Capacitor element

Abstract

Provided is a capacitor element capable of achieving both high capacity and thinness. The capacitor element includes: a capacitor portion including a first capacitor layer and a second capacitor layer facing each other in a thickness direction; and a sealing layer provided so as to cover at least one main surface of the capacitor section. Each of the first capacitor layer and the second capacitor layer includes: an anode plate having a porous portion on at least one main surface of a core portion; a dielectric layer provided on the surface of the porous part; and a cathode layer provided on the surface of the dielectric layer. The cathode layer includes: a solid electrolyte layer provided on the surface of the dielectric layer; and a conductor layer provided on the surface of the solid electrolyte layer. The conductor layer of the first capacitor layer that faces the second capacitor layer and the conductor layer of the second capacitor layer that faces the first capacitor layer are common.

Description

Technical Field

[0001] This utility model relates to capacitor elements. Background Technology

[0002] Patent Document 1 discloses a capacitor array comprising: a plurality of solid electrolytic capacitor elements, each divided from a single solid electrolytic capacitor sheet; a sheet-like first sealing layer; and a sheet-like second sealing layer. The solid electrolytic capacitor sheet includes: an anode plate formed of a valve-acting metal; a porous layer disposed on at least one main surface of the anode plate; a dielectric layer disposed on the surface of the porous layer; and a cathode layer comprising a solid electrolyte layer disposed on the surface of the dielectric layer. The solid electrolytic capacitor sheet has a first main surface and a second main surface opposing each other in the thickness direction. The first main surface side of each of the plurality of solid electrolytic capacitor elements is disposed on the first sealing layer. The second sealing layer is arranged to cover the plurality of solid electrolytic capacitor elements on the first sealing layer from the second main surface side. The solid electrolytic capacitor elements are partially separated by slit-like sheet removal sections.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-167361 Utility Model Content

[0006] Problems to be solved by utility models

[0007] In the capacitor array described in Patent Document 1, a balance between large capacity and thinness is pursued that has been achieved in the past.

[0008] Furthermore, the aforementioned problems are not limited to a configuration in which multiple capacitor sections are arranged in a planar direction, but also arise in a configuration in which a single capacitor section is arranged in a planar direction.

[0009] This invention was developed to solve the aforementioned problems, and its purpose is to provide a capacitor element that can balance large capacity and thin profile.

[0010] Solution for solving the problem

[0011] The capacitor element of this invention includes: a capacitor portion comprising a first capacitor layer and a second capacitor layer opposed in the thickness direction; and a sealing layer disposed to cover at least one main surface of the capacitor portion. The first capacitor layer and the second capacitor layer each include: an anode plate having a porous portion on at least one main surface of its core; a dielectric layer disposed on the surface of the porous portion; and a cathode layer disposed on the surface of the dielectric layer. The cathode layer includes: a solid electrolyte layer disposed on the surface of the dielectric layer; and a conductor layer disposed on the surface of the solid electrolyte layer. The conductor layer in the first capacitor layer opposite to the second capacitor layer and the conductor layer in the second capacitor layer opposite to the first capacitor layer are shared.

[0012] Preferably, the capacitor element further includes a first external electrode layer disposed on at least one main surface of the sealing layer in a manner electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer, wherein, when viewed from the thickness direction, the first external electrode layer is configured to at least partially overlap with the common conductive layer.

[0013] Preferably, when viewed from the thickness direction, the area of ​​the portion of the first external electrode layer on any main surface of the sealing layer that overlaps with the shared conductor layer is more than 50% of the area of ​​the shared conductor layer.

[0014] Preferably, the capacitor element further includes a first through-hole conductor, which is disposed on at least the inner wall surface of a first through-hole that penetrates the capacitor portion and the sealing layer in the thickness direction and is electrically connected to the first external electrode layer. The first through-hole conductor is electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer at the inner wall surface of the first through-hole.

[0015] Preferably, the capacitor element further includes: a first external electrode layer disposed on at least one main surface of the sealing layer in a manner electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer; and a second external electrode layer disposed on at least one main surface of the sealing layer in a manner electrically connected to the anode plate of the first capacitor layer and the anode plate of the second capacitor layer, wherein, when viewed from the thickness direction, at least one of the first external electrode layer and the second external electrode layer is configured to at least partially overlap with the common conductive layer.

[0016] Preferably, when viewed from the thickness direction, the total area of ​​all the first and second external electrode layers on any main surface of the sealing layer is more than 50% of the area surrounded by the outer periphery of the sealing layer.

[0017] Preferably, the capacitor element further includes: a first through-hole conductor disposed on at least the inner wall surface of a first through-hole penetrating the capacitor portion and the sealing layer in the thickness direction, and electrically connected to the first external electrode layer; and a second through-hole conductor disposed on at least the inner wall surface of a second through-hole penetrating the capacitor portion and the sealing layer in the thickness direction, and electrically connected to the second external electrode layer, wherein the first through-hole conductor is electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer at the inner wall surface of the first through-hole, and the second through-hole conductor is electrically connected to the anode plate of the first capacitor layer and the anode plate of the second capacitor layer at the inner wall surface of the second through-hole.

[0018] Preferably, the area of ​​the capacitance portion in the first capacitor layer is different from the area of ​​the capacitance portion in the second capacitor layer.

[0019] Effects of the utility model

[0020] According to this invention, a capacitor element that can balance large capacity and thin profile can be provided. Attached Figure Description

[0021] Figure 1 This is a cross-sectional view schematically illustrating an example of a capacitor element according to the first embodiment of the present invention.

[0022] Figure 2 yes Figure 1 The capacitor element shown is shown in a top view along line AA.

[0023] Figure 3 This is a cross-sectional view schematically illustrating an example of a capacitor element according to the second embodiment of the present invention.

[0024] Figure 4 yes Figure 3 The capacitor element shown is shown in a top view along line AA.

[0025] Figure 5 This is a cross-sectional view schematically illustrating an example of the process of preparing an anode plate.

[0026] Figure 6 This is a cross-sectional view schematically illustrating an example of the process of filling the interior of a porous material with insulating resin.

[0027] Figure 7This is a cross-sectional view schematically illustrating an example of the process of forming a through hole.

[0028] Figure 8 This is a cross-sectional view schematically illustrating an example of the process of forming the inner layer of a solid electrolyte layer.

[0029] Figure 9 This is a cross-sectional view schematically illustrating an example of the process of forming the outer layer of a solid electrolyte layer.

[0030] Figure 10 This is a cross-sectional view schematically illustrating an example of the process of forming a carbon layer that forms a conductive layer.

[0031] Figure 11 This is a cross-sectional view schematically illustrating an example of the process of forming a copper layer that forms a conductive layer.

[0032] Figure 12 This is a cross-sectional view schematically illustrating an example of the process of stacking the first capacitor layer and the second capacitor layer.

[0033] Figure 13 This is a cross-sectional view schematically illustrating an example of the process of forming the first through hole and the second through hole.

[0034] Figure 14 This is a cross-sectional view schematically illustrating an example of the process of forming the first through-hole conductor and the second through-hole conductor.

[0035] Figure 15 This is a cross-sectional view schematically illustrating an example of the process of forming the first resin-filled portion and the second resin-filled portion.

[0036] Figure 16 A and Figure 16 B is a cross-sectional view schematically illustrating an example of the process of forming the first outer electrode layer and the second outer electrode layer.

[0037] Figure 17 A is a cross-sectional view schematically illustrating an example of the process of preparing the anode plate in the first capacitor layer. Figure 17 B is a cross-sectional view schematically illustrating an example of the process of preparing the anode plate in the second capacitor layer.

[0038] Figure 18 A is a cross-sectional view schematically illustrating an example of the process of filling the interior of the porous portion in the first capacitor layer with insulating resin. Figure 18 B is a cross-sectional view schematically illustrating an example of the process of filling the interior of the porous portion with insulating resin in the second capacitor layer.

[0039] Figure 19A is a cross-sectional view schematically illustrating an example of the process of forming through grooves and through holes in the first capacitor layer. Figure 19 B is a cross-sectional view schematically illustrating an example of the process of forming a through-groove in the second capacitor layer.

[0040] Figure 20 A is a cross-sectional view schematically illustrating an example of the process of forming an inner layer of a solid electrolyte layer in the first capacitor layer. Figure 20 B is a cross-sectional view schematically illustrating an example of the process of forming the inner layer of the solid electrolyte layer in the second capacitor layer.

[0041] Figure 21 A is a cross-sectional view schematically illustrating an example of the process of forming the outer layer of the solid electrolyte layer in the first capacitor layer. Figure 21 B is a cross-sectional view schematically representing an example of the process of forming the outer layer of the solid electrolyte layer in the second capacitor layer.

[0042] Figure 22 A is a cross-sectional view schematically illustrating an example of the process of forming a carbon layer that is a conductive layer in the first capacitor layer. Figure 22 B is a cross-sectional view schematically illustrating an example of the process of forming a carbon layer that is a conductive layer in the second capacitor layer.

[0043] Figure 23 A is a cross-sectional view schematically illustrating an example of the process of forming a copper layer as a conductive layer in the first capacitor layer. Figure 23 B is a cross-sectional view schematically illustrating an example of the process of forming a copper layer as a conductive layer in the second capacitor layer.

[0044] Figure 24 This is a cross-sectional view schematically illustrating an example of the process of stacking the first capacitor layer and the second capacitor layer.

[0045] Figure 25 This is a cross-sectional view schematically illustrating an example of the process of forming a passage hole.

[0046] Figure 26 This is a cross-sectional view schematically illustrating an example of the process of forming the first through-hole conductor, the second through-hole conductor, and the through conductor.

[0047] Figure 27 This is a cross-sectional view schematically illustrating an example of the process of forming the first resin-filled portion and the second resin-filled portion.

[0048] Figure 28 A and Figure 28 B is a cross-sectional view schematically illustrating an example of the process of forming the first outer electrode layer and the second outer electrode layer. Detailed Implementation

[0049] The capacitor element of this utility model will now be described. Furthermore, this utility model is not limited to the following structure, and appropriate modifications can be made without changing the spirit of this utility model. Additionally, a structure combining multiple preferred structures described below is also part of this utility model.

[0050] The embodiments shown below are illustrative, and it is self-evident that parts of the structure shown in different embodiments can be replaced or combined. From the second embodiment onwards, descriptions of matters common to the first embodiment are omitted, and the differences are mainly explained. In particular, the same effects produced by the same structure are not mentioned sequentially in each embodiment.

[0051] In the following description, without particularly distinguishing between the various embodiments, they are simply referred to as "the capacitor element of this utility model".

[0052] In this specification, terms indicating the relationship between elements (such as "perpendicular", "parallel", "orthogonal") and terms indicating the shape of elements are not merely expressions with strict meanings, but rather expressions indicating substantially equal ranges, including, for example, differences of several percentage degrees.

[0053] The accompanying drawings are schematic diagrams and may differ from the actual product in dimensions, aspect ratio, scale, etc. In the drawings, the same or equivalent parts use the same reference numerals. Furthermore, in each drawing, the same reference numerals are used for the same elements, and redundant descriptions are omitted.

[0054] [First Implementation]

[0055] Figure 1 This is a cross-sectional view schematically illustrating an example of a capacitor element according to the first embodiment of the present invention. Figure 2 yes Figure 1 The capacitor element shown is shown in a top view along line AA.

[0056] Figure 1 and Figure 2 The capacitor element 1 shown includes a capacitor portion 10 and a sealing layer 20 disposed in such a way as to cover at least one main surface of the capacitor portion 10.

[0057] The capacitor section 10 includes a first capacitor layer 10A and a second capacitor layer 10B that are opposed to each other in the thickness direction (Z direction).

[0058] exist Figure 1 and Figure 2 In the example shown, a capacitor section 10 is disposed inside the sealing layer 20.

[0059] The number of capacitor sections disposed inside the sealing layer 20 is not particularly limited; there may be one or more. For example, multiple capacitor sections may be disposed inside the sealing layer 20 in a plane direction orthogonal to the thickness direction (Z direction) (i.e., a plane direction parallel to the X and Y axes).

[0060] Preferably, such as Figure 1 As shown, the sealing layer 20 is provided on two opposing main surfaces in the thickness direction of the capacitor section 10 (in... Figure 1 (The middle part is the upper and lower surfaces). The capacitor section 10 is protected by the sealing layer 20.

[0061] The sealing layer 20 can consist of a single layer or two or more layers. When the sealing layer 20 consists of two or more layers, the materials constituting each layer can be the same or different from each other.

[0062] The sealing layer 20 is formed, for example, by heat-pressing an insulating resin sheet or by heat-curing an insulating resin slurry after coating it, in a way that seals the capacitor section 10.

[0063] The first capacitor layer 10A and the second capacitor layer 10B each include: an anode plate 11 having a porous portion 11B on at least one main surface of the core 11A; a dielectric layer 13 disposed on the surface of the porous portion 11B; and a cathode layer 12 disposed on the surface of the dielectric layer 13. Figure 1 In the example shown, the anode plate 11 has a porous portion 11B on both main surfaces of the core 11A, but it is also possible that the porous portion 11B is only on either main surface of the core 11A.

[0064] The cathode layer 12 includes: a solid electrolyte layer 12A disposed on the surface of the dielectric layer 13; and a conductive layer 12B disposed on the surface of the solid electrolyte layer 12A. Because the cathode layer 12 includes the solid electrolyte layer 12A, the capacitor section 10 constitutes a solid electrolytic capacitor.

[0065] As materials constituting the solid electrolyte layer 12A, examples include conductive polymers such as poly(3,4-ethylenedioxythiophene) called PEDOT. Alternatively, the aforementioned conductive polymer may contain dopants such as polystyrene sulfonic acid (PSS). Furthermore, it is preferable that the solid electrolyte layer 12A comprises an inner layer filling the pores (recesses) of the dielectric layer 13 and an outer layer covering the dielectric layer 13.

[0066] The conductive layer 12B may include, for example, a carbon layer 12Ba disposed on the surface of the solid electrolyte layer 12A and a copper layer 12Bb disposed on the surface of the carbon layer 12Ba.

[0067] The conductive layer 12B in the first capacitor layer 10A opposite to the second capacitor layer 10B and the conductive layer 12B in the second capacitor layer 10B opposite to the first capacitor layer 10A are shared. Furthermore, if the conductive layer 12B is composed of two or more layers, it is sufficient that at least one layer is shared. In other words, it can be said that the first capacitor layer 10A and the second capacitor layer 10B share the common conductive layer 12B disposed between them.

[0068] exist Figure 1 In the example shown, the copper layer 12Bb in the first capacitor layer 10A opposite to the second capacitor layer 10B and the copper layer 12Bb in the second capacitor layer 10B opposite to the first capacitor layer 10A are shared. That is to say, it can be said that the first capacitor layer 10A and the second capacitor layer 10B share the common copper layer 12Bb disposed between them.

[0069] By stacking the first capacitor layer 10A and the second capacitor layer 10B in the thickness direction, the capacitance per unit area of ​​the capacitor section 10 can be increased. Furthermore, since the conductive layer 12B in the first capacitor layer 10A opposite to the second capacitor layer 10B and the conductive layer 12B in the second capacitor layer 10B opposite to the first capacitor layer 10A are shared, the overall thickness of the component can be reduced. Therefore, a balance between high capacitance and thinness can be achieved.

[0070] Furthermore, since the conductive layer 12B in the first capacitor layer 10A opposite to the second capacitor layer 10B and the conductive layer 12B in the second capacitor layer 10B opposite to the first capacitor layer 10A are shared, the element can be constructed using a material with high thermal conductivity without placing a thermally insulating material between the first capacitor layer 10A and the second capacitor layer 10B. Therefore, the heat dissipation of the element can be improved.

[0071] When the conductive layer 12B in the first capacitor layer 10A opposite to the second capacitor layer 10B and the conductive layer 12B in the second capacitor layer 10B opposite to the first capacitor layer 10A are different, wiring is required to electrically connect the first capacitor layer 10A and the second capacitor layer 10B, thus increasing the contact resistance. In contrast, when the conductive layer 12B in the first capacitor layer 10A opposite to the second capacitor layer 10B and the conductive layer 12B in the second capacitor layer 10B are shared, there are fewer contacts with dissimilar materials, the series resistance component is smaller, and therefore the equivalent series resistance (ESR) can be reduced.

[0072] Furthermore, when the conductor layer 12B in the first capacitor layer 10A opposite to the second capacitor layer 10B is different from the conductor layer 12B in the second capacitor layer 10B opposite to the first capacitor layer 10A, wiring is required to electrically connect the first capacitor layer 10A and the second capacitor layer 10B, thus increasing the inductance. In contrast, when the conductor layer 12B in the first capacitor layer 10A opposite to the second capacitor layer 10B is shared with the conductor layer 12B in the second capacitor layer 10B, the inductance is reduced, thus suppressing noise generation.

[0073] It could also be, such as Figure 1 and Figure 2 As shown, the capacitor element 1 also includes a first external electrode layer 31 electrically connected to the cathode layer 12 of the first capacitor layer 10A and the cathode layer 12 of the second capacitor layer 10B.

[0074] The first external electrode layer 31 is disposed on at least one main surface of the sealing layer 20. Figure 1 In the example shown, the first external electrode layer 31 is disposed on the two main surfaces of the sealing layer 20 (in Figure 1 The middle part is the upper and lower surfaces), but it can also be located on any main surface of the sealing layer 20 (in the middle). Figure 1 (The middle refers to either the upper or lower surface).

[0075] For a capacitor section 10, either one first external electrode layer 31 or multiple first external electrode layers 31 can be provided.

[0076] The planar shape of the first external electrode layer 31 when viewed from the thickness direction is not particularly limited. For example, it can be a rectangle (square or rectangular), a quadrilateral other than a rectangle, a triangle, a pentagon, a hexagon or other polygon, a circle, an ellipse, or a combination of these shapes. In addition, the planar shape of the first external electrode layer 31 can also be L-shaped, C-shaped, stepped, etc.

[0077] It could also be, such as Figure 1 and Figure 2 As shown, the capacitor element 1 also includes a second external electrode layer 32 that is electrically connected to the anode plate 11 of the first capacitor layer 10A and the anode plate 11 of the second capacitor layer 10B.

[0078] The second external electrode layer 32 is disposed on at least one main surface of the sealing layer 20. Figure 1 In the example shown, the second external electrode layer 32 is disposed on the two main surfaces of the sealing layer 20 (in Figure 1 The middle part is the upper and lower surfaces), but it can also be located on any main surface of the sealing layer 20 (in the middle). Figure 1 (The middle refers to either the upper or lower surface).

[0079] For a capacitor section 10, either one second external electrode layer 32 or multiple second external electrode layers 32 can be provided. For a capacitor section 10, the number of second external electrode layers 32 can be the same as or different from the number of first external electrode layers 31.

[0080] The planar shape of the second outer electrode layer 32 when viewed from the thickness direction is not particularly limited. For example, it can be a rectangle (square or rectangular), a quadrilateral other than a rectangle, a polygon such as a triangle, a pentagon, or a hexagon, a circle, an ellipse, or a combination of these shapes. In addition, the planar shape of the second outer electrode layer 32 can also be L-shaped, C-shaped, or stepped. The planar shape of the second outer electrode layer 32 when viewed from the thickness direction can be the same as or different from the planar shape of the first outer electrode layer 31 when viewed from the thickness direction.

[0081] Preferably, when viewed from above in the thickness direction, the first outer electrode layer 31 is at least partially connected to the aforementioned shared conductive layer 12B (in... Figure 1 The copper layer 12Bb, which is shared by the first capacitor layer 10A and the second capacitor layer 10B, is arranged in an overlapping manner.

[0082] By arranging the first outer electrode layer 31 in a manner that at least partially overlaps with the aforementioned shared conductive layer 12B, moisture is less likely to penetrate into the interior of the component. Therefore, delamination, a phenomenon known as peeling caused by rapid moisture evaporation, can be suppressed.

[0083] Furthermore, by configuring the first external electrode layer 31 to overlap at least partially with the aforementioned common conductive layer 12B, the permeation of moisture or oxygen into the interior of the element is suppressed, thereby suppressing the deterioration of the conductive polymer contained in the solid electrolyte layer 12A.

[0084] Furthermore, if the first external electrode layer 31 is configured to overlap at least partially with the aforementioned common conductive layer 12B, the area of ​​the first external electrode layer 31 becomes larger, and a cathode layer 12 is also formed inside the element, thereby reducing the generation or emission of noise.

[0085] From the viewpoint of suppressing the entry of moisture and other substances into the component, it is preferable that the area of ​​the portion of the first external electrode layer 31 overlapping with the shared conductive layer 12B is larger. For example, it is preferable that, when viewed from the thickness direction, the area of ​​the portion of the first external electrode layer 31 provided on any main surface of the sealing layer 20 that overlaps with the shared conductive layer 12B is 50% or more of the area of ​​the shared conductive layer 12B. For example, the area of ​​the first external electrode layer 31 provided on the upper surface of the sealing layer 20 that overlaps with the shared conductive layer 12B may be 50% or more of the area of ​​the shared conductive layer 12B, or the area of ​​the first external electrode layer 31 provided on the lower surface of the sealing layer 20 that overlaps with the shared conductive layer 12B may be 50% or more of the area of ​​the shared conductive layer 12B. On the other hand, when viewed from the thickness direction, the area of ​​the portion of the first external electrode layer 31 that overlaps with the common conductive layer 12B in the area of ​​any main surface of the sealing layer 20 is not particularly limited as long as it is less than 100% of the area of ​​the common conductive layer 12B.

[0086] When Figure 1 In the example shown, where the first external electrode layer 31 is provided on both main surfaces of the sealing layer 20, the area ratio on one main surface and the other main surface of the sealing layer 20 can be the same or different. Therefore, even if the area of ​​the first external electrode layer 31 overlapping with the shared conductive layer 12B in the area of ​​the first external electrode layer 31 provided on any one main surface of the sealing layer 20 is 50% or more of the area of ​​the shared conductive layer 12B, the area of ​​the first external electrode layer 31 overlapping with the shared conductive layer 12B in the area of ​​the first external electrode layer 31 provided on the other main surface of the sealing layer 20 can be less than 50% of the area of ​​the shared conductive layer 12B. However, preferably, the area of ​​the portion of the first external electrode layer 31 that overlaps with the common conductive layer 12B in the area of ​​the first external electrode layer 31 provided on any one main surface of the sealing layer 20 is 50% or more of the area of ​​the common conductive layer 12B, and the area of ​​the portion of the first external electrode layer 31 that overlaps with the common conductive layer 12B in the area of ​​the first external electrode layer 31 provided on the other main surface of the sealing layer 20 is 50% or more of the area of ​​the common conductive layer 12B.

[0087] Alternatively, when viewed from above in the thickness direction, at least one of the first outer electrode layer 31 and the second outer electrode layer 32 may be at least partially connected to the aforementioned shared conductive layer 12B. Figure 1 The common copper layer 12Bb shared by the first capacitor layer 10A and the second capacitor layer 10B is arranged in an overlapping manner. In this case, the permeation of moisture or oxygen into the interior of the element is also suppressed.

[0088] From the viewpoint of suppressing the entry of moisture and other substances into the interior of the component, it is preferable that, when viewed from above in the thickness direction, the total area of ​​all the first external electrode layers 31 and second external electrode layers 32 provided on any main surface of the sealing layer 20 is 50% or more of the area surrounded by the outer periphery of the sealing layer 20. For example, it could be that the total area of ​​all the first external electrode layers 31 and second external electrode layers 32 provided on the upper surface of the sealing layer 20 is 50% or more of the area surrounded by the outer periphery of the sealing layer 20, or it could be that the total area of ​​all the first external electrode layers 31 and second external electrode layers 32 provided on the lower surface of the sealing layer 20 is 50% or more of the area surrounded by the outer periphery of the sealing layer 20. On the other hand, when viewed from above in the thickness direction, the total area of ​​all the first external electrode layers 31 and second external electrode layers 32 provided on any main surface of the sealing layer 20 is, for example, 80% or less of the area surrounded by the outer periphery of the sealing layer 20.

[0089] Furthermore, the phrase "the total area of ​​all the first external electrode layers 31 and the second external electrode layers 32 provided on any main surface of the sealing layer 20" also includes the areas of the first external electrode layers 31 and the second external electrode layers 32 that do not overlap with the aforementioned shared conductive layer 12B on the target main surface. Additionally, "the area surrounded by the outer periphery of the sealing layer 20" does not refer to the area of ​​the sealing layer 20 itself, but rather to the entire area surrounded by the outer periphery of the sealing layer 20.

[0090] When Figure 1In the example shown, where a first external electrode layer 31 and / or a second external electrode layer 32 are provided on both main surfaces of the sealing layer 20, the area ratio described above can be the same or different on one main surface side and the other main surface side of the sealing layer 20. Therefore, even if the total area of ​​all the first external electrode layers 31 and the second external electrode layers 32 provided on any one main surface of the sealing layer 20 is more than 50% of the area surrounded by the outer periphery of the sealing layer 20, the total area of ​​all the first external electrode layers 31 and the second external electrode layers 32 provided on the other main surface of the sealing layer 20 can be less than 50% of the area surrounded by the outer periphery of the sealing layer 20. However, it is preferable that the total area of ​​all the first external electrode layers 31 and the second external electrode layers 32 provided on any one main surface of the sealing layer 20 is more than 50% of the area surrounded by the outer periphery of the sealing layer 20, and the total area of ​​all the first external electrode layers 31 and the second external electrode layers 32 provided on the other main surface of the sealing layer 20 is more than 50% of the area surrounded by the outer periphery of the sealing layer 20.

[0091] It could also be, such as Figure 1 As shown, the capacitor element 1 also includes a first through-hole conductor 41 electrically connected to the first external electrode layer 31.

[0092] The first through-hole conductor 41 only needs to be provided on at least the inner wall surface of the first through-hole 51 that penetrates the capacitor portion 10 and the sealing layer 20 in the thickness direction. The first through-hole conductor 41 may be provided only on the inner wall surface of the first through-hole 51, or it may be provided entirely inside the first through-hole 51.

[0093] When viewed from above in the thickness direction, there may be one first through-hole conductor 41 or more first through-hole conductors 41 inside the cathode layer 12.

[0094] Preferably, such as Figure 1 As shown, the end face of the anode plate 11 is insulated from the first through-hole conductor 41 by an insulating material.

[0095] Preferably, such as Figure 1 As shown, the first through-hole conductor 41 is electrically connected to the cathode layer 12 of the first capacitor layer 10A and the cathode layer 12 of the second capacitor layer 10B at the inner wall surface of the first through-hole 51.

[0096] It could also be, such as Figure 1As shown, when the first through-hole conductor 41 is only provided on the inner wall surface of the first through-hole 51, a first resin-filled portion 61 made of resin material is provided on the inner side of the first through-hole conductor 41. In this case, the first resin-filled portion 61 is provided in the space surrounded by the first through-hole conductor 41 within the first through-hole 51. If the space within the first through-hole 51 is eliminated by providing the first resin-filled portion 61, the delamination of the first through-hole conductor 41 is suppressed. Furthermore, the first resin-filled portion 61 can be either a conductor or an insulator.

[0097] It could also be, such as Figure 1 As shown, the capacitor element 1 also includes a second through-hole conductor 42 electrically connected to the second external electrode layer 32.

[0098] The second through-hole conductor 42 only needs to be provided on at least the inner wall surface of the second through-hole 52 that penetrates the capacitor portion 10 and the sealing layer 20 in the thickness direction. The second through-hole conductor 42 may be provided only on the inner wall surface of the second through-hole 52, or it may be provided entirely inside the second through-hole 52.

[0099] When viewed from above in the thickness direction, there may be one or more second through-hole conductors 42 inside the cathode layer 12.

[0100] Preferably, such as Figure 1 As shown, the end face of the cathode layer 12 is insulated from the second through-hole conductor 42 by an insulating material.

[0101] Preferably, such as Figure 1 As shown, the second through-hole conductor 42 is electrically connected to the anode plate 11 of the first capacitor layer 10A and the anode plate 11 of the second capacitor layer 10B at the inner wall surface of the second through-hole 52.

[0102] It could also be, such as Figure 1 As shown, when the second through-hole conductor 42 is only provided on the inner wall surface of the second through-hole 52, a second resin-filled portion 62 made of resin material is provided on the inner side of the second through-hole conductor 42. In this case, the second resin-filled portion 62 is provided in the space surrounded by the second through-hole conductor 42 within the second through-hole 52. If the space within the second through-hole 52 is eliminated by providing the second resin-filled portion 62, the delamination of the second through-hole conductor 42 is suppressed. Furthermore, the second resin-filled portion 62 can be either a conductor or an insulator.

[0103] exist Figure 1 Not shown, but may also be, capacitor element 1 also includes a third through-hole conductor that is not electrically connected to anode plate 11 and cathode layer 12.

[0104] exist Figure 1Not shown, but may also be, capacitor element 1 also includes a pass conductor arranged to penetrate the sealing layer 20 in the thickness direction, with one end extending to the surface of the sealing layer 20.

[0105] For example, capacitor element 1 may include a conductive path that is electrically connected to anode plate 11. In this case, anode plate 11 is electrically discharged to the outside of sealing layer 20 via the conductive path, enabling electrical connection to the outside of sealing layer 20. There may be one or more conductive paths electrically connected to anode plate 11.

[0106] Alternatively, capacitor element 1 may include a conductive path that is electrically connected to cathode layer 12. In this case, cathode layer 12 is electrically discharged to the outside of sealing layer 20 via the conductive path, enabling electrical connection to the outside of sealing layer 20. There may be one or more conductive paths electrically connected to cathode layer 12.

[0107] When the first through-hole conductor 41 or the second through-hole conductor 42 is provided inside the sealing layer 20, the capacitor section 10 may also include an insulating shielding layer disposed around the first through-hole conductor 41 or the second through-hole conductor 42 at at least one main surface of the anode plate 11.

[0108] Alternatively, the capacitor section 10 may further include an insulating shielding layer disposed at at least one main surface of the anode plate 11, surrounding the cathode layer 12. By utilizing the insulating shielding layer to surround the cathode layer 12, insulation between the anode plate 11 and the cathode layer 12 is ensured, preventing short circuits between them. The insulating shielding layer may also be disposed partially surrounding the cathode layer 12, but it is preferable to dispose of it entirely surrounding the cathode layer 12.

[0109] [Second Implementation]

[0110] In the capacitor element of the second embodiment of this utility model, the areas of the capacitance portions in the first capacitor layer and the capacitance portions in the second capacitor layer are different. Furthermore, when multiple capacitor portions are arranged in a planar direction, it is sufficient that the areas of the capacitance portions in the first capacitor layer and the second capacitor layer are different in at least one capacitor portion.

[0111] Figure 3 This is a cross-sectional view schematically illustrating an example of a capacitor element according to the second embodiment of the present invention. Figure 4 yes Figure 3 The capacitor element shown is shown in a top view along line AA.

[0112] exist Figure 3 and Figure 4In the capacitor element 2 shown, two capacitor sections 10 and 10' are arranged inside the sealing layer 20.

[0113] Preferably, such as Figure 3 As shown, the sealing layer 20 is provided on two opposing main surfaces in the thickness direction of the capacitor section 10 and the capacitor section 10' (in... Figure 3 (The middle part is the upper and lower surfaces). The capacitor section 10 and capacitor section 10' are protected by the sealing layer 20.

[0114] The capacitor section 10 includes a first capacitor layer 10A and a second capacitor layer 10B that are opposed to each other in the thickness direction (Z direction).

[0115] Similarly, the capacitor section 10' includes a first capacitor layer 10A and a second capacitor layer 10B that are opposed to each other in the thickness direction (Z direction).

[0116] In the capacitor section 10, the first capacitor layer 10A and the second capacitor layer 10B each include: an anode plate 11 having a porous portion 11B on at least one main surface of the core 11A; a dielectric layer 13 disposed on the surface of the porous portion 11B; and a cathode layer 12 disposed on the surface of the dielectric layer 13. Figure 1 In the example shown, the anode plate 11 has porous portions 11B on both main surfaces of the core 11A, but it is also possible that the porous portion 11B is only on either main surface of the core 11A. The same applies to the capacitor portion 10'.

[0117] In capacitor section 10, cathode layer 12 includes: solid electrolyte layer 12A disposed on the surface of dielectric layer 13; and conductive layer 12B disposed on the surface of solid electrolyte layer 12A. By including solid electrolyte layer 12A in cathode layer 12, capacitor section 10 constitutes a solid electrolytic capacitor. The same applies to capacitor section 10'.

[0118] In the capacitor section 10, the conductive layer 12B in the first capacitor layer 10A opposite to the second capacitor layer 10B and the conductive layer 12B in the second capacitor layer 10B opposite to the first capacitor layer 10A are shared. Furthermore, if the conductive layer 12B is composed of two or more layers, it is sufficient that at least one layer is shared. In other words, it can be said that the first capacitor layer 10A and the second capacitor layer 10B share the common conductive layer 12B disposed between them.

[0119] exist Figure 3In the example shown, in the capacitor section 10, the copper layer 12Bb in the first capacitor layer 10A opposite to the second capacitor layer 10B and the copper layer 12Bb in the second capacitor layer 10B opposite to the first capacitor layer 10A are shared. That is to say, it can be said that the first capacitor layer 10A and the second capacitor layer 10B share the common copper layer 12Bb disposed between them.

[0120] In the capacitor section 10', the conductive layer 12B in the first capacitor layer 10A opposite to the second capacitor layer 10B and the conductive layer 12B in the second capacitor layer 10B opposite to the first capacitor layer 10A are shared. Furthermore, if the conductive layer 12B is composed of two or more layers, it is sufficient that at least one layer is shared. In other words, it can be said that the first capacitor layer 10A and the second capacitor layer 10B share the common conductive layer 12B disposed between them.

[0121] exist Figure 3 In the example shown, in capacitor section 10', the copper layer 12Bb in the first capacitor layer 10A opposite to the second capacitor layer 10B and the copper layer 12Bb in the second capacitor layer 10B opposite to the first capacitor layer 10A are shared. That is to say, it can be said that the first capacitor layer 10A and the second capacitor layer 10B share the common copper layer 12Bb disposed between them.

[0122] In the capacitor section 10', the capacitance portions of the first capacitor layer 10A and the second capacitor layer 10B have different areas.

[0123] By making the capacitance portions of the first capacitor layer 10A and the second capacitor layer 10B different in area, such as in capacitor section 10', complex requirements for capacitor capacitance can be met. Therefore, the design freedom of capacitor elements is increased.

[0124] In the capacitor section 10, the areas of the capacitance portions of the first capacitor layer 10A and the second capacitor layer 10B can be the same or different.

[0125] The number of capacitor sections disposed inside the sealing layer 20 is not particularly limited; there may be one or more. For example, multiple capacitor sections may be disposed inside the sealing layer 20 in a plane direction orthogonal to the thickness direction (Z direction) (i.e., a plane direction parallel to the X and Y axes).

[0126] When multiple capacitor sections are arranged in a planar direction, it is preferable that adjacent capacitor sections in the planar direction are separated from each other by a through groove 80. In this case, it is preferable that the through groove 80 is filled with an insulating material such as a sealing layer 20.

[0127] When adjacent capacitor sections in the planar direction are separated from each other by the through groove 80, adjacent capacitor sections 10 in the planar direction only need to be physically separated from each other by the through groove 80. Therefore, adjacent capacitor sections in the planar direction can be electrically disconnected or electrically connected. The width of the through groove 80, i.e., the spacing between adjacent capacitor sections in the planar direction, can be constant in the thickness direction (Z direction) or decrease in the thickness direction.

[0128] When multiple capacitor sections are arranged in a planar direction, the capacitor sections can be arranged either regularly or irregularly. The size and shape of the capacitor sections can be the same or partially or completely different. Preferably, the capacitor sections have the same structure, but it is also possible to include capacitor sections with different structures.

[0129] It could also be, such as Figure 3 As shown, a first through-hole conductor 41 that reaches the aforementioned common conductive layer 12B is provided in the first capacitor layer 10A of the capacitor section 10'.

[0130] The first through-hole conductor 41 of the capacitor section 10' only needs to be provided on at least the inner wall surface of the first through-hole 81. The first through-hole conductor 41 may be provided only on the inner wall surface of the first through-hole 81, or it may be provided throughout the entire interior of the first through-hole 81.

[0131] When viewed from above in the thickness direction, inside the cathode layer 12 of the capacitor section 10', there may be one first through-hole conductor 41 or two or more first through-hole conductors 41.

[0132] Preferably, such as Figure 3 As shown, the end face of the anode plate 11 of the capacitor section 10' is insulated from the first through-hole conductor 41 by an insulating material.

[0133] In such Figure 3 When the first through-hole conductor 41 of the capacitor section 10' shown is only provided on the inner wall surface of the first through-hole 81, a first resin filling section 61 filled with resin material can be provided on the inner side of the first through-hole conductor 41.

[0134] Alternatively, the first capacitor layer 10A of the capacitor section 10' may be provided with a passage conductor 70 that leads to the conductor layer 12B on the opposite side of the conductor layer 12B shared with the above-mentioned conductor layer 12B.

[0135] When viewed from above in the thickness direction, inside the cathode layer 12 of the capacitor section 10', there may be one or more conductive conductors 70.

[0136] Alternatively, a second through-hole conductor 42 may be provided in the first capacitor layer 10A of the capacitor section 10', which leads to the core 11A of the anode plate 11.

[0137] The second through-hole conductor 42 of the capacitor section 10' only needs to be provided on at least the inner wall surface of the second through-hole 82. The second through-hole conductor 42 may be provided only on the inner wall surface of the second through-hole 82, or it may be provided entirely inside the second through-hole 82.

[0138] When viewed from above in the thickness direction, inside the cathode layer 12 of the capacitor section 10', there may be one second through-hole conductor 42 or more second through-hole conductors 42.

[0139] Preferably, such as Figure 3 As shown, the end face of the cathode layer 12 of the capacitor section 10' is insulated from the second through-hole conductor 42 by an insulating material.

[0140] In such Figure 3 When the second through-hole conductor 42 of the capacitor section 10' shown is only provided on the inner wall surface of the second through-hole 82, a second resin filling section 62 filled with resin material can be provided on the inner side of the second through-hole conductor 42.

[0141] The manufacturing method of the capacitor element of this utility model will be described below.

[0142] First, as an example of the method for manufacturing a capacitor element according to the first embodiment of this utility model, regarding... Figure 1 An example of the manufacturing method of the capacitor element 1 shown will be described.

[0143] Figure 5 This is a cross-sectional view schematically illustrating an example of the process of preparing an anode plate.

[0144] exist Figure 5 In the process shown, an anode plate 11 formed from valve-actuated metal is prepared.

[0145] For example, by performing anodizing on an anode plate 11, which has porous portions 11B on two main surfaces of the core 11A, a dielectric layer (not shown) is formed on the surface of the porous portions 11B.

[0146] Alternatively, it can be prepared as a foil as an anode plate 11 with a dielectric layer (not shown) on the surface of the porous part 11B.

[0147] Figure 6 This is a cross-sectional view schematically illustrating an example of the process of filling the interior of a porous material with insulating resin.

[0148] exist Figure 6In the process shown, an insulating resin such as polyimide resin is applied from the upper surface of the porous portion 11B to a predetermined position, allowing the insulating resin to penetrate into the interior of the porous portion 11B.

[0149] Figure 7 This is a cross-sectional view schematically illustrating an example of the process of forming a through hole.

[0150] exist Figure 7 In the illustrated process, a through-hole 50A is formed in the portion where the first through-hole conductor is to be formed using a laser or the like, and a through-hole 50B is formed in the portion where the second through-hole conductor is to be formed. Preferably, as shown... Figure 7 As shown, the diameter of the through hole 50A is larger than the diameter of the through hole 50B.

[0151] Figure 8 This is a cross-sectional view schematically illustrating an example of the process of forming the inner layer of a solid electrolyte layer.

[0152] exist Figure 8 In the process shown, after coating the porous portion 11B, which is surrounded by an insulating resin, with a dispersion of PEDOT / PSS, an example of a conductive polymer, and allowing it to penetrate, it is dried and cured. This process is repeated to fill the porous portion 11B with PEDOT / PSS. This forms the inner layer 12Aa of the solid electrolyte layer.

[0153] Figure 9 This is a cross-sectional view schematically illustrating an example of the process of forming the outer layer of a solid electrolyte layer.

[0154] exist Figure 9 In the process shown, a high-viscosity PEDOT / PSS dispersion is coated and allowed to dry and cure. This forms the outer layer 12Ab of the solid electrolyte layer. The solid electrolyte layer 12A is formed by the inner layer 12Aa and the outer layer 12Ab.

[0155] Moreover, such as Figure 9 As shown, insulating resin is applied to the surface of the insulating resin that has penetrated into the porous part 11B, the interior of the through hole 50A, and the interior of the through hole 50B, and then cured.

[0156] Figure 10 This is a cross-sectional view schematically illustrating an example of the process of forming a carbon layer that forms a conductive layer.

[0157] exist Figure 10 In the process shown, a conductive resin containing carbon filler is coated onto the surface of the solid electrolyte layer 12A and then cured. This forms the carbon layer 12Ba.

[0158] Moreover, such as Figure 10 As shown, an insulating resin is applied around the carbon layer 12Ba and then cured.

[0159] Figure 11 This is a cross-sectional view schematically illustrating an example of the process of forming a copper layer that forms a conductive layer.

[0160] exist Figure 11 In the process shown, a conductive resin containing copper filler is coated onto the surface of the carbon layer 12Ba and then cured. This forms a copper layer 12Bb. The conductive layer 12B is formed from the carbon layer 12Ba and the copper layer 12Bb.

[0161] Moreover, such as Figure 11 As shown, an insulating resin is applied around the copper layer 12Bb and allowed to cure. Preferably, the height is adjusted so that the copper layer 12Bb and the insulating resin are as flat as possible.

[0162] Prepare two pieces with Figure 11 The substrate shown has the following structure. One substrate forms the first capacitor layer, and the other substrate forms the second capacitor layer.

[0163] Figure 12 This is a cross-sectional view schematically illustrating an example of the process of stacking the first capacitor layer and the second capacitor layer.

[0164] exist Figure 12 In the process shown, the first capacitor layer 10A and the second capacitor layer 10B are stacked with reference to the conductor layer 12B on the back of the watch.

[0165] Moreover, such as Figure 12 As shown, insulating resin sheets such as Ajinomoto laminate (ABF) are laminated onto the surface of the laminate. After lamination, the laminate is placed in a mold and degassed under vacuum, then heat-pressed to cure it. Through the above process, a sealing layer 20 is formed.

[0166] Figure 13 This is a cross-sectional view schematically illustrating an example of the process of forming the first through hole and the second through hole.

[0167] exist Figure 13 In the process shown, a first through-hole 51 with a diameter of approximately 100 μm is formed at a predetermined location where insulating resin has been formed, using a laser such as an ultraviolet laser. The copper layer 12Bb is exposed on the side of the first through-hole 51.

[0168] Furthermore, at a predetermined location where insulating resin is formed, a second through-hole 52 with a diameter of approximately 100 μm is formed using a laser such as an ultraviolet laser. The anode plate 11 is exposed on the side of the second through-hole 52.

[0169] Figure 14 This is a cross-sectional view schematically illustrating an example of the process of forming the first through-hole conductor and the second through-hole conductor.

[0170] exist Figure 14 In the process shown, the inner circumferential surface of the first through hole 51 is subjected to, for example, non-electrolytic copper plating. Then, electrolytic copper plating is performed. This forms the first through hole conductor 41.

[0171] On the other hand, for the second through-hole 52, for example, after zincate treatment, nickel plating and non-electrolytic copper plating are performed. Then, electrolytic copper plating is performed. This forms the second through-hole conductor 42.

[0172] Figure 15 This is a cross-sectional view schematically illustrating an example of the process of forming the first resin-filled portion and the second resin-filled portion.

[0173] exist Figure 15 In the process shown, a first resin filling portion 61 is formed by embedding insulating resin into a first through hole 51 in which a first through hole conductor 41 is formed, and a second resin filling portion 62 is formed by embedding insulating resin into a second through hole 52 in which a second through hole conductor 42 is formed.

[0174] Figure 16 A and Figure 16 B is a cross-sectional view schematically illustrating an example of the process of forming the first outer electrode layer and the second outer electrode layer.

[0175] exist Figure 16 In process A shown, for the surface of the sealing layer 20, a plating layer 30 is formed, for example, by performing an electrolytic copper plating process. Then, in Figure 16 In the process shown in B, the first external electrode layer 31 and the second external electrode layer 32 are formed by etching the plating layer 30 in a manner that separates the cathode portion and the anode portion.

[0176] After the above processes, the following is obtained Figure 1 Capacitor element 1 is shown.

[0177] Furthermore, if a through-hole is pre-drilled in the anode plate 11 using a laser or similar method and the through-hole is filled with insulating resin, the copper layer 12Bb can also be formed on the entire surface except for the portion where the second through-hole 52 is to be formed. In this case, the outer and inner conductive layers 12B can be connected using a single through-hole conductor.

[0178] Next, as an example of the method for manufacturing a capacitor element according to the second embodiment of this utility model, we will discuss... Figure 3 An example of the manufacturing method of the capacitor element 2 shown will be described.

[0179] Hereinafter, an example of a method for forming the capacitor section 10' in the capacitor element 2 will be described, while the method for forming the capacitor section 10 will be omitted.

[0180] Furthermore, the second capacitor layer 10B of the capacitor section 10' is in Figure 3 Although it may not appear to be functioning, by forming the same through conductors or via conductors as the first capacitor layer 10A, it is possible to form a capacitor of a different size than the first capacitor layer 10A, or to form a second capacitor layer 10B that is independent of the first capacitor layer 10A.

[0181] Figure 17 A is a cross-sectional view schematically illustrating an example of the process of preparing the anode plate in the first capacitor layer. Figure 17 B is a cross-sectional view schematically illustrating an example of the process of preparing the anode plate in the second capacitor layer.

[0182] exist Figure 17 A and Figure 17 In the process shown in B, with Figure 5 The process shown is similar to preparing the anode plate 11 formed from valve-acting metal.

[0183] Figure 18 A is a cross-sectional view schematically illustrating an example of the process of filling the interior of the porous portion in the first capacitor layer with insulating resin. Figure 18 B is a cross-sectional view schematically illustrating an example of the process of filling the interior of the porous portion with insulating resin in the second capacitor layer.

[0184] exist Figure 18 A and Figure 18 In the process shown in B, with Figure 6 The process shown also involves coating an insulating resin, such as polyimide resin, onto a predetermined surface from the upper surface of the porous portion 11B, allowing the insulating resin to penetrate into the interior of the porous portion 11B.

[0185] Figure 19 A is a cross-sectional view schematically illustrating an example of the process of forming through grooves and through holes in the first capacitor layer. Figure 19 B is a cross-sectional view schematically illustrating an example of the process of forming a through-groove in the second capacitor layer.

[0186] exist Figure 19 A and Figure 19 In the process shown in B, a through groove 80 is formed using a laser or the like to separate the capacitor section 10 and the capacitor section 10'.

[0187] Moreover, in Figure 19 In process A, a through-hole 50A is formed in the portion where the first through-hole conductor is to be formed using a laser or the like, and a through-hole 50B is formed in the portion where the second through-hole conductor is to be formed. Preferably, as shown in Figure A... Figure 19As shown, the diameter of the through hole 50A is larger than the diameter of the through hole 50B. Furthermore, Figure 19 The through hole 50B shown does not penetrate the anode plate 11, but is referred to as a "through hole" for convenience.

[0188] Figure 20 A is a cross-sectional view schematically illustrating an example of the process of forming an inner layer of a solid electrolyte layer in the first capacitor layer. Figure 20 B is a cross-sectional view schematically illustrating an example of the process of forming the inner layer of the solid electrolyte layer in the second capacitor layer.

[0189] exist Figure 20 A and Figure 20 In the process shown in B, with Figure 8 The process shown also forms the inner layer 12Aa of the solid electrolyte layer.

[0190] Figure 21 A is a cross-sectional view schematically illustrating an example of the process of forming the outer layer of the solid electrolyte layer in the first capacitor layer. Figure 21 B is a cross-sectional view schematically representing an example of the process of forming the outer layer of the solid electrolyte layer in the second capacitor layer.

[0191] exist Figure 21 A and Figure 21 In the process shown in B, with Figure 9 The process shown forms the outer layer 12Ab of the solid electrolyte layer in the same way. The solid electrolyte layer 12A is formed from the inner layer 12Aa and the outer layer 12Ab.

[0192] Moreover, such as Figure 21 A and Figure 21 As shown in B, insulating resin is applied to the surface of the insulating resin that has penetrated into the porous part 11B, the interior of the through groove 80, the interior of the through hole 50A, and the interior of the through hole 50B, and then cured.

[0193] Figure 22 A is a cross-sectional view schematically illustrating an example of the process of forming a carbon layer that is a conductive layer in the first capacitor layer. Figure 22 B is a cross-sectional view schematically illustrating an example of the process of forming a carbon layer that is a conductive layer in the second capacitor layer.

[0194] exist Figure 22 A and Figure 22 In the process shown in B, with Figure 10 The process shown also forms a carbon layer of 12Ba.

[0195] Moreover, such as Figure 22 A and Figure 22 As shown in B, an insulating resin is applied around the carbon layer 12Ba and then cured.

[0196] Figure 23 A is a cross-sectional view schematically illustrating an example of the process of forming a copper layer as a conductive layer in the first capacitor layer. Figure 23 B is a cross-sectional view schematically illustrating an example of the process of forming a copper layer as a conductive layer in the second capacitor layer.

[0197] exist Figure 23 A and Figure 23 In the process shown in B, with Figure 11 The process shown also forms a copper layer 12Bb. A conductive layer 12B is formed from a carbon layer 12Ba and a copper layer 12Bb.

[0198] Moreover, such as Figure 23 A and Figure 23 As shown in B, an insulating resin is applied around the copper layer 12Bb and allowed to cure. Preferably, the height is adjusted so that the copper layer 12Bb and the insulating resin are as flat as possible.

[0199] have Figure 23 The substrate with the structure shown in Figure A constitutes the first capacitor layer 10A, having Figure 23 The substrate with the structure shown in B constitutes the second capacitor layer 10B.

[0200] Figure 24 This is a cross-sectional view schematically illustrating an example of the process of stacking the first capacitor layer and the second capacitor layer.

[0201] exist Figure 24 In the process shown, the first capacitor layer 10A and the second capacitor layer 10B are stacked with reference to the conductor layer 12B on the back of the watch.

[0202] Moreover, such as Figure 24 As shown, insulating resin sheets such as Ajinomoto laminate (ABF) are laminated onto the surface of the laminate. After lamination, the laminate is placed in a mold and degassed under vacuum, then heat-pressed to cure it. Through the above process, a sealing layer 20 is formed.

[0203] Figure 25 This is a cross-sectional view schematically illustrating an example of the process of forming a passage hole.

[0204] exist Figure 25 In the process shown, at a predetermined position where insulating resin is formed, the laser output is adjusted to form the first via hole 81 to the portion where the conductive layer 12B is exposed up to the center of the substrate.

[0205] In addition, at a predetermined position where insulating resin is formed, the laser output is adjusted to form the second passage hole 82 to the exposed portion of the core 11A of the anode plate 11.

[0206] Additionally, a third via 83 is formed as needed, which is a conductor layer 12B that does not penetrate the surface side of the substrate.

[0207] Figure 26 This is a cross-sectional view schematically illustrating an example of the process of forming the first through-hole conductor, the second through-hole conductor, and the through conductor.

[0208] exist Figure 26 In the process shown, the inner circumferential surface of the first via 81 is subjected to, for example, non-electrolytic copper plating. Then, electrolytic copper plating is performed. This forms the first via conductor 41.

[0209] On the other hand, for the second via 82, for example, after zincate treatment, nickel plating and electroless copper plating are performed. Then, electrolytic copper plating is performed. This forms the second via conductor 42.

[0210] Furthermore, for the third via 83, for example, electrolytic copper plating is performed after non-electrolytic copper plating. This forms the via conductor 70.

[0211] Figure 27 This is a cross-sectional view schematically illustrating an example of the process of forming the first resin-filled portion and the second resin-filled portion.

[0212] exist Figure 27 In the process shown, a first resin filling portion 61 is formed by embedding insulating resin into a first through hole 81 in which a first through hole conductor 41 is formed, and a second resin filling portion 62 is formed by embedding insulating resin into a second through hole 82 in which a second through hole conductor 42 is formed.

[0213] Figure 28 A and Figure 28 B is a cross-sectional view schematically illustrating an example of the process of forming the first outer electrode layer and the second outer electrode layer.

[0214] exist Figure 28 In process A shown, for the surface of the sealing layer 20, a plating layer 30 is formed, for example, by performing an electrolytic copper plating process. Then, in Figure 28 In the process shown in B, the first external electrode layer 31 and the second external electrode layer 32 are formed by etching the plating layer 30 in a manner that separates the cathode portion and the anode portion.

[0215] After the above processes, the following is obtained Figure 3 Capacitor element 2 is shown.

[0216] Furthermore, for the portion where the capacitor is disconnected, it is preferable, for example, to process it in a way that is not completely disconnected, after cutting along the X direction and then filling it with resin, and then cutting along the Y direction and then filling it with resin.

[0217] The following is a detailed description of the structure of capacitor elements 1 and 2.

[0218] The planar shape of the capacitor section 10 when viewed from the thickness direction can be, for example, a rectangle (square or rectangular), a quadrilateral other than a rectangle, a polygon such as a triangle, a pentagon, or a hexagon, a circle, an ellipse, or a combination of these shapes. Additionally, the planar shape of the capacitor section 10 can also be L-shaped, C-shaped, or stepped. The same applies to the capacitor section 10' below.

[0219] Preferably, the anode plate 11 is formed of a valve-acting metal that performs the valve function. Examples of valve-acting metals include individual metals such as aluminum, tantalum, niobium, titanium, and zirconium, or alloys containing at least one of these metals. Among these, aluminum or an aluminum alloy is preferred.

[0220] The anode plate 11 is preferably flat, and more preferably foil-shaped. Thus, in this specification, "plate-shaped" also includes "foil-shaped".

[0221] The anode plate 11 only needs to have a porous portion 11B on at least one main surface of the core 11A. That is, the anode plate 11 may have a porous portion 11B on only one main surface of the core 11A, or it may have a porous portion 11B on both main surfaces of the core 11A. The porous portion 11B is preferably a porous layer formed on the surface of the core 11A, and more preferably an etched layer.

[0222] The thickness of the anode plate 11 before etching is preferably 60 μm or more and 200 μm or less. The thickness of the unetched core 11A after etching is preferably 15 μm or more and 70 μm or less. The thickness of the porous portion 11B is designed to match the required voltage withstand and electrostatic capacitance, but preferably, the total thickness of the porous portions 11B on both sides of the core 11A is 10 μm or more and 180 μm or less.

[0223] The pore size of the porous portion 11B is preferably 10 nm or more and 600 nm or less. Furthermore, the pore size of the porous portion 11B refers to the median particle size D50 measured using a mercury porosimeter. The pore size of the porous portion 11B can be controlled, for example, by adjusting various conditions during etching.

[0224] The dielectric layer 13 disposed on the surface of the porous portion 11B reflects the surface state of the porous portion 11B and becomes porous, having a finely textured surface shape. Preferably, the dielectric layer 13 is composed of an oxide film of the valve-acting metal described above. For example, when using aluminum foil as the anode plate 11, an oxide film-composed dielectric layer 13 can be formed by anodizing the surface of the aluminum foil in an aqueous solution containing ammonium adipate or the like (also known as chemical conversion treatment).

[0225] The thickness of the dielectric layer 13 is designed to match the required voltage withstand and electrostatic capacitance, but is preferably 10 nm or more and 100 nm or less.

[0226] Materials constituting the solid electrolyte layer 12A included in the cathode layer 12 include, for example, conductive polymers such as polypyrrole, polythiophene, and polyaniline. Among these, polythiophene is preferred, and poly(3,4-ethylenedioxythiophene) known as PEDOT is particularly preferred. Furthermore, the aforementioned conductive polymers may also contain dopants such as polystyrene sulfonic acid (PSS). Moreover, it is preferable that the solid electrolyte layer 12A comprises an inner layer filling the pores (recesses) of the dielectric layer 13 and an outer layer covering the dielectric layer 13.

[0227] The thickness of the solid electrolyte layer 12A from the surface of the porous portion 11B is preferably 2 μm or more and 20 μm or less.

[0228] The solid electrolyte layer 12A is formed, for example, by using a treatment solution containing monomers such as 3,4-ethylenedioxythiophene to form a polymer film such as poly(3,4-ethylenedioxythiophene) on the surface of the dielectric layer 13, or by coating a dispersion of polymers such as poly(3,4-ethylenedioxythiophene) onto the surface of the dielectric layer 13 and drying it.

[0229] The solid electrolyte layer 12A can be formed in a predetermined area by applying the above-mentioned processing liquid or dispersion to the surface of the dielectric layer 13 using methods such as sponge transfer, screen printing, distributor coating, inkjet printing, etc.

[0230] When the cathode layer 12 includes a conductive layer 12B, the conductive layer 12B comprises at least one of a conductive resin layer and a metal layer. The conductive layer 12B may be only a conductive resin layer or only a metal layer. Preferably, the conductive layer 12B covers the entire surface of the solid electrolyte layer 12A.

[0231] Examples of conductive resin layers include conductive adhesive layers comprising at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler, and carbon filler.

[0232] Examples of metal layers include metal coatings and metal foils. Preferably, the metal layer is formed of at least one metal selected from the group consisting of nickel, copper, silver, and alloys of these metals as the main components. Furthermore, "main component" refers to the element with the largest weight percentage.

[0233] The conductive layer 12B may include, for example, a carbon layer disposed on the surface of the solid electrolyte layer 12A and a copper layer disposed on the surface of the carbon layer.

[0234] The carbon layer is provided to enable electrical and mechanical connection between the solid electrolyte layer 12A and the copper layer. The carbon layer is formed in a predetermined area by applying carbon paste to the surface of the solid electrolyte layer 12A using methods such as sponge transfer, screen printing, dispenser coating, or inkjet printing. The thickness of the carbon layer is preferably 2 μm or more and 20 μm or less.

[0235] The copper layer can be formed in a predetermined area by applying copper paste to the surface of the carbon layer using methods such as sponge transfer, screen printing, spray coating, dispenser coating, and inkjet printing. The thickness of the copper layer is preferably 2 μm or more and 20 μm or less.

[0236] Preferably, the sealing layer 20 contains an insulating resin.

[0237] Insulating resins contained in the sealing layer 20 include, for example, epoxy resin and phenolic resin.

[0238] Preferably, the sealing layer 20 also contains inorganic fillers.

[0239] Inorganic fillers contained in the sealing layer 20 include, for example, silica particles and alumina particles.

[0240] Alternatively, a stress-relieving layer, a moisture-proof membrane, or other layer may be provided between the capacitor section 10 and the sealing layer 20.

[0241] Alternatively, an insulating shielding layer may be provided around the first through-hole conductor 41 or the second through-hole conductor 42 on at least one main surface of the anode plate 11. Alternatively, an insulating shielding layer may be provided on at least one main surface of the anode plate 11 in a manner that surrounds the cathode layer 12.

[0242] The insulating shielding layer is made of an insulating material. In this case, it is preferable that the insulating shielding layer is made of an insulating resin.

[0243] Examples of insulating resins constituting the insulating shielding layer include polyphenylsulfone resin, polyethersulfone resin, cyanate resin, fluoropolymer (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, etc.), polyimide resin, polyamide-imide resin, epoxy resin, and their derivatives or precursors.

[0244] Alternatively, the insulating shielding layer may be made of the same resin as the sealing layer 20. If the insulating shielding layer contains inorganic fillers instead of the sealing layer 20, it may adversely affect the effective capacitance of the capacitor section 10. Therefore, it is preferable that the insulating shielding layer is made of a different type of resin.

[0245] An insulating shielding layer can be formed in a predetermined area by applying a shielding material, such as a composition containing an insulating resin, to the surface of the porous portion 11B using methods such as sponge transfer, screen printing, dispenser coating, or inkjet printing.

[0246] The insulating shielding layer can be formed in the porous portion 11B either before or after the dielectric layer 13.

[0247] The first external electrode layer 31 is electrically connected to the cathode layer 12. Figure 1 In the example shown, the first external electrode layer 31 is provided on the surface of the first through-hole conductor 41 and functions as a connection terminal of the capacitor section 10.

[0248] As a constituent material of the first external electrode layer 31, examples include metallic materials containing low-resistivity metals such as silver, gold, and copper. In this case, the first external electrode layer 31 is formed, for example, by plating the surface of the first through-hole conductor 41.

[0249] In order to improve the tightness of the first external electrode layer 31 with other components, and to improve the tightness of the first external electrode layer 31 with the first through-hole conductor 41, a mixture of at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler and carbon filler and resin may be used as the constituent material of the first external electrode layer 31.

[0250] The second external electrode layer 32 is electrically connected to the anode plate 11. Figure 1 In the example shown, the second external electrode layer 32 is disposed on the surface of the second through-hole conductor 42, and functions as a connection terminal of the capacitor section 10. Figure 1 In the example shown, the second external electrode layer 32 is electrically connected to the anode plate 11 via the second through-hole conductor 42, and functions as a connection terminal for the anode plate 11.

[0251] As a constituent material of the second external electrode layer 32, examples include metallic materials containing low-resistivity metals such as silver, gold, and copper. In this case, the second external electrode layer 32 is formed, for example, by plating the surface of the second through-hole conductor 42.

[0252] To improve the tightness of the second external electrode layer 32 with other components, and to improve the tightness of the second external electrode layer 32 with the second through-hole conductor 42, a mixture of at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler and carbon filler and resin may be used as the constituent material of the second external electrode layer 32.

[0253] The materials constituting the first outer electrode layer 31 and the second outer electrode layer 32 are preferably the same as each other, at least in terms of type, but they may also be different from each other.

[0254] When multiple capacitor sections are arranged in a planar direction, a first external electrode layer 31 electrically connected to the cathode layer 12 and a second external electrode layer 32 electrically connected to the anode plate 11 can be provided in each capacitor section, or at least one of the first external electrode layer 31 and the second external electrode layer 32 can be provided in a manner that is common to multiple capacitor sections.

[0255] The first external electrode layer 31 can be disposed on both main surfaces of the sealing layer 20, or only on one main surface of the sealing layer 20. Similarly, the second external electrode layer 32 can be disposed on both main surfaces of the sealing layer 20, or only on one main surface of the sealing layer 20. The first external electrode layer 31 and the second external electrode layer 32 can be disposed on the same main surface of the sealing layer 20, or on different main surfaces. For example, one of the first external electrode layer 31 and the second external electrode layer 32 can be disposed on both main surfaces of the sealing layer 20, and the other can be disposed on only one main surface of the sealing layer 20.

[0256] When the first through-hole conductor 41 is electrically connected to the cathode layer 12 at the inner wall surface of the first through-hole 51, it is preferable that the first through-hole conductor 41 and the end face of the conductive layer 12B facing the inner wall surface of the first through-hole 51 in the planar direction are electrically connected. Thus, the cathode layer 12 is electrically discharged to the outside via the first through-hole conductor 41.

[0257] Preferably, when viewed from the thickness direction, the first via conductor 41 is electrically connected to the conductive layer 12B over the entire circumference of the first through-hole 51. In this case, the connection resistance between the conductive layer 12B and the first via conductor 41 is easily reduced, and therefore the equivalent series resistance (ESR) is easily reduced.

[0258] When the second through-hole conductor 42 is electrically connected to the anode plate 11 at the inner wall surface of the second through-hole 52, it is preferable that the second through-hole conductor 42 and the end face of the anode plate 11 facing the inner wall surface of the second through-hole 52 in the planar direction are electrically connected. Thus, the anode plate 11 is electrically discharged to the outside via the second through-hole conductor 42.

[0259] Preferably, the core 11A and the porous portion 11B are exposed on the end face of the anode plate 11, which is electrically connected to the second through-hole conductor 42. In this case, the porous portion 11B is also electrically connected to the second through-hole conductor 42, in addition to the core 11A.

[0260] Preferably, when viewed from the thickness direction, the second through-hole conductor 42 is electrically connected to the anode plate 11 over the entire circumference of the second through-hole 52. In this case, the connection resistance between the anode plate 11 and the second through-hole conductor 42 is easily reduced, and therefore the equivalent series resistance (ESR) is easily reduced.

[0261] The first through-hole conductor 41 is formed as follows: First, a through-hole penetrating the capacitor portion 10 in the thickness direction is formed by drilling, laser processing, or the like. Next, an insulating material is filled into the through-hole. The first through-hole 51 is formed by drilling, laser processing, or the like in the portion filled with the insulating material. At this time, the diameter of the first through-hole 51 is made smaller than the diameter of the through-hole filled with the insulating material, so that there is an insulating material between the inner wall surface of the previously formed through-hole and the inner wall surface of the first through-hole 51 in the planar direction. Then, the inner wall surface of the first through-hole 51 is metallized using a metal material containing low-resistance metals such as copper, gold, or silver to form the first through-hole conductor 41. When forming the first through-hole conductor 41, for example, the inner wall surface of the first through-hole 51 is metallized by electroless copper plating or electrolytic copper plating, which makes processing easier. In addition, regarding the method of forming the first through-hole conductor 41, besides the method of metallizing the inner wall surface of the first through-hole 51, it is also possible to fill the first through-hole 51 with a metal material, a metal-resin composite material, etc.

[0262] The second through-hole conductor 42 is formed, for example, as follows: First, a second through-hole 52 penetrating the capacitor portion 10 and the sealing layer 20 in the thickness direction is formed by drilling, laser processing, or the like. Then, the inner wall surface of the second through-hole 52 is metallized using a metal material containing low-resistance metals such as copper, gold, or silver to form the second through-hole conductor 42. When forming the second through-hole conductor 42, for example, by using electroless copper plating or electrolytic copper plating to metallize the inner wall surface of the second through-hole 52, the processing becomes easier. Furthermore, regarding the method of forming the second through-hole conductor 42, in addition to metallizing the inner wall surface of the second through-hole 52, it is also possible to fill the second through-hole 52 with a metal material, a metal-resin composite material, or the like.

[0263] Alternatively, an anode connection layer may be provided between the anode plate 11 and the second through-hole conductor 42 in the planar direction. That is, the anode plate 11 and the second through-hole conductor 42 may be electrically connected via the anode connection layer.

[0264] An anode connection layer is disposed in the planar direction between the anode plate 11 and the second through-hole conductor 42. The anode connection layer functions as a barrier layer against the anode plate 11, and more specifically, as a barrier layer against the core 11A and the porous portion 11B. If the anode connection layer functions as a barrier layer against the anode plate 11, the dissolution of the anode plate 11 caused by the chemical solution used to form the second external electrode layer 32 and other external electrode layers is suppressed, thereby suppressing the penetration of the chemical solution into the capacitor portion 10, and thus the reliability is easily improved.

[0265] Preferably, the anode bonding layer comprises a layer with nickel as the main component. In this case, damage to the metal constituting the anode plate 11 (e.g., aluminum) is reduced, and thus the barrier properties of the anode bonding layer against the anode plate 11 are easily improved.

[0266] Alternatively, in the planar direction, no anode connection layer may be provided between the anode plate 11 and the second through-hole conductor 42. In this case, the second through-hole conductor 42 may also be directly connected to the end face of the anode plate 11.

[0267] As a constituent material of the conductor 70, examples include metallic materials containing low-resistance metals such as silver, gold, and copper.

[0268] The through conductor 70 is formed, for example, by plating the inner wall surface of the through hole that penetrates the sealing layer 20 in the thickness direction with the aforementioned metal material or by heat treatment after filling with conductive paste.

[0269] The capacitor element of this utility model is not limited to the above-described embodiments. Various applications and modifications can be applied to the structure and manufacturing conditions of the capacitor element within the scope of this utility model.

[0270] In the capacitor element of this invention, when multiple capacitor sections are arranged in a planar direction, it is sufficient that the conductive layer in the first capacitor layer opposite to the second capacitor layer and the conductive layer in the second capacitor layer opposite to the first capacitor layer are shared in at least one capacitor section.

[0271] In the capacitor element of this invention, the capacitor section may include three or more capacitor layers. For example, in addition to the first and second capacitor layers, the capacitor section may also include a third capacitor layer opposite the first capacitor layer in the thickness direction. In this case, it is preferable that the conductive layer in the first capacitor layer opposite the third capacitor layer and the conductive layer in the third capacitor layer opposite the first capacitor layer are shared. Similarly, in addition to the first and second capacitor layers, the capacitor section may also include a fourth capacitor layer opposite the second capacitor layer in the thickness direction. In this case, it is preferable that the conductive layer in the second capacitor layer opposite the fourth capacitor layer and the conductive layer in the fourth capacitor layer opposite the second capacitor layer are shared.

[0272] Alternatively, in the capacitor element of this invention, when multiple capacitor sections are arranged in a planar direction, a capacitor section may include only one of the first capacitor layer and the second capacitor layer.

[0273] The capacitor element of this invention can be appropriately used as a constituent material of composite electronic components. Such composite electronic components include, for example: the capacitor element of this invention; an external electrode layer disposed on the surface of the sealing layer of the capacitor element and electrically connected to the anode plate and cathode layer of the capacitor element, respectively; and an electronic component connected to the external electrode layer.

[0274] In composite electronic components, the electronic components connected to the external electrode layer can be either passive or active components. This can be either both passive and active components connected to the external electrode layer, or either only one of them. Alternatively, a combination of passive and active components can be connected to the external electrode layer.

[0275] Examples of passive components include inductors. Examples of active components include memory, GPUs (Graphics Processing Units), CPUs (Central Processing Units), MPUs (Micro Processing Units), and PMICs (Power Management Integrated Circuits).

[0276] The capacitor element of this invention has an overall sheet-like shape. Therefore, in composite electronic components, the capacitor element can be treated like a mounting substrate, and electronic components can be mounted on the capacitor element. Moreover, by making the shape of the electronic components mounted on the capacitor element sheet-like, the capacitor element and the electronic components can be connected in the thickness direction via through-hole conductors penetrating each electronic component. As a result, active and passive components can be configured into modules in batches.

[0277] For example, the capacitor element of this invention can be electrically connected between a voltage regulator containing a semiconductor active element and a load supplied with converted DC voltage to form a switching regulator.

[0278] In composite electronic components, the capacitor element of this invention may be further arranged with a plurality of capacitor matrix sheets forming a circuit layer on any one side, and then connected to passive or active components.

[0279] Alternatively, the capacitor element of this invention can be disposed in a cavity pre-formed in the substrate, and after being embedded in resin, a circuit layer can be formed on the resin. Alternatively, other electronic components (passive or active components) can be mounted in other cavities of the substrate.

[0280] Alternatively, the capacitor element of this invention can be mounted on a smooth carrier such as a wafer or glass, and a circuit layer can be formed after the outer layer is formed with resin, and then connected to passive or active components.

[0281] The following information is disclosed in this specification.

[0282] <1>

[0283] A capacitor element, wherein,

[0284] The capacitor element includes:

[0285] A capacitor section comprising a first capacitor layer and a second capacitor layer opposed in the thickness direction; and

[0286] A sealing layer is provided such that it covers at least one main surface of the capacitor portion.

[0287] Both the first capacitor layer and the second capacitor layer comprise: an anode plate having a porous portion on at least one main surface of its core; a dielectric layer disposed on the surface of the porous portion; and a cathode layer disposed on the surface of the dielectric layer.

[0288] The cathode layer comprises: a solid electrolyte layer disposed on the surface of the dielectric layer; and a conductive layer disposed on the surface of the solid electrolyte layer.

[0289] The conductive layer in the first capacitor layer opposite to the second capacitor layer and the conductive layer in the second capacitor layer opposite to the first capacitor layer are shared.

[0290] <2>

[0291] According to the capacitor element described in <1>, among which,

[0292] The capacitor element further includes a first external electrode layer, which is disposed on at least one main surface of the sealing layer in a manner electrically connected to the cathode layers of the first capacitor layer and the second capacitor layer.

[0293] When viewed from above in the thickness direction, the first outer electrode layer is configured to overlap at least partially with the shared conductor layer.

[0294] <3>

[0295] According to the capacitor element described in <2>, among which,

[0296] When viewed from the thickness direction, the area of ​​the portion of the first external electrode layer on any main surface of the sealing layer that overlaps with the shared conductive layer is 50% or more of the area of ​​the shared conductive layer.

[0297] <4>

[0298] According to the capacitor element described in <2> or <3>, wherein,

[0299] The capacitor element further includes a first through-hole conductor, which is disposed on at least the inner wall surface of a first through-hole that penetrates the capacitor portion and the sealing layer in the aforementioned thickness direction and is electrically connected to the aforementioned first external electrode layer.

[0300] The first through-hole conductor is electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer at the inner wall surface of the first through-hole.

[0301] <5>

[0302] According to the capacitor element described in <1>, among which,

[0303] The capacitor element also includes:

[0304] A first external electrode layer is disposed on at least one main surface of the sealing layer in a manner electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer; and

[0305] A second external electrode layer is disposed on at least one main surface of the sealing layer in a manner electrically connected to the anode plate of the first capacitor layer and the anode plate of the second capacitor layer.

[0306] When viewed from above in the thickness direction, at least one of the first external electrode layer and the second external electrode layer is configured to overlap at least partially with the shared conductor layer.

[0307] <6>

[0308] According to the capacitor element described in <5>, among which,

[0309] When viewed from above in the thickness direction, the total area of ​​all the first and second external electrode layers provided on any main surface of the sealing layer is more than 50% of the area surrounded by the outer periphery of the sealing layer.

[0310] <7>

[0311] According to the capacitor element described in <5> or <6>, among which,

[0312] The capacitor element also includes:

[0313] A first through-hole conductor, disposed at least on the inner wall surface of a first through-hole that penetrates the capacitor portion and the sealing layer in the aforementioned thickness direction, and electrically connected to the aforementioned first external electrode layer; and

[0314] The second through-hole conductor is disposed on at least the inner wall surface of the second through-hole that penetrates the capacitor portion and the sealing layer in the aforementioned thickness direction, and is electrically connected to the aforementioned second external electrode layer.

[0315] The first through-hole conductor is electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer at the inner wall surface of the first through-hole.

[0316] The second through-hole conductor is electrically connected to the anode plate of the first capacitor layer and the anode plate of the second capacitor layer at the inner wall surface of the second through-hole.

[0317] <8>

[0318] According to any one of <1> to <7>, the capacitor element described therein,

[0319] The area of ​​the capacitance portion in the first capacitor layer is different from the area of ​​the capacitance portion in the second capacitor layer.

[0320] Explanation of reference numerals in the attached figures

[0321] 1, 2, Capacitor element; 10, 10', Capacitor section; 10A, First capacitor layer; 10B, Second capacitor layer; 11, Anode plate; 11A, Core; 11B, Porous section; 12, Cathode layer; 12A, Solid electrolyte layer; 12Aa, Inner layer of solid electrolyte layer; 12Ab, Outer layer of solid electrolyte layer; 12B, Conductor layer; 12Ba, Carbon layer; 12Bb, Copper layer; 13, Dielectric layer; 20. Sealing layer; 30. Plating layer; 31. First external electrode layer; 32. Second external electrode layer; 41. First through-hole conductor; 42. Second through-hole conductor; 50A, 50B. Through-hole; 51. First through-hole; 52. Second through-hole; 61. First resin filling part; 62. Second resin filling part; 70. Passage conductor; 80. Through groove; 81. First passage hole; 82. Second passage hole; 83. Third passage hole.

Claims

1. A capacitor element, characterized in that, The capacitor element includes: A capacitor section comprising a first capacitor layer and a second capacitor layer opposed in the thickness direction; and A sealing layer is provided such that it covers at least one main surface of the capacitor portion. The first capacitor layer and the second capacitor layer each comprise: an anode plate having a porous portion on at least one main surface of its core; a dielectric layer disposed on the surface of the porous portion; and a cathode layer disposed on the surface of the dielectric layer. The cathode layer comprises: a solid electrolyte layer disposed on the surface of the dielectric layer; and a conductive layer disposed on the surface of the solid electrolyte layer. The conductive layer in the first capacitor layer opposite to the second capacitor layer and the conductive layer in the second capacitor layer opposite to the first capacitor layer are shared. The capacitor element further includes a first external electrode layer, which is disposed on at least one main surface of the sealing layer in a manner electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer. When viewed from above in the thickness direction, the first outer electrode layer is configured to overlap at least partially with the shared conductor layer.

2. The capacitor element according to claim 1, characterized in that, When viewed from the thickness direction, the area of ​​the portion of the first external electrode layer that overlaps with the common conductor layer in the area of ​​any main surface of the sealing layer is more than 50% of the area of ​​the common conductor layer.

3. The capacitor element according to claim 1 or 2, characterized in that, The capacitor element further includes a first through-hole conductor, which is disposed on at least the inner wall surface of a first through-hole that penetrates the capacitor portion and the sealing layer in the thickness direction and is electrically connected to the first external electrode layer. The first through-hole conductor is electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer at the inner wall surface of the first through-hole.

4. The capacitor element according to claim 1, characterized in that, The capacitor element also includes: A first external electrode layer is disposed on at least one main surface of the sealing layer in a manner electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer; and A second external electrode layer is disposed on at least one main surface of the sealing layer in a manner electrically connected to the anode plate of the first capacitor layer and the anode plate of the second capacitor layer. When viewed from above in the thickness direction, at least one of the first external electrode layer and the second external electrode layer is configured to at least partially overlap with the shared conductor layer.

5. The capacitor element according to claim 4, characterized in that, When viewed from the thickness direction, the total area of ​​all the first and second external electrode layers on any main surface of the sealing layer is more than 50% of the area surrounded by the outer periphery of the sealing layer.

6. The capacitor element according to claim 4 or 5, characterized in that, The capacitor element also includes: A first through-hole conductor, disposed on at least the inner wall surface of a first through-hole penetrating the capacitor portion and the sealing layer in the thickness direction, is electrically connected to the first external electrode layer; and A second through-hole conductor, disposed on at least the inner wall surface of a second through-hole penetrating the capacitor portion and the sealing layer in the thickness direction, is electrically connected to the second external electrode layer. The first through-hole conductor is electrically connected to the cathode layer of the first capacitor layer and the cathode layer of the second capacitor layer at the inner wall surface of the first through-hole. The second through-hole conductor is electrically connected to the anode plate of the first capacitor layer and the anode plate of the second capacitor layer at the inner wall surface of the second through-hole.

7. The capacitor element according to claim 1 or 2, characterized in that, The area of ​​the capacitance portion in the first capacitor layer is different from the area of ​​the capacitance portion in the second capacitor layer.

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