Bearing disc device
By integrating a positioning unit, pressure sensor, and optical detection unit into the carrier plate device, the shortcomings of traditional carrier plates in semiconductor manufacturing for positioning and detection are solved, achieving safe and stable transportation and efficient detection, thereby improving production efficiency and accuracy.
Patent Information
- Application Number
- CN202520009103.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-01-03
AI Technical Summary
Traditional carrier trays lack precise positioning and detection capabilities in semiconductor manufacturing and packaging testing, making it difficult to trace the product's location and status. Manual operation is prone to damage, increasing labor time and costs. Furthermore, they are easily lost or damaged during transportation, resulting in low detection efficiency and inconsistent results.
Design a carrier plate device that integrates a positioning unit, pressure sensor, optical detection unit and controller. Combined with a robotic arm and multiple positioning technologies, it can achieve precise positioning, real-time detection and safe transportation, and support automated operation and data recording.
It enables safe and stable transportation and efficient testing of electronic components during the production process, improves production transparency and testing accuracy, reduces labor costs and damage risks, and optimizes production efficiency.
Smart Images

Figure CN223798652U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the semiconductor field, and more particularly to a carrier disk device. Background Technology
[0002] In semiconductor manufacturing and packaging testing, carrier trays are crucial tools for storing and transporting electronic components such as chips. Traditional carrier trays typically only have simple storage functions and lack the ability to precisely locate and inspect electronic components. After electronic components are mounted on the carrier tray, the lack of an effective recording and tracking mechanism makes it impossible to trace the specific location and status of the products. This not only increases the difficulty of production management but also makes it difficult to quickly locate and resolve problems when they occur.
[0003] During the post-packing inspection process, products need to be manually picked up and turned. This manual operation can easily cause physical damage to the products, such as scratches and cracks. Furthermore, manual operation significantly extends working hours, increases labor costs, and operator fatigue also increases the risk of errors. All these factors seriously affect product quality and production efficiency.
[0004] Carrier trays cannot be tracked in real time during transportation, making them prone to loss, collisions, and drops. These problems not only damage the product but also affect production schedules. For example, if a carrier tray is lost during transportation, the entire batch of products may not be packaged and tested on time, thus impacting the overall production plan. Furthermore, collisions and drops can damage the internal structure of the product, further reducing product quality.
[0005] Post-packing inspection typically relies on manual visual inspection, which is not only time-consuming but also prone to missed or false positives. The inefficiency of manual inspection not only prolongs working hours but also wastes significant human resources. Especially in high-volume production lines, manual inspection has become a bottleneck restricting production efficiency. Furthermore, manual inspection is highly subjective; different operators may have different judgment standards, making it difficult to guarantee the consistency and accuracy of inspection results. Summary of the Invention
[0006] The technical problem to be solved by this application is to provide a carrier disk device to ensure the safety and stability of electronic components during the production process.
[0007] Therefore, one embodiment of this application provides a carrier disk device, comprising:
[0008] The base has an openable and closable cover;
[0009] A carrier disk, disposed in the base, has multiple accommodating units for accommodating electronic components;
[0010] A positioning unit, disposed in the base, is used to position the bearing plate.
[0011] A pressure sensor is disposed in the base;
[0012] An optical detection unit, disposed in the base, is used to detect the electronic components;
[0013] A controller is disposed in the base and is electrically connected to the positioning unit, the pressure sensor and the optical detection unit.
[0014] In one embodiment of this application, the receiving unit is provided with a robotic arm.
[0015] In one embodiment of this application, the robotic arm includes: a rotating unit disposed on the side wall of the receiving unit; a telescopic unit connected to the rotating unit; and a suction cup connected to the telescopic unit.
[0016] In one embodiment of this application, the accommodating unit has four sidewalls, and a robotic arm is disposed on each sidewall.
[0017] In one embodiment of this application, the positioning unit includes an outdoor locator or an indoor locator.
[0018] In one embodiment of this application, one or more of the positioning unit, optical detection unit, and controller are disposed on the openable cover.
[0019] In one embodiment of this application, the pressure sensor is disposed at the bottom or side of the support plate.
[0020] In one embodiment of this application, the optical detection unit includes an image sensor and an RGB light source.
[0021] In one embodiment of this application, the controller includes the PLC controller, control circuit, and input device.
[0022] In one embodiment of this application, the input device of the controller is a touch screen display.
[0023] In one embodiment of this application, the carrier disk device is connected to the PNP system via a wired or wireless means.
[0024] The advantages of the technical solution in this application are:
[0025] The carrier plate device of this application, by integrating multiple sensors and control systems, enables the carrier plate and transport electronic components to ensure their safety and stability during the production process between various stages. Attached Figure Description
[0026] The above and other objects, features and advantages of this application will become clearer from the following description of embodiments with reference to the accompanying drawings:
[0027] Figure 1 This is a schematic diagram of the structure of the carrier disk device according to an embodiment of this application.
[0028] Figure 2 This is a schematic diagram of the optical detection unit configuration of the carrier disk device according to an embodiment of this application.
[0029] The labels for the attached figures are as follows:
[0030] Base 10, bearing plate 20, accommodating unit 201, positioning unit 30, outdoor locator 301, indoor locator 302, pressure sensor 40, optical detection unit 50, image sensor 501, RGB light source 502, controller 60, rotation unit 701, telescopic unit 702, suction cup 703. Detailed Implementation
[0031] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. In describing the embodiments of this application in detail, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this application. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.
[0032] In this document, the terms "first" or "second" and similar ordinal numbers are primarily used to distinguish or refer to the same or similar components or structures, and do not necessarily imply a spatial or temporal order of these components or structures. It should be understood that, in certain situations or configurations, ordinal numbers can be used interchangeably without affecting the implementation of this application.
[0033] Furthermore, throughout this document, the terms "comprising," "having," or any other similar terms are intended to cover non-exclusive inclusions. For example, a component or structure containing a plurality of elements is not limited to those listed herein, but may include other elements not expressly listed but which are generally inherent to the component or structure.
[0034] Figure 1 This is a schematic diagram of a carrier tray device according to an embodiment of this application. In semiconductor packaging and testing, the carrier tray is used to carry and transport electronic components (e.g., chips) to ensure their safety and stability during the production process between various steps. As shown in Figure 1, a carrier tray device provided in this application includes: a base 10, a carrier tray 20, a positioning unit 30, a pressure sensor 40, an optical detection unit 50, and a controller 60.
[0035] The base 10 is used to support and mount the carrier tray device. In one embodiment, the base 10 may be made of a high-strength, lightweight material (such as aluminum alloy or carbon fiber composite material) to improve load-bearing capacity and seismic performance. The base 10 is designed as a detachable modular structure for easy maintenance and upgrades. For example, the number of carrier trays 20 can be increased or decreased according to production needs. The base 10 is provided with an openable cover, which in one embodiment can be a flip-top or a sliding type. The cover can be closed during transportation and opened when electronic components need to be placed or removed from the carrier tray. In one embodiment, the cover may be located on the top surface of the base 10, and opening the cover allows electronic components on the carrier tray to be removed or placed in a vertical manner.
[0036] A carrier tray 20 is disposed in the base 10 and has multiple receiving units 201 for receiving electronic components. In one embodiment, the carrier tray 20 has multiple grooves, each groove for receiving one electronic component. In one embodiment, a vibration isolator can be configured at the bottom of the carrier tray 20 to reduce the impact of external vibrations on the electronic components and improve production accuracy.
[0037] The accommodating unit 201 is equipped with a robotic arm, which includes a rotating unit 701, a telescopic unit 702, and a suction cup 703. The rotating unit 701 is disposed on the side wall of the accommodating unit 201 and is used to rotate the robotic arm. The telescopic unit 702 is connected to the rotating unit 701 and is used to extend and retract the robotic arm. The suction cup 703 is connected to the telescopic unit 702 and is used to contact the side wall of the electronic component. In one embodiment, the accommodating unit 201 has four side walls, each with a robotic arm. The robotic arm can be controlled by the controller 60 to adjust the translational distance and rotational angle of the electronic component in each accommodating unit 201. In one embodiment, the robotic arm can also be equipped with fine-tuning functions, such as tilting and lateral movement, to accommodate electronic components of different shapes and sizes. In one embodiment, the robotic arm can be connected to the controller 60 via a wired or wireless means.
[0038] A positioning unit 30 is disposed in the base 10 and is used to locate the orientation of the carrier plate 20. The positioning unit 30 includes an outdoor locator and an indoor locator for precise positioning of the carrier plate 20. The outdoor locator can be used for positioning over a large area, for example, locating an object when electronic components are lost during logistics or transportation. In one embodiment, the outdoor locator can be a Global Positioning System (GPS), Global Navigation Satellite System (GNSS), BeiDou Navigation Satellite System, cellular network positioning, Wi-Fi positioning, etc. The indoor locator 302 can be used for indoor positioning, for example, tracking the location of electronic components between different testing machines. In one embodiment, the indoor locator can be Wi-Fi positioning, Bluetooth Low Energy (BLE) positioning, Radio Frequency Identification (RFID) positioning, Inertial Navigation System (INS), infrared positioning, or hybrid positioning (e.g., combining multiple positioning technologies such as Wi-Fi + BLE + UWB to improve positioning accuracy and reliability).
[0039] In one embodiment, multi-sensor fusion positioning using outdoor and indoor locators can be employed, combining various positioning technologies such as GPS, Wi-Fi, BLE, and RFID to achieve seamless switching between indoor and outdoor environments and precise positioning. Furthermore, the controller 60 can plan the transportation path of electronic components in real time based on the positioning information, thereby optimizing production efficiency.
[0040] A pressure sensor 40 is disposed on the bottom or side of the support plate 20 to detect the pressure state of the support plate 20, ensuring the safety and stability of the support plate 20, detecting and recording collisions or drops during the transport of the support plate, and monitoring the pressure distribution of the support plate to prevent overload or imbalance. In one embodiment, the installation position of the pressure sensor 40 on the support plate 20 can be selected based on the measurement point to accurately reflect the required measurement parameters. For example, the pressure sensor 40 can be installed on the bottom or side of the support plate 20 to detect the weight and pressure distribution of the support plate 20, or the pressure sensors 40 can be evenly distributed at multiple locations on the support plate 20 to ensure the uniformity and reliability of the data, thereby obtaining more comprehensive data. In one embodiment, the pressure sensor can be an accelerometer, impact sensor, pressure sensor, gyroscope, or inertial measurement unit.
[0041] An optical inspection unit 50 is disposed in the base 10. Using a high-resolution image sensor and image processing algorithms, it performs non-contact visual inspection of circuit boards, chip packages, and other electronic components to detect various defects and anomalies, such as component placement defects or surface defects. In one embodiment, deep learning algorithms can be used for intelligent image analysis to improve the accuracy and efficiency of defect detection. A 3D scanning function can also be added to acquire three-dimensional topographic data of the electronic components for more precise quality control and dimensional measurement.
[0042] The controller 60 is disposed in the base 10 and electrically connected to the positioning unit 30, pressure sensor 40, robotic arm, and optical detection unit 50 to control the entire device. The controller 60 includes a PLC controller 60, control circuitry, and input devices. The PLC controller processes various signals and instructions, the control circuitry transmits and processes electrical signals, and the input device is a touchscreen display for convenient parameter setting, control, and monitoring of the carrier plate device by operators. In one embodiment, the controller 60 may include a Siemens S7 series PLC controller 60, a control circuit board, and a touchscreen display. The PLC controller 60 receives and processes signals from various sensors through the control circuitry and displays the operating interface and detection results on the touchscreen.
[0043] In other embodiments, one or more of the positioning unit, optical detection unit, and controller may also be disposed on the openable cover, which has an electrical interface to enable electrical connection between the modules on the openable cover and other modules on the base.
[0044] Figure 2 This is a schematic diagram showing the configuration of the optical detection unit 50 of the carrier disk device according to an embodiment of this application. Figure 2 As shown, the optical detection unit 50 includes an image sensor 501 and an RGB light source 502 for detecting the state of electronic components. The image sensor 501 is mounted on the openable cover. The image sensor 501 uses a high-resolution camera to capture images of the electronic components to be inspected. In practical applications, multiple cameras can be used to capture images from different angles according to the environment and inspection requirements to ensure comprehensive coverage. Alternatively, a movable camera can be used to acquire images of the electronic components. The acquired images are then processed using image processing algorithms to identify defects in the electronic components. In one embodiment, the camera can be a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal-Oxide-Semiconductor) camera.
[0045] An RGB light source 502 is disposed on the openable cover, providing different colors of light to enhance the image sensor 501's ability to capture images and detect electronic components. In one embodiment, the RGB light source 502 may consist of three independent LEDs (light-emitting diodes), each emitting red, green, and blue light respectively. By adjusting the brightness of each LED, various colors are mixed to enhance image contrast in the optical detection unit 50 and improve the accuracy of defect detection.
[0046] In one embodiment, the carrier tray device can be connected to the communication line of the PNP (Pick and Place) system via wired or wireless means to achieve direct interactive communication and mutual communication operation. This allows the PNP to automatically pick up electronic components from the carrier tray 20 and place them in designated locations for accurate picking and placing of electronic components. The wired networking method can be Ethernet, Serial Communication, USB (Universal Serial Bus), or Fiber Optic Communication. The wireless networking method can be Wi-Fi (Wireless Fidelity), Bluetooth, Zigbee, LoRaWAN (Long Range Wide Area Network), NFC (Near Field Communication), or Cellular Networks.
[0047] In one embodiment, the controller 60 can support remote access via wired or wireless networking, allowing operators to remotely monitor equipment status, perform fault diagnosis and troubleshooting via mobile devices or computers; automatically allocate resources according to production tasks to optimize production processes; and record and analyze real-time data, such as process data on the picking, placement, and testing of electronic components, for subsequent quality analysis and process improvement.
[0048] This application provides a carrier tray device with positioning and detection functions. By integrating multiple sensors and a control system, this device achieves efficient and accurate detection of electronic components. The carrier tray device can work online with a PNP system to record the position of electronic components before a specific operation, thereby improving the transparency and traceability of the production process. This allows for rapid and effective analysis of commonalities in the appearance and size issues of electronic components and traceability of batch sources.
[0049] As described above, these embodiments of the present application do not exhaustively cover all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present application, thereby enabling those skilled in the art to make good use of the present application and modifications based on it. The present application is limited only by the claims and their full scope and equivalents.
Claims
1. A carrier disc device, characterized by The application relates to a bearing plate device, comprising: a base with an openable and closable cover; a bearing plate arranged in the base and having a plurality of accommodation units for accommodating electronic components; a positioning unit arranged in the base and used for positioning the bearing plate; a pressure sensor arranged in the base; an optical detection unit arranged in the base and used for detecting the electronic components; a controller arranged in the base, the controller being electrically connected with the positioning unit, the pressure sensor and the optical detection unit.
2. The carrier disc device of claim 1, wherein, The accommodation unit is provided with a mechanical arm.
3. The carrier disc apparatus of claim 2, wherein, The mechanical arm comprises: a rotating unit arranged on the side wall of the accommodation unit; a telescopic unit connected with the rotating unit; and a suction cup connected with the telescopic unit.
4. The carrier disc apparatus of claim 3, wherein, The accommodation unit has four side walls, and one mechanical arm is arranged on each side wall.
5. The carrier disc apparatus of claim 1, wherein, The positioning unit comprises an outdoor locator or an indoor locator.
6. The carrier disc apparatus of claim 1, wherein, One or more of the positioning unit, the optical detection unit and the controller are arranged on the openable and closable cover.
7. The load disc device of claim 1, wherein The pressure sensor is arranged on the bottom or the side edge of the bearing plate.
8. The load disc device of claim 1, wherein The optical detection unit comprises an image sensor and an RGB light source.
9. The load disc device of claim 1, wherein The controller comprises a PLC controller, a control circuit and an input device.
10. The carrier disc apparatus of claim 9, wherein, The input device is a touch display screen.
11. The load disc device of claim 1, wherein The bearing plate device is connected with a PNP system in a wired or wireless mode.