Liquid cooling heat dissipation device

Abstract

The utility model relates to a liquid cooling heat dissipation device, which comprises a water row, a water inlet pipe, a water outlet pipe, a water pump and a cold plate, the water pump is arranged on the cold plate, liquid flow channels of the water pump and the cold plate are communicated, the water pump is provided with a water pump water outlet, the cold plate is provided with an inflow connector, and a water inlet end of the water row is connected with the water pump water outlet through the water inlet pipe. The water outlet end of the water row is connected to the inflow connector through a water outlet pipe. Compared with an existing liquid cooling system, according to the liquid cooling system, the water pump is arranged on the cold plate, and the problems that when the water pump is installed on a water drain or externally connected, the space of a box is insufficient, and the structure is not stable are structurally solved. And meanwhile, the flow of the cooling liquid can be increased, a heat source can be directly taken away from the cold plate, and the cooling work efficiency and the water supply stability are effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling, and more particularly to a liquid cooling heat dissipation device. Background Technology

[0002] With the continuous improvement of chip performance in computer hardware, servers, big data, and artificial intelligence applications, especially when handling high-load tasks, chips generate a large amount of heat. If this heat cannot be dissipated in a timely and effective manner, it will cause the chip temperature to become too high, thereby affecting its performance and stability, and may even lead to failure. In order to reduce the large amount of heat generated by the chip, a liquid cooling system is used, which uses circulating water or other coolants to absorb and remove the heat generated by the hardware, and then dissipates the heat into the air through a heat sink.

[0003] In current liquid cooling systems, the water pump is typically connected to both the water duct and the liquid cooling plate via separate water pipes. Because there is no fixed location, the pump's installation in the confined space of the chassis can be problematic, potentially leading to structural instability. The pump's vibration during operation reduces the stability of the water supply. The multi-stage connection also results in poor coolant flow and increases the risk of leaks. Furthermore, it fails to deliver coolant to the water duct immediately after the cooling plate absorbs heat, thus reducing efficiency. Utility Model Content

[0004] To address the aforementioned problems, this invention provides a liquid cooling system.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: The present invention relates to a liquid cooling heat dissipation device, including a water drain, an inlet pipe, an outlet pipe, a water pump, and a cold plate. The water pump is mounted on the cold plate and the liquid flow channels of the two are connected. The water pump is provided with a water pump outlet. The cold plate is provided with an inlet connector. The water inlet end of the water drain is connected to the water pump outlet through the inlet pipe, and the water outlet end of the water drain is connected to the inlet connector through the outlet pipe.

[0006] Preferably, the cold plate is fixed to the main board by a fastener, the fastener including a fastening cover plate and a fastening member, the lower surface of the fastening cover plate is provided with a cold plate mounting groove for installing the cold plate, the cold plate is installed in the cold plate mounting groove, and the fastening member fastens the fastening cover plate to the main board.

[0007] Preferably, the fastening element includes a stud and a spring fitted onto the stud.

[0008] Preferably, a first cooling fan is provided above the cold plate, and the first cooling fan is fixed above the cold plate by a fan bracket.

[0009] Preferably, the water pump and the cold plate are detachably connected. The fastening cover plate is provided with a water pump mounting platform, the water pump mounting platform is provided with a water pump mounting hole, and the water pump is provided with a water pump assembly hole. The water pump is fixed to the water pump mounting platform by fasteners passing through the water pump assembly hole and the water pump mounting hole in sequence. The water pump includes an internal liquid flow channel, a water pump inlet, and a water pump outlet that are interconnected. The cold plate includes an internal liquid flow channel, an outflow connector, and an inflow connector that are interconnected. The water pump inlet and the outflow connector are plugged in and connected.

[0010] Preferably, the inflow connector and the outflow connector are respectively disposed on the top of the cold plate. The cold plate mounting groove is provided with a first connection port and a second connection port. When the cold plate is installed in the cold plate mounting groove, the first connection port corresponds to the position of the inflow connector, and the second connection port corresponds to the position of the outflow connector. The water outlet pipe is connected to the inflow connector through the first connection port, and the water pump inlet is connected to the outflow connector through the second connection port.

[0011] Preferably, the snap-fit ​​cover plate is provided with a plurality of second assembly holes, the second assembly holes penetrating through the snap-fit ​​cover plate, and the upper surface of the cold plate is provided with a plurality of third assembly holes that match the second assembly holes. The fasteners pass through the second assembly holes and the third assembly holes in sequence to fix the cold plate to the snap-fit ​​cover plate.

[0012] Preferably, the fastening cover plate is provided with a plurality of second assembly holes, the second assembly holes passing through the fastening cover plate, and the fan bracket is provided with a plurality of first assembly holes corresponding to the second assembly holes; the fasteners pass through the first assembly holes and the second assembly holes in sequence to install the fan bracket on the fastening cover plate.

[0013] Preferably, the water drain includes a front water tank, a first flow channel, a rear water tank, and a second flow channel. The front water tank is divided into an inlet chamber and an outlet chamber. The inlet chamber is connected to the rear water tank through the first flow channel, and the outlet chamber is connected to the rear water tank through the second flow channel. The inlet chamber is connected to the water pump outlet through an inlet pipe, and the outlet chamber is connected to the inlet connector through an outlet pipe. The water drain is equipped with several second cooling fans.

[0014] The beneficial effects of this utility model are as follows: This embodiment relates to a liquid cooling heat dissipation device. Unlike existing liquid cooling systems, in this embodiment, by placing the water pump on the cold plate, the problems of insufficient chassis space and structural instability caused by installing the water pump on the water drain or external connection are structurally avoided. At the same time, it can increase the flow rate of the coolant, directly removing the heat source from the cold plate, effectively improving cooling efficiency and water supply stability. Attached Figure Description

[0015] Figure 1This is a schematic diagram of the structure of the liquid cooling system of this utility model when applied to an Intel chip motherboard.

[0016] Figure 2 This is an exploded structural diagram of the liquid cooling system of this utility model.

[0017] Figure 3 This is a schematic diagram of the assembly structure of the fan bracket, the snap-fit ​​cover plate, and the cold plate of this utility model.

[0018] Figure 4 This is a schematic diagram of the top structure of the snap-fit ​​cover plate of this utility model.

[0019] Figure 5 This is a schematic diagram of the bottom structure of the snap-fit ​​cover plate of this utility model.

[0020] Figure 6 This is a schematic diagram of the structure of the water pump of this utility model.

[0021] Figure 7 This is a schematic diagram of the internal cross-sectional structure of the water drain of this utility model.

[0022] Figure 8 This is a schematic diagram of the structure of the liquid cooling system of this utility model when applied to an AMD chip motherboard.

[0023] Figure Labels

[0024] 1. Water drain; 11. Front water tank; 111. Inlet chamber; 112. Outlet chamber; 12. First flow channel; 13. Rear water tank; 14. Second flow channel; 15. Inlet end; 16. Outlet end; 2. Inlet pipe; 3. Outlet pipe; 4. Fan bracket; 41. Support foot; 42. First assembly hole; 5. Fastening cover plate; 51. Fastening piece; 52. Second assembly hole; 53. Cold plate mounting slot; 54. First connection port; 55. Second connection port; 56. Water pump mounting platform; 57. Water pump mounting hole; 6. First cooling fan; 7. Water pump; 71. Water pump inlet; 72. Water pump outlet; 73. Water pump assembly hole; 8. Cold plate; 81. Outlet connector; 82. Inlet connector; 83. Third assembly hole; 9. Second cooling fan; 10. Assembly screw. Detailed Implementation

[0025] Example 1

[0026] Please see Figure 1-8As shown, this utility model relates to a liquid cooling heat dissipation device, including a water drain 1, an inlet pipe 2, an outlet pipe 3, a water pump 7, and a cold plate 8. The water pump 7 is mounted on the cold plate 8, and the liquid flow channels of the two are connected. The water pump 7 has a water pump outlet 72, and the cold plate 8 has an inlet connector 82. The water inlet 15 of the water drain 1 is connected to the water pump outlet 72 through the inlet pipe 2, and the water outlet 16 of the water drain 1 is connected to the inlet connector 82 through the outlet pipe 3. The coolant that has absorbed heat in the cold plate 8 is drawn out by the water pump 7 and flows out of the water pump outlet 72 back to the water drain 1. The coolant cooled by the water drain 1 flows back to the cold plate 8 through the inlet connector 82.

[0027] In this embodiment, the water pump 7 and the cold plate 8 are detachably connected. The water pump 7 includes a water pump inlet 71 and a water pump outlet 72 that are respectively connected to the internal liquid flow channel of the water pump 7. The cold plate 8 includes an outlet connector 81 and an inlet connector 82 that are connected to the internal liquid flow channel of the cold plate 8. The inlet connector 82 and the outlet connector 81 are respectively disposed on the top of the cold plate 8. The water pump inlet 71 is connected to the outlet connector 81.

[0028] In this embodiment, in order to further improve heat dissipation performance, a first cooling fan 6 is provided above the cold plate 8, and the first cooling fan 6 is fixed above the cold plate 8 by a fan bracket 4.

[0029] In this embodiment, to fix the liquid cooling device on the motherboard, the cold plate 8 is fixed to the motherboard by a fastener. To accommodate both AMD and Intel motherboards, the cold plate 8 and the fastener are detachably connected. The fastener includes a fastening cover plate 5 and a fastening element 51. The lower surface of the fastening cover plate 5 is provided with a cold plate mounting groove 53 for installing the cold plate 8. The cold plate 8 is installed in the cold plate mounting groove 53. A first cooling fan 6 is detachably installed on the upper part of the fastening cover plate 5. The first cooling fan 6 is detachably mounted on the fastening cover plate 5 by a fan bracket 4. The first cooling fan 6 is fixed to the fan bracket 4. The fan bracket 4 is fixed to the fastening cover plate 5 by fasteners. The water pump 7 is fixed to the fastening cover plate 5. The water pump inlet 71 passes through the fastening cover plate 5 and is connected to the cold plate 8. After the liquid cooling device is installed on the motherboard using a mounting bracket, the chips on the motherboard generate heat, which is conducted to the cold plate 8. The coolant inside the cold plate 8 absorbs the heat from the chips. The first cooling fan 6 dissipates heat from the cold plate 8, and simultaneously, the coolant that has absorbed heat is pumped into the water drain 1 by the water pump 7. The water drain 1 then conducts the heat to the outside air. The specific flow path of the coolant that has absorbed heat is as follows: the coolant that has absorbed heat flows out of the cold plate 8 from the outlet connector 81, enters the water pump 7 through the water pump inlet 71, enters the water drain 1 through the water pump outlet 72 and then flows into the water drain 1 through the inlet pipe 2. After circulating and cooling through the water drain 1, the cooled coolant flows back to the cold plate 8 through the outlet pipe 3 and enters the cold plate 8 through the inlet connector 82, thus achieving a circulating cooling effect.

[0030] Furthermore, the cold plate mounting groove 53 is provided with a first connection port 54 and a second connection port 55. When the cold plate 8 is installed in the cold plate mounting groove 53, the first connection port 54 corresponds to the position of the inflow connector 82, and the second connection port 55 corresponds to the position of the outflow connector 81. The water outlet pipe 3 is connected to the inflow connector 82 through the first connection port 54, and the water pump inlet 71 is connected to the outflow connector 81 through the second connection port 55.

[0031] In this embodiment, the first cooling fan 6 is positioned above the water pump 7 and the cold plate 8, enabling it to dissipate and cool the heat generated by the water pump 7 and the cold plate 8 immediately, further improving the heat dissipation effect. To further enhance the cooling effect, the water duct 1 is equipped with several second cooling fans 9, which are used to perform secondary cooling of the coolant in the water duct 1, thereby ensuring that the coolant receives sufficient cooling.

[0032] In this embodiment, the water drain 1 includes a front water tank 11, a first flow channel 12, a rear water tank 13, and a second flow channel 14. The front water tank 11 is internally divided into an inlet chamber 111 and an outlet chamber 112. The inlet chamber 111 is connected to the rear water tank 13 through the first flow channel 12, and the outlet chamber 112 is connected to the rear water tank 13 through the second flow channel 14. The inlet chamber 111 is connected to the water pump outlet 72 through an inlet pipe 2, and the outlet chamber 112 is connected to the inlet connector 82 through an outlet pipe 3.

[0033] After the coolant inside the cold plate 8 carries away the heat generated by the heat-generating chip from the surface of the cold plate 8, the coolant will enter the water pump inlet 71 through the outlet connector 81. The water pump 7 provides power to transport the coolant from the water pump outlet 72 through the inlet pipe 2 to the inlet end of the water drain 1, and then enter the water drain 1 for cooling. The coolant will enter the rear water tank 13 from the inlet chamber 111 through the first flow channel 12, and then enter the outlet chamber 112 from the rear water tank 13 through the second flow channel 14, thus achieving the cooling effect. Subsequently, the cooled coolant will enter the inlet connector 82 from the outlet end of the water drain 1 through the outlet pipe 3, and return to the cold plate 8 to cool the heat-generating chip, thereby realizing the circulation of the coolant.

[0034] Furthermore, the upper surface of the snap-fit ​​cover 5 is provided with a plurality of second assembly holes 52, which extend to the cold plate mounting groove 53. The upper surface of the cold plate 8 is provided with a plurality of third assembly holes 83 that match the second assembly holes 52. The fan bracket 4 includes a pair of support legs 41, and the support legs 41 are provided with a plurality of first assembly holes 42 corresponding to the second assembly holes 52. The first assembly holes 42, second assembly holes 52, and third assembly holes 83 are aligned sequentially from top to bottom and connected by assembly screws 10, so that while the fan bracket 4 is installed on the snap-fit ​​cover 5, the cold plate 8 is also fixedly installed on the bottom of the snap-fit ​​cover 5.

[0035] Furthermore, to further secure the water pump 7 to the snap-fit ​​cover plate 5, the snap-fit ​​cover plate 5 is provided with a water pump mounting platform 56. The second connection port 55 extends through the water pump mounting platform 56, and the water pump 7 is mounted on the water pump mounting platform 56. The water pump inlet 71 is located within the second connection port 55 and connected to the outlet connector 81. The water pump mounting platform 56 is provided with pre-fabricated water pump mounting holes 57 suitable for different models of water pumps 7. The water pump 7 is provided with a water pump assembly hole 73, the position of which matches the water pump mounting hole 57. The water pump assembly hole 73 can be connected to the water pump mounting hole 57 using fasteners, further securing the water pump 7 to the water pump mounting platform 56.

[0036] This embodiment relates to a liquid cooling heat dissipation device. Unlike existing liquid cooling systems, this embodiment, by placing the water pump 7 on the cold plate 8, structurally avoids problems such as insufficient chassis space and structural instability when the water pump 7 is installed on the water drain 1 or externally connected. Simultaneously, it increases the coolant flow rate, allowing heat to be directly carried away from the cold plate 8, effectively improving cooling efficiency and overall structural stability.

[0037] Example 2

[0038] Please see Figure 8 As shown, the liquid cooling heat dissipation device in this embodiment is assembled on the INTEL chip motherboard. The difference between embodiment two and embodiment one is that the fastening component 51 includes a stud and a spring sleeved on the stud.

[0039] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. A liquid cooling heat sink, characterized by: The water pump is arranged on the cold plate and the liquid flow channels of the two are through, the water pump is provided with a water outlet, the cold plate is provided with an inflow joint, the water inlet end of the water drain is connected with the water outlet of the water pump through the water inlet pipe, and the water outlet end of the water drain is connected with the inflow joint through the water outlet pipe.

2. The liquid cooling heat dissipation device according to claim 1, characterized in that: The cold plate is fixed on the main plate through a buckle, the buckle comprises a buckling cover plate and a buckling piece, the lower surface of the buckling cover plate is provided with a cold plate mounting groove for mounting the cold plate, and the cold plate is mounted in the cold plate mounting groove.

3. The liquid cooling heat dissipation device according to claim 2, characterized in that: The buckling piece comprises a stud and a spring sleeved on the stud.

4. The liquid cooling heat dissipation device according to claim 2, characterized in that: A first cooling fan is arranged above the cold plate, and the first cooling fan is fixed above the cold plate through a fan support.

5. The liquid cooling heat dissipation device according to claim 2, characterized in that: The water pump is detachably connected with the cold plate, the buckling cover plate is provided with a water pump mounting table, the water pump mounting table is provided with a water pump mounting hole, the water pump is provided with a water pump assembly hole, the water pump is fixed on the water pump mounting table by sequentially penetrating the water pump assembly hole and the water pump mounting hole through a fastener, the water pump comprises an internal liquid flow channel, a water inlet and a water outlet which are through each other, the cold plate comprises an internal liquid flow channel, an outflow joint and an inflow joint which are through each other, and the water inlet of the water pump is connected with the outflow joint in a plug-in manner.

6. The liquid cooling heat dissipation device according to claim 5, characterized in that: The inflow joint and the outflow joint are arranged on the top of the cold plate, the cold plate mounting groove is provided with a first connecting port and a second connecting port, when the cold plate is mounted in the cold plate mounting groove, the first connecting port corresponds to the position of the inflow joint, the second connecting port corresponds to the position of the outflow joint, the water outlet pipe is connected with the inflow joint through the first connecting port, and the water inlet of the water pump is connected with the outflow joint through the second connecting port.

7. The liquid cooling heat dissipation device according to claim 2, characterized in that: The buckling cover plate is provided with a plurality of second assembly holes which penetrate the buckling cover plate, the upper surface of the cold plate is provided with a plurality of third assembly holes which are matched with the second assembly holes, and the fastener sequentially penetrates the second assembly holes and the third assembly holes to fix and mount the cold plate on the buckling cover plate.

8. The liquid cooling heat dissipation device according to claim 4, characterized in that: The buckling cover plate is provided with a plurality of second assembly holes which penetrate the buckling cover plate, and the fan support is provided with a plurality of first assembly holes which correspond to the second assembly holes. The fastener sequentially penetrates the first assembly holes and the second assembly holes to mount the fan support on the buckling cover plate.

9. The liquid cooling heat dissipation device of claim 1, wherein: The water drain comprises a front water tank, a first flow channel, a rear water tank and a second flow channel, the inside of the front water tank is divided into a water inlet chamber and a water outlet chamber, the water inlet chamber is connected with the rear water tank through the first flow channel, the water outlet chamber is connected with the rear water tank through the second flow channel, the water inlet chamber is connected with the water outlet of the water pump through the water inlet pipe, the water outlet chamber is connected with the inflow joint through the water outlet pipe, and the water drain is provided with a plurality of second cooling fans.

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