Heat dissipation type circuit board

Abstract

The utility model is suitable for the technical field of circuit boards, and provides a heat dissipation type circuit board, which comprises a circuit board provided with a plurality of components. The heating element is arranged on the circuit board, a heat conduction silica gel sheet is arranged on the heating element, and a cooling fin is arranged on the heat conduction silica gel sheet; the mounting rack is detachably mounted on the circuit board; and the automatic heat dissipation mechanism is arranged on the mounting rack and is used for helping the automatic heat dissipation of the circuit board. According to the heat dissipation type circuit board provided by the scheme, the heat transfer efficiency is effectively improved, and the generated heat can be quickly and uniformly dissipated and is discharged through the heat dissipation mechanism, so that stable operation and long service life of equipment are ensured.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, and in particular relates to a heat dissipation circuit board. Background Technology

[0002] A circuit board, also known as a printed circuit board (PCB), is a substrate used to connect and support electronic components. It has conductive lines and mounting positions for electronic components printed on it.

[0003] In use, existing circuit boards often suffer from overheating due to their lack of proper heat dissipation. This can lead to issues such as internal circuitry overheating or excessively high chip temperatures, resulting in aging and corrosion that negatively impact long-term use. Utility Model Content

[0004] This utility model provides a heat-dissipating circuit board, which aims to solve the problem that existing circuit boards mentioned in the background art do not have good heat dissipation function and are prone to internal circuit overheating or excessively high temperature of the mounted chips.

[0005] To solve the above problems, this utility model is implemented as follows: a heat-dissipating circuit board, comprising: a circuit board on which multiple components are disposed; a heating element disposed on the circuit board, the heating element having a thermally conductive silicone pad, and the thermally conductive silicone pad having a heat sink; a mounting bracket detachably mounted on the circuit board; and an automatic heat dissipation mechanism disposed on the mounting bracket for assisting the circuit board in automatic heat dissipation.

[0006] Preferably, the automatic heat dissipation mechanism includes a channel, a micro fan, and two dust screens. The channel is opened on the mounting frame, the micro fan is fixedly installed in the channel, and the two dust screens are respectively located on the top and bottom openings of the channel.

[0007] Preferably, connecting plates are fixedly installed on both sides of the circuit board, and mounting holes for installation are provided on both connecting plates.

[0008] Preferably, guide rods are fixedly installed on both sides of the mounting bracket, and clamps for connecting to the connecting plate are slidably installed on the guide rods.

[0009] Preferably, a fixing seat is fixedly installed on the connecting plate, and a slot is provided on the fixing seat, which is engaged with the locking rod.

[0010] Preferably, a spring is fixedly mounted on one side of the mounting bracket, and one side of the spring is fixed to the clamping rod.

[0011] Preferably, a plate is fixedly mounted on the heat sink, and a fixing bolt is threaded onto the plate, the thread of the fixing bolt penetrating the thermally conductive silicone sheet of the heating element.

[0012] Compared with related technologies, the heat-dissipating circuit board provided by this utility model has the following beneficial effects:

[0013] Compared with existing technologies, the heat-dissipating circuit board provided by this solution achieves a more efficient, stable, and flexible heat dissipation effect overall, effectively improving the heat transfer efficiency, enabling the generated heat to be dissipated quickly and evenly, and discharged through the heat dissipation mechanism, thereby ensuring the stable operation and long life of the equipment. It can be applied to various types of heat-generating components and heat dissipation needs, providing strong support for the efficient heat dissipation of electronic devices. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the main structure of a heat-dissipating circuit board provided by this utility model;

[0015] Figure 2 This is a schematic diagram of the main cross-sectional structure of a heat-dissipating circuit board provided by this utility model;

[0016] Figure 3 for Figure 2 An enlarged structural diagram of part A shown in the figure;

[0017] Figure 4 for Figure 2 An enlarged structural diagram of part B shown in the figure;

[0018] Figure 5 for Figure 2 The diagram shows an enlarged view of section C.

[0019] Reference numerals: 1. Circuit board; 2. Component; 3. Heating element; 4. Thermal conductive silicone pad; 5. Heat sink; 6. Mounting bracket; 7. Through slot; 8. Miniature fan; 9. Dustproof net; 10. Connecting plate; 11. Mounting hole; 12. Guide rod; 13. Locking rod; 14. Fixing base; 15. Slot; 16. Spring; 17. Insert plate; 18. Fixing bolt. Detailed Implementation

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings are used to distinguish different objects, not to describe a particular order; the terms "inner," "outer," "left," and "right" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0021] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0022] This utility model embodiment provides a heat-dissipating circuit board, such as Figure 1-5 As shown, the heat-dissipating circuit board includes: a circuit board 1, on which multiple components 2 are disposed; a heating element 3, which is disposed on the circuit board 1, and a thermally conductive silicone sheet 4 is disposed on the thermally conductive silicone sheet 4, and a heat sink 5 is disposed on the thermally conductive silicone sheet 4; a mounting bracket 6, which is detachably mounted on the circuit board 1; and an automatic heat dissipation mechanism, which is disposed on the mounting bracket 6 and is used to help the circuit board 1 dissipate heat automatically.

[0023] In this embodiment, the circuit board 1 serves as the basic circuit board, on which multiple components 2 are mounted. These components 2 may include electronic components such as resistors, capacitors, and diodes. The heat-generating components 3 refer to those components on the circuit board 1 that easily generate heat, such as high-power resistors and integrated circuits. To improve heat dissipation, these heat-generating components 3 are provided with thermally conductive silicone pads 4. The thermally conductive silicone pads 4 are made of a material with high thermal conductivity and good flexibility, allowing them to adhere tightly to the heat-generating components 3 and effectively transfer heat to the next stage of the heat dissipation structure. Heat sinks 5 are mounted on the thermally conductive silicone pads 4, increasing the heat dissipation area and the contact area with air to improve heat dissipation efficiency. Heat sinks 5 typically... Made of metal, such as aluminum or copper, due to their good thermal conductivity, the mounting bracket 6 is a detachable structure mounted on the circuit board 1. It supports and secures the subsequent automatic heat dissipation mechanism. The detachable design of the mounting bracket 6 makes the automatic heat dissipation mechanism easy to install, replace, and maintain, reducing maintenance costs. The automatic heat dissipation mechanism, mounted on the mounting bracket 6, can automatically start or stop according to the temperature changes of the circuit board 1, helping the circuit board 1 to dissipate heat more effectively. Effective heat dissipation can extend the service life of components 2, reduce failures and damage caused by overheating, and reduce temperature fluctuations, thereby improving the stability of the entire electronic system and reducing performance degradation or failures caused by temperature.

[0024] In a further preferred embodiment of the present invention, the automatic heat dissipation mechanism includes a through groove 7, a miniature fan 8, and two dustproof nets 9. The through groove 7 is opened on the mounting bracket 6, the miniature fan 8 is fixedly installed in the through groove 7, and the two dustproof nets 9 are respectively provided on the top and bottom openings of the through groove 7.

[0025] In this embodiment, the through slot 7 is a channel formed on the mounting bracket 6 to accommodate and fix the miniature fan 8, allowing the airflow of the miniature fan 8 to pass smoothly and effectively dissipate heat from the circuit board 1. The miniature fan 8 is a small fan that can automatically start or stop according to the signal from the temperature sensor. By generating airflow, it accelerates the airflow around the circuit board 1, thereby removing more heat and improving heat dissipation efficiency, enabling the circuit board 1 to operate stably under higher loads. To prevent dust and debris from entering the through slot 7 and affecting the operation of the miniature fan 8, dustproof nets 9 are respectively provided on the top and bottom openings of the through slot 7. The dustproof nets 9 effectively prevent dust and debris from entering the through slot 7, protecting the operation of the miniature fan 8. At the same time, they can block dust and ensure smooth airflow, ensuring heat dissipation.

[0026] In a further preferred embodiment of the present invention, connecting plates 10 are fixedly installed on both sides of the circuit board 1, and mounting holes 11 for installation are provided on both connecting plates 10.

[0027] In this embodiment, two connecting plates 10 are fixedly installed on both sides of the circuit board 1. Their main function is to provide additional support and fixing points, so that the circuit board 1 can be installed more stably in the equipment or frame. Each connecting plate 10 has mounting holes 11 for installation, so that the circuit board 1 can be fixed in the required position using fasteners such as screws and bolts. The position and number of mounting holes 11 are usually customized according to the actual application requirements to ensure that the circuit board 1 can be installed stably and firmly.

[0028] In a further preferred embodiment of the present invention, guide rods 12 are fixedly installed on both sides of the mounting bracket 6, and clamping rods 13 for connecting to the connecting plate 10 are slidably installed on the guide rods 12.

[0029] In this embodiment, two guide rods 12 are fixedly installed on both sides of the mounting frame 6. Their main function is to provide a track for the sliding of the clamping rod 13, ensuring that the clamping rod 13 can move smoothly and accurately to the position connected to the connecting plate 10. The design of the guide rods 12 enhances the stability and reliability of the connection between the mounting frame 6 and the circuit board 1. By sliding the clamping rod 13, the mounting frame 6 and the circuit board 1 can be easily installed and disassembled.

[0030] In a further preferred embodiment of the present invention, a fixing seat 14 is fixedly installed on the connecting plate 10, and a slot 15 is provided on the fixing seat 14, which is engaged with the locking rod 13.

[0031] In this embodiment, the fixing seat 14 is fixed on the connecting plate 10 and is used to provide a slot 15 for engaging with the locking rod 13. The slot 15 is an opening in the fixing seat 14 for engaging with the locking rod 13. The shape and size of the slot 15 are usually matched with the head of the locking rod 13 to ensure that the locking rod 13 can slide smoothly into and be fixed in the slot 15, thereby realizing the installation between the mounting bracket 6 and the connecting plate 10.

[0032] In a further preferred embodiment of the present invention, a spring 16 is fixedly mounted on one side of the mounting bracket 6, and one side of the spring 16 is fixed to the clamping rod 13.

[0033] In this embodiment, the spring 16 is an elastic element fixed to one side of the mounting bracket 6, used to provide elastic force to push or pull the lever 13. One side of the spring 16 is fixedly connected to the mounting bracket 6, and the other side is fixedly connected to the lever 13. This connection method allows the spring 16 to provide continuous elastic force when the lever 13 slides on the guide rod 12, helping the lever 13 to maintain a stable sliding state. At the same time, when the lever 13 needs to be engaged into the slot 15, the elastic force of the spring 16 can also push the lever 13 to engage more tightly with the slot 15, thereby improving the connection's firmness, reducing the risk of loosening due to vibration or impact, and improving the stability and reliability of the entire circuit board 1. The elastic force of the spring 16 allows the lever 13 to maintain a certain tension during sliding, thus facilitating installation and disassembly operations by the user. At the same time, when the mounting bracket 6 needs to be disassembled, the user only needs to overcome the elastic force of the spring 16 to easily pull the lever 13 out of the slot 15.

[0034] In a further preferred embodiment of this utility model, a plug plate 17 is fixedly installed on the heat sink 5, and a fixing bolt 18 is threadedly installed on the plug plate 17. The fixing bolt 18 is threaded through the thermally conductive silicone sheet 4 of the heating element 3.

[0035] In this embodiment, the insert plate 17 is a structure fixed to the heat sink 5. It is usually designed as a plate to provide a base for installation and fixation. The position and size of the insert plate 17 are usually customized according to the layout of the heat sink 5 and the heating element 3 to ensure that they can be connected tightly and effectively. The fixing bolt 18 is installed on the insert plate 17 to firmly connect the heat sink 5 to the heating element 3 and the thermally conductive silicone sheet 4. The design of the fixing bolt 18 takes into account thermal conductivity, tightening force and ease of installation to ensure the stability and reliability of the connection. The thread of the fixing bolt 18 passes through the thermally conductive silicone sheet 4 and tightly connects it to the insert plate 17. As a high-performance thermally conductive material, the thermally conductive silicone sheet 4 can effectively transfer the heat generated by the heating element 3 to the heat sink 5, thereby achieving the purpose of heat dissipation. Through the tightening action of the fixing bolt 18, a good heat conduction path can be formed between the thermally conductive silicone sheet 4 and the heat sink 5, improving the heat dissipation efficiency.

[0036] In summary, compared with related technologies, this device achieves a more efficient, stable, and flexible heat dissipation effect overall, effectively improving the heat transfer efficiency and enabling the generated heat to be dissipated quickly and evenly and discharged through the heat dissipation mechanism. This ensures the stable operation and long lifespan of the equipment, and it can be applied to various types of heat-generating components and heat dissipation needs, providing strong support for the efficient heat dissipation of electronic equipment.

[0037] It should be understood, in the several embodiments provided in this application, that the disclosed apparatus may be implemented in other ways.

[0038] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.

Claims

1. A heat-dissipating circuit board, characterized in that, include: A circuit board, wherein multiple components are provided on the circuit board; A heating element is disposed on the circuit board, and a thermally conductive silicone pad is provided on the heating element, and a heat sink is provided on the thermally conductive silicone pad; Mounting bracket, which is detachably mounted on the circuit board; An automatic heat dissipation mechanism is provided on the mounting bracket to help the circuit board dissipate heat automatically.

2. The heat-dissipating circuit board as described in claim 1, characterized in that, The automatic heat dissipation mechanism includes a channel, a miniature fan, and two dust screens. The channel is opened on the mounting frame, the miniature fan is fixedly installed in the channel, and the two dust screens are respectively located on the top and bottom openings of the channel.

3. The heat-dissipating circuit board as described in claim 1, characterized in that, Both sides of the circuit board are fixedly mounted with connecting plates, and each of the two connecting plates has mounting holes for installation.

4. The heat-dissipating circuit board as described in claim 3, characterized in that, Guide rods are fixedly installed on both sides of the mounting bracket, and clamps for connecting to the connecting plate are slidably installed on the guide rods.

5. The heat-dissipating circuit board as described in claim 4, characterized in that, A fixing seat is fixedly installed on the connecting plate, and a slot is provided on the fixing seat, which is engaged with the locking rod.

6. The heat-dissipating circuit board as described in claim 4, characterized in that, A spring is fixedly mounted on one side of the mounting bracket, and one side of the spring is fixed to the clamp rod.

7. The heat-dissipating circuit board as described in claim 1, characterized in that, A mounting plate is fixedly installed on the heat sink, and a fixing bolt is threaded onto the mounting plate. The thread of the fixing bolt passes through the thermally conductive silicone sheet of the heating element.

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