Wafer warping testing device

Abstract

The utility model discloses a wafer warpage testing device, and belongs to the technical field of warpage testing devices. Comprising a feeding conveyor and a detection table, the detection table is arranged outside one side of the feeding conveyor, a supporting table is arranged outside one side of the detection table, a discharging conveyor is arranged outside one side, away from the feeding conveyor, of the detection table, and a connecting block is installed on the outer wall of the detection table; according to the utility model, the automatic feeding, conveying and detecting of the wafer by the warping testing device are realized, the conveying efficiency among a plurality of groups of wafers is accelerated, the warping degree of the wafer can be conveniently detected at multiple angles and multiple directions, the working efficiency is improved, the working efficiency is improved, the working efficiency is improved, the working efficiency is improved, and the working efficiency is improved. The test range during detection is increased, and the wafer detection accuracy and efficiency of the warping test device are improved.

Description

Technical Field

[0001] This utility model relates to the technical field of warpage testing devices, specifically a wafer warpage testing device. Background Technology

[0002] Chips, also known as chips or microchips, are an indispensable component of modern electronic devices. They are made of semiconductor materials and are used to perform various electronic functions, such as processing data, storing information, and controlling electronic devices. In the mass production process, it is essential to quickly quantify the degree and direction of chip warpage, so that subsequent production can be adjusted in real time based on the quantified parameters.

[0003] As disclosed in the patent announcement number CN215418104U, a wafer warpage testing device includes a wafer support mechanism, a measuring device, and a base; the wafer support mechanism and the measuring device are disposed on the base; the wafer support mechanism has a groove for accommodating the measuring mechanism of the measuring device; the measuring instrument is arranged around the wafer support mechanism.

[0004] Although it achieves the quantification of the warp direction and corresponding degree of warp within 2 minutes, the wafer warp testing device of this utility model has a simple structure, does not require the use of complex ultrasonic or optical sensors, and does not require complex data analysis, which can reduce the detection cost and improve the detection efficiency.

[0005] However, this does not solve the problem that existing warp testing devices are generally not conducive to the automatic feeding and conveying of wafers during use, which affects the efficiency of conveying multiple sets of wafers, makes it inconvenient to detect the warp of wafers from multiple angles and directions, affects the testing range during testing, and affects the accuracy and efficiency of the warp testing device in wafer detection. Utility Model Content

[0006] The purpose of this invention is to provide a wafer warpage testing device to solve the problems mentioned in the background art, such as the inconvenience of automatic wafer feeding and conveying for testing, which affects the efficiency of conveying multiple sets of wafers, the inconvenience of detecting wafer warpage from multiple angles and directions, the impact on the testing range, and the impact on the accuracy and efficiency of wafer testing by the warpage testing device.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0008] A wafer warpage testing device includes a feeding conveyor and a testing platform. The testing platform is located on one side of the feeding conveyor, and a support platform is located on one side of the testing platform. A discharging conveyor is located on the side of the testing platform away from the feeding conveyor. A connecting block is installed on the outer wall of the testing platform. A transverse conveyor frame is symmetrically installed on the top of the support platform. A transverse motor is installed on the outer wall of each transverse conveyor frame. A transverse threaded rod is installed at the output end of each transverse motor. A transverse threaded sleeve is fitted on the surface of each transverse threaded rod, and the transverse threaded sleeve is slidably connected to the transverse conveyor frame.

[0009] Optionally, each of the transverse threaded sleeves is equipped with a longitudinal conveyor frame at its top end, and each of the longitudinal conveyor frames is equipped with a longitudinal motor at its top end, with a longitudinal threaded rod installed at the output end of each longitudinal motor.

[0010] Optionally, the surface of each longitudinal threaded rod is fitted with a longitudinal threaded sleeve, and the longitudinal threaded sleeve is slidably connected to the longitudinal conveyor frame. A movable frame is installed on the outer wall of each longitudinal threaded sleeve, and a clamping seat is installed on the outer wall of each movable frame.

[0011] Optionally, a bushing is installed inside the connecting block and extends to the outside of the connecting block, and a third rotating shaft is fitted inside the bushing.

[0012] Optionally, a radiation collector is installed at the end of the third rotating shaft away from the bushing, a radiation emitter is installed on the outer wall of the radiation collector, and a controller is installed at the top of the radiation emitter.

[0013] Optionally, the clamping seat has racks symmetrically installed inside, and gears are installed between the racks on both sides, with the gears meshing with the racks. A first motor is provided on one side of the clamping seat.

[0014] Optionally, the output end of the first motor is equipped with a first rotating shaft, and the first rotating shaft is connected to a gear. A clamping arm is slidably installed on the outer wall of the clamping seat, and a rack is connected to the clamping arm.

[0015] Optionally, a second motor is installed inside the testing station, a second rotating shaft is installed at the output end of the second motor, and a rotating disk is installed at the top end of the second rotating shaft.

[0016] Optionally, a cover is installed on the outer wall of the connecting block, a worm gear is installed inside the cover, a servo motor is provided on one side of the cover, and the output end of the servo motor is connected to the worm gear.

[0017] Optionally, a worm gear is fitted onto the surface of the third rotating shaft, and the worm gear meshes with the worm.

[0018] Compared with the prior art, the beneficial effects of this utility model are: the warpage testing device not only realizes the automatic feeding and conveying detection of wafers, which speeds up the conveying efficiency between multiple sets of wafers, but also facilitates the detection of wafer warpage from multiple angles and directions, increases the testing range during detection, and improves the accuracy and efficiency of the warpage testing device for wafer detection.

[0019] (1) The wafer is moved to below a set of clamping arms by the drive of the feeding conveyor. The transverse motor on one side of the feeding conveyor is turned on. The transverse motor drives the transverse threaded rod to rotate. The transverse threaded rod drives the transverse threaded sleeve to move inside the transverse conveyor frame. The transverse threaded sleeve drives the longitudinal conveyor frame and the moving frame to move. The moving frame drives the longitudinal conveyor frame and the clamping arms to move. When they move to the appropriate position, the longitudinal motor drives the longitudinal threaded rod to rotate. The longitudinal threaded rod drives the longitudinal threaded sleeve to descend to the appropriate height. The first motor drives the first rotating shaft to rotate. The first rotating shaft drives the gear to rotate. In the gear and rack... The meshing drive drives two sets of racks to move in opposite directions. The racks drive the clamping arms to clamp the wafer. The reverse longitudinal motor opens, driving the moving frame, clamping arms, and wafer to rise. The reverse transverse motor opens, moving the wafer held by the clamping arms to the surface of the rotating disk. After the wafer is inspected, the inspected wafer is clamped out by another set of clamping arms and moved to the surface of the discharge conveyor. The discharge conveyor transports the wafer to the next process. This realizes the automatic feeding, conveying, and inspection of wafers by the warp testing device, which facilitates the rapid clamping, conveying, and discharge of inspected wafers and speeds up the efficiency of conveying multiple sets of wafers.

[0020] (2) The second motor drives the second rotating shaft to rotate, the second rotating shaft drives the rotating disk to rotate, and the rotating disk drives the wafer to rotate, realizing the multi-position testing of the wafer by the warp test device and improving the detection accuracy of the warp test device.

[0021] (3) By turning on the X-ray emitter, the X-ray emitter emits X-rays. The X-rays reflected by the wafer are collected by the X-ray collector. The X-ray emitter and the X-ray collector transmit various data to the controller. The controller detects the warp of the wafer by the fluctuation of the reflected signal. When it is necessary to improve the detection accuracy, or when it is necessary to detect the tilt angle, the servo motor drives the worm to rotate inside the housing. The worm drives the worm wheel to rotate. The worm wheel drives the third rotating shaft to rotate under the support of the bushing. The third rotating shaft drives the X-ray collector to rotate at a certain angle. The X-ray collector drives the X-ray emitter to rotate at a certain angle, so as to facilitate tilt detection. This realizes the multi-angle and multi-directional detection of wafer warp by the warp testing device, which facilitates the multi-angle detection of wafer by the warp testing device, increases the test range during detection, and improves the detection efficiency of the warp testing device for wafers. Attached Figure Description

[0022] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present invention and, together with the specification, further serve to explain the principles of the present invention and enable those skilled in the art to implement and use the present invention.

[0023] Figure 1 This is a front view structural diagram of the present utility model;

[0024] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0025] Figure 3 This is a three-dimensional structural diagram of the servo motor of this utility model;

[0026] Figure 4 This is a three-dimensional structural diagram of the second motor of this utility model;

[0027] Figure 5 This is a three-dimensional structural diagram of the clamping arm of this utility model;

[0028] Figure 6 This is a three-dimensional structural diagram of the clamping base of this utility model;

[0029] Figure 7 This is a three-dimensional structural diagram of the gear of this utility model.

[0030] Figure label:

[0031] 1. Feed conveyor; 2. Inspection table; 3. Support table; 4. Discharge conveyor; 5. Clamping seat; 6. Connecting block; 7. Transverse conveyor frame; 8. Transverse threaded rod; 9. Transverse threaded sleeve; 10. Longitudinal threaded sleeve; 11. Longitudinal motor; 12. Longitudinal threaded rod; 13. Transverse motor; 14. Moving frame; 15. Longitudinal conveyor frame; 16. Clamping arm; 17. Rack; 18. Gear; 19. First rotating shaft; 20. First motor; 21. Rotating disk; 22. Second rotating shaft; 23. Second motor; 24. Bushing; 25. Third rotating shaft; 26. Worm gear; 27. X-ray collector; 28. Controller; 29. ​​Worm; 30. Servo motor; 31. X-ray emitter; 32. Cover.

[0032] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiment of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0033] The wafer warpage testing device provided by this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can also use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.

[0034] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0035] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0036] It is understood that the meanings of “on”, “above”, and “above” in this utility model should be interpreted in the broadest manner, such that “on” not only means “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” not only means “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.

[0037] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0038] like Figures 1 to 7As shown, an embodiment of this utility model provides a wafer warpage testing device, including a feeding conveyor 1 and a testing platform 2. The testing platform 2 is disposed on one side of the feeding conveyor 1, and a support platform 3 is disposed on one side of the testing platform 2. A discharge conveyor 4 is disposed on the side of the testing platform 2 away from the feeding conveyor 1. A connecting block 6 is installed on the outer wall of the testing platform 2. A transverse conveyor frame 7 is symmetrically installed on the top of the support platform 3. A transverse motor 13 is disposed on the outer wall of each transverse conveyor frame 7. A transverse threaded rod 8 is installed at the output end of each transverse motor 13. A transverse threaded sleeve 9 is fitted onto the surface of each transverse threaded rod 8, and the transverse threaded sleeve 9 is slidably connected to the transverse conveyor frame 7. A longitudinal conveyor frame 15 is installed at the top of each transverse threaded sleeve 9. A longitudinal motor 11 is disposed at the top of each longitudinal conveyor frame 15. A longitudinal threaded rod 12 is installed at the output end of each longitudinal motor 11. A longitudinal threaded sleeve 10 is fitted onto the surface of each longitudinal threaded rod 12, and the longitudinal thread... The sleeve 10 is slidably connected to the longitudinal conveyor frame 15. A movable frame 14 is installed on the outer wall of the longitudinal threaded sleeve 10. A clamping seat 5 is installed on the outer wall of the movable frame 14. A bushing 24 is installed inside the connecting block 6 and extends to the outside of the connecting block 6. A third rotating shaft 25 is installed inside the bushing 24. A radiation collector 27 is installed at the end of the third rotating shaft 25 away from the bushing 24. A radiation emitter 31 is installed on the outer wall of the radiation collector 27. A controller 28 is installed at the top of the radiation emitter 31. A rack 17 is symmetrically installed inside the clamping seat 5. A gear 18 is installed between the two racks 17 and meshes with the rack 17. A first motor 20 is provided on one side of the outside of the clamping seat 5. A first rotating shaft 19 is installed at the output end of the first motor 20 and is connected to the gear 18. A clamping arm 16 is slidably installed on the outer wall of the clamping seat 5 and is connected to the rack 17.

[0039] The wafer is placed on the surface of the feed conveyor 1. The feed conveyor 1 is turned on, and the wafer is moved to the underside of a set of clamping arms 16 by the drive of the feed conveyor 1. The transverse motor 13 on one side of the feed conveyor 1 is turned on. Under the support of the support platform 3, the transverse motor 13 drives the transverse threaded rod 8 to rotate. With the threaded connection between the transverse threaded rod 8 and the transverse threaded sleeve 9, the transverse threaded rod 8 drives the transverse threaded sleeve 9 to move inside the transverse conveyor frame 7. The transverse threaded sleeve 9 drives the longitudinal conveyor frame 15 and the moving frame 14 to move. The moving frame 14 drives the longitudinal conveyor frame 15 and the clamping arms 16 to move. When the wafer moves to the appropriate position, the longitudinal motor 11 is turned on. With the support of the longitudinal conveyor frame 15, the longitudinal motor 11 drives the longitudinal threaded rod 12 to rotate. With the threaded connection between the longitudinal threaded rod 12 and the longitudinal threaded sleeve 10, the longitudinal threaded rod 12 drives the longitudinal threaded sleeve 10 to descend to the appropriate position. The height is adjusted so that the first motor 20 is turned on. Under the support of the clamping seat 5, the first motor 20 drives the first rotating shaft 19 to rotate. The first rotating shaft 19 drives the gear 18 to rotate. Under the meshing drive of the gear 18 and the rack 17, the two sets of racks 17 are driven to move in opposite directions. The rack 17 drives the clamping arm 16 to clamp the wafer. The vertical motor 11 is turned on in the opposite direction, which drives the moving frame 14, the clamping arm 16 and the wafer to rise. The horizontal motor 13 is turned on in the opposite direction to move the wafer held by the clamping arm 16 to the surface of the rotating disk 21. After the wafer is inspected, the inspected wafer is clamped out by another set of clamping arms 16 and moved to the surface of the discharge conveyor 4. The discharge conveyor 4 transports the wafer to the next process. This realizes the automatic feeding, conveying and inspection of wafers by the warp test device, which facilitates the quick clamping, conveying and discharge of inspected wafers and speeds up the efficiency of conveying multiple sets of wafers.

[0040] The testing station 2 is equipped with a second motor 23. The output end of the second motor 23 is equipped with a second rotating shaft 22. The top of the second rotating shaft 22 is equipped with a rotating disk 21.

[0041] The second motor 23 is turned on, and with the support of the test table 2, the second motor 23 drives the second rotating shaft 22 to rotate. The second rotating shaft 22 drives the rotating disk 21 to rotate, and the rotating disk 21 drives the wafer to rotate. This realizes the multi-position testing of the wafer by the warpage test device and improves the detection accuracy of the warpage test device.

[0042] A cover 32 is installed on the outer wall of the connecting block 6. A worm gear 29 is installed inside the cover 32. A servo motor 30 is provided on one side of the cover 32, and the output end of the servo motor 30 is connected to the worm gear 29. A worm wheel 26 is fitted on the surface of the third rotating shaft 25, and the worm wheel 26 meshes with the worm gear 29.

[0043] When X-ray emitter 31 is turned on, it emits X-rays. The X-rays reflected by the wafer are collected by X-ray collector 27. X-ray emitter 31 and X-ray collector 27 transmit various data to controller 28. Controller 28 detects the wafer warpage by the fluctuation of the reflected signal. When higher detection accuracy is required, or when tilt angle detection is required, servo motor 30 is turned on. Supported by connecting block 6, servo motor 30 drives worm gear 29 to rotate inside housing 32. Under the meshing of worm gear 29 and worm wheel 26, worm gear 29 drives worm wheel 26 to rotate. Worm wheel 26 drives third rotating shaft 25 to rotate under the support of bushing 24. Third rotating shaft 25 drives X-ray collector 27 to rotate at a certain angle. X-ray collector 27 drives X-ray emitter 31 to rotate at a certain angle, facilitating tilt detection. This enables the warpage testing device to detect wafer warpage from multiple angles and directions, facilitating convenient multi-angle detection of wafers, increasing the testing range, and improving the efficiency of wafer detection.

[0044] The working principle of the technical solution provided by this utility model is as follows: The wafer is placed on the surface of the feeding conveyor 1. Driven by the feeding conveyor 1, the wafer is moved to below a set of clamping arms 16. The transverse motor 13 drives the transverse threaded rod 8 to rotate. The transverse threaded rod 8 drives the transverse threaded sleeve 9 to move inside the transverse conveyor frame 7. The transverse threaded sleeve 9 drives the longitudinal conveyor frame 15 and the moving frame 14 to move. The moving frame 14 drives the longitudinal conveyor frame 15 and the clamping arms 16 to move. When the wafer is moved to a suitable position, the longitudinal motor 11 drives the longitudinal threaded rod 12 to rotate. The longitudinal threaded rod 12 drives the longitudinal threaded sleeve 10 to descend to a suitable height. The first motor 20 drives the first rotating shaft 19 to rotate. The first rotating shaft 19 drives the gear 18 to rotate, thereby driving the two sets of racks 17 to move in opposite directions. The racks 17 drive the clamping arms 16 to clamp the wafer. The longitudinal motor 11 is then turned in the opposite direction, causing the moving frame 14, the clamping arms 16, and the wafer to rise. The reverse horizontal motor 13 moves the wafer held by the clamping arm 16 to the surface of the rotating disk 21. After the wafer is inspected, another set of clamping arms 16 removes the inspected wafer and moves it to the surface of the discharge conveyor 4. The discharge conveyor 4 transports the wafer to the next process. The second motor 23 drives the second rotating shaft 22 to rotate, which in turn drives the rotating disk 21 to rotate. The rotating disk 21 drives the wafer to rotate, and the X-ray emitter 31 is turned on. When tilt angle inspection is required, the servo motor 30 drives the worm gear 29 to rotate inside the housing 32. The worm gear 29 drives the worm wheel 26 to rotate, which in turn drives the third rotating shaft 25 to rotate under the support of the bushing 24. The third rotating shaft 25 drives the X-ray collector 27 to rotate at a certain angle, which in turn drives the X-ray emitter 31 to rotate at a certain angle, thus facilitating tilt inspection and completing the use of the warp test device.

[0045] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0046] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A wafer warpage testing device, characterized in that: The device includes a feeding conveyor and a testing platform. The testing platform is located on one side of the feeding conveyor, and a support platform is located on one side of the testing platform. A discharging conveyor is located on the side of the testing platform away from the feeding conveyor. A connecting block is installed on the outer wall of the testing platform. A transverse conveyor frame is symmetrically installed on the top of the support platform. A transverse motor is installed on the outer wall of each transverse conveyor frame. A transverse threaded rod is installed at the output end of each transverse motor. A transverse threaded sleeve is fitted on the surface of each transverse threaded rod, and the transverse threaded sleeve is slidably connected to the transverse conveyor frame.

2. The wafer warpage testing apparatus according to claim 1, characterized in that: The top of each transverse threaded sleeve is equipped with a longitudinal conveyor frame, the top of each longitudinal conveyor frame is equipped with a longitudinal motor, and the output end of each longitudinal motor is equipped with a longitudinal threaded rod.

3. The wafer warpage testing apparatus according to claim 2, characterized in that: The surface of each longitudinal threaded rod is fitted with a longitudinal threaded sleeve, and the longitudinal threaded sleeve is slidably connected to the longitudinal conveyor frame. Each longitudinal threaded sleeve is equipped with a movable frame on its outer wall, and each movable frame is equipped with a clamping seat on its outer wall.

4. The wafer warpage testing apparatus according to claim 3, characterized in that: A bushing is installed inside the connecting block and extends to the outside of the connecting block. A third rotating shaft is fitted inside the bushing.

5. The wafer warpage testing apparatus according to claim 4, characterized in that: A radiation collector is installed at the end of the third rotating shaft away from the bushing. A radiation emitter is installed on the outer wall of the radiation collector, and a controller is installed at the top of the radiation emitter.

6. The wafer warpage testing apparatus according to claim 5, characterized in that: The clamping seat has racks symmetrically installed inside, and gears are installed between the racks on both sides, with the gears meshing with the racks. A first motor is provided on one side of the outside of the clamping seat.

7. The wafer warpage testing apparatus according to claim 6, characterized in that: The output end of the first motor is equipped with a first rotating shaft, which is connected to a gear. A clamping arm is slidably mounted on the outer wall of the clamping seat, and a rack is connected to the clamping arm.

8. The wafer warpage testing apparatus according to claim 7, characterized in that: The testing station is equipped with a second motor, and a second rotating shaft is installed at the output end of the second motor. A rotating disk is installed at the top of the second rotating shaft.

9. The wafer warpage testing apparatus according to claim 8, characterized in that: A cover is installed on the outer wall of the connecting block, a worm gear is installed inside the cover, and a servo motor is installed on one side of the cover, with the output end of the servo motor connected to the worm gear.

10. The wafer warpage testing apparatus according to claim 9, characterized in that: The surface of the third rotating shaft is fitted with a worm gear, and the worm gear meshes with the worm.

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