Insulation structure for magnetron sputtering coating substrate transmission

Abstract

The utility model relates to an insulation structure for magnetron sputtering coating substrate transmission, which comprises a support block, an insulation carrier plate and an insulation block clamped between the edge of the support block and the edge of the insulation carrier plate, and the insulation block enables the support block not to be in direct contact with the lower surface of the insulation carrier plate; the supporting block is of a strip-shaped structure, a groove is formed in the upper surface of the supporting block in the length direction of the supporting block, the insulating block is in a long strip shape and contained in the groove, the width of the insulating block is smaller than that of the groove, and the side face of the insulating block does not make contact with the side wall of the groove. According to the insulation structure, the L-shaped space in which air is difficult to circulate is formed on the side surface of the insulation block, and short circuit is not easy to cause, so that the normal process is ensured. The insulation structure is simple in construction, even if the side faces of the insulation blocks are covered with coating materials, the coating materials can be scraped off through the gaps, and the service life is longer.

Description

Technical Field

[0001] This utility model relates to the field of magnetron sputtering technology, and in particular to an insulating structure for transporting substrates in magnetron sputtering coating. Background Technology

[0002] Magnetron sputtering is a high-vacuum process where an inert gas (such as argon) is introduced into a vacuum chamber, and a high voltage is applied between the cathode and anode. This ionizes the gas, generating a large number of ions. Under the influence of an electric field, these positive ions are accelerated towards the cathode target, colliding with target atoms. This causes the target atoms to gain energy and sputter from the target surface. The sputtered target atoms deposit on the substrate surface, gradually forming a dense thin film. During sputtering, the substrate is placed in a hollow position on a carrier plate, exposing most of the bottom area of ​​the substrate downwards. The carrier plate itself is an insulating material, but during the sputtering process, the lower surface inevitably becomes coated with the film material. The edges of the insulating carrier plate are always placed on support blocks. To prevent the coating material on the insulating carrier plate from conducting through the support blocks, an insulating block is used to isolate the insulating carrier plate from the support blocks. Currently, in the perovskite automated equipment industry, the insulating carrier plates used for large-size glass transport generally have their insulating parts exposed within the coating environment. This leads to the gradual formation of a conductive film layer on the surface of the insulating block between the insulating carrier plate and the support block as the coating material accumulates. Once the conductive film layer conducts electricity to both sides of the insulating block, it will cause a change in the electric field, which will then affect the normal progress of the process.

[0003] Chinese patent CN214937780U discloses an insulating structure that uses an insulating body to separate a sputtering substrate and a conveyor belt cover. A groove is formed on one surface of the insulating body, thereby increasing the area required to allow metal molecules to conduct between the sputtering substrate and the conveyor belt cover, and extending the working time of the insulating structure. However, this groove is a recessed space on the insulating body, which is difficult to manufacture. Furthermore, the coating material accumulated in the groove is not easy to clean, and even after prolonged use, the coating on the front side may still pose a risk of conduction.

[0004] Therefore, it is necessary to improve the insulation structure to solve the above problems. Utility Model Content

[0005] The main purpose of this invention is to provide an insulating structure for the transmission of magnetron sputtering coating substrates, which can prevent the coating material from covering the side of the insulating block and causing the film layer to conduct with the support block, thus ensuring the normal progress of the process. The structure is simple and easy to clean.

[0006] This utility model achieves the above-mentioned objective through the following technical solution: an insulating structure for transporting substrates in magnetron sputtering coating, comprising a support block, an insulating carrier plate, and an insulating block sandwiched between the edge of the support block and the edge of the insulating carrier plate, wherein the insulating block prevents the support block from directly contacting the lower surface of the insulating carrier plate; the support block is a strip-shaped structure, and a groove is provided on the upper surface of the support block along its length direction; the insulating block is a long strip and is housed in the groove, the width of the insulating block is smaller than the width of the groove, and the side of the insulating block does not contact the sidewall of the groove.

[0007] Specifically, the upper surface of the support block is provided with a ridge along its length, the ridge being located on the outer side of the groove, and the lower surface of the insulating carrier plate is provided with a clearance groove corresponding to the position of the ridge, with a gap between the clearance groove and the surface of the ridge.

[0008] Specifically, the insulating carrier plate has a stepped hole in the middle and two pickup notches located on opposite sides of the stepped hole.

[0009] Specifically, the support block has several screws along its long side. The screws pass through the insulating block from top to bottom and are fixed to the upper surface of the support block. The insulating block completely surrounds the screws. The support block has a threaded countersunk hole that does not penetrate the lower surface of the support block. The end of the screw is connected to the threaded countersunk hole. The edge of the insulating carrier plate has several positioning notches. The screw is located in the positioning notches and the head of the screw does not contact the edge of the positioning notches.

[0010] Furthermore, each screw passes through an insulating ring located inside the positioning notch, with the upper surface of the insulating ring in close contact with the screw head and the lower surface in close contact with the insulating block.

[0011] The beneficial effects of this utility model's technical solution are:

[0012] This insulation structure creates an L-shaped space on the side of the insulating block, making airflow difficult. Even if the coating material enters this L-shaped space, most of it adheres directly to the surfaces above and below the gap inlet, without penetrating the side of the insulating block. As long as the side of the insulating block is not covered by the coating material, a short circuit will not easily occur, thus ensuring the normal progress of the process. This insulation structure is simple in construction, and even if the side of the insulating block is covered with coating material, it can be scraped off through the gap, resulting in a longer service life. Attached Figure Description

[0013] Figure 1 This is a top view of the insulating structure used for transporting substrates in magnetron sputtering deposition, as described in the embodiment.

[0014] Figure 2This is a perspective view of the insulating structure used for transporting substrates in magnetron sputtering coating, as described in the embodiment, in its operational state.

[0015] Figure 3 This is a diagram showing the assembly relationship between the support block, the insulating carrier plate, and the insulating block.

[0016] Figure 4 This is a partial cross-sectional view of the sealing location.

[0017] The numbers in the diagram represent:

[0018] 100 - Insulation structure,

[0019] 1-Support block, 11-Groove, 12-Ribbon, 13-Threaded countersunk hole

[0020] 2-Insulating carrier plate, 21-Stepped hole, 22-Pickup notch, 23-Allowing groove, 24-Positioning notch

[0021] 3-Insulating block,

[0022] 4-Screw, 41-Cap, 42-End

[0023] 5-Insulating ring;

[0024] 200-substrate. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to specific embodiments.

[0026] Example:

[0027] like Figures 1 to 4 As shown, an insulating structure 100 for transporting magnetron sputtering coating substrates according to the present invention includes a support block 1, an insulating carrier plate 2, and an insulating block 3 sandwiched between the edge of the support block 1 and the edge of the insulating carrier plate 2. The insulating block 3 prevents the support block 1 from directly contacting the lower surface of the insulating carrier plate 2.

[0028] Support block 1 and insulating carrier plate 2 must be connected as one unit, but they must also be separated. Otherwise, as soon as the downward surface of the insulating carrier plate 2 is covered with the coating material, it will become conductive with support block 1. Therefore, insulating block 3 is needed to separate them, forming a gap. Since a small amount of coating material will not immediately cause conductivity, the thickness of this gap can be 0.3~1.0mm.

[0029] like Figures 2 to 4 As shown, the support block 1 is a strip structure. On the upper surface of the support block 1, along its length, there are grooves 11 and ridges 12 respectively. The insulating block 3 is a long strip and is housed in the groove 11. The width of the insulating block 3 is smaller than the width of the groove 11 and the side of the insulating block 3 does not contact the side wall of the groove 11. The ridge 12 is located on the outer side of the groove 11.

[0030] If the side of the insulating block 3 is in close contact with the side wall of the groove 11, the coating material will only adhere to the part of the insulating block 3 exposed through the gap. Since the gap is very thin, once the insulating block 3 is exposed and covered, it will cause the film layer on the lower surface of the support block 1 and the insulating carrier plate 2 to become conductive. To avoid this, a gap must be left between the side of the insulating block 3 and the side wall of the groove 11. Because the coating is upward-facing, the gap will form an L-shaped space on the side of the insulating block 3 where air circulation is difficult. Even if the coating material enters this L-shaped space, most of it will adhere directly to the surfaces above and below the gap inlet, and will not penetrate into the side of the insulating block 3. As long as the side of the insulating block 3 is not covered by the coating material, a short circuit will not easily occur, thus ensuring the normal progress of the process. This insulation structure 100 has a simple construction, and even if the side of the insulating block 3 is covered with coating material, it can be scraped off through the gap, resulting in a longer service life.

[0031] like Figures 1 to 4 As shown, the insulating carrier plate 2 has a stepped hole 21 in the middle, two pickup notches 22 on opposite sides of the stepped hole 21, a clearance groove 23 on the lower surface of the insulating carrier plate 2, and several positioning notches 24 near the edge of the support block 1. The clearance groove 23 corresponds to the position of the ridge 12 and there is a gap between their surfaces.

[0032] The stepped hole 21 extends vertically through the thickness direction of the insulating carrier plate 2, and its edge has a stepped surface to support the edge of the substrate 200. The pick-up notch 22 is used to separate the substrate 200 from the insulating carrier plate 2 after sputtering. The clearance groove 23, in conjunction with the ridge 12, increases the transition structure between the contact surfaces of the insulating carrier plate 2 and the support block 1, and also prevents airflow, preventing the coating material from covering the outer side of the insulating block 3 and avoiding short circuits.

[0033] like Figure 1 , Figure 2 and Figure 4 As shown, a number of screws 4 are provided along the long side of the support block 1. The screws 4 pass through the insulating block 3 from top to bottom and are fixed to the upper surface of the support block 1. The insulating block 3 completely surrounds the screws 4. The support block 1 is provided with a threaded countersunk hole 13 that does not penetrate the lower surface of the support block 1. The end 42 of the screw 4 is connected to the threaded countersunk hole 13. The screw 4 is located in the positioning notch 24 and the head 41 of the screw 4 does not contact the edge of the positioning notch 24.

[0034] Screw 4 limits the positioning notch 24, ensuring that the insulating carrier plate 2 and the substrate 200 are positioned together on the support block 1. Provided that screw 4 does not penetrate the support block 1, and because the insulating block 3 surrounds screw 4, no new leakage channel will be formed between screw 4 and the insulating carrier plate 2.

[0035] like Figure 4As shown, each screw 4 passes through an insulating ring 5, which is located inside the positioning notch 24. The upper surface of the insulating ring 5 is in close contact with the head 41 of the screw 4, and the lower surface is in close contact with the insulating block 3.

[0036] Since both screw 4 and support block 1 are made of conductive materials, it is also necessary to prevent screw 4 from conducting electricity with the film layer. Insulating ring 5 can prevent screw 4 from directly contacting the insulating carrier plate 2, thereby further reducing the risk of short circuit.

[0037] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. An insulating structure for transporting a magnetron sputtering coated substrate, comprising a support block, an insulating carrier plate, and an insulating block sandwiched between the edge of the support block and the edge of the insulating carrier plate, wherein the insulating block prevents the support block from directly contacting the lower surface of the insulating carrier plate; characterized in that: The support block is a strip-shaped structure, and a groove is provided on the upper surface of the support block along its length. The insulating block is a long strip and is housed in the groove. The width of the insulating block is smaller than the width of the groove, and the side of the insulating block does not contact the sidewall of the groove.

2. The insulating structure for transporting magnetron sputtered coating substrates according to claim 1, characterized in that: The upper surface of the support block is also provided with a ridge along its length. The ridge is located on the outer side of the groove. The lower surface of the insulating carrier plate is provided with a relief groove corresponding to the position of the ridge. A gap is left between the relief groove and the surface of the ridge.

3. The insulating structure for transporting magnetron sputtered coating substrates according to claim 1, characterized in that: The insulating carrier plate has a stepped hole in the middle and two pickup notches on opposite sides of the stepped hole.

4. The insulating structure for transporting magnetron sputtered coating substrates according to claim 1, characterized in that: The support block has several screws along its long side. The screws pass through the insulating block from top to bottom and are fixed to the upper surface of the support block. The insulating block completely surrounds the screws. The support block has a threaded countersunk hole that does not penetrate the lower surface of the support block. The end of the screw is connected to the threaded countersunk hole. The edge of the insulating carrier plate has several positioning notches. The screw is located in the positioning notch and the head of the screw does not contact the edge of the positioning notch.

5. The insulating structure for transporting magnetron sputtered coating substrates according to claim 4, characterized in that: Each screw passes through an insulating ring located inside the positioning notch, with the upper surface of the insulating ring in close contact with the screw head and the lower surface in close contact with the insulating block.

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