Wafer frequency division device
By designing a combination of a recovery air pump and a cylinder in the wafer frequency division device, the problem of manual recovery after wafers fall into the recovery tank is solved, realizing automated recovery and efficient utilization of wafers.
Patent Information
- Application Number
- CN202423234119.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-26
AI Technical Summary
In the current wafer dispersion process, wafers are prone to falling from the edge of the distribution tray into the recycling tank, requiring manual collection and reloading, which leads to high operational difficulty and low work efficiency.
A wafer frequency division device was designed, which uses a combination of a recovery air pump, a recovery pipe, a vertical cylinder and a horizontal cylinder to automatically pick up wafers from the recovery trough at the edge of the material tray and reuse them through a vibrating feeder, reducing manual intervention.
It enables automated recycling and reuse of wafers, improving work efficiency and reducing reliance on manual operation and potential error risks.
Smart Images
Figure CN223792499U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of quartz crystal frequency division technology, and in particular to a crystal frequency division device. Background Technology
[0002] Traditional wafer frequency dividers typically use a scattering motor to shake back and forth in both forward and reverse directions to disperse the wafers located on the scattering surface of the scattering tray. This dispersion process is to ensure that the wafers are evenly distributed, so that the subsequent wafer transfer assembly can effectively hold individual wafers and place them on the electrode test scattering assembly for necessary electrical performance testing.
[0003] However, in existing technologies, when wafers are dispersed, they may move to the edge of the tray and fall, or accumulate at protruding points on the edge. To solve this problem, a recycling trough is usually set at the edge of the tray to catch the wafers that may fall out. However, even with the presence of the recycling trough, once the wafers fall into these troughs, traditional methods still require manual intervention to remove these wafers from the recycling trough and reintroduce them into the processing flow. Because the wafers are very small, this process is not only difficult to operate, but also easily leads to a significant decrease in work efficiency, while increasing the risk of human error, such as wafer damage or contamination.
[0004] Therefore, it is imperative to redesign a chip frequency divider. Utility Model Content
[0005] In view of the above-mentioned defects in the prior art, the present invention provides a chip frequency division device, which aims to solve the problem that in the prior art, chips are easy to fall from the edge of the distribution tray into the recycling tank during the distribution process, and need to be manually collected and reloaded, resulting in high operation difficulty and low work efficiency.
[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a wafer frequency division device, including a machine base, on which a material dispensing assembly and a wafer recycling assembly are configured. The material dispensing assembly includes a material dispensing motor, a material dispensing disk disposed on the output end of the material dispensing motor, and a vibrating feeder. The upper surface of the material dispensing disk is provided with a recycling trough located at the edge and a material dispensing surface located in the middle. The vibrating feeder is disposed on the machine base, and the output end of the vibrating feeder is located above the material dispensing disk. The wafer recycling assembly includes a recycling air pump, a recycling pipe disposed on the output end of the recycling air pump, a vertical cylinder located on one side of the material dispensing disk, and a horizontal cylinder disposed on the output end of the vertical cylinder. The recycling end of the recycling pipe is fixed to the output end of the horizontal cylinder. The recycling pipe absorbs wafers from the recycling trough and releases wafers on the vibrating feeder.
[0007] Based on the above, the beneficial effect of a wafer frequency division device is to solve the problem in the prior art that wafers easily fall from the edge of the distribution tray into the recycling tank during the distribution process, requiring manual recycling and reloading, resulting in high operational difficulty and low work efficiency. This is mainly reflected in the following: This utility model, through the cooperation of a recycling air pump, a recycling pipe, a vertical cylinder, and a horizontal cylinder, allows the recycling air pump to draw crystals from the recycling tank at the edge of the distribution tray through the recycling pipe. Then, the vertical cylinder drives the horizontal cylinder to rise, and the horizontal cylinder drives the outlet of the recycling pipe to move above the vibrating feeder to release the wafers, allowing for wafer reuse. This reduces reliance on manual operation, improves the automation level of the entire system, and eliminates the time and potential errors caused by manual wafer recycling, making the wafer processing process smoother and more efficient, greatly improving work efficiency and production capacity.
[0008] Furthermore, the machine is also equipped with an electrode testing and dispensing assembly and a wafer transfer assembly. The wafer transfer assembly is located on one side of the discharge and dispensing assembly and the electrode testing and dispensing assembly, and is used to transfer the wafers on the discharge and dispensing assembly to the electrode testing and dispensing assembly.
[0009] Based on the above, the beneficial effect of the wafer transfer assembly is that it realizes the automatic transfer of wafers from the material dispensing assembly to the electrode testing material dispensing assembly, which greatly improves the testing efficiency.
[0010] Furthermore, the electrode testing and dispensing assembly includes a dispensing tray, a transfer and storage motor, a transfer rod, a first suction nozzle, and an electrode testing platform. The transfer and storage motor is mounted on the platform and located at the center of the dispensing tray. The transfer rod is located at the output end of the transfer and storage motor. The electrode testing platform is located between the dispensing tray and the distribution tray. A plurality of wafer storage cups are evenly arranged on the dispensing tray. The first suction nozzle is located at the end of the transfer rod away from the transfer and storage motor. The first suction nozzle, the test electrode on the electrode testing platform, and each wafer storage cup are all located on the same circumference of the dispensing tray. The transfer and storage motor transfers the tested wafers into the wafer storage cups via the transfer rod.
[0011] Based on the above, the beneficial effect of having the first nozzle, the test electrode on the electrode test stage, and each wafer storage cup located on the same circumference of the distribution tray is to ensure that each wafer is accurately transferred to the corresponding storage cup after each test.
[0012] Furthermore, the wafer transfer assembly includes a wafer traverse motor, a lead screw, a traverse plate, a fine-tuning slider, a fine-tuning knob, and a second suction nozzle. The lead screw is disposed on the output end of the wafer traverse motor, the traverse plate is adapted to the lead screw, the fine-tuning slider is slidably connected to the traverse plate, the fine-tuning knob is disposed on one side of the traverse plate, and the output end of the fine-tuning knob is connected to the fine-tuning slider. The second suction nozzle is disposed on the lower front end of the fine-tuning slider.
[0013] Based on the above, the beneficial effect of the wafer transverse motor, lead screw and transverse plate is to achieve precise movement of the wafer in the horizontal direction, ensuring that the second suction nozzle can accurately pick up the wafer from the discharge and distribution assembly and transfer it to the electrode test distribution assembly; the beneficial effect of the fine adjustment knob is to adjust the height of the second suction nozzle by adjusting the fine adjustment slider to adapt to wafers of different thicknesses.
[0014] Furthermore, both the first and second suction nozzles are connected to an external air pump.
[0015] Based on the above, the beneficial effect of connecting both the first and second suction nozzles to an external air pump is to ensure a stable and sufficient suction force during the suction and transfer of wafers.
[0016] Furthermore, a CCD camera is also mounted on the machine platform, and the CCD camera is located above the material tray.
[0017] Based on the above, the beneficial effect of a CCD camera is to acquire real-time, high-resolution images of wafers scattered on the surface of the material.
[0018] To more clearly illustrate the above-mentioned features of this utility model and the objectives it aims to achieve, the present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description
[0019] Figure 1 This is a front view of the present invention;
[0020] Figure 2 This is a top view of the present invention;
[0021] Figure 3 This is a schematic diagram of the wafer recycling component of this utility model.
[0022] Reference numerals: 1-Machine base, 2-Discharge bulk material assembly, 21-Bulk material motor, 22-Bulk material tray, 221-Recovery tank, 222-Bulk material surface, 23-Vibrating feeder, 3-Electrode testing and material distribution assembly, 31-Distribution tray, 311-Wafer storage cup, 32-Transfer storage motor, 33-Transfer rod, 34-First suction nozzle, 35-Electrode testing platform, 4-Wafer recovery assembly, 41-Recovery air pump, 42-Recovery tube, 43-Vertical cylinder, 44-Horizontal cylinder, 5-Wafer transfer assembly, 51-Wafer transverse motor, 52-Lead screw, 53-Transverse plate, 54-Fine adjustment slider, 55-Fine adjustment knob, 56-Second suction nozzle, 6-CCD camera. Detailed Implementation
[0023] like Figures 1-3 As shown, a wafer frequency division device includes a machine base 1, on which a material dispensing assembly 2 and a wafer recovery assembly 4 are configured. The material dispensing assembly 2 includes a material dispensing motor 21, a material dispensing tray 22 disposed on the output end of the material dispensing motor 21, and a vibrating feeder 23. The upper surface of the material dispensing tray 22 is provided with a recovery groove 221 located at the edge and a material dispensing surface 222 located in the middle. The vibrating feeder 23 is disposed on the machine base 1, and the output end of the vibrating feeder 23 is located above the material dispensing tray 22. The wafer recovery assembly 4 includes a recovery air pump 41, a recovery pipe 42 disposed on the output end of the recovery air pump 41, a vertical cylinder 43 located on one side of the material dispensing tray 22, and a horizontal cylinder 44 disposed on the output end of the vertical cylinder 43. The recovery end of the recovery pipe 42 is fixed to the output end of the horizontal cylinder 44. The recovery pipe 42 absorbs wafers from the recovery groove 221 and releases the wafers on the vibrating feeder 23.
[0024] The machine 1 is also equipped with an electrode testing and sorting component 3 and a wafer transfer component 5. The wafer transfer component 5 is located on one side of the discharge and sorting component 2 and the electrode testing and sorting component 3, and is used to transfer the wafers on the discharge and sorting component 2 to the electrode testing and sorting component 3.
[0025] The electrode testing and dispensing assembly 3 includes a dispensing tray 31, a transfer and storage motor 32, a transfer rod 33, a first suction nozzle 34, and an electrode testing platform 35. The transfer and storage motor 32 is mounted on the machine base 1 and is located at the center of the dispensing tray 31. The transfer rod 33 is located at the output end of the transfer and storage motor 32. The electrode testing platform 35 is located between the dispensing tray 31 and the material distribution tray 22. A plurality of wafer storage cups 311 are evenly arranged on the dispensing tray 31. The first suction nozzle 34 is located at the end of the transfer rod 33 away from the transfer and storage motor 32. The first suction nozzle 34, the test electrode on the electrode testing platform 35, and each wafer storage cup 311 are located on the same circumference of the dispensing tray 31. The transfer and storage motor 32 transfers the tested wafers into the wafer storage cups 311 through the transfer rod 33.
[0026] The wafer transfer assembly 5 includes a wafer traverse motor 51, a lead screw 52, a traverse plate 53, a fine-tuning slider 54, a fine-tuning knob 55, and a second suction nozzle 56. The lead screw 52 is disposed on the output end of the wafer traverse motor 51. The traverse plate 53 is adapted to the lead screw 52. The fine-tuning slider 54 is slidably connected to the traverse plate 53. The fine-tuning knob 55 is disposed on one side of the traverse plate 53, and the output end of the fine-tuning knob 55 is connected to the fine-tuning slider 54. The second suction nozzle 56 is disposed on the lower front end of the fine-tuning slider 54.
[0027] Both the first suction nozzle 34 and the second suction nozzle 56 are connected to an external air pump.
[0028] A CCD camera 6 is also mounted on the machine base 1, and the CCD camera 6 is located above the material tray 22.
[0029] In summary, the specific implementation of this utility model is as follows: First, the vibrating feeder 23 vibrates the wafers onto the distribution surface 222 of the distribution tray 22. Then, the distribution motor 21 drives the distribution tray 22 to rotate and vibrate back and forth, so that the wafers are evenly distributed on the distribution surface 222. During this process, some wafers will fall to the edge and into the recycling tank 221. For these wafers that fall into the recycling tank, the recycling air pump 41 sucks up the wafers from the recycling tank 221 through the recycling pipe 42. Then, the vertical cylinder 43 drives the horizontal cylinder 44 to rise, and then the horizontal cylinder 44 drives the outlet of the recycling pipe 42 to move above the vibrating feeder 23 and vibrate continuously, releasing the wafers back to the vibrating feeder for recycling.
[0030] Meanwhile, the CCD camera 6 captures images of the wafers scattered on the bulk surface 222 and positions each wafer. The control equipment analyzes the images captured by the CCD camera to distinguish between qualified and unqualified wafers. In preparation for transferring qualified wafers, before the operation, the fine-tuning knob 55 can adjust the height of the second suction nozzle 56 by adjusting the fine-tuning slider 54 to accommodate wafers of different thicknesses. After positioning is completed, the transverse motor 51 drives the second suction nozzle 56 to reach above the qualified wafers through the lead screw 52 to pick them up. After picking them up, the second suction nozzle transfers the wafers to the test electrodes of the electrode test stage 35 and releases them for electrical performance testing.
[0031] After the test is completed, the first suction nozzle 34 is driven by the transfer storage motor 32 through the transfer rod 33 to reach the test electrode position of the electrode test stage 35, pick up the tested wafer, and then the first suction nozzle 34 places the wafer into the corresponding wafer storage cup 311 on the sorting tray 31 for classification and storage according to the test results.
[0032] The above description is only the optimal solution embodiment of this utility model and is not intended to limit this utility model. Various modifications or substitutions made by those skilled in the art to this utility model without departing from the essence and protection scope of this utility model should also be within the protection scope of this utility model.
Claims
1. A wafer dividing apparatus comprising a machine table (1), characterized in that: The machine table (1) is provided with a discharge bulk component (2) and a wafer recycling component (4), the discharge bulk component (2) comprises a bulk motor (21), a bulk disc (22) arranged on the output end of the bulk motor (21) and a vibrating feeder (23), the upper end surface of the bulk disc (22) is provided with a recycling groove (221) at the edge and a bulk surface (222) at the middle, the vibrating feeder (23) is arranged on the machine table (1), the output end of the vibrating feeder (23) is located above the bulk disc (22), the wafer recycling component (4) comprises a recycling air pump (41), a recycling pipe (42) arranged on the output end of the recycling air pump (41), a vertical air cylinder (43) located on one side of the bulk disc (22) and a horizontal air cylinder (44) arranged on the output end of the vertical air cylinder (43), the recycling end of the recycling pipe (42) is fixed on the output end of the horizontal air cylinder (44), the recycling pipe (42) absorbs wafers from the recycling groove (221) and releases wafers on the vibrating feeder (23).
2. The device of claim 1, wherein: The machine table (1) is also provided with an electrode test distribution component (3) and a wafer transfer component (5), the wafer transfer component (5) is located on one side of the discharge bulk component (2) and the electrode test distribution component (3), used for transferring wafers on the discharge bulk component (2) to the electrode test distribution component (3).
3. The device of claim 2 wherein: the first and second inductors are coupled to the first and second transistors, respectively, and the first and second inductors are coupled to the first and second capacitors, respectively. The electrode test distribution component (3) comprises a distribution disc (31), a transfer storage motor (32), a transfer rod (33), a first suction nozzle (34) and an electrode test table (35), the transfer storage motor (32) is arranged on the machine table (1), and the transfer storage motor (32) is located at the center of the distribution disc (31), the transfer rod (33) is arranged on the output end of the transfer storage motor (32), the electrode test table (35) is arranged between the distribution disc (31) and the bulk disc (22), the distribution disc (31) is uniformly provided with a plurality of wafer storage cups (311), the first suction nozzle (34) is arranged on one end of the transfer rod (33) away from the transfer storage motor (32), the first suction nozzle (34), the test electrode on the electrode test table (35) and each wafer storage cup (311) are located on the same circumferential line of the distribution disc (31), the transfer storage motor (32) transfers the tested wafers into the wafer storage cup (311) through the transfer rod (33).
4. The device of claim 3 wherein: the first and second inductors are coupled to the first and second transistors, respectively, and the first and second inductors are coupled to the first and second transistors, respectively. The wafer transfer assembly (5) comprises a wafer horizontal transfer motor (51), a screw rod (52), a horizontal transfer plate (53), a fine adjustment slider (54), a fine adjustment knob (55) and a second suction nozzle (56), the screw rod (52) is arranged on the output end of the wafer horizontal transfer motor (51), the horizontal transfer plate (53) is adapted to the screw rod (52), the fine adjustment slider (54) is slidingly connected to the horizontal transfer plate (53), the fine adjustment knob (55) is arranged on one side of the horizontal transfer plate (53), and the output end of the fine adjustment knob (55) is connected with the fine adjustment slider (54), and the second suction nozzle (56) is arranged on the lower front end of the fine adjustment slider (54).
5. The device of claim 4 wherein: the first and second inductors are coupled to the first and second transistors, respectively, and the first and second inductors are coupled to the first and second transistors, respectively. The first suction nozzle (34) and the second suction nozzle (56) are connected with an external air pump.
6. The device of claim 1 wherein: the first and second inductors are formed on the same side of the substrate. A CCD camera (6) is further arranged on the machine table (1), and the CCD camera (6) is located above the bulk tray (22).