Electronic equipment and energy storage system

Abstract

The utility model relates to the technical field of heat dissipation, in particular to electronic equipment and an energy storage system. The electronic equipment comprises a shell, a substrate, a plurality of electronic elements and a liquid cooling plate, the substrate and the plurality of electronic elements are accommodated in the shell, and the plurality of electronic elements comprise a first electronic element and a second electronic element; the liquid cooling plate comprises a top plate, a bottom plate and a middle plate, the liquid cooling plate further comprises at least one flow guide part, and the flow guide part is at least partially located between the first electronic element and the second electronic element in the flow direction of the cooling medium. In the flow direction of the cooling medium, the flow guide part is provided with a first end and a second end, the first end is closer to the first electronic element than the second end, and the flow cross-sectional area of the flow channel at the first end of the flow guide part is smaller than that of the flow channel at the second end of the flow guide part. The flow channels of the liquid cooling plate can change the flow speed of the cooling medium in the circulation process, the heat dissipation requirement of the electronic element with the high heat dissipation requirement can be met, and the heat dissipation effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to an electronic device and an energy storage system. BACKGROUND

[0002] With the continuous development of green energy technology, energy storage systems that can store and release electric energy are widely used. Power converters in the energy storage field gradually begin to use liquid cooling technology for heat dissipation, which can meet installation requirements and space requirements while achieving good heat dissipation.

[0003] The flow channel design of the liquid cooling plate in the traditional technology is relatively single, and the liquid cooling heat dissipation of the power converter still has room for improvement. CONTENT OF THE INVENTION

[0004] The present application provides an electronic device and an energy storage system, and the flow channel of the liquid cooling plate can change the flow rate of the cooling medium in the flow process, and can meet the heat dissipation requirements of electronic components with high heat dissipation requirements.

[0005] In a first aspect, the present application provides an electronic device, which comprises a housing, a substrate, a plurality of electronic components, and a liquid cooling plate; the substrate and the plurality of electronic components are accommodated in the housing, the plurality of electronic components are fixed to the substrate, and the liquid cooling plate is fixed to the outer surface of the housing; the plurality of electronic components comprise a first electronic component and a second electronic component, the heat generation of the first electronic component at the maximum power is greater than the heat generation of the second electronic component at the maximum power; the orthographic projection of the liquid cooling plate on the substrate overlaps with the first electronic component and the second electronic component; the liquid cooling plate comprises a top plate, a bottom plate, and an intermediate plate; the intermediate plate comprises a hollow structure, the hollow structure penetrates through the intermediate plate along the thickness of the liquid cooling plate, the intermediate plate is connected in layers between the top plate and the bottom plate, and the hollow structure and the top plate and the bottom plate enclose a flow channel for circulating cooling medium; the liquid cooling plate further comprises a flow guide part, the flow guide part is accommodated in the flow channel and is fixed to at least one of the top plate, the bottom plate, and the intermediate plate, and along the flow direction of the cooling medium, the flow guide part is at least partially located between the first electronic component and the second electronic component. Along the flow direction of the cooling medium, the flow guide part has a first end and a second end, the first end is closer to the first electronic component than the second end, and the flow cross-sectional area of the flow channel at the first end of the flow guide part is smaller than the flow cross-sectional area of the flow channel at the second end of the flow guide part.

[0006] The liquid cooling plate in the electronic device provided by the present application is a kind of laminated design structure, when the cooling medium flows through a section of flow channel containing a flow guide part, because the flow cross-sectional area of the flow channel at the first end of the flow guide part is greater than the flow cross-sectional area of the flow channel at the second end, the flow rate of the cooling medium at the first end is greater than the flow rate at the second end when the cooling medium passes through this section of flow channel, the increased flow rate improves the heat exchange capacity, thereby dissipating heat for the first electronic component with higher heat dissipation requirements, and optimizing the heat dissipation effect.

[0007] In one embodiment, the flow guide is connected to the top plate and the bottom plate along the thickness direction of the liquid cooling plate; along the width direction of the flow channel, there is a gap between the two sides of the flow guide and the middle plate to form part of the flow channel, and the distance between the two ends of any one side of the flow guide and the middle plate is not equal. The thickness of the middle plate, i.e. the depth of the flow channel, can change the cross-sectional area of the flow channel at the two ends of the flow guide by changing the distance between the two ends of the flow guide and the middle plate.

[0008] In one embodiment, along the width direction of the flow channel, one side of the flow guide is fixed to the middle plate, and the other side of the flow guide has a gap with the middle plate to form part of the flow channel, and the distance between the two ends of the other side of the flow guide and the middle plate is not equal. The thickness of the middle plate, i.e. the depth of the flow channel, can change the cross-sectional area of the flow channel at the two ends of the flow guide by changing the distance between the two ends of the flow guide and the middle plate.

[0009] In one embodiment, the liquid cooling plate further comprises at least one flow disturbance part, and the orthogonal projection of the flow disturbance part on the substrate overlaps with the first electronic component along the thickness direction of the liquid cooling plate. For electronic components with high heat dissipation requirements, the addition of the flow disturbance part can slow down the flow rate of the cooling medium, so that the cooling medium can fully contact the liquid cooling plate, thereby improving the heat dissipation effect. The combination of the flow guide and the flow disturbance part can better dissipate heat for electronic components with high heat dissipation requirements.

[0010] In one embodiment, the shell comprises a window penetrating through the shell for fixing the side wall of the liquid cooling plate, and the liquid cooling plate is fixed to the shell and covers the window; at least one electronic component is connected to the liquid cooling plate through the window at one end facing the liquid cooling plate, and the connection between the electronic component and the liquid cooling plate establishes a heat transfer link, and the heat transfer path is shorter and the heat transfer rate is faster.

[0011] In one embodiment, the surface of the top plate away from the bottom plate comprises an annular sealing groove, and the sealing groove is used to accommodate a sealing ring, and the sealing ring protrudes from the surface of the top plate towards the shell. The area enclosed by the sealing groove is used to contact the device to be cooled, and the inlet and outlet of the flow channel are located outside the area enclosed by the sealing groove. The inlet and outlet of the flow channel are used for liquid connection, and when the area enclosed by the sealing groove cools the electrified device, water and electricity can be easily isolated. When the top plate is fixed to the shell, the sealing ring can be sealingly connected to the shell to achieve annular sealing of the window.

[0012] In one embodiment, the height of the at least one electronic component protruding from the substrate is less than the distance between the substrate and the liquid cooling plate, and the electronic component is connected to the liquid cooling plate through a heat conducting member, thereby achieving good heat dissipation.

[0013] In one embodiment, the shell comprises a containing cavity and a separating cavity, the substrate and the at least one electronic component are accommodated in the containing cavity, and the separating cavity is used to accommodate a pipeline for connecting the flow channel to an external cold source; the shell comprises a communication port which is separated from the containing cavity and which communicates the separating cavity with the liquid inlet and the liquid outlet of the flow channel. By separating the containing cavity from the separating cavity, the water circuit of the liquid cooling plate is separated from the circuit of the electronic component, thereby achieving water-electricity separation.

[0014] In one embodiment, the liquid cooling plate comprises a connecting end which is fixed to the surface of the top plate away from the bottom plate and close to one side edge of the liquid cooling plate; the connecting end comprises two fluid channels which are separated from each other and which are respectively connected to the liquid inlet and the liquid outlet of the flow channel. At least a part of the connecting end penetrates through the communication port and is accommodated in the separating cavity along the thickness direction of the liquid cooling plate. The connecting end is connected to the external cold source in the separating cavity, thereby achieving water-electricity separation. In one embodiment, the liquid cooling plate comprises a connecting end which is fixed to the surface of the top plate away from the bottom plate and close to one side edge of the liquid cooling plate; the connecting end comprises two fluid channels which are separated from each other and which are respectively connected to the liquid inlet and the liquid outlet of the flow channel. The two fluid channels can circulate cooling to the flow channel, and the liquid inlet and the liquid outlet of the flow channel are integrated into the connecting end, which is conducive to reducing the layout space of the liquid cooling circuit. The distance between the connecting end and the first side edge of the liquid cooling plate is greater than the distance between the connecting end and the second side edge of the liquid cooling plate, and the first side edge and the second side edge are opposite along the thickness direction perpendicular to the liquid cooling plate, thereby facilitating the connection of the connecting end to the flow channel and the connection of the connecting end to the cold source. In one embodiment, the inlet and the outlet of each fluid channel are not coplanar, and the flow direction of the cooling medium can be changed. The inlet of one fluid channel is coplanar with the outlet of the other fluid channel, and the outlet of one fluid channel is coplanar with the inlet of the other fluid channel, thereby facilitating the communication layout of the connecting end to the flow channel and the communication layout of the connecting end to the cold source.

[0015] In one embodiment, the liquid cooling plate further comprises an air-cooled radiator which is fixed to the surface of the top plate away from the bottom plate. The air-cooled radiator can accelerate the air flow on the surface of the liquid cooling plate and enhance the heat dissipation effect. The distance between the air-cooled radiator and the first side edge of the liquid cooling plate is greater than the distance between the air-cooled radiator and the second side edge of the liquid cooling plate, and the first side edge and the second side edge are opposite along the thickness direction perpendicular to the liquid cooling plate. The air flow formed when the air-cooled radiator works can cover the surface of the liquid cooling plate as much as possible, thereby achieving better air-cooled heat dissipation effect.

[0016] In a second aspect, the embodiments of the present application provide a kind of energy storage system, energy storage system includes battery and power converter, power converter is as any one electronic equipment provided in the first aspect;Battery is electrically connected with power converter, and power conversion device is used to output the power conversion of battery and exports to load or power grid, or for the power conversion of power grid input power and provides battery.Wherein the power converter can obtain good heat dissipation, it is favorable to can improve the efficacy of energy storage system.

[0017] In one embodiment, the energy storage system includes a cabinet, the battery and the power converter are housed in the cabinet, and the battery and the power converter are arranged along the height direction of the cabinet. The liquid cooling plate in the power converter does not substantially occupy the size of the cabinet perpendicular to the height direction, which is conducive to the structural layout in the cabinet. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A structural schematic diagram of an energy storage system provided by the embodiments of the present application is shown.

[0019] Figure 2a A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown.

[0020] Figure 2b An exploded view of an electronic device provided by the embodiments of the present application is shown.

[0021] Figure 2c An exploded view of an electronic device provided by the embodiments of the present application is shown.

[0022] Figure 3a A structural schematic diagram of a liquid cooling plate provided by the embodiments of the present application is shown.

[0023] Figure 3b An exploded view of a liquid cooling plate provided by the embodiments of the present application is shown.

[0024] Figure 3c A working state schematic diagram of a liquid cooling plate provided by the embodiments of the present application is shown.

[0025] Figure 4a A schematic diagram of part of the flow channel of a liquid cooling plate provided by the embodiments of the present application is shown.

[0026] Figure 4b A schematic diagram of part of the flow channel of a liquid cooling plate provided by the embodiments of the present application is shown.

[0027] Figure 4c A schematic diagram of part of the flow channel of a liquid cooling plate provided by the embodiments of the present application is shown.

[0028] Figure 4d A schematic diagram of part of the flow channel of a liquid cooling plate provided by the embodiments of the present application is shown.

[0029] Figure 5a An exploded view of a liquid cooling plate provided by an embodiment of the present application;

[0030] Figure 5b A schematic diagram of the liquid cooling plate provided by an embodiment of the present application for heat dissipation of electronic components;

[0031] Figure 6 A structural schematic diagram of a spoiler of a liquid cooling plate provided by an embodiment of the present application;

[0032] Figure 7a A structural schematic diagram of a liquid cooling plate provided by an embodiment of the present application;

[0033] Figure 7b A partial structural schematic diagram of a liquid cooling plate provided by an embodiment of the present application;

[0034] Figure 7c A structural schematic diagram of a connecting end of a liquid cooling plate provided by an embodiment of the present application;

[0035] Figure 8 A structural schematic diagram of multiple liquid cooling plates supplied with cooling by a cooling source provided by an embodiment of the present application;

[0036] Figure 9a A structural schematic diagram of a liquid cooling plate provided by an embodiment of the present application;

[0037] Figure 9b A structural schematic diagram of a liquid cooling plate provided by an embodiment of the present application;

[0038] Figure 10 A structural schematic diagram of a liquid cooling plate provided by an embodiment of the present application;

[0039] Figure 11a A partial structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0040] Figure 11b A partial structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0041] Figure 12a A partial structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0042] Figure 12b A partial structural schematic diagram of an electronic device provided by an embodiment of the present application.

[0043] Reference signs:

[0044] 100 - energy storage cabinet

[0045] 10 - electronic device; 20 - cabinet; 201 - body; 202 - cabinet door; 30 - battery; 40 - controller; 50 - power converter

[0046] 1 - housing; 11 - air outlet; 12 - air inlet; 2 - base plate; 3, 3a, 3b - electronic component; 31 - first electronic component; 32 - second electronic component; 4 - liquid cooling plate; 41 - top plate; 411 - sealing groove; 42 - bottom plate; 43 - middle plate; 431 - hollow structure; 44 - flow guide; 45 - turbulence part; 46 - connecting end; 461 - fluid channel; 461a - liquid inlet channel; 461b - liquid outlet channel; 47 - air-cooled radiator; 5 - heat-conducting adapter; 6 - sealing ring;

[0047] b1 - first side; b2 - second side; n1, n2 - port; t - communication port; D - flow channel; J - flow channel port; T - isolation cavity; Q - containing cavity; R1 - first end; R2 - second end. DETAILED DESCRIPTION

[0048] Power converters are the core devices in energy storage systems, responsible for implementing bidirectional flow of electrical energy and controlling the charging and discharging process of batteries. Taking a power conversion system (PCS) as an example, it can convert direct current into alternating current, or convert alternating current into direct current for storage, thereby achieving efficient energy management and regulation. Liquid cooling can prevent the temperature of the power converter from being too high to affect the function and service life, and is more conducive to the spatial layout of the energy storage system. How to design the structure of the liquid cooling plate so that the liquid cooling plate can improve the heat dissipation capacity according to the heat dissipation requirements of the power converter is a technical problem that needs to be solved at present.

[0049] Based on this, the electronic device and the energy storage system provided by the embodiments of the present application can change the flow speed of the cooling medium at different positions of the flow channel, thereby changing the heat dissipation capacity to meet different heat dissipation requirements.

[0050] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be described in further detail below with reference to the drawings.

[0051] The terms used in the following embodiments are only for the purpose of describing the specific embodiments and are not intended to be limiting on the present application. As used in the specification and the appended claims of the present application, the singular forms "a," "an," and "the" are intended to include the plural forms, such as "one or more," unless the context clearly indicates otherwise.

[0052] Reference in the specification to "one embodiment" or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in some embodiments" in various places in the specification are not necessarily all referring to the same embodiment, although it can. The terms "including," "comprising," "having" and variations thereof are meant to encompass the items listed thereafter and equivalents thereof as well as additional items.

[0053] Energy storage systems are applied in scenarios such as home energy storage, industrial energy storage, data centers, power stations, and vehicle charging, for storing and releasing electric energy. Figure 1 An energy storage system structure is provided for embodiments of the application. As shown in Figure 1 The energy storage system example is an energy storage cabinet 100, which includes a power converter 50, a cabinet 20, a battery 30, and a controller 40. The cabinet 20 includes a body 201 and a cabinet door 202. The power converter 50, the battery 30, and the controller 40 are detachably installed in the cabinet 20. The number of power converters 50 is one or more, and the number of batteries 30 is one or more. In an embodiment, along the height direction of the cabinet 20, one or more power converters 50 are installed between the controller 40 and the one or more battery packs 30. The power converter 50 is electrically connected to the battery 30, for converting alternating current into direct current to provide to the battery, or converting direct current from the battery into alternating current to output externally.

[0054] In Figure 1 the energy storage cabinet 100, when the number of power converters 50 is multiple, multiple power conversion devices 50 are arranged in sequence along the height direction of the energy storage cabinet 100. Each power converter 50 is integrated with a liquid cooling structure for liquid cooling and heat dissipation of the corresponding power converter 50.

[0055] Embodiments of the application provide an electronic device 10 as shown in Figure 2a and Figure 2b The electronic device 10 is cooled by liquid cooling. In an embodiment, as shown in Figures 2a to 2c The electronic device 10 includes a housing 1, a substrate 2, a plurality of electronic components 3, and a liquid cooling plate 4. The substrate 2 and one or more electronic components 3 are housed in the housing 1, and the liquid cooling plate 4 is fixed to the housing 1 for liquid cooling and heat dissipation of each electronic component 3. The electronic device 10 includes, but is not limited to, terminal devices in the field of personal consumer products, communication devices in the field of communications, energy storage devices in the field of energy, and the like, and of course also includes Figure 1The power converter 50 in the power converter 50.

[0056] The substrate 2 can be a ceramic substrate, a metal crystal holder, a single-sided or double-sided copper-clad ceramic substrate (which can be a DBC board or a DCB board), an active metal bonding (AMB) substrate, an insulated metal substrate (IMS), a Substrate, a printed circuit board (PCB), or other types of packaging substrates. DBC is an abbreviation of direct bond copper, and DCB is an abbreviation of direct copper bonding. The electronic element 3 can be one or a combination of a chip, a power element, and a passive element. The chip can be an integrated circuit (IC) chip, for example. The power element can be a diode, a transistor, or the like, where the transistor can be an insulate gate bipolar transistor (IGBT), a metal oxide semiconductor field effect transistor (MOSFET), or the like. The passive element can be a capacitor, a resistor, an inductor, or the like. In addition, the electronic element 3 can also be a fan-in, fan-out structure chip or a complete pre-packaging structure derived from a chip, a power element, or a passive element, or the like. The packaging structure in the present application can include materials such as silicone gel, epoxy molding compound, and epoxy potting compound.

[0057] As shown in FIG. 1, Figures 2a to 2c A three-dimensional coordinate system is established with reference to the shape of the shell 1 for ease of understanding. The three-dimensional coordinate system includes a first direction X, a second direction Y, and a third direction Z, which are perpendicular to each other. The third direction Z is the thickness direction of the shell 1 and the electronic device 10. The first direction X is one of the length direction and the width direction of the shell 1 and the electronic device 10. The second direction Y is the other of the length direction and the width direction of the shell 1 and the electronic device 10. The thickness of the shell 1 is less than the length and the width of the shell 1.

[0058] The internal space of the shell 1 forms a receiving cavity Q, and the substrate 2 and the plurality of electronic elements 3 are received in the receiving cavity Q of the shell 1. The plurality of electronic elements 3 are all fixed to the substrate 2, and the plurality of electronic elements 3 can be electrically connected with the substrate 2 to form a functional circuit. The liquid cooling plate 4 is fixed outside the shell 1, and the circulating cooling medium flowing through the liquid cooling plate 4 dissipates heat for the plurality of electronic elements 3.

[0059] In one embodiment, the shell 1 is combined withFigure 2a and Figure 2b As shown, multiple electronic components 3 are housed within a housing 1, and a liquid cooling plate 4 is fixed to the outside of the housing 1. The multiple electronic components 3 are shielded by the housing 1 and are indicated by dashed lines. At least one of the multiple electronic components 3 can achieve thermal contact by connecting with the inner surface of the housing 1, and indirectly dissipate heat by conducting heat through the housing 1 to the liquid cooling plate 4. The sidewall where the electronic component 3 connects to the housing 1 is also the sidewall where the liquid cooling plate 4 connects to the housing 1. The electronic component 3 is connected to the inner surface of this sidewall, and the liquid cooling plate 4 is connected to the outer surface of this sidewall.

[0060] In one embodiment, combined with Figure 2a and Figure 2c As shown, multiple electronic components 3 are housed within a housing 1, and a liquid cooling plate 4 is fixed to the outside of the housing 1. Along the third direction Z, one sidewall of the housing 1 includes a window C communicating with a receiving cavity Q. The liquid cooling plate 4 is fixed to the surface of the housing 1 and covers the window C, allowing the surface of the liquid cooling plate 4 facing the housing 1 to communicate with the receiving cavity Q. At least one electronic component 3 can be exposed through the window C and thermally connected to the liquid cooling plate 4, allowing for liquid cooling of the at least one electronic component 3. The two surfaces of the housing 1 perpendicular to the third direction Z have large areas, and the window C can be designed to be larger, enabling the liquid cooling plate 4 to thermally connect to more electronic components 3 or to have a larger thermally conductive area with the electronic components 3, achieving better heat dissipation.

[0061] When electronic device 10 is installed as a power converter Figure 1 In the energy storage cabinet 100 shown, the thickness direction of the electronic device 10 is the height direction of the energy storage cabinet 100, and the energy storage cabinet 100 has fewer restrictions in the height direction. The liquid cooling plate 4 is fixed to one side of the housing 1 in the thickness direction. The liquid cooling plate 4 occupies the thickness direction of the electronic device 10, which is the height direction of the energy storage cabinet 100. It does not increase the size of the electronic device 10 perpendicular to the thickness direction, nor does it occupy the space of the energy storage cabinet 100 perpendicular to the height direction.

[0062] like Figure 3a As shown in the embodiment of this application, a liquid cooling plate 4 includes an internal flow channel D and inlet / outlet ports communicating with the flow channel D. The inlet / outlet ports include two flow ports J. One flow port J is used to supply cooling medium to the flow channel D, and the other flow port J is used to discharge the cooling medium in the flow channel D. An external cold source achieves cyclic cooling of the flow channel D through the inlet / outlet ports. When the liquid cooling plate 4 is used to dissipate heat for multiple electronic components 3 in the electronic device 10, the projection of each electronic component 3 along the third direction Z on the liquid cooling plate 4 at least partially overlaps with the flow channel D.

[0063] In one embodiment, the liquid cooling plate 4 provided in this application is a stacked design structure, comprising a top plate 41, a bottom plate 42, and an intermediate plate 43, which are sequentially stacked and connected as a single unit along the third direction Z. In a specific manufacturing process, brazing can be used to weld the top plate 41, bottom plate 42, and intermediate plate 43 into a single unit, which can reduce machining and stamping processes from the design stage, ensuring the low cost and long-term reliability of the liquid cooling plate 4.

[0064] In this design, any one of the top plate 41, bottom plate 42, and intermediate plate 43 can be formed by stacking multiple plates of the same shape. The plates can be in various forms, including but not limited to sheet metal structures and composite solder structures. The stacked liquid cooling plate 4 has a smaller thickness, and the design of the internal flow channel D is also more cost-effective. In some embodiments, the top plate 41 or bottom plate 42 can be designed with grooves, which cooperate with the intermediate plate 43 to form the flow channel D.

[0065] Figure 3b An exploded view of a liquid cooling plate 4 provided in an embodiment of this application. (In conjunction with...) Figure 3a and Figure 3b As shown, the intermediate plate 43 includes a perforated structure 431 that extends through the intermediate plate 43 along the thickness of the liquid cooling plate 4. When the intermediate plate 43 is connected between the top plate 41 and the bottom plate 42, the perforated structure 431, the top plate 41, and the bottom plate 42 can enclose a flow channel D for the flow of cooling medium. The depth of the flow channel D is the dimension of the flow channel D along the third direction Z, that is, the thickness of the intermediate plate 43 and the distance between the top plate 41 and the bottom plate 42. The perforated structure 431 of the intermediate plate 43 can be formed by punching, wire cutting, or laser cutting. To enhance the sealing performance of the flow channel D, the thickness of the top plate 41 and the bottom plate 42 can be increased.

[0066] As a specific example, two flow channels J serving as liquid inlets and outlets can be located on the top plate 41, with each flow channel J penetrating the top plate 41 along the third direction Z to connect to the flow channel D. For the overall structure of the liquid cooling plate 4, the two flow channels J for liquid inlets and outlets are located on one side of the liquid cooling plate 4 in the height direction, and will not occupy the dimension of the liquid cooling plate 4 perpendicular to the third direction Z when connected to an external cold source. Compared to setting the two flow channels J on the side of the liquid cooling plate 4 parallel to the third direction Z, this is beneficial for reducing the dimension of the liquid cooling plate 4 itself along the third direction Z.

[0067] In one embodiment, the liquid cooling plate 4 is attached and fixed to the housing 1 of the electronic device 10 via the top plate 41, and the flow channel D can be supplied with liquid by a cold source configured in the housing 1 of the electronic device 10, thereby further improving the integration of the electronic device 10.

[0068] Refer to together Figure 3a and Figure 3bAs shown, the liquid cooling plate 4 further comprises at least one flow guide 44, each flow guide 44 is accommodated in the flow channel D and can divide the cooling medium in the flow channel D. The specific position of each flow guide 44 in the flow channel D and the shape of the flow guide 44 can be adjusted according to the liquid cooling demand. In the manufacturing of the liquid cooling plate 4, each flow guide 44 can be fixed to any one of the top plate 41 and the bottom plate 42. Figure 3a and Figure 3b An example of a flow guide 44 is shown.

[0069] In one embodiment, along the flow direction of the cooling medium in the flow channel D or the extension direction of the flow channel D, the flow guide 44 is designed to have a first end R1 and a second end R2, and the flow cross-sectional area of the flow channel D at the first end R1 of the flow guide 44 is different from the flow cross-sectional area of the flow channel D at the second end R2 of the flow guide 44. The intervention of the flow guide 44 can change the flow cross-section of the liquid inlet and outlet of the section of the flow channel D, thereby changing the speed of the cooling medium after flowing through the section of the flow channel D. The change of the flow rate of the cooling medium will further affect the liquid cooling capacity of the cooling medium. In the structural design of the liquid cooling plate 4, the flow guide 44 can be arranged at a suitable position of the flow channel D according to the heat dissipation demand of the application scenario, so that the liquid cooling capacity of the cooling medium is increased or decreased when flowing through the section of the flow channel D provided with the flow guide 44, thereby meeting the special cooling demand.

[0070] As a specific example, as shown, Figure 3c The flow guide 44 in the liquid cooling plate 4 is specifically arranged in combination with the two electronic elements 3 in the electronic device 10 to achieve good heat dissipation of the electronic element 3 with high heat dissipation demand. The two electronic elements 3 are a first electronic element 31 and a second electronic element 32, and the heat generation of the first electronic element 31 at the maximum power is greater than that of the second electronic element 32 at the maximum power, i.e., the heat dissipation demand of the first electronic element 31 is higher than that of the second electronic element 32. The liquid cooling plate 4 is provided with a flow guide 44, which is at least partially located between the first electronic element 31 and the second electronic element 32, and the first end R1 of the flow guide 44 is closer to the first electronic element 31 than the second end R2. The flow guide 44 and the flow channel D are designed such that the flow cross-sectional area of the flow channel D at the first end R1 of the flow guide 44 is smaller than the flow cross-sectional area of the flow channel D at the second end R2 of the flow guide 44. Under the condition of the same flow rate, the flow rate of the cooling medium at the first end R1 is greater than that at the second end R2, and the cooling medium with higher flow rate can accelerate the heat exchange efficiency with the first electronic element 31, thereby meeting the higher heat dissipation demand of the first electronic element 31. The flow direction in the flow channel D can not be limited, and the liquid cooling system involving the entire flow channel D is taken as a reference.

[0071] It should be understood that the different flow cross-sectional areas of the flow channel D at the first end R1 and the second end R2 of the guide section 44 are related to the structural design of the flow channel D and the guide section 44, and the structural design of the flow channel D is related to the top plate 41, the bottom plate 42, and the intermediate plate 43 of the liquid cooling plate 4. The design will be illustrated by several specific embodiments below. Figures 4a to 4c The following are simplified structural diagrams of a flow channel D with an internal guide section 44.

[0072] like Figure 4a A flow guide 44 is provided within a section of the flow channel D shown. The width of the flow channel D remains relatively consistent, and the depth of the flow channel D is uniform. Along the flow direction M of the cooling medium, the two ends of the flow guide 44 are a first end R1 and a second end R2, respectively. Along the thickness direction of the liquid cooling plate 4, the flow guide 44 connects to the top plate 41 and the bottom plate 42, which are not shown here. Along the width direction W of the flow channel D, the flow guide 44 does not contact the two sides of the flow channel D, forming a gap. The gap between the flow guide 44 and the two sides of the flow channel D is used for the flow of the cooling medium, and this gap forms part of the flow channel D. The size of the first end R1 of the flow guide 44 is different from the size of the second end R2 of the flow guide 44. In one embodiment, along the width direction W of the flow channel, the distance between the two ends of either side of the flow guide 44 and the intermediate plate 43 is not equal. Specifically, the distances between the first end R1 of the guide section 44 and the two sides of the flow channel D are distances d11 and d12, respectively, and the distances between the second end R2 of the guide section 44 and the two sides of the flow channel D are distances d21 and d22, respectively. Along the width direction W of the flow channel D, distances d11 and d21 are located on one side of the guide section 44, and distances d12 and d22 are located on the other side of the guide section 44. The sum of distances d11 and d12 is greater than the sum of distances d21 and d22. When the depth of the flow channel D at the first end R1 is equal to the depth at the second end R2, the cross-sectional area of ​​the cooling medium at the first end R1 is smaller than the cross-sectional area at the second end R2.

[0073] like Figure 4bA flow guide section 44 is provided within a section of the flow channel D shown. The depth of the flow channel D is uniform. Along the thickness direction of the liquid cooling plate 4, the flow guide section 44 connects to the top plate 41 and the bottom plate 42, which are not shown here. Along the flow direction M of the cooling medium, the width of this section of the flow channel D varies, and the two ends of the flow guide section 44 are the first end R1 and the second end R2, respectively. Along the width direction W of the flow channel D, the width of the flow guide section 44 remains basically consistent. The flow guide section 44 does not contact the sides of the flow channel D, and the space between the flow guide section 44 and the sides of the flow channel D is used for the flow of the cooling medium. In one embodiment, the distances between the first end R1 of the flow guide 44 and the two sides of the flow channel D are distances d11 and d12, respectively, and the distances between the second end R2 of the flow guide 44 and the two sides of the flow channel D are distances d21 and d22, respectively. Distances d11 and d21 are located on one side of the flow guide 44, and distances d12 and d22 are located on the other side of the flow guide 44. The sum of distances d11 and d12 is less than the sum of distances d21 and d22. Since the depth of the flow channel D at the first end R1 is equal to the depth at the second end R2, the flow cross-section of the cooling medium at the first end R1 is smaller than the flow cross-section at the second end R2.

[0074] like Figure 4c A flow guide 44 is provided within a section of flow channel D. The width and depth of flow channel D are generally consistent. One side of the flow guide 44 along the width direction of flow channel D is fixed to an intermediate plate 43. Along the flow direction M of the cooling medium, the two ends of the flow guide 44 are a first end R1 and a second end R2, respectively. Along the width direction W of flow channel D, the size of the first end R1 of the flow guide 44 is different from the size of the second end R2. The flow guide 44 contacts one side of flow channel D, and the space between the flow guide 44 and the other side of flow channel D is used for the flow of cooling medium. In one embodiment, the distance between the first end R1 of the flow guide 44 and the other side of flow channel D is distance d1, and the distance between the second end R2 of the flow guide 44 and the other side of flow channel D is distance d2, where distance d1 is smaller than distance d2. Since the depth of flow channel D at the first end R1 is equal to the depth at the second end R2, the flow cross-section of the cooling medium at the first end R1 is smaller than the flow cross-section at the second end R2.

[0075] like Figure 4dA flow guide part 44 is arranged in a section of the flow channel D, the section of the flow channel D has a variable width, and the depth of the flow channel D is the same. The flow guide part 44 is fixed to the intermediate plate 43 along one side of the width direction of the flow channel D. In the flow direction M of the cooling medium, the two ends of the flow guide part 44 are respectively a first end R1 and a second end R2. In the width direction W of the flow channel D, the width of the flow guide part 44 remains basically unchanged, the flow guide part 44 is in contact with one side of the flow channel D, and the space between the flow guide part 44 and the other side of the flow channel D is used for the flow of the cooling medium. In an embodiment, the distance between the first end R1 of the flow guide part 44 and the other side of the flow channel D is a distance d1, the distance between the second end R2 of the flow guide part 44 and the other side of the flow channel D is a distance d2, and the distance d1 is less than the distance d2. Based on the depth of the flow channel D at the first end R1 being equal to the depth at the second end R2, the flow cross section of the cooling medium at the first end R1 is smaller than the flow cross section at the second end R2.

[0076] It should be understood that Figures 4a to 4d Four forms of cooperation between the flow guide part 44 and the section of the flow channel D are respectively illustrated, and the structural form of the flow guide part 44 and the structural form of the flow channel D can be adjusted in specific application scenarios to change the flow rate of the cooling medium in the flow process, thereby changing the heat dissipation capacity of the cooling medium passing through the section of the flow channel D. For example, the surface in the thickness direction of the flow guide part 44 can also be designed to be inclined, in combination with the gap between the flow guide part 44 and the intermediate plate 43 in the flow channel D, so that the flow channel D has different flow cross section areas at the first end R1 and the second end R2 of the flow guide part 44.

[0077] Figure 5a An exploded view of a liquid cooling plate 4 according to an embodiment of the present application is provided. As Figure 5a In some embodiments, the liquid cooling plate 4 further comprises at least one flow disturbing part 45, and each flow disturbing part 45 is fixed in the flow channel D. Specifically, the flow disturbing part 45 can be fixed to the intermediate plate 43, and specifically can be embedded in the side wall of the hollow structure 431. Alternatively, the flow disturbing part 45 can be fixed to at least one of the top plate 41 and the bottom plate 42.

[0078] In some embodiments, the flow disturbing part 45 can be a modular structure independent of the flow channel D, and can be installed at any position of the flow channel D as needed to perform targeted liquid cooling heat dissipation on the device to be cooled at the specific position.

[0079] As a specific example, the electronic elements with higher heat dissipation requirements among the plurality of electronic elements 3 are configured with the flow disturbing part 45, and the electronic elements with high heat dissipation requirements can be better cooled. As Figure 5bAs shown in a structure diagram of a liquid cooling plate 4 for dissipating heat of a plurality of electronic components 3, a flow channel D in the liquid cooling plate 4 is designed to pass through the area where each electronic component 3 is distributed, i.e. along the third direction Z, and the orthographic projection of each electronic component 3 on the liquid cooling plate 4 overlaps with the distribution area of the flow channel D, so that the cooling medium can dissipate heat of each electronic component 3 by liquid cooling when flowing through the flow channel D.

[0080] For reference, in an embodiment, the plurality of electronic components 3 includes a plurality of electronic components 3a and a plurality of electronic components 3b, and the heat generation of the electronic components 3a at maximum power is greater than that of the electronic components 3b at maximum power. In order to better dissipate heat of the electronic components 3a, a flow disturbance part 45 is arranged in the area of the flow channel D corresponding to each electronic component 3a. The cooling medium passes through the flow disturbance part 45 at a slower speed, can fully contact the liquid cooling plate 4, and further better dissipate heat of the corresponding electronic component 3a. Figure 5b For reference, in an embodiment, the plurality of electronic components 3 includes a plurality of electronic components 3a and a plurality of electronic components 3b, and the heat generation of the electronic components 3a at maximum power is greater than that of the electronic components 3b at maximum power. In order to better dissipate heat of the electronic components 3a, a flow disturbance part 45 is arranged in the area of the flow channel D corresponding to each electronic component 3a. The cooling medium passes through the flow disturbance part 45 at a slower speed, can fully contact the liquid cooling plate 4, and further better dissipate heat of the corresponding electronic component 3a.

[0081] Figure 5b For reference, in an embodiment, the plurality of electronic components 3 includes a plurality of electronic components 3a and a plurality of electronic components 3b, and the heat generation of the electronic components 3a at maximum power is greater than that of the electronic components 3b at maximum power. In order to better dissipate heat of the electronic components 3a, a flow disturbance part 45 is arranged in the area of the flow channel D corresponding to each electronic component 3a. The cooling medium passes through the flow disturbance part 45 at a slower speed, can fully contact the liquid cooling plate 4, and further better dissipate heat of the corresponding electronic component 3a. Figure 6 An example of a structure of a flow disturbance part 45 is shown. As shown in the figure, the flow disturbance part 45 is formed into a three-dimensional mesh structure by winding a plurality of wavy line bodies, and the holes therein are used for the cooling medium to flow through. The flow disturbance part 45 is placed at a certain position in the flow channel D, and the flow disturbance part 45 can reduce the flow speed of the cooling medium passing through, so that the cooling medium can more fully contact the liquid cooling plate 4 at this position of the flow channel D, increase the heat exchange area, and the cooling medium can better cool and dissipate heat of the structure to be cooled through the liquid cooling plate 4, thereby improving the heat dissipation effect. Figure 6

[0082] ​​In other embodiments, the spoiler 45 can be in the form of spoiler fins, spoiler columns, spoiler plates, or other forms as part of the structure of at least one of the top plate 41, the bottom plate 42, and the intermediate plate 43 of the liquid cooling plate 4, and the spoiler 45 is formed when the top plate 41, the bottom plate 42, and the intermediate plate 43 are formed.

[0083] As shown in a liquid cooling plate 4, Figure 7a including a connection head 46 fixed to the surface of the top plate 41 away from the bottom plate 42, the connection head 46 includes two fluid channels 461 isolated from each other, and the two fluid channels 461 are respectively used to communicate with both ends of the flow channel D. When the liquid cooling plate 4 is connected to the external cold source, the cold source can circulate cooling to the flow channel D through the two fluid channels 461 of the connection head 46. The connection head 46 integrates the inlet and outlet ports of the flow channel D into one structure, and in the layout of the liquid cooling plate 4 and the cold source, the liquid communication between the liquid cooling plate 4 and the cold source can be realized through the connection head 46, which can save layout space.

[0084] In an embodiment, the connection head 46 is configured to be close to one side edge of the liquid cooling plate 4, which facilitates the connection of the connection head 46 to the cold source. As shown in Figure 7a , along the first direction X, the liquid cooling plate 4 has opposite first and second side edges b1 and b2, and the distance between the connection head 46 and the first side edge b1 is greater than the distance between the connection head 46 and the second side edge b2.

[0085] In an embodiment, as shown in Figure 7b , the two fluid channels 461 are respectively an inlet channel and an outlet channel, the inlet channel communicates with one end of the flow channel D through a flow channel port J on the top plate 41, and the outlet channel communicates with the other end of the flow channel D through another flow channel port J on the top plate 41. Among them, the communication interfaces of the fluid channels 461 and the flow channel ports J and the communication interfaces of the flow channel ports J and the flow channel D can be defined by the size of the two ends of the flow channel port J and the size of the inner diameter of the flow channel port J.

[0086] Figure 7c A structure of a connection head 46 is shown, which is in the form of a rectangular parallelepiped. As shown in Figure 7c , the connection head 46 includes two fluid channels 461, and each fluid channel 461 includes two ports, which are port n1 and port n2. For each fluid channel 461, the two ports n1 and n2 are not coplanar, i.e. the ports n1 and n2 are located on two surfaces of the connection head 46. In a specific embodiment, the surface where the port n1 is located and the surface where the port n2 is located are arranged at an angle. When one of the two ports is used to communicate with one end of the flow channel D through a flow channel port J, the other port is used to communicate with the other end of the flow channel D through another flow channel port J.

[0087] In some embodiments, the ports n1 of the two fluid channels 461 are coplanar, and the ports n2 of the two fluid channels 461 are coplanar. In combination with Figure 7a and Figure 7b As shown in FIG. 4, when the connecting end 46 is fixed to the top plate 41, the plane in which the two ports n1 are located can be used to abut the surface of the top plate 41 away from the bottom plate 42, and the plane in which the two ports n2 are located can be used to abut the cold source. Alternatively, the plane in which the two ports n2 are located can be used to abut the surface of the top plate 41 away from the bottom plate 42, and the plane in which the two ports n1 are located can be used to abut the cold source. In the structural design of the connecting end 46 configured to connect the flow channel D and the cold source, the difficulty of space layout can be reduced, which is conducive to reducing the space required for liquid path communication.

[0088] As shown in FIG. 4, when the connecting end 46 is fixed to the top plate 41, the plane in which the two ports n1 are located can be used to abut the surface of the top plate 41 away from the bottom plate 42, and the plane in which the two ports n2 are located can be used to abut the cold source. Alternatively, the plane in which the two ports n2 are located can be used to abut the surface of the top plate 41 away from the bottom plate 42, and the plane in which the two ports n1 are located can be used to abut the cold source. In the structural design of the connecting end 46 configured to connect the flow channel D and the cold source, the difficulty of space layout can be reduced, which is conducive to reducing the space required for liquid path communication. Figure 7c As shown in FIG. 4, when the connecting end 46 is fixed to the top plate 41, the plane in which the two ports n1 are located can be used to abut the surface of the top plate 41 away from the bottom plate 42, and the plane in which the two ports n2 are located can be used to abut the cold source. Alternatively, the plane in which the two ports n2 are located can be used to abut the surface of the top plate 41 away from the bottom plate 42, and the plane in which the two ports n1 are located can be used to abut the cold source. In the structural design of the connecting end 46 configured to connect the flow channel D and the cold source, the difficulty of space layout can be reduced, which is conducive to reducing the space required for liquid path communication.

[0089] With reference to the overall structure of the liquid cooling plate 4, the two fluid channels 461 of the connecting end 46 can change the direction of the cooling medium communicated to the flow channel D through the flow channel port J, which facilitates the overall structural layout of the liquid cooling plate 4. Specifically, as shown in FIG. 4, the direction of the cooling medium entering or flowing out of the flow channel D through the flow channel port J is substantially parallel to the third direction Z, and the direction of the cooling medium entering or flowing out of the liquid cooling plate 4 through the fluid channel 461 is at an angle with the third direction Z, Figures 7a to 7c As shown in FIG. 4, the direction of the cooling medium entering or flowing out of the flow channel D through the flow channel port J is substantially parallel to the third direction Z, and the direction of the cooling medium entering or flowing out of the liquid cooling plate 4 through the fluid channel 461 is at an angle with the third direction Z, Figure 7a As shown in FIG. 4, the direction of the cooling medium entering or flowing out of the flow channel D through the flow channel port J is substantially parallel to the third direction Z, and the direction of the cooling medium entering or flowing out of the liquid cooling plate 4 through the fluid channel 461 is at an angle with the third direction Z,

[0090] Based on the structure shown in FIG. 4, as shown in FIG. 4, when a plurality of liquid cooling plates 4 are arranged in sequence along the third direction Z, one cold source located on the periphery of the plurality of liquid cooling plates 4 can be used to circulate cooling for the plurality of liquid cooling plates 4. It should be understood that each liquid cooling plate 4 is integrated into a housing 1 when applied to one electronic device 10, and the liquid path communication relationship between the cold source and the plurality of liquid cooling plates 4 here is only one communication mode, and does not limit the specific liquid path communication structure. Figures 7a to 7c Figure 8 Based on the structure shown in FIG. 4, as shown in FIG. 4, when a plurality of liquid cooling plates 4 are arranged in sequence along the third direction Z, one cold source located on the periphery of the plurality of liquid cooling plates 4 can be used to circulate cooling for the plurality of liquid cooling plates 4. It should be understood that each liquid cooling plate 4 is integrated into a housing 1 when applied to one electronic device 10, and the liquid path communication relationship between the cold source and the plurality of liquid cooling plates 4 here is only one communication mode, and does not limit the specific liquid path communication structure. ​

[0091] In some embodiments, the top plate 41 of the liquid cooling plate 4 is used to fix it to the housing 1 of the electronic device 10, the connection end 46 can be accommodated in the housing 1, and the cold source for supplying liquid to the liquid cooling plate 4 can be at least partially accommodated in the housing 1. Taking the overall structure of the electronic device 10 as a reference, the housing 1 can provide a certain degree of sealing protection for the liquid circuit connection of the liquid cooling plate 4, reducing the risk of leakage of the liquid cooling circuit of the cooling medium.

[0092] like Figure 9a The example illustrates a liquid cooling plate 4, which is used as... Figure 2c The illustrated method is for heat dissipation of electronic component 3, with top plate 41 used to fix it to housing 1 of electronic device 10. At least one electronic component 3 inside housing 1 can be directly connected to liquid cooling plate 4 for heat dissipation through window C. To enhance the sealing of top plate 41 fixed to housing 1, the surface of top plate 41 facing away from bottom plate 42 includes an annular sealing groove 411. In one embodiment, the inlet and outlet of flow channel D are located outside the area enclosed by sealing groove 411, that is, the two flow ports J of liquid cooling plate 4 are located outside the area enclosed by sealing groove 411. The area enclosed by sealing groove 411 is used to contact the electronic component 3, and the two flow ports J are located outside the area enclosed by sealing groove 411, isolating the two flow ports J from the area used to contact the device to be cooled.

[0093] like Figure 9b In the example of a liquid cooling plate 4, the inlet and outlet of the liquid cooling plate 4 are integrated through a connecting end 46. The connecting end 46 is located outside the area enclosed by the sealing groove 411, which isolates the connecting end 46 from the area used to contact the device to be cooled. When the top plate 41 of the liquid cooling plate 4 is fixed to the housing 1, a sealing ring can be embedded in the sealing groove 411 for sealing connection with the housing 1. The area enclosed by the sealing groove 411 can be thermally connected to the device inside the housing 1. The sealing groove 411 can isolate the device with circuitry and the connecting end 46, which also has liquid channels, achieving water and electricity isolation. This reduces the possibility of the coolant inside the liquid cooling plate 4 leaking liquid at the connecting end 46 and contacting the device inside the housing 1, thus improving safety.

[0094] like Figure 10 The example includes a liquid cooling plate 4, which also includes an air-cooled radiator 47. The air-cooled radiator 47 can achieve heat exchange between the liquid cooling plate 4 and the air through airflow, thereby enhancing the cooling effect of the liquid cooling plate 4.

[0095] In one embodiment, the top plate 41 is used to fix the housing 1 of the electronic device 10, and the air-cooled heat sink 47 can be fixed to the surface of the top plate 41 opposite to the bottom plate 42. When the liquid cooling plate 4 is fixed to the housing 1, the air-cooled heat sink 7 can be housed inside the housing 1.

[0096] In one embodiment, the air-cooled heat sink 47 is fixed to the top plate 41 and close to one side plate of the liquid-cooled plate 4, facilitating the design of the air flow formed by the air-cooled heat sink 47. Specifically, in the first direction X, the liquid-cooled plate 4 has opposite first and second side edges b1 and b2, and the air-cooled heat sink 47 is spaced apart from the first side edge b1 by a distance greater than the distance between the connecting end 46 and the second side edge b2. By arranging the air-cooled heat sink 47 close to the side edge of the liquid-cooled plate 4, when the air-cooled heat sink 47 is in operation, the air flow formed thereby can cover the surface of the liquid-cooled plate 4 as much as possible, achieving better air-cooled heat dissipation effect.

[0097] As shown in Figure 11a , in an electronic device 10 provided by an embodiment of the present application, the liquid-cooled plate 4 is fixed to the surface of the housing 1 having a window C in a manner shown in Figure 2c , and the liquid-cooled plate 4 blocks the window C. The housing 1 includes a receiving cavity Q, and the substrate 2 and the electronic components 3 are accommodated in the receiving cavity Q, with the substrate 2 fixed to the inner wall of the housing 1. The electronic components 3 are exemplified by two, and the two electronic components 3 are respectively fixed to the surface of the substrate 2 away from the inner wall of the housing 1. The liquid-cooled plate 4 can be connected to each electronic component 3 through the window C, and a heat transfer link is established between the electronic component 3 and the liquid-cooled plate 4.

[0098] In a specific embodiment, the electronic device 10 includes a plurality of electronic components 3, and the different electronic components 3 have different heights in the third direction Z, while the surface of the liquid-cooled plate 4 facing the plurality of electronic components 3 is substantially planar. In order to enable each electronic component to be connected to the liquid-cooled plate 4 for heat conduction, for the electronic components 3 that cannot directly contact the liquid-cooled plate 4, a heat-conductive adapter 5 can be used to connect the electronic component 3 and the liquid-cooled plate 4. In one embodiment, the height of at least one electronic component 3 of the plurality of electronic components 3 protruding from the substrate 2 is equal to the distance between the substrate 2 and the liquid-cooled plate 4, and the surface of the electronic component 3 away from the substrate 2 can be directly connected to the liquid-cooled plate 4 for liquid-cooled heat dissipation. The plurality of electronic components 3 also includes at least one electronic component 3 having a height less than the distance between the substrate 2 and the liquid-cooled plate 4, and the electronic component 3 can be connected to the liquid-cooled plate 4 through the heat-conductive adapter 5. The heat-conductive adapter 5 has good heat conduction effect, and can transfer the heat of the electronic component 3 to the cooling medium in the flow channel D through the liquid-cooled plate 4, thereby achieving heat dissipation of the electronic component 3.

[0099] In one embodiment, the housing 1 also includes an isolation cavity T, which is isolated from the receiving cavity Q, and the isolation cavity T is used to accommodate a pipeline for connecting the flow channel D of the liquid-cooled plate 4 to an external cooling source. Correspondingly, the side wall of the housing 1 used to fix the liquid-cooled plate 4 includes a communication port t isolated from the receiving cavity Q, and the communication port t connects the isolation cavity T to the inlet and outlet of the flow channel D. As a specific example, as shown in Figure 11aAs shown, at least a portion of the connecting end 46 on the liquid cooling plate 4 can pass through the communication port t and be accommodated in the isolation cavity T. By isolating the connecting end 46 from the electronic element 3 through the isolation of the isolation cavity T and the accommodation cavity Q, water and electricity isolation is achieved.

[0100] Figure 11b A partial structure cross-sectional view of the electronic device 10 is shown, the cross-section being along the third direction Z and passing through the connecting end 46. Reference is made to Figure 11a and Figure 11b As shown, the top plate 41 can be fixed to the shell 1 by welding, threaded connection or the like. The top plate 41 of the liquid cooling plate 4 covers the window C of the shell 1, and the sealing groove 411 included in the surface of the top plate 41 towards the shell 1 surrounds the window C. The orthogonal projection of the window C on the liquid cooling plate 4 along the third direction Z falls within the area surrounded by the sealing groove 411, and the orthogonal projection of the area surrounded by the sealing groove 411 on the shell 1 along the third direction Z covers the window C. The sealing ring 6 is embedded in the sealing groove 411, and can be a rubber ring or a silica gel ring. The sealing ring 6 can meet the sealing condition, and also has a structure buffering effect on the cooperative installation of the liquid cooling plate 4 and the shell 1, thereby improving the connection reliability therebetween. Along the third direction Z, the sealing ring 6 protrudes from the surface of the top plate 41 towards the shell 1. When the liquid cooling plate 4 is fixed to the shell 1, the sealing ring 6 can be in interference fit between the sealing groove 411 of the top plate 41 and the shell 1, thereby achieving the sealing cooperation between the top plate 41 and the shell 1. The shell 1 further includes a communication port t in communication with the isolation cavity T, and the connecting end 46 can pass through the communication port t and enter the isolation cavity T. The connecting end 46 fixed to the top plate 41 extends into the isolation cavity T, and the cold source can circulate and supply cold to the flow channel D of the liquid cooling plate 4 through the connecting end 46. Here, the structure of the cold source is not shown, and only the connecting end 46 is shown as being partially accommodated in the isolation cavity T of the shell 1, and the isolation cavity T is used to arrange at least a portion of the liquid cooling circuit.

[0101] Figure 12a A partial structure view of the electronic device 10 is shown. As shown in Figure 12b The liquid cooling plate 4 includes an air cooling radiator 47, and the air cooling radiator 7 is installed on the surface of the liquid cooling plate 4 towards the shell 1 and can be accommodated in the shell 1. The air cooling radiator 7 can take away the heat from the surface of the liquid cooling plate 4 towards the shell 1 through air flow, thereby strengthening the cooling effect of the electronic element 3.

[0102] Figure 12b A cross-sectional view of Figure 12a is shown, the cross-section passing through the air cooling radiator 7. Reference is made to Figure 12a and Figure 12bAs shown, in order to form the air flow, the shell 1 further comprises an air inlet 12 and an air outlet 11, and the air-cooled radiator 7 is arranged between the air inlet 12 and the air outlet 11. In an embodiment, the air-cooled radiator 7 corresponds to the air outlet 11. The air-cooled radiator 7 works to disturb the air, so that the air flow can be formed between the air inlet 12 and the air outlet 11. As a specific structural diagram, the plurality of electronic elements 3 are arranged between the air inlet 12 and the air outlet 11, so that the air flow formed by the air-cooled radiator 7 can also pass through the plurality of electronic elements 3, and the plurality of electronic elements 3 are air-cooled and radiated. Among them, the air-cooled radiator 47 is arranged close to the side edge of the liquid cooling plate 4, and when the air-cooled radiator 47 works, the air flow formed can cover the surface of the liquid cooling plate 4 as much as possible, and better air-cooled and radiated effect is obtained.

[0103] It should be understood that the liquid cooling plate 4 provided by the embodiment of the present application can also be applied to other electronic devices 10 that need to be cooled, such as electronic devices 10 in photovoltaic systems and electric drive systems, and is not limited to the energy storage scene in the examples of the present application.

[0104] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising: The electronic device comprises a housing, a substrate, a plurality of electronic components, and a liquid cooling plate; The substrate, the plurality of electronic components are accommodated in the housing, the plurality of electronic components are fixed to the substrate, and the liquid cooling plate is fixed to the outer surface of the housing; The plurality of electronic components comprise a first electronic component and a second electronic component, the first electronic component generates more heat at maximum power than the second electronic component; The liquid cooling plate comprises a top plate, a bottom plate, and an intermediate plate, and along the thickness direction of the liquid cooling plate, the orthogonal projection of the liquid cooling plate on the substrate overlaps with the first electronic component and the second electronic component; The intermediate plate comprises a hollow structure, the hollow structure penetrates through the intermediate plate along the thickness direction of the liquid cooling plate, the intermediate plate is connected between the top plate and the bottom plate, and the hollow structure and the top plate and the bottom plate enclose a flow channel for circulating cooling medium; The liquid cooling plate further comprises a flow guide part, the flow guide part is accommodated in the flow channel and fixed to at least one of the top plate, the bottom plate and the intermediate plate; Along the flow direction of the cooling medium, the flow guide part is at least partially located between the first electronic component and the second electronic component; Along the flow direction of the cooling medium, the flow guide part has a first end and a second end, the first end is closer to the first electronic component than the second end, and the flow cross-sectional area of the flow channel at the first end of the flow guide part is smaller than the flow cross-sectional area of the flow channel at the second end of the flow guide part.

2. The electronic device of claim 1, wherein, Along the thickness direction of the liquid cooling plate, the flow guide part is connected to the top plate and the bottom plate respectively; Along the width direction of the flow channel, there is a gap between the two sides of the flow guide part and the intermediate plate to form part of the flow channel, and the distances between the two ends of any one side of the flow guide part and the intermediate plate are not equal.

3. The electronic device of claim 1, wherein, Along the width direction of the flow channel, one side of the flow guide part is fixed to the intermediate plate, and the other side of the flow guide part has a gap with the intermediate plate to form part of the flow channel, and the distances between the two ends of the other side of the flow guide part and the intermediate plate are not equal.

4. The electronic device of any of claims 1-3, wherein, The liquid cooling plate further comprises a flow guide part accommodated in the flow channel, and along the thickness direction of the liquid cooling plate, the orthogonal projection of the flow guide part on the substrate overlaps with the first electronic component.

5. The electronic device of any of claims 1-4, wherein, The housing comprises a window, the window penetrates through the housing for fixing the side wall of the liquid cooling plate, and the liquid cooling plate is fixed to the housing and covers the window; At least one of the electronic components is connected to the liquid cooling plate through the window.

6. The electronic device of claim 5, wherein, The surface of the top plate away from the bottom plate comprises an annular sealing groove, the sealing groove is used to accommodate a sealing ring, and the sealing ring protrudes from the surface of the top plate towards the housing; The area enclosed by the sealing groove covers the window, and the inlet and outlet of the flow channel are located outside the area enclosed by the sealing groove.

7. The electronic device of claim 5 or 6, wherein, Along the thickness direction of the liquid cooling plate, the height of at least one of the electronic components protruding from the substrate is smaller than the distance between the substrate and the liquid cooling plate and is connected to the liquid cooling plate through a heat conduction part.

8. The electronic device of any one of claims 1-7, wherein, The shell comprises a containing cavity and an isolation cavity, the substrate and the at least one electronic component are accommodated in the containing cavity, and the isolation cavity is used for accommodating a pipeline for the flow channel to communicate with an external cold source. The shell comprises a communication port which is isolated from the containing cavity, and the communication port communicates the isolation cavity with the liquid inlet and the liquid outlet of the flow channel.

9. The electronic device of claim 8, wherein, The liquid cooling plate comprises a connecting end fixed to the surface of the top plate away from the bottom plate, and the connecting end comprises two fluid channels which are isolated from each other and respectively communicate with the liquid inlet and the liquid outlet of the flow channel. At least a part of the connecting end is accommodated in the isolation cavity through the communication port along the thickness direction of the liquid cooling plate.

10. The electronic device of any one of claims 1-9, wherein, The liquid cooling plate comprises a connecting end fixed to the surface of the top plate away from the bottom plate, and the connecting end has a distance to a first side of the liquid cooling plate which is greater than a distance to a second side of the liquid cooling plate, and the first side and the second side are opposite along a direction perpendicular to the thickness direction of the liquid cooling plate. The connecting end comprises two fluid channels which are isolated from each other and respectively communicate with the liquid inlet and the liquid outlet of the flow channel.

11. The electronic device of claim 10, wherein, The inlet and the outlet of each fluid channel are not coplanar. The inlet of one fluid channel is coplanar with the outlet of the other fluid channel, and the outlet of one fluid channel is coplanar with the inlet of the other fluid channel.

12. The electronic device of any one of claims 1-11, wherein, The electronic device further comprises an air cooling radiator fixed to the surface of the top plate away from the bottom plate, and the air cooling radiator has a distance to a first side of the liquid cooling plate which is greater than a distance to a second side of the liquid cooling plate, and the first side and the second side are opposite along a direction perpendicular to the thickness direction of the liquid cooling plate.

13. The electronic device of any of claims 1-12, wherein, One end of the at least one electronic component away from the substrate is connected to the inner surface of a first side wall of the shell, and the liquid cooling plate is fixed to the outer surface of the first side wall.

14. An energy storage system characterized by, The energy storage system comprises a battery and a power converter, and the power converter is the electronic device of any one of claims 1-13. The battery is electrically connected with the power converter, and the power converter is used for outputting the power converted by the battery to a load or a power grid, or is used for providing the power converted by the power grid to the battery.

15. The energy storage system of claim 14, wherein, The energy storage system comprises a cabinet, and the battery and the power converter are accommodated in the cabinet, and the battery and the power converter are arranged at intervals along the height direction of the cabinet.

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