Photovoltaic inverter IGBT (Insulated Gate Bipolar Translator) welding device
By designing a photovoltaic inverter IGBT welding device, and utilizing a combination of a support fixture and a pressure cover fixture, the problem of cumbersome IGBT welding operations was solved. This enabled reliable bonding between the IGBT and the heat sink, ensuring heat dissipation performance and welding quality, and improving welding efficiency and product qualification rate.
Patent Information
- Application Number
- CN202520314933.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2035-02-26
AI Technical Summary
In the existing technology, IGBT soldering on PCBA circuit boards is a cumbersome operation, making it difficult to ensure high stability. Poor soldering results in unstable solder strength, leading to poor adhesion between the IGBT and the heat sink. Poor adhesion between the IGBT and the heat sink results in poor heat dissipation performance, and there is also a risk of stress on the soldering pins during the soldering process.
A photovoltaic inverter IGBT welding device was designed, including a PCBA circuit board, a support fixture, and a pressure cover fixture. Through a support and locking mechanism, a height limiting column, a floating pressing mechanism, and a locking and cooperating mechanism, the device ensures that the IGBT and the heat sink are welded at the same height, prevents the circuit board from deforming, and improves welding efficiency and quality.
This achieves reliable bonding between the IGBT and the heat sink, ensuring heat dissipation performance, simplifying the operation process, improving welding efficiency and product qualification rate, preventing circuit board deformation, and enhancing product stability and safety.
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Figure CN223762549U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a photovoltaic inverter IGBT welding device, belonging to the technical field of welding fixtures. Background Technology
[0002] IGBT (Insulated Gate Bipolar Transistor) is a composite, fully controllable, voltage-driven power semiconductor device composed of a BJT (Bipolar Junction Transistor) and a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). It combines the advantages of both MOSFETs (high input impedance) and GTRs (low on-state voltage drop). GTRs have a low saturation voltage drop and high current density, but require a large drive current; MOSFETs have very low drive power and fast switching speed, but a large on-state voltage drop and low current density. IGBTs combine the advantages of both devices, offering low drive power and a low saturation voltage drop. They are ideally suited for applications in DC power conversion systems of 600V and above, such as photovoltaics, AC motors, frequency converters, switching power supplies, lighting circuits, and traction drives. IGBT modules are modular semiconductor products packaged by bridging IGBT chips and FWD (Folded Diode chips) using a specific circuit. The packaged IGBT modules are directly applied to equipment such as frequency converters and UPS (Uninterruptible Power Supply).
[0003] When the IGBT module in a photovoltaic inverter is manufactured, the IGBT needs to be soldered onto the PCBA circuit board. With the increasing demand for photovoltaic inverters and intensifying competition, the requirements for machine safety and stability are becoming increasingly stringent. Heat dissipation of the IGBTs in a photovoltaic inverter is an extremely critical technology. The IGBTs are soldered onto the PCBA and attached to a heat sink for heat dissipation. The stability of the IGBT soldering height is crucial. Too low a height will lead to poor contact between the IGBT and the heat sink, resulting in poor heat dissipation performance; too high a height will cause interference between the IGBT and the heat sink, stress on the soldered pins, and pose a significant risk.
[0004] Currently, the basic welding method involves locking the IGBT onto the heatsink to fix its height before welding it to the PCBA circuit board. This fixing process is difficult and inefficient. Another approach is to pre-lock the PCBA circuit board and the IGBT, but this requires a large number of bolts, which is also cumbersome. Furthermore, during the locking and welding of the PCBA circuit board and the IGBT, relative displacement and deformation can occur, resulting in a low yield rate. Utility Model Content
[0005] The purpose of this invention is to address the shortcomings of the existing technology and to propose a photovoltaic inverter IGBT welding device that solves the problem of cumbersome operation in pre-locking IGBTs on heat sinks and PCBA circuit boards.
[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0007] A photovoltaic inverter IGBT welding device includes a PCBA circuit board and a plurality of IGBTs. The PCBA circuit board is provided with a plurality of circuit board positioning holes and a plurality of loading areas. The loading areas are provided with a plurality of IGBT loading positions for corresponding to the IGBTs, including a support fixture and a cover fixture.
[0008] The support fixture includes a fixture frame. One side of the fixture frame is provided with a support and locking mechanism for supporting and locking the PCBA circuit board, and the other side is provided with a flush abutment plate for flush contact with a plurality of IGBTs. The flush abutment plate is provided with a plurality of height limiting posts for abutting with the PCBA circuit board to limit the welding height of the IGBTs.
[0009] The pressure cover fixture includes a pressure cover plate body for pressing onto the top of the PCBA circuit board. The pressure cover plate body includes a floating pressing mechanism for floatingly pressing the IGBTs, which is arranged one-to-one with the IGBTs, and a pin welding window arranged one-to-one with the loading area.
[0010] The fixture frame and the pressure plate body are provided with an alignment and engagement mechanism for relative alignment and engagement between the fixture frame and the pressure plate body, and a locking and engagement mechanism for relative locking between the fixture frame and the pressure plate body.
[0011] Preferably, the supporting and locking mechanism includes a frame annular recess on the fixture frame for supporting the PCBA circuit board and a plurality of circuit board knobs for locking the PCBA circuit board in the frame annular recess.
[0012] Preferably, the frame annular recess is provided with circuit board positioning posts that correspond one-to-one with the circuit board positioning holes.
[0013] Preferably, the cover plate body is provided with a knob avoidance position for avoiding the circuit board knob.
[0014] Preferably, the main body of the pressure plate is provided with a plurality of anti-deformation spring clips for pressing the PCBA circuit board.
[0015] Preferably, any of the IGBTs is provided with an auxiliary pressure cap, and the auxiliary pressure cap is provided with a positioning pipe post;
[0016] The floating pressing mechanism includes an avoidance ring groove for avoiding the positioning pipe pile and a positioning abutment spring buckle disposed in the avoidance ring groove.
[0017] Preferably, the alignment and mating mechanism includes a plurality of alignment and positioning posts disposed on the bearing fixture and alignment and positioning holes disposed on the main body of the pressure plate, which correspond one-to-one with the alignment and positioning posts.
[0018] Preferably, the locking mechanism includes a plurality of fixture engagement knobs disposed on the bearing fixture and fixture engagement holes disposed on the pressure plate body corresponding one-to-one with the fixture engagement knobs.
[0019] Preferably, the cover plate body is provided with a device avoidance groove for avoiding devices on the PCBA circuit board.
[0020] The beneficial effects of this utility model are mainly reflected in:
[0021] 1. Ensure high soldering requirements for IGBTs and other components, guarantee reliable bonding with the heatsink later, and ensure the product's heat dissipation performance.
[0022] 2. It meets the needs of auxiliary welding, is easy and quick to operate, and improves welding efficiency.
[0023] 3. It can achieve precise positioning and locking of circuit boards, effectively preventing circuit board deformation and significantly improving product quality. Attached Figure Description
[0024] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:
[0025] Figure 1 This is an exploded view of the assembly structure of a photovoltaic inverter IGBT welding device according to this utility model.
[0026] Figure 2 This is a schematic diagram of the exploded assembly structure of a photovoltaic inverter IGBT welding device from another perspective.
[0027] Figure 3 This is a top view schematic diagram of a photovoltaic inverter IGBT welding device according to the present invention.
[0028] Figure 4 This is a schematic diagram of the assembled structure of a photovoltaic inverter IGBT welding device according to this utility model.
[0029] Figure 5 This is a schematic diagram of the assembly structure of a photovoltaic inverter IGBT welding device from another perspective. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0031] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant utility model and not intended to limit the utility model. Furthermore, it should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in the present application can be combined with each other.
[0032] This utility model provides a photovoltaic inverter IGBT welding device, such as Figures 1 to 5 As shown, it includes a PCBA circuit board 1 and several IGBTs 2. The PCBA circuit board 1 is provided with several circuit board positioning holes 11 and several loading areas 12. The loading areas 12 are provided with several IGBT loading positions 120 for corresponding IGBTs.
[0033] In this case, if Figures 1 to 5 As shown, it includes a carrying fixture 3 and a gland fixture 4.
[0034] The support fixture 3 includes a fixture frame 31. One side of the fixture frame 31 is provided with a support and locking mechanism 32 for supporting and locking the PCBA circuit board, and the other side is provided with a flush abutment plate 33 for flush contact with a number of IGBTs. The flush abutment plate 33 is provided with a number of height limiting posts 34 for abutting with the PCBA circuit board to limit the welding height of the IGBTs.
[0035] The pressure cover fixture 4 includes a pressure cover plate body 41 for pressing onto the top of the PCBA circuit board. The pressure cover plate body 41 includes a floating pressing mechanism 42 for floating pressing IGBTs, which is configured one-to-one with the IGBTs, and a pin soldering window 43 configured one-to-one with the loading area.
[0036] The fixture frame 31 and the pressure plate body 41 are provided with a positioning and fitting mechanism 5 for relative positioning and fitting of the fixture frame and the pressure plate body, and a locking and fitting mechanism 6 for relative locking of the fixture frame and the pressure plate body.
[0037] Detailed implementation process and principle explanation:
[0038] During the IGBT welding and assembly operation, the PCBA circuit board 1 is aligned and placed on the fixture frame 31, which is supported on the height limiting column 34 to achieve height limitation and is locked by the support and locking mechanism 32. Then, the IGBT is mounted on the IGBT loading position 120, so that several IGBTs abut against the flush abutment plate 33 to complete the pre-assembly.
[0039] After pre-assembly, the cover body 41 is pressed and mounted on the PCBA circuit board. The alignment mechanism 5 is used for alignment, and the clamping mechanism 6 is used to clamp and lock the PCBA circuit board between the fixture frame and the cover body. At this time, the floating pressing mechanism 42 is used to press the IGBT to ensure that it abuts against the flush abutment plate 33. The pin soldering operation of the IGBT is carried out through the pin soldering window 43.
[0040] In one specific embodiment, the support and locking mechanism 32 includes a frame annular recess 321 disposed on the fixture frame for supporting the PCBA circuit board and a plurality of circuit board knobs 322 for locking the PCBA circuit board in the frame annular recess.
[0041] Specifically, the PCBA circuit board is positioned and mounted by the frame ring recess 321, and the PCBA circuit board is locked in the frame ring recess 321 by turning the circuit board knob 322.
[0042] In one specific embodiment, the frame annular recess 321 is provided with circuit board positioning posts 323 that correspond one-to-one with the circuit board positioning holes 11.
[0043] That is, the circuit board positioning post 323 passes through the circuit board positioning hole 11, thereby realizing the mounting and positioning guidance of the circuit board, making its position accurate and reliable and effectively preventing displacement.
[0044] In one specific embodiment, the cover plate body 41 is provided with a knob avoidance position 410 for avoiding the circuit board knob.
[0045] The knob clearance position 410 design can meet the turning clearance requirements of the circuit board knob 322.
[0046] In one specific embodiment, the cover plate body 41 is provided with a plurality of anti-deformation spring clips 411 for pressing PCBA circuit boards.
[0047] Specifically, the anti-deformation spring clip 411 can prevent large deformation of the PCBA circuit board during the soldering process, thereby ensuring product quality.
[0048] In one specific embodiment, any IGBT has an auxiliary pressure cover 20, and the auxiliary pressure cover is provided with a positioning pipe post.
[0049] The floating pressing mechanism 42 includes a clearance ring groove 421 for avoiding the positioning pipe pile and a positioning abutment spring buckle 422 disposed in the clearance ring groove.
[0050] This satisfies the positioning and fit of the auxiliary pressure cover 20, meets the requirements for alignment accuracy and elastic pressing, ensures that several IGBTs are flush with the flush abutment plate 33, and ensures the position accuracy to guarantee welding quality.
[0051] In one specific embodiment, the alignment and mating mechanism 5 includes a plurality of alignment and positioning posts 51 disposed on the bearing fixture and alignment and positioning holes 52 disposed on the main body of the pressure plate, which are respectively disposed on the alignment and positioning posts.
[0052] The relative position accuracy of the fixture is ensured by the relative engagement of the positioning pin 51 and the positioning hole 52. Of course, other positioning structures can also be used, such as right-angle end positioning. As long as the positioning structure is satisfied, it is within the protection scope of this case.
[0053] In one specific embodiment, the locking mechanism 6 includes a plurality of fixture engagement knobs 61 disposed on the bearing fixture and fixture engagement holes 62 disposed on the pressure plate body corresponding one-to-one with the fixture engagement knobs.
[0054] Specifically, the locking requirement can be met by turning the fixture engagement knob 61 through the fixture engagement hole 62. The loosening operation is easy and convenient. Of course, other locking mechanisms, such as pin locking and buckle locking, can also be used.
[0055] In one specific embodiment, the cover plate body 41 is provided with a device avoidance groove 412 for avoiding devices on the PCBA circuit board.
[0056] That is, the design of the component avoidance groove 412 meets the requirements of the avoidance component and realizes the hollow avoidance fit.
[0057] As described above, this utility model provides a photovoltaic inverter IGBT welding device that ensures the IGBTs meet the same height welding requirements, guarantees reliable bonding with the heat sink later, and ensures the product's heat dissipation performance. It meets auxiliary welding needs, is convenient and quick to operate, and improves welding efficiency. It can achieve precise positioning and locking of the circuit board, effectively preventing circuit board deformation and significantly improving product quality.
[0058] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent in such process, method, article, or apparatus / device.
[0059] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.
Claims
1. A photovoltaic inverter IGBT welding device, comprising a PCBA circuit board and a plurality of IGBTs, the PCBA circuit board being provided with a plurality of circuit board positioning holes and a plurality of loading areas, the loading areas being provided with a plurality of IGBT loading positions for one-to-one loading of the IGBTs, characterized in that: it comprises a bearing jig and a pressing cap jig; the bearing jig comprises a jig frame, one side of the jig frame being provided with a supporting and locking mechanism for supporting and locking the PCBA circuit board, the other side being provided with a flush abutting plate for flush abutting with the plurality of IGBTs, the flush abutting plate being provided with a plurality of height limiting columns for abutting with the PCBA circuit board to limit the welding height of the IGBTs; the pressing cap jig comprises a pressing cap plate body for pressing on the top of the PCBA circuit board, the pressing cap plate body comprising a floating pressing mechanism for floating pressing of the IGBTs corresponding to the IGBTs, and a pin welding window corresponding to the loading area; the jig frame and the pressing cap plate body are provided with a relative position matching mechanism for matching the jig frame and the pressing cap plate body, and a locking mechanism for locking the jig frame and the pressing cap plate body.
2. The photovoltaic inverter IGBT welding device according to claim 1, characterized in that: the supporting and locking mechanism comprises a frame ring recess provided on the jig frame for supporting the PCBA circuit board, and a plurality of circuit board knobs for locking the PCBA circuit board in the frame ring recess.
3. The photovoltaic inverter IGBT welding device according to claim 2, characterized in that: the frame ring recess is provided with a circuit board positioning column corresponding to the circuit board positioning hole.
4. The photovoltaic inverter IGBT welding device according to claim 2, characterized in that: the pressing cap plate body is provided with a knob avoiding position for avoiding the circuit board knob.
5. The photovoltaic inverter IGBT welding device according to claim 1, characterized in that: the pressing cap plate body is provided with a plurality of anti-deformation snap buckles for pressing the PCBA circuit board.
6. The photovoltaic inverter IGBT welding device according to claim 1, characterized in that: any of the IGBTs is provided with an auxiliary pressing cap, the auxiliary pressing cap being provided with a positioning tube stake; the floating pressing mechanism comprises an avoiding ring groove for avoiding the positioning tube stake and a positioning abutting snap buckle provided in the avoiding ring groove.
7. The photovoltaic inverter IGBT welding device according to claim 1, characterized in that: the relative position matching mechanism comprises a plurality of relative position positioning columns provided on the bearing jig and a plurality of relative position positioning holes provided on the pressing cap plate body corresponding to the relative position positioning columns.
8. The photovoltaic inverter IGBT welding device according to claim 1, characterized in that: the locking mechanism comprises a plurality of jig combination knobs provided on the bearing jig and a plurality of jig combination holes provided on the pressing cap plate body corresponding to the jig combination knobs. 9. The photovoltaic inverter IGBT welding device according to any one of claims 1-8, characterized in that: The grommet plate body is provided with a device avoiding groove for avoiding the device on the PCBA circuit board.