Four-layer thermoelectric separation copper substrate

Abstract

The utility model relates to a four-layer thermoelectric separation copper substrate, which comprises a red copper hot disc, heat dissipation salient points, thermosetting adhesive, a first copper-clad plate, a second copper-clad plate, a first via hole, a second via hole and resin, and is characterized in that the heat dissipation salient points are arranged on the red copper hot disc and penetrate through the thermosetting adhesive, the first copper-clad plate and the second copper-clad plate; the upper surface and the lower surface of the red copper hot plate are respectively connected with the first copper-clad plate and the second copper-clad plate through the thermosetting adhesive, the first via hole respectively penetrates through the first copper-clad plate and the second copper-clad plate, the second via hole penetrates through the red copper hot plate, the thermosetting adhesive, the first copper-clad plate and the second copper-clad plate, and the resin is arranged in the second via hole. Wherein the first copper-clad plate and the second copper-clad plate have the same structure. Compared with the prior art, the four-layer circuit and high-density wiring design meets the dense circuit layout requirement, and meanwhile, the added heat dissipation salient points are utilized, so that the high heat conduction function of the circuit board is realized; and electronic components are welded on two sides, so that diversified design requirements of customers are met, and the practicability is higher.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely relates to a four layer thermoelectric separation copper base plate. BACKGROUND

[0002] Ordinary single surface thermoelectric separation copper base plate, although heat dissipation performance is very good, but only one layer circuit, and single layer circuit can only single surface soldering component, cannot satisfy complex circuit layout requirement. But in order to satisfy multilayer wiring, two surface soldering component requirement and give consideration to good heat dissipation performance, it is the difficult problem that current prior art cannot give consideration to. Its reason is due to circuit layer increase, the LED lamp installed on it is also more, and heat source is more, and natural heat generation amount becomes big. And on the other hand, how to handle its circuit communication and avoid short circuit to realize double surface four layer thermoelectric separation copper base plate is also a big difficulty.

[0003] In order to solve above-mentioned problem, we have made a series of improvements. CONTENT OF THE UTILITY MODEL

[0004] The utility model is directed to providing a four layer thermoelectric separation copper base plate to overcome the above-mentioned shortcomings and deficiencies of the prior art.

[0005] A four layer thermoelectric separation copper base plate, comprising: red copper hot disc, heat dissipation convex point, heat curing adhesive, first copper clad plate, second copper clad plate, first through hole, second through hole and resin, the red copper hot disc is equipped with heat dissipation convex point, the heat dissipation convex point penetrates heat curing adhesive, first copper clad plate and second copper clad plate, the upper and lower surfaces of the red copper hot disc are connected with first copper clad plate and second copper clad plate respectively through heat curing adhesive, the first through hole penetrates first copper clad plate and second copper clad plate respectively, the second through hole penetrates red copper hot disc, heat curing adhesive, first copper clad plate and second copper clad plate, and the resin is arranged in the second through hole.

[0006] The first copper clad plate and the second copper clad plate are identical in structure, the first copper clad plate comprises: an insulating layer, a first circuit layer and a second circuit layer, the first circuit layer is arranged on the heat curing adhesive, the other side of the first circuit layer is provided with the insulating layer, and the other side of the insulating layer is provided with the second circuit layer.

[0007] The utility model has the advantages of:

[0008] Compared with the prior art, the four layer circuit and the high-density wiring design meet the requirements of dense circuit layout, and the increased heat dissipation convex points realize the high-thermal-conductivity function of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 The utility model is a structural schematic diagram.

[0010] Figure label:

[0011] 100 copper heat sink, 200 heat dissipation bumps, 300 thermosetting adhesive, 400 first copper clad laminate, 410 insulating layer, 420 first circuit layer and 430 second circuit layer.

[0012] The second copper-clad laminate 500, the first through hole 600, the second through hole 700, and the resin 800. Detailed Implementation

[0013] The present invention will be further described below with reference to specific embodiments. It should be understood that the following embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0014] Example 1

[0015] like Figure 1 As shown, a four-layer thermoelectrically separated copper substrate includes: a copper heat sink 100, heat dissipation bumps 200, thermosetting adhesive 300, a first copper clad laminate 400, a second copper clad laminate 500, a first through hole 600, a second through hole 700, and resin 800. The copper heat sink 100 is provided with heat dissipation bumps 200, which penetrate the thermosetting adhesive 300, the first copper clad laminate 400, and the second copper clad laminate 500. The upper and lower surfaces of the copper heat sink 100 are respectively connected to the first copper clad laminate 400 and the second copper clad laminate 500 through the thermosetting adhesive 300. The first through hole 600 penetrates the first copper clad laminate 400 and the second copper clad laminate 500. The second through hole 700 penetrates the copper heat sink 100, the thermosetting adhesive 300, the first copper clad laminate 400, and the second copper clad laminate 500. The resin 800 is disposed in the second through hole 700.

[0016] The first copper clad laminate 400 and the second copper clad laminate 500 have the same structure. The first copper clad laminate 400 includes an insulating layer 410, a first circuit layer 420 and a second circuit layer 430. The first circuit layer 420 is disposed on the thermosetting adhesive 300. The insulating layer 410 is disposed on the other side of the first circuit layer 420 and the second circuit layer 430 is disposed on the other side of the insulating layer 410.

[0017] This invention achieves double-sided welding by providing thermosetting adhesive 300, a first copper-clad laminate 400, a second copper-clad laminate 500, and a first via 600 on both sides of a copper hot plate 100. Compared to traditional copper substrates, this structure features symmetrical design. Multi-layer wiring can be achieved through the symmetrical first circuit layer 420 and second circuit layer 430 on all four sides. To ensure connectivity across these four circuit layers, a second via 700 is provided, penetrating the entire copper substrate and connecting the first circuit layer 420 and second circuit layer 430 on the first copper-clad laminate 400 and second copper-clad laminate 500. To prevent short circuits, resin 800 is placed within the second via 700.

[0018] To address the heat dissipation issue, we have installed heat dissipation bumps 200 on both the top and bottom surfaces of the copper heat plate 100, which enable efficient overall heat dissipation.

[0019] Compared with traditional technologies, this utility model features a four-layer circuit and high-density wiring design, which meets the requirements of dense circuit layout while utilizing the added heat dissipation bumps to achieve high thermal conductivity of the circuit board; double-sided soldering of electronic components meets the diverse design requirements of customers and is more practical.

[0020] The specific embodiments of this utility model have been described above, but this utility model is not limited thereto. Various changes can be made to this utility model as long as they do not depart from its spirit.

Claims

1. A four-layer thermoelectrically separated copper substrate, characterized in that, include: The copper heat sink (100), heat dissipation bumps (200), thermosetting adhesive (300), a first copper-clad laminate (400), a second copper-clad laminate (500), a first through hole (600), a second through hole (700), and resin (800) are provided. The copper heat sink (100) is provided with heat dissipation bumps (200), and the heat dissipation bumps (200) penetrate the thermosetting adhesive (300), the first copper-clad laminate (400), and the second copper-clad laminate (500). The top and bottom surfaces of the copper heat plate (100) are connected to the first copper clad laminate (400) and the second copper clad laminate (500) respectively by thermosetting adhesive (300). The first through hole (600) passes through the first copper clad laminate (400) and the second copper clad laminate (500) respectively. The second through hole (700) passes through the copper heat plate (100), the thermosetting adhesive (300), the first copper clad laminate (400) and the second copper clad laminate (500). The resin (800) is disposed in the second through hole (700). The first copper clad laminate (400) and the second copper clad laminate (500) have the same structure. The first copper clad laminate (400) includes an insulating layer (410), a first circuit layer (420) and a second circuit layer (430). The first circuit layer (420) is disposed on a thermosetting adhesive (300). An insulating layer (410) is disposed on the other side of the first circuit layer (420), and a second circuit layer (430) is disposed on the other side of the insulating layer (410).

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