Automatic silicon wafer separating and transferring equipment

Abstract

The utility model discloses automatic silicon wafer separating and transferring equipment, which is characterized in that cut silicon wafers are separated from a top support by using a silicon wafer separating assembly, independent silicon wafers are screened and loaded into a second silicon wafer basket by using a silicon wafer feeding assembly, and the silicon wafers are separated from the top support by using the silicon wafer feeding assembly. According to the silicon wafer cleaning, separating, screening, loading and transferring device, the second silicon wafer basket loaded with the silicon wafers is transferred to the next processing procedure, in the production process of the silicon wafers, automatic treatment is used in the whole process, the silicon wafers are cleaned, separated, screened, loaded and transferred, the automation degree is high, manpower resources are saved, and the production efficiency of the silicon wafers is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, and in particular to an automatic silicon wafer separation and transfer device. Background Technology

[0002] With the development of semiconductor technology, the demand for silicon wafers is increasing. Currently, the common method for producing silicon wafers is to cut silicon rods. This involves attaching the silicon rod to a support and placing it in a wafer basket. The silicon rod is then cut. After cutting, the wafer needs to be separated from the support to facilitate further processing. This process involves many steps, and since wafer production typically uses wafer baskets for loading, it requires high-intensity handling. If manual handling is used, it would consume a great deal of manpower. Utility Model Content

[0003] To overcome the above-mentioned shortcomings, the purpose of this utility model is to provide an automatic silicon wafer separation and transfer device. This device uses a silicon wafer separation component to separate the cut silicon wafers from the top support, and a silicon wafer loading component to screen and load the individual silicon wafers into a second silicon wafer basket. The basket loading component then transfers the second silicon wafer basket to the next processing step. The entire silicon wafer production process is automated, completing the cleaning, separation, screening, loading, and transfer of the silicon wafers. This highly automated process saves manpower and significantly improves silicon wafer production efficiency.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: an automatic silicon wafer separation and transfer device, comprising:

[0005] A silicon wafer separation assembly, comprising a spray tank, a degumming tank, and a cleaning tank arranged side-by-side along a second direction;

[0006] A silicon wafer feeding assembly, wherein the silicon wafer feeding assembly and the silicon wafer separation assembly are arranged side by side along a first direction, the silicon wafer feeding assembly includes a silicon wafer transport device and a silicon wafer feeding device, the silicon wafer transport device and the silicon wafer feeding device are arranged side by side along the first direction, the silicon wafer transport device is disposed at one end of the silicon wafer feeding device near the silicon wafer separation assembly, the silicon wafer transport device includes a first conveyor belt extending along the first direction, and the silicon wafer feeding device includes a screening element connected to the first conveyor belt;

[0007] The basket feeding assembly is connected to the silicon wafer feeding assembly. The basket feeding assembly includes a first guide beam, a second guide beam, and a third guide beam. The first guide beam extends along a first direction, the second guide beam extends along a second direction and is disposed on the first guide beam, and the third guide beam extends along a third direction and is disposed on the second guide beam.

[0008] In this technical solution, the silicon wafer separation assembly uses a spray tank to clean the silicon wafer basket, thereby removing dust generated during silicon wafer cutting. It then uses a debinding tank to separate the silicon wafers from the support, and a cleaning tank to clean the debinded silicon wafers. The silicon wafer loading assembly uses a first conveyor belt to transport the loose silicon wafers to the silicon wafer sorting device, and uses a screening device to remove defective silicon wafers. The basket loading assembly uses a first guide beam to allow the second silicon wafer basket, loaded with silicon wafers, to move along the length of the first guide beam. The second guide beam facilitates the movement of the second silicon wafer basket along its length. A third guide beam is used to lift and lower the second silicon wafer basket, completing the transfer process.

[0009] In some embodiments, the automated silicon wafer separation and transfer equipment further includes a basket drive assembly, which is disposed above the silicon wafer separation assembly and the silicon wafer loading assembly. The basket drive assembly includes a first crossbeam, a second crossbeam, and a vertical beam. The first crossbeam extends along a first direction, the second crossbeam extends along a second direction, and the vertical beam extends along a third direction. The second crossbeam is disposed on the first crossbeam, and the vertical beam is connected to the second crossbeam.

[0010] In this technical solution, the flower basket drive assembly is used to drive the first silicon wafer flower basket loaded with the top support, the first crossbeam is used to guide the movement of the first silicon wafer flower basket in a first direction, the second crossbeam is used to guide the movement of the first silicon wafer flower basket in a second direction, and the third crossbeam is used to guide the movement of the second silicon wafer flower basket in a third direction.

[0011] In some embodiments, the flower basket driving assembly further includes a first driving device, a second driving device, and a third driving device, wherein the second driving device is fixedly connected to the third driving device, the second crossbeam is disposed on the first crossbeam via the first driving device, and the vertical beam is disposed on the second crossbeam via the second driving device and the third driving device.

[0012] In this technical solution, the first driving device is used to drive the second crossbeam to move along the length direction of the first crossbeam, the second driving device is used to drive the vertical beam to move along the length direction of the second crossbeam, and the third driving device is used to drive the vertical beam to move along the third direction.

[0013] In some embodiments, the first driving device includes a first driving ruler extending along the length direction of the first crossbeam and a first driving gear engaging with the first driving ruler; the second driving device includes a second driving ruler extending along the length direction of the second crossbeam and a second driving gear engaging with the second driving ruler; and the third driving device includes a third driving ruler extending along the length direction of the vertical beam and a second driving gear engaging with the third driving ruler. The first driving ruler is fixed to the first crossbeam, the second driving ruler is fixed to the second crossbeam, and the third driving ruler is fixed to the vertical beam.

[0014] In this technical solution, the first driving ruler and the first driving gear move along the length direction of the first driving ruler through the movement of the first driving gear. The second driving ruler and the second driving gear move along the length direction of the second driving ruler through the movement of the second driving gear. The third driving ruler and the third driving gear move along their length direction through the movement of the third driving gear.

[0015] In some embodiments, the silicon wafer transport device further includes a loading bin, and the first conveyor belt is disposed inside the loading bin.

[0016] In this technical solution, the loading box is used to load the first silicon wafer basket that is taken out from the top support, thereby placing the silicon wafer on the first conveyor belt, and using the first conveyor belt to transport the silicon wafer to the silicon wafer loading device.

[0017] In some embodiments, the silicon wafer feeding device further includes a basket lifting assembly disposed below the basket feeding assembly and at the end of the screening element away from the first conveyor belt.

[0018] In this technical solution, the basket lifting component is used to lift the second silicon wafer basket, thereby cooperating with the screening component to load the qualified silicon wafers after inspection into the second silicon wafer basket.

[0019] In some embodiments, the basket feeding assembly further includes a fourth drive device, a fifth drive device, and a sixth drive device, wherein the second guide beam is disposed on the first guide beam via the fourth drive device, and the third guide beam is disposed on the second guide beam via the fifth drive device and the sixth drive device.

[0020] In this technical solution, the fourth driving device is used to drive the second guide beam to move along the length direction of the first guide beam, the fifth driving device is used to drive the third guide beam to move along the length direction of the second guide beam, and the sixth driving device is used to drive the third guide beam to move along its length direction.

[0021] In some embodiments, the fourth drive device includes a guide rod extending along a first direction and a drive wheel, the drive wheel having a groove extending along its circumference, the guide rod being engaged with the drive wheel, the fifth drive device including a fifth drive ruler extending along the length direction of the second beam and a fifth drive gear engaged with the fifth drive ruler, and the sixth drive device including a drive track, one end of the drive track being fixed to the fifth drive device.

[0022] In this technical solution, the guide rod is used to guide the movement of the drive wheel, the drive wheel drives the second guide beam to move, the fifth drive device is used to drive the third guide beam to move along the length direction of the second guide beam, and the sixth drive device is used to drive the third guide beam to move along the third direction.

[0023] In some embodiments, the automated silicon wafer separation and transfer equipment further includes a top support conveying assembly disposed on the side of the silicon wafer separation assembly away from the silicon wafer loading assembly, the top support conveying assembly including a plurality of tracks extending along a first direction.

[0024] In this technical solution, after the silicon wafer is separated from the top support, the top support is transported using a top support transport assembly.

[0025] In some embodiments, the automated silicon wafer separation and transfer equipment further includes a silicon wafer impact assembly disposed between the top support conveying assembly and the silicon wafer separation assembly, the silicon wafer impact assembly including an impact end with an upper opening and a side opening.

[0026] In this technical solution, when the silicon wafer and the top support are not fully separated, the silicon wafer impact component is used to impact the first silicon wafer basket that holds the silicon wafer and the top support to separate the silicon wafer and the top support.

[0027] The beneficial effects of this utility model are that by using a silicon wafer separation component to separate the cut silicon wafers from the top support, and using a silicon wafer loading component to screen and load the individual silicon wafers into a second silicon wafer basket, and using a basket loading component to transfer the second silicon wafer basket loaded with silicon wafers to the next processing step, the entire silicon wafer production process is automated, completing the cleaning, separation, screening, loading and transfer of silicon wafers. The degree of automation is high, and it saves manpower, greatly improving the production efficiency of silicon wafers. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention;

[0029] Figure 2 This is a top view schematic diagram of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention;

[0030] Figure 3 This is a top view schematic diagram of the silicon wafer separation component of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of the silicon wafer feeding assembly of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention;

[0032] Figure 5 This is a top view schematic diagram of the silicon wafer feeding device of an automatic silicon wafer separation and transfer equipment according to an embodiment of the present invention;

[0033] Figure 6 This is a schematic diagram of the basket feeding assembly of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention;

[0034] Figure 7 This is a schematic diagram of the connection relationship of the basket feeding assembly of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention;

[0035] Figure 8 This is a schematic diagram of the basket drive assembly of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention;

[0036] Figure 9 This is a schematic diagram of the connection relationship of the basket drive assembly of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention;

[0037] Figure 10 This is a schematic diagram of the silicon wafer impact component of an automatic silicon wafer separation and transfer device according to an embodiment of the present invention;

[0038] In the diagram: 1. Silicon wafer separation module; 11. Spray tank; 12. Degumming tank; 13. Cleaning tank;

[0039] 2. Silicon wafer feeding assembly; 21. Silicon wafer conveying device; 211. First conveyor belt; 212. Feeding box; 22. Silicon wafer feeding device; 221. Screening component; 2211. Arched conveyor device; 2212. Second conveyor belt; 2213. Ejection device; 2214. Detection sensor; 2215. Ejection section; 222. Basket lifting assembly;

[0040] 3. Basket loading assembly; 31. First guide beam; 32. Second guide beam; 33. Third guide beam; 341. Guide rod; 342. Drive wheel; 351. Fifth drive ruler; 352. Fifth drive gear; 361. Drive track;

[0041] 4. Flower basket drive assembly; 41. First crossbeam; 42. Second crossbeam; 43. Vertical beam; 441. First drive ruler; 442. First drive gear; 451. Second drive ruler; 461. Third drive ruler; 462. Second drive gear;

[0042] 5. Top support and handling assembly; 51. Track;

[0043] 6. Silicon wafer impact assembly; 61. Impact end; 62. Collection end; 63. Support frame;

[0044] x, first direction; y, second direction; z, third direction. Detailed Implementation

[0045] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0046] Combined with appendix Figure 1 To be continued Figure 6 As shown, this utility model provides an automatic silicon wafer separation and transfer device, comprising:

[0047] A silicon wafer separation assembly 1 includes a spray tank 11, a degumming tank 12, and a cleaning tank 13 arranged side by side along the second direction y. The spray tank 11 is equipped with a spray pipe, and the degumming tank 12 is equipped with a heating plate for heating the liquid in the degumming tank 12 to improve the degumming efficiency.

[0048] A silicon wafer loading assembly is provided, wherein the silicon wafer loading assembly and the silicon wafer separation assembly are arranged side-by-side along a first direction x. The silicon wafer loading assembly 2 includes a silicon wafer transport device 21 and a silicon wafer loading device 22, which are arranged side-by-side along the first direction x. The silicon wafer transport device 21 is located at one end of the silicon wafer loading device 22 near the silicon wafer separation assembly 1. The silicon wafer transport device 21 includes a first conveyor belt 211 extending along the first direction x. The silicon wafer loading device 22 includes a screening element 221, which includes elements extending along the first direction x. The arched conveyor assembly comprises an arched conveyor 2211, a second conveyor belt 2212, an ejector 2213, a detection sensor 2214, and an ejector section 2215. The upper end of the arched conveyor assembly is connected to the second conveyor belt 2212. The ejector section 2215 is disposed between the two second conveyor belts 2212. The ejector section 2215 and the second conveyor belts 2212 are arranged side by side along the first direction x. The ejector 2213 is disposed below the ejector section 2215. The detection sensor 2214 is communicatively connected to the ejector 2213. The lower end of the arched conveyor 2211 of the screening element 221 is connected to the first conveyor belt 211.

[0049] The basket feeding assembly 3 is connected to the silicon wafer feeding assembly. The basket feeding assembly 3 includes a first guide beam 31, a second guide beam 32 and a third guide beam 33. The first guide beam 31 extends along a first direction x, the second guide beam 32 extends along a second direction y and is disposed on the first guide beam 31, and the third guide beam 33 extends along a third direction z and is disposed on the second guide beam 32.

[0050] The silicon wafer separation assembly 1 cleans the silicon wafer basket using a spray tank 11 to remove dust generated during silicon wafer cutting, separates the silicon wafer from the top support using a degumming tank 12, and cleans the degummed silicon wafer using a cleaning tank 13. The silicon wafer loading assembly transports loose silicon wafers to the silicon wafer sorting device using a first conveyor belt 211, and removes defective silicon wafers using a screening element 221. The basket loading assembly 3 uses a first guide beam 31 to allow the second silicon wafer basket loaded with silicon wafers to move along the length of the first guide beam 31, a second guide beam 32 to facilitate the movement of the second silicon wafer basket along the length of the second guide beam 32, and a third guide beam 33 to lift and lower the second silicon wafer basket, completing the transfer process of the second silicon wafer basket.

[0051] Continue to combine with the appendix Figure 8 As shown, in some embodiments, the automatic silicon wafer separation and transfer equipment further includes a basket drive assembly 4, which is disposed on the upper side of the silicon wafer separation assembly 1 and the silicon wafer loading assembly. The basket drive assembly 4 includes a first crossbeam 41, a second crossbeam 42, and a vertical beam 43. The first crossbeam 41 extends along a first direction x, the second crossbeam 42 extends along a second direction y, and the vertical beam 43 extends along a third direction z. The second crossbeam 42 is disposed on the first crossbeam 41, and the vertical beam 43 is connected to the second crossbeam 42.

[0052] The flower basket drive assembly 4 is used to drive the first silicon wafer flower basket that loads the top support. The first crossbeam 41 is used to guide the movement of the first silicon wafer flower basket along the first direction x. The second crossbeam 42 is used to guide the movement of the first silicon wafer flower basket along the second direction y. The third beam is used to guide the movement of the second silicon wafer flower basket along the third direction z.

[0053] In some embodiments, the flower basket driving assembly 4 further includes a first driving device, a second driving device, and a third driving device, wherein the second driving device is fixedly connected to the third driving device, the second crossbeam 42 is disposed on the first crossbeam 41 via the first driving device, and the vertical beam 43 is disposed on the second crossbeam 42 via the second driving device and the third driving device.

[0054] The first driving device is used to drive the second crossbeam 42 to move along the length direction of the first crossbeam 41, the second driving device is used to drive the vertical beam 43 to move along the length direction of the second crossbeam 42, and the third driving device is used to drive the vertical beam 43 to move along the third direction z.

[0055] Continue to combine with the appendix Figure 9 As shown, in some embodiments, the first driving device includes a first driving ruler 441 extending along the length direction of the first crossbeam 41 and a first driving gear 442 engaging with the first driving ruler 441; the second driving device includes a second driving ruler 451 extending along the length direction of the second crossbeam 42 and a second driving gear 462 engaging with the second driving ruler 451; the third driving device includes a track, a third driving ruler 461 extending along the length direction of the vertical beam 43 and a second driving gear 462 engaging with the third driving ruler 461; the first driving ruler 441 is fixed to the first crossbeam 41; the second driving ruler 451 is fixed to the second crossbeam 42; the third driving ruler 461 is fixed to the vertical beam 43; one end of the track is fixed to the third driving device; and the other end of the track is disposed at the lower end of the vertical beam 43.

[0056] The first drive ruler 441 and the first drive gear 442 move along the length direction of the first drive ruler 441 through the movement of the first drive gear 442. The second drive ruler 451 and the second drive gear 462 move along the length direction of the second drive ruler through the movement of the second drive gear 462. The third drive ruler 461 and the third drive gear move along their length direction through the movement of the third drive gear.

[0057] Continue to combine with the appendix Figure 4 and attached Figure 5 As shown, in some embodiments, the silicon wafer transport device 21 further includes a loading box 212, and the first conveyor belt 211 is disposed in the loading box 212. The loading box 212 is used to load the first silicon wafer basket with the top support, thereby placing the silicon wafer on the first conveyor belt 211 and using the first conveyor belt 211 to transport the silicon wafer to the silicon wafer loading device 22.

[0058] In some embodiments, the silicon wafer loading device 22 further includes a basket lifting assembly 222, which is disposed below the basket loading assembly 3 and at the end of the screening member 221 away from the first conveyor belt 211. The basket lifting assembly 222 is used to lift the second silicon wafer basket, thereby cooperating with the screening member 221 to load the qualified silicon wafers after inspection into the second silicon wafer basket.

[0059] In some embodiments, the basket feeding assembly 3 further includes a fourth driving device, a fifth driving device, and a sixth driving device. The second guide beam 32 is mounted on the first guide beam 31 via the fourth driving device, and the third guide beam 33 is mounted on the second guide beam 32 via the fifth driving device and the sixth driving device.

[0060] The fourth drive device is used to drive the second guide beam 32 to move along the length direction of the first guide beam 31, the fifth drive device is used to drive the third guide beam 33 to move along the length direction of the second guide beam 32, and the sixth drive device is used to drive the third guide beam 33 to move along its length direction.

[0061] Continue to combine with the appendix Figure 7 As shown, in some embodiments, the fourth driving device includes a guide rod 341 extending along a first direction x and a driving wheel 342. The driving wheel 342 is provided with a groove extending along its circumference. The guide rod 341 is engaged with the driving wheel 342. The fifth driving device includes a fifth driving ruler 351 extending along the length direction of the second beam and a fifth driving gear 352 engaged with the fifth driving ruler 351. The sixth driving device includes a driving track 361, one end of which is fixed to the fifth driving device.

[0062] The guide rod 341 is used to guide the movement of the drive wheel 342. The drive wheel 342 drives the second guide beam 32 to move. The fifth drive device is used to drive the third guide beam 33 to move along the length direction of the second guide beam 32. The sixth drive device is used to drive the third guide beam 33 to move along the third direction z.

[0063] Continue to combine with the appendix Figure 1 and attached Figure 2 As shown, in some embodiments, the automatic silicon wafer separation and transfer equipment further includes a top support transport assembly 5. The top support transport assembly 5 is disposed on the side of the silicon wafer separation assembly 1 away from the silicon wafer loading assembly. The top support transport assembly 5 includes a plurality of tracks 51 extending along a first direction x. The trolley can move along the tracks 51. After the silicon wafer is separated from the top support, the top support transport assembly 5 is used to transport the top support.

[0064] Continue to combine with the appendix Figure 1 and attached Figure 10As shown, in some embodiments, the automatic silicon wafer separation and transfer device further includes a silicon wafer impact component 6, which is disposed between the top support transport component 5 and the silicon wafer separation component 1. The silicon wafer impact component 6 includes an impact end 61 with an upper opening and a side opening. When the silicon wafer is not fully separated from the top support, the silicon wafer impact component 6 is used to impact the first silicon wafer basket that loads the silicon wafer and the top support to separate the silicon wafer from the top support. The silicon wafer impact component 6 also includes a collection end 62 and a support frame 63. The collection end 62 is disposed below the impact end 61 and is connected to the support frame 63.

[0065] In summary, this utility model provides an automatic silicon wafer separation and transfer device. It uses a silicon wafer separation component to separate the cut silicon wafers from the top support, and a silicon wafer loading component to screen and load the individual silicon wafers into a second silicon wafer basket. The basket loading component then transfers the second silicon wafer basket to the next processing step. The entire silicon wafer production process is automated, completing the cleaning, separation, screening, loading, and transfer of the silicon wafers. This highly automated process saves manpower and significantly improves silicon wafer production efficiency.

[0066] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A silicon wafer automatic separating and transferring equipment, characterized in that, The utility model relates to a silicon wafer separating assembly, a silicon wafer feeding assembly and a flower basket feeding assembly. The silicon wafer separating assembly comprises a spraying pool, a degumming pool and a cleaning pool arranged side by side along a second direction. The silicon wafer feeding assembly is arranged side by side with the silicon wafer separating assembly along a first direction. The silicon wafer feeding assembly comprises a silicon wafer conveying device and a silicon wafer feeding device.

2. The automatic separating and transferring equipment for silicon wafer according to claim 1, wherein, The silicon wafer conveying device is arranged side by side with the silicon wafer feeding device along the first direction.

3. The automatic separating and transferring apparatus for silicon wafer according to claim 2, wherein, The silicon wafer conveying device is arranged at one end of the silicon wafer feeding device close to the silicon wafer separating assembly.

4. The automatic separating and transferring apparatus for silicon wafer according to claim 3, wherein, The silicon wafer conveying device comprises a first conveying belt extending along the first direction.

5. The apparatus according to claim 1, wherein The silicon wafer feeding device comprises a screening element connected to the first conveying belt.

6. The apparatus according to claim 1, wherein The flower basket feeding assembly comprises a first guide beam, a second guide beam and a third guide beam.

7. The apparatus according to claim 1, wherein The first guide beam extends along the first direction. The second guide beam extends along the second direction. The second guide beam is arranged on the first guide beam. The third guide beam extends along a third direction. The third guide beam is arranged on the second guide beam. The flower basket driving assembly is arranged on the upper side of the silicon wafer separating assembly and the silicon wafer feeding assembly. The flower basket driving assembly comprises a first cross beam, a second cross beam and a vertical beam. The first cross beam extends along the first direction. The second cross beam extends along the second direction. The vertical beam extends along the third direction. The second cross beam is arranged on the first cross beam through the first driving device. The vertical beam is arranged on the second cross beam through the second driving device and the third driving device. The first driving device comprises a first driving ruler extending along the length direction of the first cross beam and a first driving gear engaged with the first driving ruler. The second driving device comprises a second driving ruler extending along the length direction of the second cross beam and a second driving gear engaged with the second driving ruler. The third driving device comprises a third driving ruler extending along the length direction of the vertical beam and a second driving gear engaged with the third driving ruler. The first driving ruler is fixed on the first cross beam. The second driving ruler is fixed on the second cross beam. The third driving ruler is fixed on the vertical beam. The silicon wafer conveying device further comprises a feeding box. The first conveying belt is arranged in the feeding box. The silicon wafer feeding device further comprises a flower basket lifting assembly. The flower basket lifting assembly is arranged on the lower side of the flower basket feeding assembly. The flower basket lifting assembly is arranged at one end of the screening element away from the first conveying belt. The flower basket feeding assembly further comprises a fourth driving device, a fifth driving device and a sixth driving device. The second guide beam is arranged on the first guide beam through the fourth driving device. The third guide beam is arranged on the second guide beam through the fifth driving device and the sixth driving device.

8. The automatic separating and transferring apparatus for silicon wafer according to claim 7, wherein, The fourth driving device comprises a guide rod extending in a first direction and a driving wheel provided with a groove extending along the circumference of the driving wheel, the guide rod is in a clamping connection with the driving wheel, the fifth driving device comprises a fifth driving ruler extending along the length direction of the second beam body and a fifth driving gear in a clamping connection with the fifth driving ruler, and the sixth driving device comprises a driving track fixed at one end to the fifth driving device.

9. The apparatus according to claim 1, wherein The top supporting and carrying assembly is arranged on the side of the silicon wafer separating assembly away from the silicon wafer feeding assembly, and comprises a plurality of tracks extending in a first direction.

10. The apparatus according to claim 9, wherein the apparatus further comprises a plurality of the silicon wafer automatic separating and transferring devices. The silicon wafer impacting assembly is arranged between the top supporting and carrying assembly and the silicon wafer separating assembly, and comprises an impacting end with an open upper end and side face.

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