Double-sleeve bubbling structure and wafer cleaning device

Abstract

The utility model provides a double-sleeve bubbling structure and a wafer cleaning device, the double-sleeve bubbling structure comprises a main pipe and a double-layer bubbling pipe, the double-layer bubbling pipe comprises an inner pipe and an outer pipe, the inner pipe is embedded in the outer pipe, and a gap is arranged between the inner pipe and the outer pipe; the main pipe is connected with the inner pipe; the two ends of the outer pipe are blocked, the inner pipe is provided with first bubbling holes, and the outer pipe is provided with second bubbling holes. By designing the double-layer bubbling pipe, the effect of uniform bubbling in the wafer cleaning tank is achieved, the gas consumption is reduced, the cleaning process time is shortened, the cleanliness of the wafer surface is improved, the structure is simple, installation is convenient, and the material and machining cost is low.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a double-tube bubbling structure and a wafer cleaning device. Background Technology

[0002] In semiconductor wet process equipment, the quality of the machine is mainly judged by the actual product yield, i.e., the cleanliness of the cleaning or the uniformity of the etching. Special gases are used in certain special solutions to further improve product quality, and the flow field is a key factor in determining the product yield. The flow field is divided into liquid flow field and gas flow field. The liquid flow field determines the quality of wafer etching. A good liquid flow field can uniformly control the overall flow direction of the solution, and in critical areas, it can stably guide contaminant particles or particles that may cause wafer contamination through overflow into the filtration system, achieving a complete removal of these particles from the wafer. It affects the uniformity of etching, the orientation of particles, and the utilization rate of the solution. The gas flow field determines the purity of wafer cleaning. Uniformly controlling the airflow direction of the machine guides all contaminant particles to the exhaust system, enabling the wafer to achieve a high-purity, high-efficiency cleaning effect.

[0003] In existing cleaning processes, such as Figure 1-3 As shown, existing technology involves laying a single-layer bubbling tube (12) at the bottom of a wafer cleaning tank (6). The single-layer bubbling tube has bubbling holes (11). Gas is introduced into the single-layer bubbling tube (12), and the gas is ejected from the bubbling holes (11), causing the cleaning agent in the tank (6) to swirl and boil, churning and washing the wafer. However, as... Figure 1 The single-layer bubbling tube structure shown has a single-layer bubbling tube (12) into which gas enters and then splits into two paths to enter the bubbling area where the bubbling hole exists. Under a certain pressure, the first bubbling area A that enters the entire pipe first releases pressure from the hole. Then, the gas that cannot be released rushes straight to the end of the pipe, i.e., the second bubbling area C, due to inertia. When neither the first nor the second bubbling areas A nor C can release gas, it is slowly released from the hole in the middle area B. This is the phenomenon we see in the tank where the bubbles are large at both ends and small in the middle, i.e., the problem of uneven bubbling. Utility Model Content

[0004] Based on the above, this utility model provides a double-tube bubbling structure and a wafer cleaning device, aiming to solve some problems existing in the bubbling tube structure in the prior art.

[0005] This utility model provides a double-tube bubbling structure, including a main tube and a double-layer bubbling tube. The double-layer bubbling tube includes an inner tube and an outer tube, with the inner tube embedded inside the outer tube and a gap between the inner tube and the outer tube.

[0006] The main tube connects to the inner tube; both ends of the outer tube are sealed, the inner tube has a first bubbling hole, and the outer tube has a second bubbling hole.

[0007] Furthermore, the bubbling directions of the first and second bubbling holes are opposite.

[0008] Furthermore, the bubbling structure includes at least two double-layered bubbling tubes;

[0009] The inner tube and the main tube in each double-layered bubbling tube are connected.

[0010] Furthermore, multiple double-layered bubbling tubes are arranged in parallel on a horizontal plane.

[0011] Furthermore, the first bubbling holes are evenly spaced on the inner tube.

[0012] Furthermore, the second bubbling holes are evenly spaced on the outer tube. Furthermore, the distance between two adjacent second bubbling holes is less than the distance between two adjacent first bubbling holes. Furthermore, the diameters of the first and second bubbling holes are the same. This utility model also provides a wafer cleaning apparatus, comprising:

[0013] Using the aforementioned double-tube bubbling structure;

[0014] The tank has an inlet pipe at the bottom, which is used to supply cleaning agent for wafer cleaning to the tank.

[0015] A wafer support is located above the liquid inlet pipe; the wafer support is used to support the wafer.

[0016] In the double-tube bubbling structure, the double-layer bubbling tube is set at the bottom of the tank, and external gas enters the double-layer bubbling tube from the main tube of the double-tube bubbling structure.

[0017] The beneficial technical effects of this utility model are as follows: By designing a double-layer bubbling tube, external gas enters the inner tube of the double-layer bubbling tube through the main pipe, and then the gas is released from the first bubbling hole into the gap between the inner and outer tubes. For the outer tube, the gas inside is relatively uniformly and smoothly filled in the gap between the inner and outer tubes, and there is no obvious pressure difference. That is, the inner tube buffers the gas inlet pressure and distributes it evenly inside the outer tube, so that the gas can be evenly released through the second bubbling hole of the outer tube, achieving a uniform bubbling effect in the wafer cleaning tank. It also reduces the amount of gas used, shortens the cleaning process time, and improves the cleanliness of the wafer surface. Moreover, the structure is simple, easy to install, and has low material and processing costs. Attached Figure Description

[0018] Figure 1-2 This is a schematic diagram of a bubble tube structure in the prior art;

[0019] Figure 3 A schematic diagram of a bubble tube structure in the prior art, showing that the bubble holes are larger at both ends and smaller in the middle.

[0020] Figure 4 This is a schematic diagram showing the uniform bubbling in the front, middle, and rear regions of a double-tube bubbling structure according to this utility model.

[0021] Figure 5 This is a schematic diagram of the overall structure of a double-tube bubbling structure according to the present invention;

[0022] Figure 6 This is a schematic cross-sectional view of a double-tube bubbling structure according to the present invention;

[0023] in,

[0024] 11-Single-layer bubbling hole; 12-Single-layer bubbling tube structure;

[0025] 1-Supervisor;

[0026] 2-Inner tube;

[0027] 3-Outer tube;

[0028] 4-First bubbling hole;

[0029] 5-Second bubbling hole;

[0030] 6- Tank body;

[0031] 7-Wafer;

[0032] 8-Double-layer bubbling tube. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0035] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0036] See Figure 4 This utility model provides a double-tube bubbling structure, including a main tube (1) and a double-layer bubbling tube (8). The double-layer bubbling tube includes an inner tube (2) and an outer tube (3). The inner tube (2) is embedded inside the outer tube (3), and there is a gap between the inner tube (2) and the outer tube (3).

[0037] The main tube (1) is connected to the inner tube (2); both ends of the outer tube (3) are sealed, the inner tube (2) has a first bubbling hole (4), and the outer tube (3) has a second bubbling hole (5).

[0038] A double-layer bubbling tube was designed to guide the gas flow within the cleaning agent during wafer cleaning. The outer tube is sealed at both ends. External gas enters the inner tube of the double-layer bubbling tube through the main pipe. The gas then diffuses from the first bubbling hole into the gap between the inner and outer tubes. Once completely filled, it is released from the second bubbling hole in the outer tube. For the outer tube, the gas is relatively evenly and smoothly filled throughout the gap between the inner and outer tubes, with no significant pressure difference. This means the inner tube buffers the gas inlet pressure and distributes it evenly inside the outer tube, allowing the gas to be released evenly through the second bubbling hole, achieving a uniform bubbling effect within the wafer cleaning tank.

[0039] Furthermore, the bubbling directions of the first bubbling hole (4) and the second bubbling hole (5) are opposite.

[0040] The opposite direction of bubbling makes the gas fill the gap between the outer and inner tubes more evenly and smoothly, thus buffering the gas and improving the uniformity of bubbling in various areas.

[0041] Specifically, in the double-layer bubbling tube (8), if the first bubbling hole (4) is located at the bottom of the inner tube (2), then the second bubbling hole (5) is located at the top of the outer tube (3). The first bubbling hole (4) bubbles downward and the second bubbling hole (5) bubbles upward, thus achieving opposite bubbling directions.

[0042] Specifically, in the double-layer bubbling tube, the first bubbling hole (4) is set at the top of the inner tube (2), and the second bubbling hole (5) is set at the bottom of the outer tube (3). The first bubbling hole (4) bubbles upward and the second bubbling hole (5) bubbles downward, so that the bubbling directions are opposite.

[0043] See Figure 5 Furthermore, the bubbling structure includes at least two double-layered bubbling tubes (8);

[0044] The inner tube (2) and the main tube (3) of each double-layered bubbling tube (8) are connected.

[0045] Furthermore, multiple double-layered bubbling tubes (8) are arranged in parallel on the horizontal plane.

[0046] The main pipe (1) and the double-layer bubbling tubes (8) are perpendicular, and the main pipe (1) delivers external gas to each double-layer bubbling tube. Furthermore, the first bubbling holes (4) are evenly spaced on the inner tube.

[0047] Furthermore, the second bubbling holes (5) are evenly spaced on the outer tube (3).

[0048] Setting the first bubbling hole (4) and the second bubbling hole (5) at equal intervals can achieve uniform bubbling.

[0049] Furthermore, the distance between two adjacent second bubble holes (5) is smaller than the distance between two adjacent first bubble holes (4).

[0050] Specifically, for a double-layered bubbling tube (8), the distance between two adjacent first bubbling holes (4) is 60mm. For example, six first bubbling holes are made in the inner tube with a distance of 60mm.

[0051] Specifically, for a double-layer bubbling tube (8), the distance between two adjacent second bubbling holes (5) is 15mm. For example, 25 second bubbling holes are made in the outer tube with a distance of 15mm.

[0052] The distance between two adjacent second bubble holes (5) is smaller than the distance between two adjacent first bubble holes (4). That is, on the double-layer bubble tube (8), the number of first bubble holes (4) is less and the number of second bubble holes (5) is more. The number of holes in the inner tube is less and evenly distributed, which further buffers the gas intake pressure and evenly distributes it to the inside of the outer tube, thereby achieving the effect of uniform bubbling in the tank.

[0053] Furthermore, the first bubbling hole (4) and the second bubbling hole (5) have the same diameter.

[0054] Specifically, the diameter of the first bubbling hole (4) and the second bubbling hole (5) is 1.5 mm.

[0055] See Figure 6 Specifically, the inner tube (2) and outer tube (3) of the double-layer bubbling tube (8) are on the same central axis.

[0056] See Figure 4 This utility model also provides a wafer cleaning device, comprising:

[0057] Using the aforementioned double-tube bubbling structure (2);

[0058] The tank (6) has an inlet pipe at the bottom, which is used to supply cleaning agent for cleaning wafers (7) to the tank.

[0059] A wafer support is located above the liquid inlet pipe; the wafer support is used to support the wafer.

[0060] The double-layer bubbling tube (8) in the double-tube bubbling structure is set at the bottom of the tank (46), and the external gas enters the inner tube (2) of the double-layer bubbling tube (8) from the main tube (1) of the double-tube bubbling structure.

[0061] The tank, inlet pipe, wafer tray, etc. are existing technologies and will not be described in detail here.

[0062] Specifically, the gas is nitrogen. The gas enters through the first bubbling hole of the inner tube, filling the gap between the inner and outer tubes, and is then released through the second bubbling hole of the outer tube.

[0063] This invention compares and tests the existing bubbling tube with the newly constructed double-layer bubbling tube. Tests were conducted on the existing bubbling tube structure, including N2 flow rate, the number of contaminant particles on the wafer surface over a specified time, the time required to maintain the required number of contaminant particles, and N2 pipeline pressure. The results were then compared to those of the newly constructed double-layer bubbling tube under the same conditions. The comparisons revealed that the newly constructed double-layer bubbling tube effectively reduces process time, improves process stability, achieves higher wafer surface cleanliness, and reduces N2 usage, significantly lowering costs and increasing efficiency.

[0064] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A double-sleeve bubbling structure, characterized in that, It includes a main tube and a double-layer bubbling tube, wherein the double-layer bubbling tube includes an inner tube and an outer tube, the inner tube is embedded inside the outer tube, and there is a gap between the inner tube and the outer tube; The main tube is connected to the inner tube; both ends of the outer tube are sealed, the inner tube has a first bubbling hole, and the outer tube has a second bubbling hole; The first bubbling holes are evenly spaced on the inner tube; The second bubbling holes are evenly spaced on the outer tube.

2. The double-tube bubbling structure as described in claim 1, characterized in that, The bubbling directions of the first bubbling hole and the second bubbling hole are opposite.

3. The double-tube bubbling structure as described in claim 1, characterized in that, The bubbling structure includes at least two of the double-layered bubbling tubes; The inner tube of each of the double-layered bubbling tubes is connected to the main tube.

4. The double-tube bubbling structure as described in claim 3, characterized in that, Multiple double-layer bubbling tubes are arranged in parallel on a horizontal plane.

5. The double-sleeve bubbling structure as described in claim 1, characterized in that, The distance between two adjacent second bubbling holes is less than the distance between two adjacent first bubbling holes.

6. The double-sleeve bubbling structure as described in claim 1, characterized in that, The first bubbling hole and the second bubbling hole have the same diameter.

7. A wafer cleaning apparatus, characterized in that, include: Using a double-sleeve bubbling structure as described in any one of claims 1-6; The tank body has an inlet pipe at the bottom, which is used to supply cleaning agent for wafer cleaning to the tank body; A wafer support is provided above the liquid inlet pipe, and the wafer support is used to support the wafer; The double-layer bubbling tube in the double-tube bubbling structure is located at the bottom of the tank, and external gas enters the double-layer bubbling tube from the main tube of the double-tube bubbling structure.

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