Driver heat dissipation device
By introducing a gold-plated structure of tungsten copper base plate and heat sink into the driver, and combining it with a limiting and positioning mechanism, the problems of low heat dissipation efficiency and shaking of traditional drivers are solved, achieving more efficient heat dissipation and stable positioning.
Patent Information
- Application Number
- CN202520154870.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-01-23
AI Technical Summary
Traditional drives have slow heat dissipation efficiency during long-term use, resulting in excessively high temperatures.
The heat dissipation mechanism consists of a tungsten copper base plate and heat sinks, with an external gold-plated layer. The driver is supported and positioned by a limiting mechanism and a positioning mechanism to prevent shaking.
It improves the heat dissipation efficiency of the driver, prevents the driver temperature from becoming too high, and prevents the driver from shaking and scratching during long-term use.
Smart Images

Figure CN223816332U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of driver, in particular to a driver heat dissipation device. BACKGROUND
[0002] Driver refers to the driver hardware driving a certain type of equipment in a broad sense. With the development of science and technology, semiconductor device products continue to develop towards high integration and thinness. The volume of chips and components is continuously reduced, and the power density is rapidly increasing. The product heat dissipation scheme needs to be upgraded.
[0003] At present, in the use process of the traditional driver, the driver is cooled by heat exchange with the surrounding environment, but in the long-term use process, the heat dissipation efficiency of the driver is slow, which leads to the high temperature of the driver. CONTENT OF THE INVENTION
[0004] In view of the shortcomings of the prior art, the driver heat dissipation device is provided, which overcomes the shortcomings of the prior art and aims to solve the problems in the background art.
[0005] In order to achieve the above purpose, the technical scheme adopted by the present application is as follows: the driver heat dissipation device comprises a frame, a limiting mechanism is arranged in the inside of the frame, a positioning mechanism is arranged on one side of the limiting mechanism, a heat dissipation mechanism is arranged at the bottom of the frame, the heat dissipation mechanism comprises a reinforcing ring, the reinforcing ring is fixedly connected with the frame, a tungsten copper bottom plate is arranged in the inside of the reinforcing ring, the tungsten copper bottom plate is fixedly connected with the frame, two heat dissipation fins are arranged on one side of the tungsten copper bottom plate, and the two heat dissipation fins are symmetrically distributed at the bottom of the frame.
[0006] As a preferred embodiment, the tungsten copper bottom plate and the heat dissipation fins are both provided with a gold plating layer.
[0007] By adopting the above technical scheme, the gold plating layer is arranged on the outside of the frame, the tungsten copper bottom plate and the heat dissipation fins, and the heat dissipation of the frame, the tungsten copper bottom plate and the heat dissipation fins is strengthened by the gold plating layer, so that the heat management of the equipment is improved.
[0008] As a preferred embodiment, the limiting mechanism comprises a first spring, the first spring is fixedly connected with the frame, a moving plate is fixedly connected on one side of the first spring, the moving plate is slidingly connected with the frame, and a rubber protection pad is fixedly connected on the side, away from the first spring, of the moving plate.
[0009] By adopting the above technical scheme, the moving plate is supported by the first spring, the driver is limited by the moving plate, and the driver is protected by the rubber protection pad, so that the driver can be better limited.
[0010] As a preferred implementation, the positioning mechanism comprises a positioning frame fixedly connected with the moving plate, a second spring fixedly connected inside the positioning frame, and a positioning rod fixedly connected to the bottom of the second spring and in sliding connection with the positioning frame.
[0011] By adopting the above technical scheme, the positioning rod is limited by the positioning frame, the positioning rod is supported by the second spring, and the drive is positioned by the positioning rod abutting against the surface of the drive, so that the drive can be better positioned.
[0012] As a preferred implementation, the side of the positioning rod away from the positioning frame is fixedly connected with a hemispherical rubber pad.
[0013] By adopting the above technical scheme, the side of the positioning rod away from the positioning frame is fixedly connected with a hemispherical rubber pad, the drive is prevented from being scratched by the positioning rod, and the drive can be better prevented from being scratched by the positioning rod.
[0014] As a preferred implementation, the bottom of the moving plate is fixedly connected with a sliding block, the surface of the frame is provided with a sliding groove, the sliding block is located inside the sliding groove, and the sliding block is in sliding connection with the sliding groove.
[0015] By adopting the above technical scheme, the sliding block slides inside the sliding groove, and the sliding groove limits the sliding block, so that the moving plate can better move on the surface of the frame.
[0016] Advantages of the present application:
[0017] 1. The drive heat dissipation device is provided with a tungsten copper bottom plate, a heat sink, and a reinforcing ring. The tungsten copper bottom plate and the heat sink enhance the heat dissipation of the drive inside the frame, and the reinforcing ring reinforces the tungsten copper bottom plate and the heat sink. The problem that the heat dissipation efficiency of the drive is slow during long-time use of the traditional drive, causing the temperature of the drive to be too high, is avoided, and the practicality is improved.
[0018] 2. The drive heat dissipation device is provided with a first spring, a moving plate, and a rubber protection pad. The first spring supports the moving plate, the moving plate limits the drive, and the rubber protection pad protects the drive. The problem that the traditional drive shakes during long-time use is avoided, and the practicality is improved. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 is a front structure schematic view of the present application;
[0020] Figure 2 is a bottom structure schematic view of the present application;
[0021] Figure 3 It is a schematic view of the limiting mechanism structure of the application;
[0022] Figure 4 It is a schematic view of the positioning mechanism structure of the application.
[0023] In the figure, 1 is a frame; 2 is a heat dissipation mechanism; 21 is a tungsten copper bottom plate; 22 is a heat dissipation fin; 23 is a reinforcing ring; 3 is a limiting mechanism; 31 is a first spring; 32 is a moving plate; 33 is a rubber protection pad; 4 is a positioning mechanism; 41 is a positioning rod; 42 is a second spring; 43 is a positioning frame; 5 is a sliding block; and 6 is a sliding groove. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only some of the embodiments of the application, not all the embodiments.
[0025] Referring to Figures 1-4 , the driver heat dissipation device comprises a frame 1, the inside of the frame 1 is provided with a limiting mechanism 3, the limiting mechanism 3 comprises a first spring 31, the first spring 31 is fixedly connected with the frame 1, one side of the first spring 31 is fixedly connected with a moving plate 32, the moving plate 32 is slidingly connected with the frame 1, and the side, away from the first spring 31, of the moving plate 32 is fixedly connected with a rubber protection pad 33; the moving plate 32 is supported by the first spring 31, the driver is limited by the moving plate 32, and the driver is protected by the rubber protection pad 33, so that the driver can be better limited.
[0026] Referring to Figures 3-4 , one side of the limiting mechanism 3 is provided with a positioning mechanism 4, the positioning mechanism 4 comprises a positioning frame 43, the positioning frame 43 is fixedly connected with the moving plate 32, the inside of the positioning frame 43 is fixedly connected with a second spring 42, the bottom of the second spring 42 is fixedly connected with a positioning rod 41, and the positioning rod 41 is slidingly connected with the positioning frame 43; the positioning rod 41 is limited by the positioning frame 43, the positioning rod 41 is supported by the second spring 42, and the driver is positioned by the positioning rod 41 abutting against the surface of the driver, so that the driver can be better positioned.
[0027] Referring to Figures 3-4 , the side, away from the positioning frame 43, of the positioning rod 41 is fixedly connected with a hemispherical rubber pad; the side, away from the positioning frame 43, of the positioning rod 41 is fixedly connected with the hemispherical rubber pad, the driver is prevented from being scratched by the positioning rod 41 by the hemispherical rubber pad, and the driver can be better prevented from being scratched by the positioning rod 41.
[0028] Referring to Figures 1-2The bottom of the frame 1 is provided with a heat dissipation mechanism 2, the heat dissipation mechanism 2 comprises a reinforcing ring 23, the reinforcing ring 23 is fixedly connected with the frame 1, the inside of the reinforcing ring 23 is provided with a tungsten copper bottom plate 21, the tungsten copper bottom plate 21 is fixedly connected with the frame 1, one side of the tungsten copper bottom plate 21 is provided with two heat dissipation fins 22, the two heat dissipation fins 22 are symmetrically distributed at the bottom of the frame 1, and the outside of the tungsten copper bottom plate 21 and the heat dissipation fins 22 is provided with a gold plating layer; the outside of the frame 1, the tungsten copper bottom plate 21 and the heat dissipation fins 22 is provided with a gold plating layer, and the heat dissipation of the frame 1, the tungsten copper bottom plate 21 and the heat dissipation fins 22 is strengthened by the gold plating layer, so that the heat dissipation of the frame 1, the tungsten copper bottom plate 21 and the heat dissipation fins 22 is better, and the heat management of the equipment is improved.
[0029] Referring to Figures 1-3 The bottom of the moving plate 32 is fixedly connected with a sliding block 5, the surface of the frame 1 is provided with a sliding groove 6, the sliding block 5 is located in the inside of the sliding groove 6, and the sliding block 5 is in sliding connection with the sliding groove 6; the sliding block 5 slides in the inside of the sliding groove 6, and the sliding groove 6 limits the sliding block 5, so that the moving plate 32 can move on the surface of the frame 1 better.
[0030] Working principle: the driver is placed in the inside of the frame 1, the moving plate 32 is supported by the first spring 31, the driver is limited by the moving plate 32, the driver is protected by the rubber protection pad 33, the positioning rod 41 is limited by the positioning frame 43, the positioning rod 41 is supported by the second spring 42, the driver is positioned by the positioning rod 41 abutting the surface of the driver, the heat dissipation of the driver in the inside of the frame 1 is strengthened by the tungsten copper bottom plate 21 and the heat dissipation fins 22, and the tungsten copper bottom plate 21 and the heat dissipation fins 22 are reinforced by the reinforcing ring 23.
[0031] In the description of the present application, it should be explained that the positions or position relations indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end" and "the other end" are the positions or position relations shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and cannot be understood as indicating or implying that the devices or elements indicated must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0032] In the description of the utility model, it is necessary to explain that, unless there is definite stipulation and limitation, the terms "mounts", "is provided with", "connects" and the like should be understood broadly, for example, "connects", can be fixedly connected, also can be detachably connected, or integrally connected;Can be mechanical connection, can also be electrical connection;Can be directly connected, also can be indirectly connected through intermediate medium, can be the communication inside two elements.For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to specific conditions by the person skilled in the art.
[0033] The utility model has been described above in combination with specific embodiments, but the person skilled in the art should know that these descriptions are exemplary, and are not the limitation of the protection scope of the utility model.The person skilled in the art can make various modifications and changes to the utility model according to the spirit and principle of the utility model, and these modifications and changes are also within the scope of the utility model.
Claims
1. A heat sink for a driver, comprising a frame (1), characterized in that, The inside of the frame (1) is provided with a limiting mechanism (3), one side of the limiting mechanism (3) is provided with a positioning mechanism (4), the bottom of the frame (1) is provided with a heat dissipation mechanism (2), the heat dissipation mechanism (2) comprises a reinforcing ring (23), the reinforcing ring (23) is fixedly connected with the frame (1), the inside of the reinforcing ring (23) is provided with a tungsten copper bottom plate (21), the tungsten copper bottom plate (21) is fixedly connected with the frame (1), one side of the tungsten copper bottom plate (21) is provided with two cooling fins (22), and the two cooling fins (22) are symmetrically distributed on the bottom of the frame (1).
2. The driver heat sink device of claim 1, wherein, The outside of the frame (1), the tungsten copper bottom plate (21) and the cooling fin (22) is provided with a gold plating layer.
3. The driver heat sink device of claim 1, wherein, The limiting mechanism (3) comprises a first spring (31), the first spring (31) is fixedly connected with the frame (1), one side of the first spring (31) is fixedly connected with a moving plate (32), the moving plate (32) is slidably connected with the frame (1), and the side, away from the first spring (31), of the moving plate (32) is fixedly connected with a rubber protection pad (33).
4. The driver heat sink device of claim 3, wherein, The positioning mechanism (4) comprises a positioning frame (43), the positioning frame (43) is fixedly connected with the moving plate (32), the inside of the positioning frame (43) is fixedly connected with a second spring (42), the bottom of the second spring (42) is fixedly connected with a positioning rod (41), and the positioning rod (41) is slidably connected with the positioning frame (43).
5. The driver heat sink device of claim 4, wherein, The side, away from the positioning frame (43), of the positioning rod (41) is fixedly connected with a hemispherical rubber pad.
6. The driver heat sink device of claim 3, wherein, The bottom of the moving plate (32) is fixedly connected with a sliding block (5), the surface of the frame (1) is provided with a sliding groove (6), the sliding block (5) is located in the inside of the sliding groove (6), and the sliding block (5) is slidably connected with the sliding groove (6).