Supportable radiator

Abstract

The embodiment of the utility model provides a supportable radiator. The supportable radiator comprises a shell, a radiating assembly and a bracket cover, the shell is provided with a containing cavity and a first heat dissipation opening communicated with the containing cavity; the heat dissipation assembly is arranged in the accommodating cavity; the support cover is rotatably arranged on the shell and located on the side, provided with the first heat dissipation opening, of the shell. The support cover can be switched between a storage state and a supporting state through rotation, when the support cover is in the storage state, the support cover covers the first heat dissipation opening, an overflowing opening communicated with the first heat dissipation opening is jointly defined by the support cover and the shell, and when the support cover is in the supporting state, the overflowing opening is communicated with the first heat dissipation opening. And an included angle is formed between the bracket cover and the shell. The radiator provided by the embodiment of the utility model can be used for supporting the electronic equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, in particular to a supportable heat sink. BACKGROUND

[0002] The heat sink is used as a heat dissipation device, which can be fixed outside the shell of electronic equipment to quickly cool and dissipate heat of the electronic equipment.

[0003] The heat sink in the related art is mostly single-function, but when a user watches a video by using the electronic equipment, the user needs to hold the electronic equipment for a long time, and the use feeling is poor. CONTENT OF THE UTILITY MODEL

[0004] Therefore, an embodiment of the present application aims to provide a heat sink capable of supporting an electronic equipment.

[0005] To achieve the above-mentioned purpose, an embodiment of the present application provides a supportable heat sink, comprising:

[0006] A shell having a containing cavity and a first heat dissipation opening in communication with the containing cavity;

[0007] A heat dissipation assembly arranged in the containing cavity;

[0008] A support cover rotatably arranged in the shell, the support cover being located at one side of the shell having the first heat dissipation opening; the support cover is switchable between a storage state and a support state by rotation, when the support cover is in the storage state, the support cover covers the first heat dissipation opening, and together with the shell defines a flow-through opening in communication with the first heat dissipation opening, when the support cover is in the support state, an included angle is formed between the support cover and the shell.

[0009] In an embodiment, the heat sink comprises a fixing seat assembly arranged around the first heat dissipation opening, the fixing seat assembly comprises a fixing seat and a connecting shaft, the connecting shaft is arranged in the fixing seat and the support cover, so that the support cover is rotatably connected with the shell.

[0010] In an embodiment, the shell has a groove in communication with the first heat dissipation opening on the outside, and the fixing seat is arranged in the groove.

[0011] In an embodiment, the support cover comprises an elastic member, the elastic member is in abutment with the support cover, so that the support cover is kept in the support state under the elastic force of the elastic member; and / or,

[0012] When the support cover is in the storage state, the support cover is clamped with the shell.

[0013] In one embodiment, the housing comprises a main shell having the accommodating cavity and a light guide shell having the first heat dissipation opening, the heat dissipation device comprises a decorative lamp assembly arranged in the accommodating cavity, the decorative lamp assembly comprises a lamp plate and lamp beads arranged on the lamp plate, the lamp beads are directed towards the light guide shell, and the support cover is rotationally connected with one of the light guide shell and the main shell.

[0014] In one embodiment, when the support cover is in the storage state, part of the structure of the light guide shell is exposed to the outer circumferential side of the support cover.

[0015] In one embodiment, the heat dissipation assembly comprises a heat dissipation member and a fan, the fan is arranged between the heat dissipation member and the first heat dissipation opening, and is directed towards the first heat dissipation opening.

[0016] In one embodiment, the heat dissipation member has an avoiding cavity directed towards the first heat dissipation opening, and the fan is arranged in the avoiding cavity; and / or,

[0017] The heat dissipation member comprises a heat dissipation main body and a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged at intervals on one side of the heat dissipation main body close to the first heat dissipation opening; and / or,

[0018] The heat dissipation assembly comprises a heat conduction member, the heat conduction member is arranged on the side of the heat dissipation member away from the first heat dissipation opening; and / or,

[0019] The first heat dissipation opening is located on one side of the housing along a first direction, the housing further has a second heat dissipation opening, the second heat dissipation opening is located on at least one side along a second direction perpendicular to the first direction, and part of the heat dissipation member is exposed at the second heat dissipation opening.

[0020] In one embodiment, the heat dissipation device comprises an electric control board arranged in the accommodating cavity and a charging coil electrically connected with the electric control board, the charging coil is located on the side of the heat dissipation assembly away from the first heat dissipation opening.

[0021] In one embodiment, the heat dissipation device comprises a magnetic attraction assembly arranged in the housing, the magnetic attraction assembly is located on the side of the housing away from the first heat dissipation opening;

[0022] The magnetic attraction assembly is exposed to the outside of the housing, the heat dissipation device further comprises an anti-skid sheet, the anti-skid sheet is arranged on the side of the magnetic attraction assembly away from the first heat dissipation opening to shield the magnetic attraction assembly; or,

[0023] The outer casing has a first clearance opening on the side opposite to the first heat dissipation vent, which communicates with the receiving cavity. The heat sink includes an electronic control board disposed in the receiving cavity and a charging coil electrically connected to the electronic control board and located at the first clearance opening. The magnetic attraction component is disposed on the outer periphery of the first clearance opening and exposed to the outside of the outer casing. The heat sink also includes an anti-slip sheet, which is covered at the first clearance opening to shield the first clearance opening and the magnetic attraction component.

[0024] The supportable heat sink of this embodiment has a support cover at the first heat dissipation port. The support cover can be rotated to switch between a retracted state and a supported state. When the support cover is in the supported state, an angle is formed between the support cover and the outer shell, so that the support cover and the outer shell can be stably placed on a horizontal surface, forming a triangular support structure. Therefore, the heat sink of this embodiment can be supported on a horizontal surface when used with electronic devices. Attached Figure Description

[0025] Figure 1 This is an exploded view of a heat sink according to an embodiment of this application;

[0026] Figure 2 for Figure 1 The radiator shown is a cross-sectional view, with the bracket cover in a retracted state.

[0027] Figure 3 for Figure 1 The diagram shows the structure of the radiator.

[0028] Figure 4 for Figure 1 The diagram shows the structure of a radiator, which is in a supported state.

[0029] Figure 5 for Figure 1 The diagram shows the structure of the heat dissipation back clip, with the heat sink in a retracted state.

[0030] Explanation of reference numerals in the attached figures:

[0031] 10, housing; 10a, accommodating cavity; 10b, first heat dissipation opening; 10c, second heat dissipation opening; 10d, groove; 10e, first avoiding opening; 10f, second avoiding opening; 10g, mounting groove; 10h, flow passage; 11, main housing; 12, light guide housing; 13, clamping block; 20, heat dissipation assembly; 21, heat dissipation member; 21a, avoiding cavity; 211, heat dissipation main body; 212, heat dissipation fin; 22, fan; 23, heat conduction member; 30, support cover; 31, cover body; 32, buckle; 40, fixing seat assembly; 41, fixing seat; 42, connecting shaft; 50, elastic member; 60, decorative lamp assembly; 61, lamp plate; 62, lamp bead; 70, electric control board; 80, charging coil; 90, magnetic attraction assembly; 100, anti-skid piece. DETAILED DESCRIPTION

[0032] In the description of the embodiments of the present application, it should be noted that the terms "first direction", "second direction" are based on the orientation or positional relationship shown in the drawings. These orientation terms are only for the convenience of describing the embodiments of the present application and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. Figure 2 The orientation terms are only for the convenience of describing the embodiments of the present application and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0033] The present application provides a supportable heat dissipation device. Please refer to Figures 1 to 5 The heat dissipation device includes a housing 10, a heat dissipation assembly 20 and a support cover 30.

[0034] The housing 10 has an accommodating cavity 10a and a first heat dissipation opening 10b in communication with the accommodating cavity 10a, and the heat dissipation assembly 20 is arranged in the accommodating cavity 10a.

[0035] The support cover 30 is rotatably arranged in the housing 10, and the support cover 30 is located on the side of the housing 10 having the first heat dissipation opening 10b. The support cover 30 can be switched between a storage state and a support state by rotation. When the support cover 30 is in the storage state, the support cover 30 covers the first heat dissipation opening 10b and cooperates with the housing 10 to define a flow passage 10h in communication with the first heat dissipation opening 10b. When the support cover 30 is in the support state, an included angle is formed between the support cover 30 and the housing 10.

[0036] The accommodating cavity 10a is used to accommodate the heat dissipation assembly 20, and the first heat dissipation opening 10b is an outlet for the heat dissipation assembly 20 to discharge heat.

[0037] The support cover 30 is used to provide support for the heat dissipation device. Please refer to Figure 4When the support cover 30 is in the supporting state, the electronic device is used in cooperation with the heat sink, the heat sink can be used as a support of the electronic device, that is, when the heat sink is placed on a horizontal plane, an included angle is formed between the support cover 30 and the shell 10, and the shell 10 and the support cover 30 are both in contact with the horizontal plane, so that the support cover 30 and the shell 10 form a stable triangular support structure.

[0038] Please refer to Figure 5 When the support cover 30 is in the storage state of covering the first heat dissipation opening 10b, the support cover 30 and the shell 10 jointly define a flow opening 10h in communication with the first heat dissipation opening 10b, that is, the support cover 30 in the storage state does not block the first heat dissipation opening 10b, and the first heat dissipation opening 10b can be in communication with the outside through the flow opening 10h, that is, the heat dissipation assembly 20 can discharge heat through the first heat dissipation opening 10b and the flow opening 10h in sequence.

[0039] In order to facilitate the user to use, the side of the shell 10 away from the support cover 30 can be a contact surface of the heat sink in contact with the electronic device, that is, when the heat sink is used in cooperation with the electronic device, the support cover 30 is located on the side of the heat sink away from the electronic device, and when the support cover 30 is switched from the storage state to the supporting state, the support cover 30 rotates in the direction away from the electronic device. In another embodiment, the contact surface can also be arranged at other positions.

[0040] The supportable heat sink of the embodiment of the present application is provided with a support cover 30 at the first heat dissipation opening 10b, and the support cover 30 can be switched between the storage state and the supporting state through rotation, and when the support cover 30 is in the supporting state, an included angle is formed between the support cover 30 and the shell 10, so that the support cover 30 and the shell 10 can be stably placed on a horizontal plane to form a triangular support structure. Therefore, when the heat sink is used in cooperation with the electronic device, the heat sink can be supported on the horizontal plane.

[0041] In an embodiment, please refer to Figure 1 and Figure 2 The heat sink can include a fixing seat assembly 40 arranged on the periphery of the first heat dissipation opening 10b, and the fixing seat assembly 40 includes a fixing seat 41 and a connecting shaft 42, and the connecting shaft 42 is arranged through the fixing seat 41 and the support cover 30, so that the support cover 30 is rotationally connected with the shell 10.

[0042] The fixing seat assembly 40 is used for connecting the shell 10 and the support cover 30.

[0043] The fixing seat 41 is fixed to the shell 10, and the support cover 30 is rotationally connected with the fixing seat 41 through the connecting shaft 42, so as to realize the rotational connection with the shell 10.

[0044] Exemplarily, please refer to Figure 2 and Figure 3The outer part of the shell 10 can have a groove 10d in communication with the first heat dissipation opening 10b, and the fixing seat 41 is arranged in the groove 10d. By arranging the fixing seat 41 in the groove 10d, the size of the heat dissipation device can be reduced, and the structure of the heat dissipation device is more compact. In an embodiment, please refer to Figure 1 The bracket cover 30 can include an elastic member 50 abutting against the bracket cover 30 to keep the bracket cover 30 in the supporting state under the elastic force of the elastic member 50. That is, the elastic member 50 can keep the bracket cover 30 in the supporting state stably to improve the user experience.

[0045] The type of the elastic member 50 is not limited, and exemplarily, the elastic member 50 can be a torsion spring. For the embodiment in which the heat dissipation device includes the fixing seat assembly 40, the torsion spring can be sleeved on the connecting shaft 42 and abut against the fixing seat 41 and the bracket cover 30 respectively. When the bracket cover 30 is in the storage state, the torsion spring is compressed, and when the bracket cover 30 is switched from the storage state to the supporting state, the torsion spring releases the elastic deformation to keep the bracket cover 30 in the supporting state stably.

[0046] In an embodiment, Figure 2 When the bracket cover 30 is in the storage state, the bracket cover 30 can be clamped with the shell 10 to keep the bracket cover 30 in the storage state, which is convenient for the user to store.

[0047] Exemplarily, please refer to Figure 2 and Figure 3 The outer side of the shell 10 has two clamping blocks 13 arranged at intervals, the bracket cover 30 includes a buckle 32 and a cover body 31 covering the first heat dissipation opening 10b, the buckle 32 is located on the side of the cover body 31 close to the first heat dissipation opening 10b, and the buckle 32 is clamped between the two clamping blocks 13 to realize the clamping of the bracket cover 30 with the shell 10. In an embodiment, please refer to Figure 1 and Figure 2 The shell 10 can include a main shell 11 having a receiving cavity 10a and a light guide shell 12 having a first heat dissipation opening 10b, and the heat dissipation device further includes a decorative lamp assembly 60 arranged in the receiving cavity 10a. The decorative lamp assembly 60 includes a lamp plate 61 and lamp beads 62 arranged on the lamp plate 61, and the light emitting surface of the lamp beads 62 faces the light guide shell 12, so that the light guide shell 12 can transmit the light emitted by the lamp beads 62.

[0048] The decorative lamp assembly 60 can be used to prompt the working state of the heat dissipation device, or can be used to decorate the heat dissipation device to meet the individual needs of the user. The light guide shell 12 can guide the light emitted by the lamp beads 62, so that the user can determine the working state of the heat dissipation device through the on-off of the lamp beads 62.

[0049] The arrangement mode of the main shell 11 and the light guide shell 12 is not limited, and exemplarily, please refer to Figure 1 and Figure 2The main shell 11 can have a second avoiding opening 10f in communication with the accommodating cavity 10a, the light guide shell 12 is arranged in the accommodating cavity 10a, and the second avoiding opening 10f avoids the first heat dissipation opening 10b. The light emitted by the lamp beads can be emitted through the area of the second avoiding opening 10f exposed by the light guide shell 12.

[0050] The support cover 30 is arranged on the shell 10 in a manner not limited, and exemplarily, please refer to Figure 2 The support cover 30 is rotatably connected with the light guide shell 12, and in another embodiment, the support cover 30 can also be rotatably connected with the main shell 11.

[0051] Exemplarily, please refer to Figure 2 and Figure 3 When the support cover 30 is in the storage state, part of the structure of the light guide shell 12 can be exposed to the outer circumferential side of the support cover 30. That is, when the support cover 30 is arranged on the first heat dissipation opening 10b, the support cover 30 does not completely shield the light guide shell 12, and the user can observe the light emitted by the lamp beads from the area of the light guide shell 12 not shielded by the support cover 30. Therefore, even when the support cover 30 is in the storage state, the light guide function of the light guide shell 12 will not be affected.

[0052] In an embodiment, please refer to Figures 1 to 3 The heat dissipation assembly 20 includes a heat dissipation piece 21 and a fan 22, the fan 22 is arranged between the heat dissipation piece 21 and the first heat dissipation opening 10b, and the fan 22 blows air towards the first heat dissipation opening 10b.

[0053] The heat dissipation piece 21 is used for heat dissipation of the electronic device. When the heat dissipation piece 21 is in contact with the electronic device, the heat generated by the electronic device is transferred to the heat dissipation piece 21, and the heat dissipation piece 21 exchanges heat with the air to complete the heat dissipation of the electronic device.

[0054] The material of the heat dissipation piece 21 is not limited, and preferably, the heat dissipation piece 21 can be made of aluminum. The heat dissipation piece 21 made of aluminum has high thermal conductivity, can quickly conduct heat out, and the density of aluminum is relatively low, which can reduce the weight of the heat dissipation piece 21.

[0055] The fan 22 is used to improve the efficiency of heat dissipation of the heat dissipation piece 21. The fan 22 blows air towards the first heat dissipation opening 10b, which can improve the heat dissipation efficiency of the heat dissipation piece 21.

[0056] When the support cover 30 is in the storage state, the support cover 30 is arranged on the first heat dissipation opening 10b. In order to ensure that the heat dissipation piece 21 still has good heat dissipation effect when the support cover 30 is arranged on the first heat dissipation opening 10b, a second heat dissipation opening 10c can be arranged on the shell 10. Exemplarily, please refer to Figures 1 to 3 , Figure 5The first heat dissipation opening 10b can be located on one side of the housing 10 along a first direction, and the second heat dissipation opening 10c can be located on at least one side of the housing 10 along a second direction perpendicular to the first direction. A portion of the heat dissipation member 21 is exposed at the second heat dissipation opening 10c. That is, heat of the heat dissipation member 21 can be dissipated from both the first heat dissipation opening 10b and the second heat dissipation opening 10c.

[0057] For example, referring to Figure 3 The heat dissipation member 21 can have an avoiding cavity 21a with an opening facing the first heat dissipation opening 10b. The fan 22 is arranged in the avoiding cavity 21a, which can reduce the thickness of the heat dissipation member 21 and improve the user experience.

[0058] For example, referring to Figure 2 and Figure 3 The heat dissipation member 21 includes a heat dissipation body 211 and a plurality of heat dissipation fins 212. The plurality of heat dissipation fins 212 are arranged at intervals on one side of the heat dissipation body 211 close to the first heat dissipation opening 10b.

[0059] The plurality of heat dissipation fins 212 can increase the contact area between the heat dissipation member 21 and the air, thereby improving the heat dissipation effect. For the embodiment in which the housing 10 includes the second heat dissipation opening 10c, the gap between two adjacent heat dissipation fins 212 can be aligned with the second heat dissipation opening 10c, that is, the gap is in communication with the second heat dissipation opening 10c, which can further improve the heat dissipation effect of the heat dissipation member 21.

[0060] For example, referring to Figure 1 and Figure 2 The heat dissipation assembly 20 can include a heat conduction member 23 arranged on the side of the heat dissipation member 21 away from the first heat dissipation opening 10b. That is, when the electronic device contacts the contact surface on the side of the housing 10 away from the first heat dissipation opening 10b, the heat conduction member 23 is closer to the electronic device than the heat dissipation member 21.

[0061] The heat conduction member 23 is used to improve the heat conduction efficiency between the electronic device and the heat dissipation member 21, so that heat can be more effectively conducted from the electronic device to the heat dissipation member 21.

[0062] The type of the heat conduction member 23 is not limited. For example, the heat conduction member 23 can be a heat-conducting silicone grease, which has high heat conductivity and high-temperature stability to ensure continuous and effective heat dissipation effect.

[0063] In an embodiment, referring to Figure 1 and Figure 2 The heat dissipation member can include an electric control board 70 arranged in the accommodating cavity 10a and a charging coil 80 electrically connected to the electric control board 70. The charging coil 80 is located on the side of the heat dissipation assembly 20 away from the first heat dissipation opening 10b.

[0064] The charging coil 80 is used for wireless charging of the electronic device arranged on the heat sink. After the power is turned on, the electric control board 70 is energized to make the charging coil 80 generate a magnetic field, and a certain current is generated in the coil of the electronic device through electromagnetic induction, so that the electric energy can be transferred from the charging coil 80 to the electronic device.

[0065] The setting position of the charging coil 80 is not limited, and exemplarily, please refer to Figure 1 The side of the shell 10 away from the first heat dissipation opening 10b has a first avoiding opening 10e in communication with the accommodating cavity 10a, and the charging coil 80 is located at the first avoiding opening 10e. The heat sink further comprises an anti-skid sheet 100, which is arranged at the first avoiding opening 10e to shield the first avoiding opening 10e.

[0066] The first avoiding opening 10e not only can play a limiting role for the charging coil 80 to prevent the charging coil 80 from loosening and moving, but also can make the coil more close to the electronic device to improve the charging stability and charging efficiency.

[0067] The anti-skid sheet 100 not only can protect the charging coil 80 at the first avoiding opening 10e, but also can increase the friction force when the electronic device contacts the heat sink, so that the electronic device is not easy to slide.

[0068] The material of the anti-skid sheet 100 is not limited, and exemplarily, the anti-skid sheet 100 can be made of silica gel.

[0069] For the embodiment in which the heat dissipation assembly 20 comprises the heat conduction piece 23, the heat conduction piece 23 can be located between the charging coil 80 and the heat dissipation piece 21, that is, the heat conduction piece 23 is located in the projection plane of the first avoiding opening 10e along the direction perpendicular to the first direction. The heat generated by the electronic device will be conducted to the heat conduction piece 23 through the charging coil 80, and at the same time, the heat generated by the charging coil 80 when working can also be transmitted to the heat dissipation piece 21 through the heat conduction piece 23, so as to realize heat dissipation.

[0070] In an embodiment, please refer to Figure 1 and Figure 2 The heat sink can comprise a magnetic attraction assembly 90 arranged on the shell 10, and the magnetic attraction assembly 90 is located on the side of the shell 10 away from the first heat dissipation opening 10b. When the electronic device contacts the heat sink, the magnetic attraction assembly 90 located on the side of the shell 10 away from the first heat dissipation opening 10b can be relatively close to the electronic device, so as to ensure that the magnetic attraction assembly 90 and the electronic device have good adsorption force. When the electronic device is close, the magnetic attraction assembly 90 can quickly adsorb and fix the electronic device on the heat sink.

[0071] The magnetic attraction assembly 90 is not limited in position and can be arranged in the accommodating cavity 10a or on the outside of the shell 10.

[0072] Exemplarily, please refer toFigure 1 And Figure 2 The magnetic assembly 90 can be exposed outside the shell 10, and the heat sink further comprises an anti-skid sheet 100 covering the side of the magnetic assembly 90 away from the first heat dissipation opening 10b to shield the magnetic assembly 90.

[0073] The anti-skid sheet 100 shields the magnetic assembly 90, which can protect the magnetic assembly 90 and prevent the magnetic assembly 90 from falling off the shell 10.

[0074] Referring to Figure 1 And Figure 2 The side of the shell 10 away from the accommodating cavity 10a has a mounting groove 10g, and the magnetic assembly 90 is arranged in the mounting groove 10g, and the anti-skid sheet 100 covers the mounting groove 10g to ensure the flatness of the heat sink.

[0075] For the heat sink comprising the electric control board 70 and the charging coil 80, the shell 10 has a first avoiding opening 10e, referring to Figure 1 The magnetic assembly 90 is arranged at the outer circumferential side of the first avoiding opening 10e and is exposed outside the shell 10, and the anti-skid sheet 100 covers the side of the magnetic assembly 90 away from the first heat dissipation opening 10b to shield the magnetic assembly 90.

[0076] That is, the magnetic assembly 90 is arranged at the outer circumferential side of the charging coil 80, so that the magnetic assembly 90 avoids the magnetic field generated by the charging coil 80 to avoid interference of the magnetic assembly 90 to the charging coil 80, thereby improving the charging effect. At the same time, the magnetic assembly 90 is arranged at the outer circumferential side of the first avoiding opening 10e, which can realize accurate positioning of the electronic device.

[0077] In the description of the present application, the description of the terms "in an embodiment", "in some embodiments", "in another embodiment", "in yet another embodiment", or "exemplary" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the exemplary description of the above terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.

[0078] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application is included in the protection scope of the present application.

Claims

1. A supportable heat sink, comprising: The heat dissipation device comprises: a housing having a receiving cavity and a first heat dissipation opening in communication with the receiving cavity; a heat dissipation assembly arranged in the receiving cavity; a support cover rotatably arranged on the housing, the support cover being located on the side of the housing having the first heat dissipation opening; the support cover can be switched between a storage state and a support state by rotation; when the support cover is in the storage state, the support cover covers the first heat dissipation opening and cooperates with the housing to define a flow opening in communication with the first heat dissipation opening; when the support cover is in the support state, an included angle is formed between the support cover and the housing.

2. The heat spreader of claim 1, wherein, The heat dissipation device comprises a fixing seat assembly arranged on the periphery of the first heat dissipation opening, the fixing seat assembly comprising a fixing seat and a connecting shaft, the connecting shaft being arranged through the fixing seat and the support cover to rotatably connect the support cover and the housing.

3. The heat sink of claim 2, wherein, The housing has a groove on the outside in communication with the first heat dissipation opening, and the fixing seat is arranged in the groove.

4. The heat sink of any one of claims 1-3, wherein, The support cover comprises an elastic member abutting against the support cover to keep the support cover in the support state under the elastic force of the elastic member. When the support cover is in the storage state, the support cover is clamped with the housing. The housing comprises a main shell having the receiving cavity and a light guide shell having the first heat dissipation opening; the heat dissipation device comprises a decorative light assembly arranged in the receiving cavity, the decorative light assembly comprising a light plate and lamp beads arranged on the light plate, the lamp beads facing the light guide shell; the support cover is rotatably connected with one of the light guide shell and the main shell.

5. The heat sink of any one of claims 1-3, wherein, When the support cover is in the storage state, part of the structure of the light guide shell is exposed to the periphery of the support cover.

6. The heat sink of claim 5, wherein, The heat dissipation assembly comprises a heat dissipation member and a fan, the fan being arranged between the heat dissipation member and the first heat dissipation opening and facing the first heat dissipation opening.

7. The heat sink of any one of claims 1-3, wherein, The heat dissipation member has an avoiding cavity facing the first heat dissipation opening, and the fan is arranged in the avoiding cavity.

8. The heat sink of claim 7, wherein, The heat dissipation member comprises a heat dissipation main body and a plurality of heat dissipation fins, the plurality of heat dissipation fins being arranged at intervals on the side of the heat dissipation main body close to the first heat dissipation opening. The heat dissipation assembly comprises a heat conduction member arranged on the side of the heat dissipation member away from the first heat dissipation opening. The first heat dissipation opening is located on the side of the housing along a first direction, and the housing further has a second heat dissipation opening located on at least one side along a second direction perpendicular to the first direction, and part of the heat dissipation member is exposed at the second heat dissipation opening. The heat dissipation device comprises an electric control board arranged in the receiving cavity and a charging coil electrically connected with the electric control board, the charging coil being located on the side of the heat dissipation assembly away from the first heat dissipation opening. The heat dissipation device comprises a magnetic attraction assembly arranged on the housing, the magnetic attraction assembly being located on the side of the housing away from the first heat dissipation opening.

9. The heat sink of any one of claims 1-3, wherein, ​ 10. The heat sink of any one of claims 1-3, wherein, ​ The magnetic attraction assembly is exposed outside the shell, and the heat sink further comprises an anti-skid sheet covering a side of the magnetic attraction assembly away from the first heat dissipation opening to shield the magnetic attraction assembly; or A side of the shell away from the first heat dissipation opening has a first avoiding opening in communication with the accommodating cavity, the heat sink comprises an electric control board arranged in the accommodating cavity and a charging coil electrically connected with the electric control board and located at the first avoiding opening, the magnetic attraction assembly is arranged at a peripheral side of the first avoiding opening and exposed outside the shell, and the heat sink further comprises an anti-skid sheet covering the first avoiding opening to shield the first avoiding opening and the magnetic attraction assembly.

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