the length of the first connecting surface (61) is greater than or equal to 2mm, and the width of the first connecting surface (61) is greater than or equal to 2mm; and / or, the second connecting surface (62) is rectangular, the length of the second connecting surface (62) is greater than or equal to 2mm, and the width of the second connecting surface (62) is greater than or equal to 2mm.

15. The electronic device (100) according to claim 13, characterized by The material of the filling piece (60) comprises foam, silica gel or plastic.

16. The electronic device (100) according to claim 1 or 2, characterized by The first device (52) comprises a first sub-device (52a) and a second sub-device (52b), and in the first direction, the distance between the top surface (521a) of the first sub-device (52a) and the top surface (511) of the circuit board (51) is greater than the distance between the top surface (521b) of the second sub-device (52b) and the top surface (511) of the circuit board (51), wherein the top surface (521a) of the first sub-device (52a) and the top surface (521b) of the second sub-device (52b) are both part of the top surface (521) of the first device (52). Along the length extension direction of the first air duct (501), the second sub-device (52b) is located on one side of the first sub-device (52a).

17. The electronic device (100) according to claim 1 or 2, characterized by The first device (52) comprises at least one of a capacitor, an inductor, a connector, a power supply, a fixed hard disk, a memory, a shielding plate and a shielding cover; and the second device (53) comprises at least one of a central processing unit, a graphics processing unit, a memory and an inductor.

18. The electronic device (100) according to claim 1 or 2, characterized by The circuit board (51) is provided with a through hole (5019) penetrating the circuit board (51) along the first direction and communicating with the first air duct (501).

19. The electronic device (100) according to claim 1 or 2, characterized by The electronic equipment (100) comprises a display device (10) and an input device (20), the display device (10) and the input device (20) are connected through a rotating shaft, the shell (30) is a shell of the input device (20), and the air outlet (322) of the shell (30) is located on the side (321) of the shell (30) close to the rotating shaft.

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