Semiconductor ceramic chip assembling equipment

Abstract

The utility model discloses semiconductor ceramic chip assembling equipment which comprises a copper sheet feeding disc used for bearing copper sheets, a separation paper feeding disc used for bearing separation paper and a ceramic chip feeding assembly used for outputting ceramic chips. The semiconductor ceramic chip assembling equipment further comprises a material taking mechanical arm and an assembling position, and the material taking mechanical arm can obtain the copper sheets, the separation paper and the ceramic chips from the preset positions of the copper sheet feeding disc, the separation paper feeding disc and the ceramic chip feeding assembly one by one and can place the copper sheets, the separation paper and the ceramic chips on the assembling position according to the preset stacking sequence. According to the semiconductor ceramic chip assembling equipment, the copper sheets, the separation paper and the ceramic chips can be obtained from the copper sheet feeding disc, the separation paper feeding disc and the ceramic chip feeding assembly through the material taking mechanical arm, and the copper sheets, the separation paper and the ceramic chips can be placed at the assembling position according to the preset stacking sequence. Therefore, by reasonably setting the sequence of taking and placing different materials of the taking manipulator, the assembling efficiency of the copper sheets, the partition paper and the ceramic sheets can be improved, and the production requirements are met.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor, concretely relates to a semiconductor ceramic sheet equipment. BACKGROUND

[0002] In the field of semiconductor, it is usually related to the stacking of copper sheet, separator paper and ceramic sheet according to certain order to complete one processing step. In the prior art, the stacking of the above-mentioned materials is mostly manual operation, so that the assembly of various materials cannot be efficiently completed, resulting in low efficiency of automatic assembly.

[0003] Therefore, in view of the above technical problems, it is necessary to provide a semiconductor ceramic sheet assembly equipment. SUMMARY

[0004] The utility model discloses a semiconductor ceramic sheet assembly equipment, which can solve the problem of low efficiency of automatic assembly of copper sheet, separator paper and ceramic sheet.

[0005] In order to achieve the above-mentioned purpose, the technical scheme provided by the utility model in one embodiment is as follows:

[0006] A semiconductor ceramic sheet assembly equipment includes a copper sheet feeding tray for holding copper sheets, a separator paper feeding tray for holding separator paper, and a ceramic sheet feeding assembly for outputting ceramic sheets.

[0007] The semiconductor ceramic sheet assembly equipment further includes a material taking manipulator and an assembly position, the material taking manipulator can take copper sheets, separator paper and ceramic sheets one by one from the predetermined positions of the copper sheet feeding tray, the separator paper feeding tray and the ceramic sheet feeding assembly, and can be placed in the assembly position according to the preset stacking order.

[0008] In one or more embodiments of the utility model, the semiconductor ceramic sheet assembly equipment further includes a copper sheet prepositioning tray and a copper sheet feeding assembly, the copper sheet feeding tray is provided with at least two, the copper sheet feeding assembly can take copper sheets from the copper sheet feeding tray and move to the copper sheet prepositioning tray, and the material taking manipulator can take copper sheets from the copper sheet prepositioning tray and move to the assembly position.

[0009] In one or more embodiments of the utility model, the copper sheet feeding assembly includes a moving assembly, a material taking assembly installed at the output end of the moving assembly, and the moving assembly can drive the material taking assembly to move between the copper sheet feeding tray and the copper sheet prepositioning tray.

[0010] The material taking assembly includes a material taking plate, a plurality of suction accessories are installed on the material taking plate, and the suction accessories can suck or release copper sheets.

[0011] In one or more embodiments of the utility model, the semiconductor ceramic sheet assembly equipment further includes lifting assembly and assembly disc, the lifting assembly can drive the assembly disc to move to preset assembly position, the assembly position is located on the side of the assembly disc far away from the lifting assembly.

[0012] In one or more embodiments of the utility model, the semiconductor ceramic sheet assembly equipment further includes conveying assembly for conveying assembly disc, the lifting assembly is installed with the conveying assembly, the lifting assembly can drive the assembly disc on the conveying assembly to move to the preset assembly position, or drive the assembly disc after stacking to move to the conveying assembly.

[0013] In one or more embodiments of the utility model, the conveying assembly includes input conveying belt for inputting assembly disc, temporary conveying belt for temporarily buffering assembly disc and output conveying belt for outputting full load assembly disc, the input conveying belt, temporary conveying belt and output conveying belt are connected in sequence, the lifting assembly is arranged with the temporary conveying belt to make the assembly disc leave the temporary conveying belt or reset to the temporary conveying belt.

[0014] In one or more embodiments of the utility model, the lifting assembly includes lifting drive and bearing plate installed on the output end of the lifting drive, the lifting drive can drive the bearing plate to be close to or far away from the temporary conveying belt, and the bearing plate is used for bearing the assembly disc.

[0015] In one or more embodiments of the utility model, the semiconductor ceramic sheet assembly equipment further includes workbench, the copper sheet feeding tray, the paper separator feeding tray and the ceramic sheet feeding assembly are installed on one side of the workbench, the conveying assembly and the lifting assembly are installed on the other side of the workbench, the workbench is provided with avoiding hole, the lifting assembly can drive the assembly disc to move to the avoiding hole, and the avoiding hole is the preset assembly position.

[0016] In one or more embodiments of the utility model, the ceramic sheet feeding assembly includes moving drive, jacking drive and material taking frame installed on the output end of the jacking drive, the moving drive can drive the jacking drive to move to obtain ceramic disc from the tray, and the jacking drive can drive the material taking frame to lift to hold ceramic sheet.

[0017] In one or more embodiments of the utility model, the ceramic sheet feeding assembly further includes two positioning drives installed on the two sides of the material taking frame, the output end of the positioning drive is provided with abutting frame, and the two positioning drives can drive the two abutting frames to be close to each other to abut and position the ceramic sheet on the material taking frame.

[0018] Compared with the prior art, the semiconductor ceramic sheet assembling equipment can obtain copper sheets, paper separators and ceramic sheets from the copper sheet feeding disc, the paper separator feeding disc and the ceramic sheet feeding assembly respectively through the material taking manipulator, and can be placed in the assembling position according to the preset stacking sequence. Therefore, by reasonably setting the sequence of taking and placing materials of the material taking manipulator, the assembly efficiency of the copper sheets, the paper separators and the ceramic sheets can be improved, and the production requirements can be met. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments in the present application, and other drawings can also be obtained according to these drawings without creative labor for those skilled in the art.

[0020] Figure 1 It is a structural schematic view of the semiconductor ceramic sheet assembling equipment in an embodiment of the present application.

[0021] Figure 2 It is a top view of the semiconductor ceramic sheet assembling equipment in an embodiment of the present application.

[0022] Figure 3 It is Figure 1 It is an enlarged schematic view of A in the figure.

[0023] Figure 4 It is a structural schematic view of the conveying assembly and the lifting assembly in an embodiment of the present application.

[0024] Figure 5 It is a structural schematic view of the ceramic sheet feeding assembly in an embodiment of the present application.

[0025] MAIN REFERENCE NUMERALS:

[0026] 1, copper sheet feeding disc; 2, paper separator feeding disc; 3, ceramic sheet feeding assembly; 31, moving driving part; 32, jacking driving part; 33, material taking frame; 34, positioning driving part; 35, abutting frame; 4, material taking manipulator; 5, copper sheet presetting disc; 6, copper sheet feeding assembly; 61, moving assembly; 62, material taking assembly; 621, material taking plate; 622, suction accessory; 7, lifting assembly; 71, lifting driving part; 8, assembling disc; 91, input conveying belt; 92, temporary conveying belt; 93, output conveying belt; 10, workbench; 101, avoiding hole. DETAILED DESCRIPTION

[0027] In order to make the technical scheme in the present application better understood by those skilled in the art, the technical scheme in the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should belong to the scope of protection of the present application.

[0028] With reference to Figure 1 and Figure 2 , the semiconductor ceramic sheet assembling equipment in an embodiment of the present application comprises a copper sheet feeding tray 1 for supporting copper sheets, a separator paper feeding tray 2 for supporting separator papers, a ceramic sheet feeding assembly 3 for outputting ceramic sheets, a material taking manipulator 4, and an assembling position. The material taking manipulator 4 can obtain copper sheets, separator papers and ceramic sheets one by one from predetermined positions of the copper sheet feeding tray 1, the separator paper feeding tray 2 and the ceramic sheet feeding assembly 3, and can be placed in the assembling position according to a preset stacking sequence.

[0029] Therefore, by reasonably setting the sequence of taking and placing materials of the material taking manipulator 4, the assembling efficiency of the copper sheets, the separator papers and the ceramic sheets can be improved to meet the production requirements. The preset stacking sequence can be reasonably set according to actual requirements. In the present embodiment, the preset stacking sequence is separator paper-copper sheet-ceramic sheet-copper sheet-separator paper. In other embodiments, the stacking requirements can also be set specifically according to actual requirements.

[0030] With reference to Figure 1 and Figure 2 , the semiconductor ceramic sheet assembling equipment in the present embodiment further comprises a copper sheet prepositioning tray 5 and a copper sheet feeding assembly 6. The copper sheet feeding tray 1 is provided with at least two copper sheet feeding assemblies 6, which can obtain copper sheets from the copper sheet feeding tray 1 and move to the copper sheet prepositioning tray 5; the material taking manipulator 4 can obtain copper sheets from the copper sheet prepositioning tray 5 and move to the assembling position. In the present embodiment, two copper sheet feeding trays 1 are taken as an exemplary description, which is not a limitation on the number of copper sheet feeding trays 1 in the present embodiment. In other embodiments, the number of copper sheet feeding trays 1 can also be three, four or even more. The number of copper sheet feeding trays 1 can further improve the assembling efficiency.

[0031] With reference to Figures 1 to 3The copper sheet feeding assembly 6 comprises a moving assembly 61, a material taking assembly 62 installed at the output end of the moving assembly 61, and the moving assembly 61 can drive the material taking assembly 62 to move between the copper sheet feeding disc 1 and the copper sheet preposition disc 5. The material taking assembly 62 comprises a material taking plate 621, and a plurality of suction accessories 622 are installed on the material taking plate 621, and the suction accessories 622 can suck or release the copper sheet. In the embodiment, the moving assembly 61 can be a common linear moving module, and the suction accessories 622 can be suction cups, so that the material taking assembly 62 can be driven to move between the copper sheet feeding disc 1 and the copper sheet preposition disc 5. When the moving assembly 61 drives the material taking assembly 62 to move to the copper sheet feeding disc 1, the copper sheet can be sucked from the copper sheet feeding disc 1. When the moving assembly 61 drives the material taking assembly 62 to move to the copper sheet preposition disc 5, the copper sheet can be released to the copper sheet preposition disc 5.

[0032] With reference to Figure 1 and Figure 4 , the semiconductor ceramic sheet assembling equipment in the embodiment further comprises a lifting assembly 7, an assembling disc 8, and a conveying assembly for conveying the assembling disc 8. The lifting assembly 7 can drive the assembling disc 8 to move to a preset assembling position, and the assembling position is located on the side of the assembling disc 8 away from the lifting assembly 7. The lifting assembly 7 is cooperatively installed with the conveying assembly, and the lifting assembly 7 can drive the assembling disc 8 on the conveying assembly to move to the preset assembling position, or drive the assembling disc 8 after the stacking to move to the conveying assembly.

[0033] With reference to Figure 1 and Figure 4 , the conveying assembly comprises an input conveying belt 91 for inputting the assembling disc 8, a temporary conveying belt 92 for temporarily buffering the assembling disc 8, and an output conveying belt 93 for outputting the full assembling disc 8, and the input conveying belt 91, the temporary conveying belt 92 and the output conveying belt 93 are sequentially connected, and the lifting assembly 7 is cooperatively arranged with the temporary conveying belt 92 to make the assembling disc 8 leave the temporary conveying belt 92 or reset to the temporary conveying belt 92. In the embodiment, the input conveying belt 91, the temporary conveying belt 92 and the output conveying belt 93 each comprise two conveying belts arranged oppositely and in parallel, and the assembling disc 8 is placed between the two conveying belts.

[0034] With reference to Figure 1 and Figure 4 , the lifting assembly 7 comprises a lifting driving member 71 and a bearing plate installed at the output end of the lifting driving member 71, and the lifting driving member 71 can drive the bearing plate to approach or move away from the temporary conveying belt 92, and the bearing plate is used for bearing the assembling disc 8. The lifting driving member 71 can be a cylinder or other related equipment. The lifting driving member 71 is arranged between the two conveying belts arranged oppositely and in parallel.

[0035] When in operation, the input conveying belt 91 can convey the empty assembling disc 8 to the temporary conveying belt 92, the lifting driver 71 can drive the carrying plate to move, so that the assembling disc 8 on the temporary conveying belt 92 moves away from the temporary conveying belt 92 and moves to the preset assembling position. Then the taking mechanical arm 4 takes the copper sheet, the separator paper and the ceramic sheet from the copper sheet feeding disc 1, the separator paper feeding disc 2 and the ceramic sheet feeding assembly 3 respectively and places them on the assembling disc 8 according to the preset stacking sequence. After the stacking is completed, the lifting driver 71 drives the carrying plate to move away from the preset assembling position and makes the full assembling disc 8 return to the temporary conveying belt 92, and the temporary conveying belt 92 starts and conveys the full assembling disc 8 to the output assembling disc 8 to complete the discharging action.

[0036] With reference to Figure 1 The semiconductor ceramic sheet assembling equipment in the embodiment further comprises a workbench 10, the copper sheet feeding disc 1, the separator paper feeding disc 2 and the ceramic sheet feeding assembly 3 are installed on one side of the workbench 10, the conveying assembly and the lifting assembly 7 are installed on the other side of the workbench 10, the workbench 10 is provided with a avoiding hole 101, the lifting assembly 7 can drive the assembling disc 8 to move to the avoiding hole 101, the position of the avoiding hole 101 is the preset assembling position, which is used for cooperating to complete the stacking of the copper sheet, the separator paper and the ceramic sheet. The cooperation of the above structure can effectively complete the feeding, stacking and discharging of the copper sheet, the separator paper and the ceramic sheet, so as to improve the assembling efficiency. Meanwhile, the above structure can effectively utilize the space and reduce the volume of the whole equipment.

[0037] With reference to Figure 2 And Figure 5 The ceramic sheet feeding assembly 3 comprises a moving driver 31, a lifting driver 32 and a taking rack 33 installed on the output end of the lifting driver 32, the moving driver 31 can drive the lifting driver 32 to move, which is used for taking the ceramic sheet from the feeding disc, and the lifting driver 32 can drive the taking rack 33 to lift, which is used for holding the ceramic sheet. The ceramic sheet feeding assembly 3 is connected with the feeding disc, and the feeding disc is provided with ceramic plates, so that the ceramic sheet feeding assembly 3 takes the ceramic sheets from the feeding disc one by one. The taking mechanical arm 4 takes the ceramic sheet from the taking rack 33 and moves to the assembling position. The moving driver 31 and the lifting driver 32 can be selected from cylinders and the like.

[0038] When in operation, the moving driver 31 drives the taking rack 33 to move to the feeding disc, and the lifting driver 32 lifts to take a ceramic sheet. Then the moving driver 31 drives the taking rack 33 to reset, and the lifting driver 32 descends to the initial position at the same time, so as to take the ceramic sheet by the taking mechanical arm 4.

[0039] With reference to Figure 1 And Figure 5Further, the ceramic sheet loading assembly 3 further comprises two positioning driving members 34 installed on two sides of the loading rack 33, and the output ends of the positioning driving members 34 are provided with abutting racks 35, and the two abutting racks 35 can be driven by the two positioning driving members 34 to abut and position the ceramic sheet on the loading rack 33. In the embodiment, the positioning driving member 34 can be a pneumatic cylinder. The position of the ceramic sheet abutted and positioned by the abutting rack 35 can be corrected, so as to facilitate the ceramic sheet taking manipulator 4 to obtain the accuracy of the ceramic sheet and ensure the cooperation of each structure.

[0040] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended to embrace all changes falling within the meaning and scope of the equivalent elements of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.

[0041] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.

Claims

1. A semiconductor ceramic sheet assembly apparatus, characterized by comprising: a ceramic sheet 1; a semiconductor chip 2; a resin 3; and a semiconductor ceramic sheet assembly device 4. The device comprises a copper sheet feeding tray (1) for placing copper sheets, a separator feeding tray (2) for placing separators, and a ceramic sheet feeding assembly (3) for outputting ceramic sheets. The semiconductor ceramic sheet assembling device further comprises a material taking manipulator (4) and an assembling position, the material taking manipulator (4) can take copper sheets, separators and ceramic sheets from the predetermined positions of the copper sheet feeding tray (1), the separator feeding tray (2) and the ceramic sheet feeding assembly (3) one by one, and place them in the assembling position according to the preset stacking sequence.

2. The semiconductor ceramic sheet assembly apparatus according to claim 1, characterized by, The device further comprises a copper sheet prepositioning tray (5) and a copper sheet feeding assembly (6), the copper sheet feeding tray (1) is provided with at least two, the copper sheet feeding assembly (6) can take copper sheets from the copper sheet feeding tray (1) and move to the copper sheet prepositioning tray (5), the material taking manipulator (4) can take copper sheets from the copper sheet prepositioning tray (5) and move to the assembling position.

3. The semiconductor ceramic sheet assembly apparatus according to claim 2, characterized by, The copper sheet feeding assembly (6) comprises a moving assembly (61) and a material taking assembly (62) installed at the output end of the moving assembly (61), the moving assembly (61) can drive the material taking assembly (62) to move between the copper sheet feeding tray (1) and the copper sheet prepositioning tray (5). The material taking assembly (62) comprises a material taking plate (621) provided with a plurality of suction accessories (622), the suction accessories (622) can suck or release copper sheets.

4. The semiconductor ceramic sheet assembly apparatus according to claim 1, characterized by, The device further comprises a lifting assembly (7) and an assembling tray (8), the lifting assembly (7) can drive the assembling tray (8) to move to a preset assembling position, and the assembling position is located on the side of the assembling tray (8) away from the lifting assembly (7).

5. The semiconductor ceramic sheet assembly apparatus according to claim 4, wherein The device further comprises a conveying assembly for conveying the assembling tray (8), the lifting assembly (7) is installed in cooperation with the conveying assembly, the lifting assembly (7) can drive the assembling tray (8) on the conveying assembly to move to the preset assembling position, or drive the assembling tray (8) after the stacking to move to the conveying assembly.

6. The semiconductor ceramic sheet assembly apparatus according to claim 5, wherein The conveying assembly comprises an input conveying belt (91) for inputting the assembling tray (8), a temporary conveying belt (92) for temporarily storing the assembling tray (8), and an output conveying belt (93) for outputting the full assembling tray (8), the input conveying belt (91), the temporary conveying belt (92) and the output conveying belt (93) are connected in sequence, and the lifting assembly (7) is arranged in cooperation with the temporary conveying belt (92) to make the assembling tray (8) leave the temporary conveying belt (92) or reset to the temporary conveying belt (92).

7. The semiconductor ceramic sheet assembly apparatus according to claim 6, wherein The lifting assembly (7) comprises a lifting driving member (71) and a bearing plate installed at the output end of the lifting driving member (71), the lifting driving member (71) can drive the bearing plate to approach or move away from the temporary conveying belt (92), and the bearing plate is used for placing the assembling tray (8).

8. The semiconductor ceramic sheet assembly apparatus according to claim 5, wherein Also include a workbench (10), the copper sheet feeding tray (1), the separator paper feeding tray (2), and the ceramic sheet feeding assembly (3) are installed on one side of the workbench (10), the conveying assembly and the lifting assembly (7) are installed on the other side of the workbench (10), the workbench (10) is provided with a avoiding hole (101), the lifting assembly (7) can drive the assembly tray (8) to move to the avoiding hole (101), the avoiding hole (101) is the preset assembly position.

9. The semiconductor ceramic sheet assembly apparatus according to claim 1, wherein The ceramic sheet feeding assembly (3) comprises a moving drive element (31), a jacking drive element (32) and a material taking frame (33) installed on the output end of the jacking drive element (32), the moving drive element (31) can drive the jacking drive element (32) to move, which is used for obtaining ceramic disc from the material tray, and the jacking drive element (32) can drive the material taking frame (33) to lift, which is used for supporting the ceramic sheet.

10. The semiconductor ceramic sheet assembly apparatus according to claim 9, wherein The ceramic sheet feeding assembly (3) further comprises two positioning drive elements (34) installed on the two sides of the material taking frame (33), the output ends of the positioning drive elements (34) are provided with abutting frames (35), and the two positioning drive elements (34) can drive the two abutting frames (35) to approach each other to abut and position the ceramic sheet on the material taking frame (33).

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