Sorting machine for semiconductor testing
The cylinder-driven clamping, collecting, and cleaning mechanism solves many of the shortcomings of traditional semiconductor testing equipment, enabling stable clamping, automated collection, and cleaning of semiconductors of different sizes, thus improving the accuracy and efficiency of testing.
Patent Information
- Application Number
- CN202423289769.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Traditional semiconductor testing equipment has limited functionality and is difficult to adapt to semiconductors of different sizes and shapes. It is prone to shaking during testing, and subsequent steps rely on manual operation, which is inefficient and easily introduces impurities. The electrode connections are rudimentary and make it difficult to accurately determine the semiconductor's pressure state.
The device employs a cylinder-driven clamping mechanism, a collection mechanism, and a cleaning mechanism. The clamping mechanism achieves stable clamping through the cooperation of a push rod and a pivot rod. The collection mechanism achieves automatic collection by using a cylinder to return to its original position. The cleaning mechanism removes impurities through airflow. The electrode system determines the semiconductor's pressure state through the precise connection between the pressure rod and the electrode.
It achieves stable clamping of semiconductors of different sizes, automated collection and cleaning, improves the accuracy and efficiency of pressure testing, ensures a clean testing environment, accurately captures the moment when semiconductors are under pressure, and reduces errors.
Smart Images
Figure CN223772454U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor testing, especially relates to a semiconductor test sorting machine. BACKGROUND
[0002] As the core component of various electronic products, the quality and performance of semiconductor components are crucial. With the development of semiconductor technology towards higher precision and higher power, semiconductor components are facing increasingly complex stress environments in actual working scenarios. Whether it is the mechanical pressure in the chip packaging process or the semiconductor components in some special application fields such as high temperature and high pressure environment in power electronic devices, the ability to withstand pressure directly affects the reliability and stability of the entire system. Once the semiconductor is damaged within the normal working pressure range, it may cause the entire electronic product to fail, causing serious economic losses and even safety hazards. Therefore, accurately detecting the pressure of the semiconductor becomes a necessary means to ensure the quality of semiconductor products and the safety of downstream applications.
[0003] Traditional semiconductor pressure detection devices have many shortcomings. Traditional devices often focus on single pressure testing function, lack effective integration with other key testing processes. For example, when fixing semiconductor components, simple rigid clamps are often used, which is difficult to adapt to different sizes and shapes of semiconductors, and is easy to cause the semiconductor to shake during testing, affecting the accuracy of pressure testing. Moreover, after testing, the collection and cleaning of tested semiconductors usually rely on manual operation, which is low in efficiency and easy to introduce impurities, interfering with subsequent testing. Furthermore, the electrode connection of the traditional detection device is relatively simple, and the pressure detection system cannot accurately judge the real-time working state of the semiconductor during pressure, making it difficult to accurately capture the moment when the semiconductor is crushed, resulting in large test result errors. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a semiconductor test sorting machine to solve the problems of inaccurate pressure testing, inconvenient sample fixing and processing during semiconductor testing and sorting.
[0005] The utility model realizes the following technical scheme:
[0006] The application discloses a semiconductor testing sorting machine, which comprises a machine body, a cylinder arranged on the machine body, a placing table arranged in the machine body and used for placing the semiconductor, a clamping mechanism arranged in the machine body and used for clamping and limiting the semiconductor, the clamping mechanism working in the process of the cylinder shaft moving towards the semiconductor, a collecting mechanism arranged on the placing table and used for collecting the tested semiconductor, the collecting mechanism making the tested semiconductor slide off the placing table in the process of the cylinder shaft returning, and a cleaning mechanism arranged in the machine body and used for removing impurities, the cleaning mechanism generating air flow on the area where the semiconductor is placed in the process of the cylinder shaft returning.
[0007] Preferably, the clamping mechanism comprises a push rod arranged at the outer end of the cylinder shaft, a pressing rod coaxial with the cylinder shaft arranged on the push rod, the pressing rod being hollow, the inner diameter of the pressing rod matching the outer diameter of the cylinder shaft, one end of the pressing rod being connected to the push rod, and the other end of the pressing rod being provided with a first electrode; a first spring connecting the push rod and the cylinder is arranged between the push rod and the cylinder, one end of the push rod being connected to the pressing rod, and the other end of the push rod being connected with a push head; two opposite side walls of the placing table are provided with openings, the inner wall of each opening is provided with a fixed shaft, each pivot rod is provided with a hole matching the fixed shaft, one end of each pivot rod is provided with a straight plate, and the other end of each pivot rod is provided with a chuck used for clamping the semiconductor; when the cylinder shaft moves towards the placing table, the push head acts on the straight plate through the first spring, the push rod and the push head, and then drives the pivot rod to rotate around the fixed shaft, so that the chucks on both sides move towards the position directly above the placing table.
[0008] Preferably, the collecting mechanism comprises a top plate hinged to the side wall of the placing table; when the push head moves away from the straight plate, the top plate is lifted, the top plate moves around the hinge point, and the tested semiconductor slides off the top plate.
[0009] Preferably, a slot is arranged on the machine body, the cleaning mechanism comprises a movable plate arranged in the machine body, the end of the movable plate is arranged in the slot, a second spring connecting the inner wall of the slot and the movable plate is arranged in the slot, an air bag is arranged on the movable plate, a nozzle in communication with the inside of the air bag is arranged on the side of the air bag close to the top plate, and a fixed plate is arranged on the push rod; when the cylinder shaft returns upwards, the fixed plate acts on the air bag, air in the air bag is squeezed out from the nozzle, and the air acts on the surface of the top plate to blow away the impurities generated in the testing process.
[0010] Preferably, the cleaning mechanism is arranged on both sides of the push rod in the direction of the axis of the push rod.
[0011] Preferably, one end of the push head is connected to the push rod, and a rubber sleeve is sleeved on the other end of the push head.
[0012] Preferably, a hemispherical groove is arranged on the top plate, and the center point of the groove coincides with the axis of the pressing rod; a second electrode and a pressure sensor are further arranged below the groove and inside the top plate.
[0013] Preferably, a sliding table is further arranged in the machine body, and a baffle is arranged on the sliding table.
[0014] Preferably, the axis of the push head is parallel to the axis of the top plate.
[0015] Preferably, a connecting plate is arranged on each of the two pivot rods, and a third spring connecting the two connecting plates is arranged between the two connecting plates, so that the two clamps have a tendency to move away from the groove when the third spring is in an initial state.
[0016] Compared with the prior art, the utility model has the following advantages and beneficial effects: the cylinder configured in the machine body is used as a power source, and can stably drive subsequent actions. When testing, the clamping mechanism operates synchronously with the cylinder shaft pressing the semiconductor, and by means of the ingenious connection of the push rod and the pivot rod and the clamps arranged according to the opening of the side wall of the placing table, various sizes of semiconductors can be flexibly dealt with, firmly clamped, and shaking is eliminated, so that the pressure test data is accurate and reliable; after testing, the push head in the collecting mechanism is lifted to the hinged top plate, and the measured semiconductor slides down under the action of gravity, greatly improving the collection rate; at the same time, the cleaning mechanism generates airflow during the cylinder return, timely removes impurities in the test area, ensures that the test environment is always clean, and is beneficial to subsequent continuous and efficient testing. BRIEF DESCRIPTION OF DRAWINGS
[0017] The drawings described herein are used to provide further understanding of the embodiments of the utility model and form part of the application, and do not constitute limitation on the embodiments of the utility model. In the drawings:
[0018] Figure 1 It is a whole structure schematic view of the utility model;
[0019] Figure 2 It is a front view structure diagram of the utility model;
[0020] Figure 3 It is a clamping mechanism schematic view of the utility model, and is used to show the clamping process of the pivot rod to the semiconductor;
[0021] Figure 4The schematic view of the collecting mechanism and the cleaning mechanism of the utility model is aimed at showing the process that the tested semiconductor is lifted and falls and cleaned in the test area;
[0022] Figure 5 The schematic view of the first electrode, the semiconductor and the second electrode forming a loop of the utility model;
[0023] Figure 6 The relative position schematic view of the push rod, the pressing rod, the push head and the fixed plate of the utility model;
[0024] Figure 7 For Figure 1 The enlarged view of A of the utility model;
[0025] Figure 8 The structure schematic view of the utility model's storage table.
[0026] The represented by the reference signs are:
[0027] 1, the machine body, 11, the slot,
[0028] 2, the cylinder, 21, the cylinder shaft,
[0029] 3, the pressing rod, 31, the first spring, 32, the first electrode,
[0030] 4, the push rod, 41, the push head, 42, the rubber sleeve,
[0031] 5, the storage table, 51, the opening, 52, the top plate, 521, the second electrode, 53, the recess, 54, the fixed shaft, 55, the pivot rod, 56, the chuck, 57, the straight plate, 58, the connecting plate, 59, the second spring,
[0032] 6, the fixed plate, 61, the movable plate, 62, the third spring, 63, the air bag, 64, the nozzle,
[0033] 7, the sliding table, 71, the baffle. DETAILED DESCRIPTION
[0034] To make the purpose, technical scheme and advantages of the embodiments of the utility model more clear, the technical scheme of the embodiments of the utility model will be clearly and completely described below in combination with the drawings of the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the described embodiments of the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the scope of protection of the utility model. The illustrative embodiment of the utility model and its description are only used to explain the utility model, and are not used as the limitation of the utility model. It should be noted that the utility model has been in the actual research and development stage of use.
[0035] Unless otherwise defined, technical terms or scientific terms used in the present application shall have the ordinary meaning as understood by a person of ordinary skill in the art to which the present application pertains. The terms "first", "second", and similar terms used in the present application do not denote any order, quantity, or importance, but are used to distinguish different components. The terms "comprise", "comprising", and similar terms mean that the elements or objects before the term encompass the elements or objects listed after the term, and equivalents thereof, and do not exclude other elements or objects.
[0036] The conventional semiconductor pressure detection device has obvious defects. On the one hand, the function is single, only focusing on pressure test, and not integrated with other important test processes. Like using a simple rigid clamp to fix the semiconductor, it cannot adapt to various sizes and shapes, causing the semiconductor to shake easily during testing, affecting accuracy. On the other hand, the subsequent links rely on manual operation, and the efficiency of collecting and cleaning the tested semiconductor is low, and impurities are easily introduced to interfere with the test. In addition, the electrode and pressure detection system are simple, and it is difficult to accurately determine the state of the semiconductor in real time, capture the moment of pressure failure, and the error is large.
[0037] Embodiment 1:
[0038] As Figure 1 , Figure 2 In this embodiment, a semiconductor testing sorting machine includes a machine body 1 and a cylinder 2 arranged on the machine body 1. A semiconductor placing table 5 is arranged in the machine body 1. A clamping mechanism for clamping and limiting the semiconductor is arranged in the machine body 1. The clamping mechanism works during the downward pressing process of the cylinder shaft 21 of the cylinder 2 to the semiconductor. A collecting mechanism for collecting the tested semiconductor is arranged on the placing table 5. The collecting mechanism makes the tested semiconductor slide off the placing table 5 during the return process of the cylinder shaft 21. A cleaning mechanism for removing impurities is arranged in the machine body 1. The cleaning mechanism generates airflow in the area where the semiconductor is placed during the return process of the cylinder shaft 21.
[0039] The scheme aims to solve the problems of sample fixation, collection after testing and impurities affecting subsequent testing in the semiconductor testing and sorting process. The cylinder 2 on the starting machine body 1 is driven to press down the pressure rod 3. When the cylinder shaft 21 presses the semiconductor, the clamping mechanism starts to work, the push rod 4 buffers the force through the first spring 31 between the cylinder 2 and the push rod 4, and transmits the force to the push head 41, which acts on the straight plate 57 of the pivot rod 55, promotes the pivot rod 55 to rotate around the fixed shaft 54 of the side wall of the placement table 5, drives the chuck 56 to move close to the position directly above the placement table 5, accurately clamps different size semiconductors, ensures the stability of the semiconductor during pressure testing, and ensures the accuracy of pressure testing. After testing, the cylinder shaft 21 returns to the original position, the push head 41 moves away from the straight plate 57, the top plate 52 hinged to the side wall of the placement table 5 is lifted, and the tested semiconductor slides down to complete the collection. At the same time, the cleaning mechanism uses the cylinder 2 to drive the fixed plate 6 to extrude the air bag 63, so that the nozzle 64 sprays air to remove impurities in the test area, ensure the cleanliness of the test environment, and improve the overall test and sorting efficiency.
[0040] As Figure 2 、 Figure 3 , the clamping mechanism includes a push rod 4 and two pivot rods 55. The push rod 4 is arranged at the outer end of the cylinder shaft 21, and the push rod 4 is provided with a pressure rod 3 coaxial with the cylinder shaft 21. The pressure rod 3 is hollow, the inner diameter of the pressure rod 3 matches the outer diameter of the cylinder shaft 21, one end of the pressure rod 3 is connected to the push rod 4, and the other end of the pressure rod 3 is provided with a first electrode 32. A first spring 31 is arranged between the push rod 4 and the cylinder 2 to connect the push rod 4 and the cylinder 2. One end of the push rod 4 is connected to the pressure rod 3, and the other end of the push rod 4 is connected to the push head 41. Two opposite side walls of the placement table 5 are provided with openings 51, and the inner wall of each opening 51 is provided with a fixed shaft 54. Each pivot rod 55 is provided with a hole matching the fixed shaft 54, one end of each pivot rod 55 is provided with a straight plate 57, and the other end of each pivot rod 55 is provided with a chuck 56 for clamping the semiconductor. When the cylinder shaft 21 moves towards the placement table 5, the push head 41 acts on the straight plate 57 through the first spring 31, the push rod 4 and the push head 41, and then drives the pivot rod 55 to rotate around the fixed shaft 54, so that the chucks 56 on both sides move close to the position directly above the placement table 5.
[0041] This solution addresses the problems of traditional clamping methods, such as inability to adapt to various semiconductor sizes, difficulty in controlling clamping force, and inconvenience in electrode integration. The push rod 4 in the clamping mechanism is coaxially connected to the cylinder shaft 21, and its outer end, the pressure rod 3, has a hollow structure, facilitating installation with the cylinder shaft 21 and providing space for the subsequent installation of the first electrode 32. One end of the pressure rod 3 is connected to the push rod 4, and the other end houses the first electrode 32, used to connect to an external power source and determine the semiconductor's operating status. When the cylinder 2 is activated and applies pressure, the first spring 31 between the push rod 4 and the cylinder 2 buffers the initial impact force, preventing impact damage to the semiconductor. As the cylinder shaft 21 moves toward the stage 5, the push rod 4 is subjected to force and acts on the pivot rod 55 and the straight plate 57 through the push head 41. The pivot rod 55 rotates around the fixed shaft 54 on the side wall of the stage 5, causing the clamps 56 at both ends to move closer to the top of the stage 5, accurately and stably clamping the semiconductor. This accommodates semiconductors of different sizes, ensures that the semiconductor position is fixed when pressure is applied, and provides a guarantee for the accuracy of pressure testing. It also facilitates the smooth progress of subsequent electrode testing.
[0042] like Figure 1 , Figure 4 The collection mechanism includes a top plate 52 hinged to the side wall of the platform 5; when the pusher 41 moves away from the straight plate 57, it can lift the top plate 52, causing the top plate 52 to move around the hinge point, allowing the tested semiconductor to slide off the top plate 52.
[0043] During the testing phase, the top plate 52 is initially in a flat position, providing a support surface for the semiconductor. When the test is completed, as the cylinder shaft 21 returns to its original position, the pusher 41, which previously pushed the pivot rod 55, begins to move away from the straight plate 57. Due to the movement of the pusher 41, it lifts the top plate 52 during the return process. The top plate 52 rotates upward around the hinge point, forming an inclined slope, which allows the tested semiconductor to slide down the top plate 52 under the action of gravity, achieving rapid and automatic collection.
[0044] like Figure 1 , Figure 7 The machine body 1 is provided with a slot 11. The cleaning mechanism includes a movable plate 61 located inside the machine body 1. The end of the movable plate 61 is placed in the slot 11. A second spring 59 is provided in the slot 11 to connect the inner wall of the slot 11 and the movable plate 61. An airbag 63 is provided on the movable plate 61. A nozzle 64 communicating with the interior of the airbag 63 is provided in the direction near the top plate 52. A fixed plate 6 is provided on the push rod 4. When the cylinder shaft 21 returns to its upward position, the fixed plate 6 acts on the airbag 63 to squeeze the gas in the airbag 63 out of the nozzle 64. The gas acts on the surface of the top plate 52 to blow away the impurities generated during the test.
[0045] When the test is over, the cylinder shaft 21 is returned upward, the fixed plate 6 on the push rod 4 is moved upward, and the air bag 63 is pressed, the gas in the air bag 63 is squeezed out of the nozzle 64, and the air flow is formed and hits the surface of the top plate 52. With the axis direction of the push rod 4 as the reference, the cleaning mechanism arranged on both sides can comprehensively cover the top plate 52, effectively blow away the semiconductor fragments, dust and other impurities on the top plate 52 during the test, and maintain the cleanliness of the test area, providing a reliable environment for the next test, improving the repeatability and accuracy of the test.
[0046] As Figure 2 , with the axis direction of the push rod 4 as the reference, the cleaning mechanism is arranged on both sides of the push rod 4.
[0047] The bilateral arrangement can more comprehensively cover the top plate 52 and the surrounding area, effectively remove the semiconductor fragments, dust and other impurities scattered everywhere during the test, greatly reduce the impurity residues, and ensure the high cleanliness of the test environment.
[0048] As Figure 6 , one end of the push head 41 is connected to the push rod 4, and the other end of the push head 41 is sleeved with a rubber sleeve 42.
[0049] When the push head 41 acts on the straight plate 57 of the pivoting rod 55, the rubber sleeve 42 first contacts the straight plate 57, which can buffer the impact force transmitted by the push head 41, prevent the straight plate 57 from being damaged due to hard collision, and reduce the noise generated in the instant of contact between the push head 41 and the straight plate 57. At the same time, the rubber sleeve 42 increases the friction between the push head 41 and the straight plate 57 to a certain extent, ensuring stable transmission of force.
[0050] As Figure 1 , Figure 8 , the top plate 52 is provided with a hemispherical recess 53, the center point of the recess 53 coincides with the axis of the pressure rod 3, and a second electrode 521 and a pressure sensor are further arranged below the recess 53 and inside the top plate 52.
[0051] The hemispherical recess 53 plays a precise positioning role, guides the semiconductor to be quickly and accurately positioned directly below the pressure rod 3, and ensures that the pressure point and the detection electrode position are accurately corresponded. A second electrode 521 and a pressure sensor are further arranged below the recess 53 and inside the top plate 52. When the first electrode 32 is connected to the second electrode 521 through the semiconductor and connected to an external power supply, once the semiconductor is crushed during the pressing process, the circuit is interrupted, at this time the pressure sensor can capture this change in time, and accurately measure the pressure value at this moment, that is, the maximum pressure that the semiconductor can withstand, greatly improving the accuracy and reliability of the pressure test, and providing a strong basis for quality control of the semiconductor.
[0052] Test process:
[0053] During testing, the semiconductor is first placed in the corresponding position on the stage 5. The stage 5 is equipped with a clamping mechanism, which is activated during the pressure application by the cylinder 2 of the machine body 1. The push rod 4 moves with the cylinder shaft 21, and through the push head 41, it acts on the pivot rod 55, causing the clamp 56 to clamp the semiconductor and ensure its fixed position. At this time, the first electrode 32 at the end of the pressure rod 3, the semiconductor, and the second electrode 521 below the groove 53 of the stage 5 are connected to the external power supply, forming a circuit, and the semiconductor is in a normal operation monitoring state. As the cylinder 2 continues to drive the pressure rod 3 downward, the pressure gradually increases. When the pressure reaches the limit that the semiconductor can withstand, the semiconductor is crushed, and the circuit is interrupted. At the same time, the pressure sensor below the groove 53 immediately captures this change and accurately measures the pressure value at this moment. This value is the maximum pressure that the semiconductor can withstand. This data is then transmitted to the display screen for easy reading by the operator. This completes the accurate test of the semiconductor's pressure resistance. After the test, the collection mechanism and the cleaning mechanism operate in sequence to prepare for the next round of testing.
[0054] Example 2:
[0055] like Figure 1 , Figure 4 The machine body 1 is also equipped with a slide 7, and a baffle 71 is provided on the slide 7.
[0056] Once the test is complete, the cylinder shaft 21 returns to its original position, causing the pusher head 41 to lift the top plate 52, and the tested semiconductor slides off the top plate 52. During this process, the slide table 7 provides a stable platform for the semiconductor to slide down in a predetermined direction, while the baffle 71 acts as a barrier to prevent the semiconductor from deviating from the normal collection path due to excessive sliding speed, excessive inertia, or external interference, ensuring that the semiconductor falls accurately into the predetermined collection area.
[0057] In this embodiment, the axis of the pusher 41 is parallel to the axis of the top plate 52.
[0058] When the cylinder shaft 21 performs the pressing and returning actions, the pusher head 41 acts more stably and precisely on the top plate 52. During pressing, the pusher head 41 can smoothly push the pivot rod 55 to clamp the semiconductor; during returning, the pusher head 41 can smoothly lift the top plate 52 along the parallel axis, allowing the tested semiconductor to slide off. This avoids additional stress, jamming, or component interference caused by non-parallel axes.
[0059] like Figure 3 Both pivot rods 55 are provided with connecting plates 58, and a third spring 62 is provided between the two connecting plates 58 to connect the two connecting plates 58. When the third spring 62 is in the initial state, the two clamps 56 tend to move away from the groove 53.
[0060] Before the test starts, the clamp 56 is in the loose state, facilitating the semiconductor to be placed; when the test is carried out, the air cylinder 2 pushes the push head 41 to overcome the elastic force of the third spring 62 to make the clamp 56 clamp the semiconductor, ensuring that the test is stably carried out; after the test is completed, with the push head 41 moving away, the elastic force of the third spring 62 is restored to drive the clamp 56 to reset rapidly, loosen the semiconductor, and facilitate subsequent operation.
[0061] The above examples are only used to illustrate the technical solutions of the present disclosure, but not to limit it; although the present disclosure has been described in detail with reference to the foregoing examples, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacements for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure. The following points need to be explained: only the structures involved in the embodiments of the present disclosure are involved in the drawings of the embodiments of the present disclosure, and other structures can refer to the usual design. In the case of no conflict, the features in the same embodiment and different embodiments of the present disclosure can be combined with each other. The above is only a demonstrative embodiment of the present disclosure, but is not used to limit the protection scope of the present disclosure, and the protection scope of the present disclosure is determined by the appended claims.
Claims
1. A semiconductor testing handler, comprising a machine body (1) and a cylinder (2) arranged on the machine body (1), and a placing table (5) arranged in the machine body (1) for placing the semiconductor, characterized in that, a clamping mechanism is arranged in the machine body (1) for clamping and limiting the semiconductor, and the clamping mechanism works during the process of the cylinder shaft (21) of the cylinder (2) pressing the semiconductor; a collecting mechanism is arranged on the placing table (5) for collecting the tested semiconductor, and the collecting mechanism makes the tested semiconductor slide off the placing table (5) during the process of the cylinder shaft (21) returning. A cleaning mechanism is arranged in the machine body (1) for removing impurities, and the cleaning mechanism generates air flow in the area where the semiconductor is placed during the process of the cylinder shaft (21) returning.
2. The semiconductor testing handler according to claim 1, characterized in that, the clamping mechanism comprises a push rod (4) and two pivot rods (55), the push rod (4) is arranged at the outer end of the cylinder shaft (21), a pressing rod (3) coaxial with the cylinder shaft (21) is arranged on the push rod (4), the pressing rod (3) is hollow, the inner diameter of the pressing rod (3) matches the outer diameter of the cylinder shaft (21), one end of the pressing rod (3) is connected to the push rod (4), and the other end of the pressing rod (3) is provided with a first electrode (32); a first spring (31) connecting the push rod (4) and the cylinder (2) is arranged between the push rod (4) and the cylinder (2), one end of the push rod (4) is connected to the pressing rod (3), and the other end of the push rod (4) is connected with a push head (41); each of the two opposite side walls of the placing table (5) is provided with an opening (51), the inner wall of each opening (51) is provided with a fixed shaft (54), each pivot rod (55) is provided with a hole matching the fixed shaft (54), one end of each pivot rod (55) is provided with a straight plate (57), and the other end of each pivot rod (55) is provided with a chuck (56) for clamping the semiconductor; when the cylinder shaft (21) moves towards the placing table (5), the push head (41) acts on the straight plate (57) through the first spring (31), the push rod (4) and the push head (41), and drives the pivot rod (55) to rotate around the fixed shaft (54). The collecting mechanism comprises a top plate (52) hinged to the side wall of the placing table (5); during the process that the push head (41) moves away from the straight plate (57), the top plate (52) is lifted up, the top plate (52) moves around the hinge point, and the tested semiconductor slides off the top plate (52).
4. The semiconductor testing handler according to claim 3, characterized in that, 3. The handler for testing semiconductor devices as set forth in claim 2, wherein, The body (1) is provided with a slot (11), the cleaning mechanism includes a movable plate (61) arranged in the body (1), the end of the movable plate (61) is arranged in the slot (11), the slot (11) is provided with a second spring (59) connecting the inner wall of the slot (11) and the movable plate (61); the movable plate (61) is provided with an air bag (63), the air bag (63) is provided with a nozzle (64) in communication with the inside of the air bag (63) in the direction close to the top plate (52). The push rod (4) is provided with a fixed plate (6), when the air cylinder shaft (21) is upwardly returned, the fixed plate (6) acts on the air bag (63), and the gas in the air bag (63) is extruded from the nozzle (64), and the gas acts on the surface of the top plate (52), and the impurities generated in the test process are blown away.
5. The handler for testing semiconductor devices as set forth in claim 4, wherein With the axis direction of the push rod (4) as the reference, the two sides of the push rod (4) are provided with the cleaning mechanism.
6. The handler for testing semiconductor devices as set forth in claim 2, wherein, One end of the push head (41) is connected to the push rod (4), and the other end of the push head (41) is provided with a rubber sleeve (42).
7. The handler for testing semiconductor devices as set forth in claim 5, wherein, The top plate (52) is provided with a hemispherical recess (53), and the center point of the recess (53) coincides with the axis of the pressure rod (3); below the recess (53) and inside the top plate (52), a second electrode (521) and a pressure sensor are further arranged.
8. The handler for testing semiconductor devices as set forth in claim 6, wherein, The body (1) is further provided with a sliding table (7), and the sliding table (7) is provided with a baffle (71).
9. The handler for testing semiconductor devices as set forth in claim 7, wherein, The axis of the push head (41) is parallel to the axis of the top plate (52).
10. The handler for testing semiconductor devices as recited in claim 7, wherein, The two pivot rods (55) are provided with connecting plates (58), and the two connecting plates (58) are provided with a third spring (62) connecting the two connecting plates (58), when the third spring (62) is in the initial state, the two clamps (56) have a tendency to move away from the recess (53).