CFP radiator with efficient heat dissipation

Abstract

The utility model relates to the technical field of CFP radiators, and discloses an efficient radiating CFP radiator which comprises a radiating substrate, a pulsating heat pipe is arranged on the radiating substrate, the pulsating heat pipe and the radiating substrate are integrally formed in a pouring mode, and the pulsating heat pipe extends in the axial direction of the radiating substrate. According to the CFP radiator, the pulsating heat pipe and the radiating substrate are integrally formed in the pouring mode, so that the pulsating heat pipe is arranged in the radiating substrate, the radiating efficiency of the radiating substrate is improved through cooperation of the pulsating heat pipe and the radiating substrate, and then it is ensured that the CFP radiator can dissipate heat stably.

Description

Technical Field

[0001] This utility model relates to the field of CFP heat sink technology, and in particular to a CFP heat sink with high efficiency in heat dissipation. Background Technology

[0002] CFP (Centum Form-factor Pluggable) connectors are optical transceiver modules defined by the CFP MSA protocol organization for 40GE / 100GE applications. With the increasing capacity of communication transmission, traditional transmission technologies can no longer meet the requirements of transmission capacity and speed, especially in data center applications, Internet core nodes, educational institutions, search engines, large websites, and high-performance computing.

[0003] CFP connectors are communication devices based on miniature connectors. They employ high-end optoelectronic devices, which not only support high-speed data transmission but also ensure effective signal transmission and stability. Various performance optimization technologies have been incorporated into the design and manufacturing process of the optical modules, making them widely used in communication equipment.

[0004] Existing CFP connectors mainly consist of a heat dissipation substrate and heat dissipation fins on the heat dissipation substrate working together to dissipate heat from the CFP connector. In today's increasingly frequent information exchange, relying solely on heat dissipation fins is no longer sufficient to meet the heat dissipation requirements of CFP connectors, and therefore improvements are needed. Utility Model Content

[0005] The main objective of this invention is to propose a high-efficiency CFP heat sink, specifically a CFP heat sink with pulsating heat pipes.

[0006] To achieve the above objectives, this utility model proposes a high-efficiency heat dissipation CFP radiator, including a heat dissipation substrate, on which a pulsating heat pipe is disposed, the pulsating heat pipe being integrally cast with the heat dissipation substrate, and the pulsating heat pipe extending along the axial direction of the heat dissipation substrate.

[0007] Specifically, the heat dissipation substrate includes a heat-conducting part and a heat-dissipating part, which are integrally formed, and the area of ​​the heat-dissipating part is larger than the area of ​​the heat-conducting part.

[0008] Specifically, a number of heat dissipation fins are evenly distributed on one side of the heat dissipation part, and the heat dissipation fins are spaced apart from each other.

[0009] Specifically, the pulsating heat pipe is made of stainless steel, the heat dissipation substrate has a reserved opening, the pulsating heat pipe has a refrigerant port, and the refrigerant port extends to the outside of the heat dissipation substrate through the reserved opening.

[0010] Specifically, the heat sink is provided with fixing holes, and the heat sink is connected to external devices by external screws that cooperate with the fixing holes.

[0011] Specifically, the heat-conducting part is provided with a connecting groove, and a connecting platform is provided inside the connecting groove.

[0012] Specifically, the connecting platform is located in the middle of the connecting groove, and the connecting platform is integrally formed with the heat dissipation substrate.

[0013] Specifically, the heat dissipation part is square in shape, the heat conduction part is rectangular in shape, and one side of the heat dissipation part is adjacent to the side of the heat conduction part that has a short side.

[0014] This utility model's technical solution integrates the pulsating heat pipe and the heat dissipation substrate through a casting process, allowing the pulsating heat pipe to be placed inside the heat dissipation substrate. By cooperating with the heat dissipation substrate, the heat dissipation efficiency of the heat dissipation substrate is improved, thereby ensuring that the CFP heat sink can dissipate heat stably. Attached Figure Description

[0015] Figure 1 This is one of the three-dimensional structural schematic diagrams of this utility model.

[0016] Figure 2 This is the second three-dimensional structural schematic diagram of the present invention.

[0017] Figure 3 This is a schematic diagram showing the disassembled state of the heat dissipation substrate and the pulsating heat pipe of this utility model.

[0018] The reference numerals in the attached drawings include: 10, heat dissipation substrate; 11, heat-conducting part; 12, heat dissipation part; 13, heat dissipation fins; 14, connecting groove; 15, connecting platform; 16, fixing hole; 20, pulsating heat pipe; 21, refrigerant port. Detailed Implementation

[0019] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0020] It should be noted that if any directional indication (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial, etc.) is involved in the embodiments of this utility model, the directional indication is only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0021] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0022] like Figures 1 to 2 As shown, a high-efficiency CFP heat sink includes a heat sink substrate 10, on which a pulsating heat pipe 20 is disposed. The pulsating heat pipe 20 is integrally cast with the heat sink substrate 10, and extends along the axis of the heat sink substrate. By integrally casting the pulsating heat pipe 20 with the heat sink substrate 10, the pulsating heat pipe 20 is disposed within the heat sink substrate 10. Through the cooperation between the pulsating heat pipe 20 and the heat sink substrate 10, the heat dissipation efficiency of the heat sink substrate 10 is improved, thereby ensuring stable heat dissipation of the CFP heat sink.

[0023] The heat dissipation substrate 10 includes a heat-conducting part 11 and a heat dissipation part 12, which are integrally formed. The area of ​​the heat dissipation part 12 is larger than that of the heat-conducting part 11. In this embodiment, the heat dissipation substrate 10 is provided with a heat-conducting part 11 and a heat dissipation part 12. The heat-conducting part 11 conducts heat generated during the operation of the optical transceiver module, and the heat dissipation part 12 dissipates the heat in a timely manner, thereby improving the heat dissipation efficiency of the CFP heat sink.

[0024] A plurality of heat dissipation fins 13 are evenly distributed on one side of the heat dissipation section 12, with the heat dissipation fins 13 spaced apart from each other. In this embodiment, heat dissipation fins 13 are provided on the heat dissipation section 12 to accelerate heat dissipation and further improve the heat dissipation effect of the heat dissipation section 12.

[0025] The pulsating heat pipe 20 is made of stainless steel. A pre-drilled opening is provided on the heat dissipation substrate 10, and a refrigerant port 21 is provided on the pulsating heat pipe 20, extending outside the heat dissipation substrate 10 through the pre-drilled opening. In this embodiment, a pre-drilled opening is provided on the heat dissipation substrate 10 to facilitate the extension of the pulsating heat pipe 20 outside the heat dissipation substrate 10. In actual use, it is convenient for operators to fill the pulsating heat pipe 20 with refrigerant through the refrigerant port 21.

[0026] The heat sink has mounting holes 16, and the heat sink is connected to an external device by external screws that engage with the mounting holes 16. In this embodiment, mounting holes 16 are provided on the heat sink to facilitate a stable connection between the heat sink and the external device.

[0027] A connecting groove 14 is provided on the heat-conducting part 11, and a connecting platform 15 is provided inside the connecting groove 14. The connecting platform 15 is located in the middle of the connecting groove 14 and is integrally formed with the heat dissipation substrate 10. In this embodiment, a connecting groove 14 is provided on the heat-conducting part 11, and a connecting platform 15 is provided inside the connecting groove 14, so that external devices can be assembled with the heat dissipation substrate 10 through the connecting platform 15.

[0028] The heat dissipation part 12 is square in shape, and the heat conduction part 11 is rectangular in shape. One side of the heat dissipation part 12 is adjacent to the side of the heat conduction part 11 with a short side.

[0029] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A CFP heat sink with high heat dissipation, comprising a heat dissipation substrate, characterized in that: The pulsating heat pipe is arranged on the heat dissipation base plate and integrally cast with the heat dissipation base plate, extends along the axial direction of the heat dissipation base plate, the heat dissipation base plate comprises a heat conduction part and a heat dissipation part, the heat conduction part and the heat dissipation part are integrally formed, the area of the heat dissipation part is larger than the area of the heat conduction part, a plurality of heat dissipation fins are uniformly arranged on one side of the heat dissipation part, and the heat dissipation fins are arranged at intervals.

2. The CFP heat sink of claim 1, wherein: The pulsating heat pipe is made of stainless steel, the heat dissipation base plate is provided with a reserved port, the pulsating heat pipe is provided with a refrigerant port, and the refrigerant port extends out of the heat dissipation base plate through the reserved port.

3. The CFP heat sink of claim 1, wherein: The heat dissipation base plate is provided with a fixing hole, and the heat dissipation base plate is connected with external equipment through the fixing hole and external screws.

4. The CFP heat sink of claim 1, wherein: The connecting platform is located in the middle of the connecting groove, and the connecting platform is integrally formed with the heat dissipation base plate.

5. The high-efficiency heat-dissipating CFP heat sink of claim 1, wherein: The heat dissipation part is in a square shape, the heat conduction part is in a rectangular shape, and one side of the heat dissipation part is arranged adjacent to one side of the heat conduction part provided with a short side.

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