Thick film chip resistor structure

Abstract

The utility model discloses a thick-film chip resistor structure and relates to the technical field of thick-film resistors. The resistor comprises a tin layer, the right side of the tin layer is fixedly connected with a conductive plate, the right side of the conductive plate is in contact with two conductive strips, the right side of the protective shell is provided with a sliding groove, and the side, close to the conductive plate, of the outer surface of each conductive strip is in sliding connection with the inner wall of the sliding groove. The side, close to the conductive plate, of the outer surface of the conductive strip is fixedly connected with a threaded block, and the outer surface of the threaded block is in threaded connection with a fastening block. According to the thick-film resistor, the conductive strips are arranged, specifically, the conductive strips are poked to slide on the inner walls of the sliding grooves, and when the two conductive strips reach the required distance, the fastening block is rotated, so that the left side of the fastening block is in close contact with the right side of the protective shell, and the conductive strips are fixed, and the problem that the conventional thick-film resistor needs to be pulled when the distance between the two conductive strips is adjusted is solved. Adjustment is inconvenient, and the bus bar is easy to damage.

Description

Technical Field

[0001] This utility model belongs to the field of thick film resistor technology, and in particular relates to a thick film wafer resistor structure. Background Technology

[0002] Passive component chip resistors can be divided into two main categories based on their manufacturing process: thick film resistors and thin film resistors. Thin film resistors are manufactured using a sputtering process to create the resistive film, while thick film resistors are manufactured using a printing and sintering process. The main difference between thick film resistors and thin film resistors lies in their accuracy tolerance. Users choose different resistors based on their product requirements.

[0003] Thick film resistors are typically connected to other electrical components using conductive strips. However, when adjusting the distance between two conductive strips in existing thick film resistors, the conductive strips are usually bent directly. This is not only inconvenient to adjust, but the conductive strips are also easily damaged by bending, thus affecting the normal operation of the resistor. Utility Model Content

[0004] The purpose of this invention is to provide a thick-film wafer resistor structure. By setting conductive strips, specifically by moving the conductive strips to slide on the inner wall of the groove, and when the two conductive strips reach the required distance, the fastening block is rotated to move on the threaded surface of the threaded block. This allows the left side of the fastening block to make tight contact with the right side of the protective shell, thus fixing the conductive strips. This solves the problem that existing thick-film resistors require bending the conductive strips when adjusting the distance between the two conductive strips, which is inconvenient and easily damages the conductive strips.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model relates to a thick-film wafer resistor structure, comprising a resistor and a protective shell. The resistor includes a tin layer, and a conductive plate is fixedly connected to the right side of the tin layer. Two conductive strips are in contact with the right side of the conductive plate. The right side of the conductive strips penetrates the right side of the protective shell and extends to the outside. A sliding groove is formed on the right side of the protective shell. The outer surface of the conductive strips near the conductive plate is slidably connected to the inner wall of the sliding groove. The conductive strips can slide within the sliding groove to adjust the distance. This not only makes adjustment convenient but also avoids damage caused by bending the conductive strips, greatly improving the practicality of the resistor.

[0007] Furthermore, a threaded block is fixedly connected to the outer surface of the conductive strip near the conductive plate, and a fastening block is threadedly connected to the outer surface of the threaded block. The left side of the fastening block contacts the right side of the protective shell. By rotating the fastening block to make the left side of the fastening block contact the right side of the protective shell, the conductive strip can be fixed, which can prevent the conductive strip from shifting when the resistor is working and improve the practicality of the device.

[0008] Furthermore, spherical latches are slidably connected to both the front and back sides of the tin layer, and springs are fixedly connected to the side of each spherical latch near the tin layer. The springs not only provide power to the spherical latches, but also absorb minor movements caused by temperature changes or other factors, protecting the resistor from damage.

[0009] Furthermore, the protective shell has snap-fit ​​grooves on both the front and back sides of its inner wall. The outer surface of the spherical snap-fit ​​contacts the inner wall of the snap-fit ​​groove, thereby fixing the protective shell in place. This improves the protective effect of the protective shell and prevents the resistor from being damaged by external impacts.

[0010] Furthermore, a protective layer one is fixedly connected to the top of the tin layer, a protective layer two is fixedly connected to the bottom of the protective layer one, and a protective layer three is fixedly connected to both the front and back of the protective layer two. The protective layer three can effectively prevent external substances from entering, thereby preventing sulfides from entering and reacting with the resistor to produce silver sulfide, thus avoiding changes in the resistance value of the resistor due to silver sulfide, and greatly improving the stability of the resistor.

[0011] Furthermore, positive electrodes are fixedly connected to the bottom of both protective layers, and an impedance layer is fixedly connected to the corresponding side of the two positive electrodes. A ceramic substrate is fixedly connected to the bottom of the impedance layer. The ceramic substrate has good heat resistance and mechanical stability, which not only provides a solid support for the resistor, but also helps the resistor dissipate heat during operation.

[0012] Furthermore, two back electrodes are fixedly connected to the bottom of the ceramic substrate, and side electrodes are fixedly connected to the left and right sides of the ceramic substrate. The outer surfaces of the side electrodes, the back electrodes, and the protective layer are all fixedly connected to the inner wall of the tin layer. The outer surfaces of the side electrodes, the back electrodes, and the protective layer are all tightly connected to the inner wall of the tin layer, which not only ensures good conductivity but also helps to improve the stability of the resistor.

[0013] This utility model has the following beneficial effects:

[0014] This invention utilizes conductive strips, specifically by moving the conductive strips to slide along the inner wall of the groove. When the two conductive strips reach the desired distance, the fastening block is rotated, causing it to move along the threaded surface of the threaded block. This ensures that the left side of the fastening block makes tight contact with the right side of the protective shell, thus fixing the conductive strips in place. This not only facilitates adjustment but also prevents damage caused by bending the conductive strips, greatly improving the practicality of the resistor.

[0015] This invention incorporates a third protective layer, specifically made of the same resin material as the first protective layer. Because its coefficient of thermal expansion is the same, it maintains good integrity under temperature changes, preventing gaps and effectively preventing external substances from entering. This prevents sulfides from reacting with the resistor to form silver sulfide, thus avoiding changes in the resistor's resistance due to silver sulfide and significantly improving the resistor's stability.

[0016] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This utility model Figure 1 Schematic diagram of the enlarged structure of A in the middle;

[0020] Figure 3 This is a schematic diagram of the conductive plate structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the protective shell structure of this utility model;

[0022] Figure 5 This is a schematic diagram of the spherical buckle structure of this utility model;

[0023] Figure 6 This is a schematic diagram of the internal structure of this utility model.

[0024] The attached diagram lists the components represented by each number as follows:

[0025] 1. Resistor; 11. Protective Layer 1; 111. Protective Layer 2; 112. Protective Layer 3; 113. Positive Electrode; 114. Impedance Layer; 115. Ceramic Substrate; 116. Back Electrode; 117. Side Electrode; 118. Tin Layer; 12. Conductive Plate; 13. Spherical Clip; 131. Spring; 2. Protective Shell; 21. Clip Groove; 22. Slide Groove; 23. Conductive Strip; 231. Threaded Block; 232. Fastening Block. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0027] Please see Figure 1-6 As shown, this utility model is a thick film wafer resistor structure, including a resistor 1 and a protective shell 2. The resistor 1 includes a tin layer 118. A conductive plate 12 is fixedly connected to the right side of the tin layer 118. Two conductive strips 23 are in contact with the right side of the conductive plate 12. The right side of the conductive strips 23 penetrates the right side of the protective shell 2 and extends to the outside. A groove 22 is provided on the right side of the protective shell 2. The outer surface of the conductive strips 23 near the conductive plate 12 is slidably connected to the inner wall of the groove 22.

[0028] A threaded block 231 is fixedly connected to the outer surface of the conductive strip 23 near the conductive plate 12. A fastening block 232 is threadedly connected to the outer surface of the threaded block 231. The left side of the fastening block 232 contacts the right side of the protective shell 2. By setting the conductive strip 23, specifically by moving the conductive strip 23 to slide on the inner wall of the slide groove 22, when the two conductive strips 23 reach the required distance, the fastening block 232 is rotated to make the fastening block 232 move threadedly on the surface of the threaded block 231, so that the left side of the fastening block 232 is in close contact with the right side of the protective shell 2, thus fixing the conductive strip 23. This not only makes adjustment convenient but also avoids damage caused by bending the conductive strip 23, greatly improving the practicality of the resistor 1.

[0029] Both the front and back sides of the tin layer 118 are slidably connected to ball-shaped latches 13, and each ball-shaped latch 13 is fixedly connected to a spring 131 on the side of the tin layer 118 closest to it.

[0030] The protective shell 2 has a buckle groove 21 on both the front and back of the inner wall, and the outer surface of the spherical buckle 13 is in contact with the inner wall of the buckle groove 21.

[0031] A protective layer 11 is fixedly connected to the top of the tin layer 118, and a protective layer 2 111 is fixedly connected to the bottom of the protective layer 111. A protective layer 3 112 is fixedly connected to both the front and back of the protective layer 2 111. By setting the protective layer 3 112, specifically, the protective layer 3 112 is made of the same resin material as the protective layer 11. Because its coefficient of thermal expansion is the same as that of the protective layer 11, it can maintain good integrity under temperature changes and is not prone to gaps. It can effectively prevent the entry of external substances, thereby preventing sulfides from entering and reacting with the resistor 1 to produce silver sulfide. This can avoid the resistance value of the resistor 1 from changing due to silver sulfide, and greatly improve the stability of the resistor 1.

[0032] Positive electrodes 113 are fixedly connected to the bottom of both protective layers 112, and impedance layers 114 are fixedly connected to the corresponding side of the two positive electrodes 113. A ceramic substrate 115 is fixedly connected to the bottom of the impedance layers 114.

[0033] Two back electrodes 116 are fixedly connected to the bottom of the ceramic substrate 115. Side electrodes 117 are fixedly connected to the left and right sides of the ceramic substrate 115. The outer surfaces of the side electrodes 117, the back electrodes 116, and the protective layer 112 are all fixedly connected to the inner wall of the tin layer 118.

[0034] A specific application of this embodiment is as follows: During installation, the protective shell 2 is positioned directly above the resistor 1. Then, the protective shell 2 is pressed down so that its inner wall contacts the outer surface of the tin layer 118. The spherical buckle 13 is then pressed and moves towards the resistor 1. When the protective shell 2 completely covers the outer surface of the tin layer 118, the spherical buckle 13, due to the elastic force of the spring 131, contacts the inner wall of the buckle groove 21, thus fixing the protective shell 2. Similarly, when the protective shell 2 needs to be disassembled, it can be pulled upwards. When the distance between the conductive strips 23 needs to be adjusted, the conductive strips 23 are moved to slide along the inner wall of the groove 22. When the two conductive strips 23 reach the desired distance, the fastening block 232 is rotated to tighten the connection. Block 232 moves along the threaded surface of threaded block 231, thereby making the left side of fastening block 232 in close contact with the right side of protective shell 2, fixing conductive strip 23. During the use of resistor 1, protective layer 11 is made of resin material, which plays the first protective role. Protective layer 111 is made of glass material, which plays the second protective role. Protective layer 112 is also made of resin material. Because its coefficient of thermal expansion is the same as that of protective layer 11, it can maintain good integrity under temperature changes and is not prone to gaps. It can effectively prevent external substances from entering, thereby preventing sulfides from entering and reacting with resistor 1 to produce silver sulfide, thus avoiding changes in resistor value due to silver sulfide.

[0035] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the present utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art of thick-film resistors to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A thick-film wafer resistor structure, comprising a resistor (1) and a protective shell (2), wherein the resistor (1) comprises a tin layer (118), characterized in that: A conductive plate (12) is fixedly connected to the right side of the tin layer (118). Two conductive strips (23) are in contact with the right side of the conductive plate (12). The right side of the conductive strips (23) penetrates the right side of the protective shell (2) and extends to the outside. A groove (22) is provided on the right side of the protective shell (2). The outer surface of the conductive strips (23) close to the conductive plate (12) is slidably connected to the inner wall of the groove (22).

2. The thick-film wafer resistor structure according to claim 1, characterized in that, A threaded block (231) is fixedly connected to the outer surface of the conductive strip (23) near the conductive plate (12). A fastening block (232) is threadedly connected to the outer surface of the threaded block (231). The left side of the fastening block (232) is in contact with the right side of the protective shell (2).

3. The thick-film wafer resistor structure according to claim 2, characterized in that, Both the front and back sides of the tin layer (118) are slidably connected to spherical buckles (13), and each spherical buckle (13) is fixedly connected to a spring (131) on the side of the tin layer (118) near the tin layer (118).

4. The thick-film wafer resistor structure according to claim 3, characterized in that, The protective shell (2) has a buckle groove (21) on both the front and back sides of its inner wall, and the outer surface of the spherical buckle (13) is in contact with the inner wall of the buckle groove (21).

5. A thick-film wafer resistor structure according to claim 4, characterized in that, The top of the tin layer (118) is fixedly connected to a protective layer one (11), the bottom of the protective layer one (111) is fixedly connected to a protective layer two (111), and the front and back of the protective layer two (111) are both fixedly connected to a protective layer three (112).

6. The thick-film wafer resistor structure according to claim 5, characterized in that, A positive electrode (113) is fixedly connected to the bottom of each of the two protective layers (112), and an impedance layer (114) is fixedly connected to the corresponding side of the two positive electrodes (113). A ceramic substrate (115) is fixedly connected to the bottom of the impedance layer (114).

7. A thick-film wafer resistor structure according to claim 6, characterized in that, Two back electrodes (116) are fixedly connected to the bottom of the ceramic substrate (115), and side electrodes (117) are fixedly connected to the left and right sides of the ceramic substrate (115). The outer surfaces of the side electrodes (117), the back electrodes (116), and the outer surfaces of the protective layer three (112) are all fixedly connected to the inner wall of the tin layer (118).

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