Removing device
By introducing a rejection device that combines vacuum adsorption and ultrasonic detection into the silicon wafer transport system, the problem of equipment instability caused by overlapping silicon wafers was solved, achieving efficient and safe dual-wafer rejection and improving production efficiency and product quality.
Patent Information
- Application Number
- CN202520201876.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-08
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-02-08
AI Technical Summary
Existing technologies suffer from low efficiency, high manpower consumption, unstable equipment operation, and high costs when eliminating overlapping silicon wafers.
The device employs a rejection system comprising a first transmission module, a second transmission module, a receiving station, a rejection mechanism, and an inspection mechanism. It utilizes a vacuum generator and ultrasonic sensors to inspect silicon wafers and automatically rejects heavy and thick wafers through vacuum suction holes and a conveyor belt.
It enables efficient and safe removal of dual silicon wafers, ensures stable operation of the sorting machine, reduces equipment downtime, increases production capacity and yield, saves manpower and reduces equipment costs.
Smart Images
Figure CN223832890U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of photovoltaic monocrystalline silicon wafer production, and in particular to a rejection device. Background Technology
[0002] After silicon wafers are inserted into the basket, two wafers may end up in the same compartment. When the cleaning machine finishes cleaning, the sorting machine will remove both wafers simultaneously. This simultaneous transfer of the two wafers within the sorting machine can disrupt its operation, leading to issues such as card jams, broken wafers, misjudgments, wafer collisions during insertion, and machine shutdowns. Therefore, it is necessary to remove overlapping wafers. The main removal methods used in the industry are as follows:
[0003] 1. After the impact of the impact, manual cleaning and tidying are carried out. However, this method is inefficient and waiting for the equipment to stop before processing will result in waiting time, which will affect the normal operation of the equipment.
[0004] 2. After personnel discover the problem, they use tweezers to extract the fragments. However, although this method is very effective, the force of the tweezers is difficult to control, which can easily cause fragments or pieces to break. Furthermore, it requires a lot of manpower and is not practical.
[0005] 3. Using a custom material box for receiving materials, however, the entry of two pieces into the machine will cause unknown malfunctions, and the existing feeding mechanism cannot control the entry posture of the two pieces into the box, so after entering the material box, it will cause cards, broken pieces, and missing corners.
[0006] 4. The thickness of the silicon wafer under inspection is determined by taking pictures with a camera and measuring the size with a laser rangefinder, thereby determining whether there are duplicate wafers or thick wafers. Generally, wafers that are completely overlapping are detected by a laser rangefinder, while wafers that are not completely overlapping are detected by taking pictures with a camera to determine the size of the wafers to determine whether there are multiple wafers. Usually, both methods need to be used at the same time. However, this results in high equipment usage and maintenance costs. Utility Model Content
[0007] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a rejection device that saves manpower and has high rejection efficiency.
[0008] The technical solution adopted by this utility model is as follows: This utility model includes a first transmission module and a second transmission module, a receiving station is provided between the first transmission module and the second transmission module, a rejection mechanism is provided above the receiving station, the two ends of the rejection mechanism are respectively connected to the first transmission module and the second transmission module, a detection mechanism is provided on the first transmission module, the rejection mechanism includes a third transmission module and a vacuum generator, the third transmission module includes a conveyor belt, the conveyor belt is connected to the vacuum generator, and the conveyor belt has multiple vacuum adsorption holes.
[0009] Furthermore, a receiving box is provided at the receiving station.
[0010] Furthermore, the detection mechanism includes an ultrasonic sensor.
[0011] Furthermore, both the first transmission module and the second transmission module rotate in the first direction, and the conveyor belt rotates in the second direction.
[0012] Furthermore, the two ends of the conveyor belt are located on the first transmission module and the second transmission module, respectively.
[0013] Furthermore, an electromagnetic valve is connected between the conveyor belt and the vacuum generator.
[0014] Furthermore, the number of solenoid valves is two.
[0015] Furthermore, the third transmission module includes a mounting base, on which both the conveyor belt and the vacuum generator are mounted.
[0016] Furthermore, the mounting base has an observation hole located above the receiving station.
[0017] Furthermore, multiple vacuum adsorption holes are formed on the inner and outer sides of the conveyor belt.
[0018] The beneficial effects of this utility model are:
[0019] Compared with the shortcomings of the existing technology, this utility model can prevent double wafers from entering the sorting machine while saving manpower, ensuring the stable operation of the sorting machine. Moreover, the double silicon wafers can be reused after rewashing. It has the advantages of efficient rejection, safety and environmental protection and high degree of automation. It avoids sorting card and wafer collision, effectively ensuring the stable operation of the sorting machine, thereby reducing equipment downtime and improving the production capacity and yield of monocrystalline silicon wafers. This utility model has the advantages of saving manpower and high rejection efficiency. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0021] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;
[0022] Figure 2 This is a schematic diagram of the planar structure of this utility model.
[0023] The attached figures are labeled as follows:
[0024] 1. First transmission module; 2. Second transmission module; 3. Receiving station; 5. Rejection mechanism; 6. Detection mechanism; 7. Third transmission module; 8. Vacuum generator; 9. Conveyor belt; 10. Vacuum adsorption hole; 11. Receiving box; 12. Ultrasonic sensor; 13. Solenoid valve; 15. Mounting base; 16. Observation hole.
[0025] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0027] It should be noted that all directional indicators in this utility model embodiment, such as up, down, left, right, front, back, clockwise, counterclockwise, etc., are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indicator will also change accordingly.
[0028] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.
[0029] like Figures 1 to 2As shown, in this embodiment, the present invention includes a first transmission module 1 and a second transmission module 2. A receiving station 3 is provided between the first transmission module 1 and the second transmission module 2. A rejection mechanism 5 is provided above the receiving station 3. The two ends of the rejection mechanism 5 are respectively connected to the first transmission module 1 and the second transmission module 2. A detection mechanism 6 is provided on the first transmission module 1. The rejection mechanism 5 includes a third transmission module 7 and a vacuum generator 8. The third transmission module 7 includes a conveyor belt 9, which is connected to the vacuum generator 8. The conveyor belt 9 has multiple vacuum adsorption holes 10. Due to the action of the vacuum generator 8, the conveyor belt 9 can adsorb the silicon wafers located on the first transmission module 1 through the vacuum adsorption holes 10.
[0030] Specifically, the rejection device is installed at the feeding end of the sorting machine. After the silicon wafers in the basket are taken out by the wafer picker, they are transported by the first transmission module 1 at a speed of 800mm / s-1800mm / s. At the same time, the conveyor belt 9 maintains a negative pressure transmission state and rotates counterclockwise at a speed of 800mm / s-1800mm / s, and the speed cannot exceed the rotation speed of the second transmission module 2, which rotates clockwise. When the detection mechanism 6 on the first transmission module 1 detects that the silicon wafer is a single wafer, the wafer will be adsorbed and transported to the second transmission module 2 by the conveyor belt 9. When the detection mechanism 6 detects that the silicon wafer is a heavy or thick wafer, the wafer will be adsorbed and transported to the top of the receiving station 3 by the conveyor belt 9, so that the overlapping wafers can fall into the receiving station 3.
[0031] Compared with the shortcomings of the existing technology, this utility model can prevent double wafers from entering the sorting machine while saving manpower, ensuring the stable operation of the sorting machine. Moreover, the double silicon wafers can be reused after rewashing. It has the advantages of efficient rejection, safety and environmental protection and high degree of automation. It avoids sorting card and wafer collision, effectively ensuring the stable operation of the sorting machine, thereby reducing equipment downtime and improving the production capacity and yield of monocrystalline silicon wafers. This utility model has the advantages of saving manpower and high rejection efficiency.
[0032] In some embodiments, the detection mechanism 6 includes two ultrasonic sensors 12, one for transmitting signals and the other for receiving signals. Specifically, when the silicon wafers are transported by the first transmission module 1, they are detected using a non-contact ultrasonic method. The fluctuation of the sound waves is used to determine whether the wafers overlap, thus avoiding the collision of wafers inside the machine. After the double wafers are rejected, they can be rewashed and re-sorted, reducing the product damage rate. Furthermore, there is no need to use a high-precision laser rangefinder and camera to detect dimensions, significantly reducing equipment operating and maintenance costs.
[0033] In some embodiments, the first transmission module 1 and the second transmission module 2 both rotate in a first direction, and the conveyor belt 9 rotates in a second direction; the two ends of the conveyor belt 9 are respectively located on the first transmission module 1 and the second transmission module 2.
[0034] In some embodiments, a solenoid valve 13 is connected between the conveyor belt 9 and the vacuum generator 8; there are two solenoid valves 13; and a receiving box 11 is provided on the receiving station 3. Specifically, if the determination result is a heavy wafer or an extra-thick wafer, one solenoid valve 13 will be closed and the other solenoid valve will be opened, and the silicon wafer will fall freely into the receiving box 11, and air will be blown to ensure stable falling into the box.
[0035] In some embodiments, the third transmission module 7 includes a mounting base 15, on which the conveyor belt 9 and the vacuum generator 8 are both mounted; the mounting base 15 has an observation hole 16 located above the receiving station 3; and a plurality of vacuum adsorption holes 10 are located on the inner and outer sides of the conveyor belt 9.
[0036] The testing process for this utility model is as follows:
[0037] After the silicon wafer is removed from the wafer picker, it is transferred to the first transfer module 1 and detected by the ultrasonic sensor 12. Furthermore, the vacuum generator 8 opens under negative pressure, allowing the conveyor belt 9 to adsorb the silicon wafer through the vacuum adsorption hole 10.
[0038] When the test result is a single wafer, the vacuum generator 8 continues to apply negative pressure, so that the conveyor belt 9 can continue to adsorb the silicon wafer through the vacuum adsorption hole 10 and transport it to the second transmission module 2.
[0039] When the test result indicates a heavy or thick wafer, the vacuum generator 8 stops the negative pressure state and blows air, allowing the silicon wafer to fall into the receiving box 11.
[0040] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A rejection device, characterized in that: It includes a first transmission module (1) and a second transmission module (2), a receiving station (3) is provided between the first transmission module (1) and the second transmission module (2), a rejection mechanism (5) is provided above the receiving station (3), the two ends of the rejection mechanism (5) are respectively connected to the first transmission module (1) and the second transmission module (2), a detection mechanism (6) is provided on the first transmission module (1), the rejection mechanism (5) includes a third transmission module (7) and a vacuum generator (8), the third transmission module (7) includes a conveyor belt (9), the conveyor belt (9) is connected to the vacuum generator (8), and multiple vacuum adsorption holes (10) are opened on the conveyor belt (9).
2. The rejection device according to claim 1, characterized in that: The receiving station (3) is equipped with a receiving box (11).
3. The rejection device according to claim 1, characterized in that: The detection mechanism (6) includes an ultrasonic sensor (12).
4. A rejection device according to any one of claims 1-3, characterized in that: The first transmission module (1) and the second transmission module (2) both rotate in the first direction, and the conveyor belt (9) rotates in the second direction.
5. The rejection device according to claim 4, characterized in that: The two ends of the conveyor belt (9) are located on the first transmission module (1) and the second transmission module (2), respectively.
6. The rejection device according to claim 5, characterized in that: A solenoid valve (13) is connected between the conveyor belt (9) and the vacuum generator (8).
7. The rejection device according to claim 6, characterized in that: The number of solenoid valves (13) is two.
8. The rejection device according to claim 4, characterized in that: The third transmission module (7) includes a mounting base (15), and the conveyor belt (9) and the vacuum generator (8) are both mounted on the mounting base (15).
9. A rejection device according to claim 8, characterized in that: The mounting base (15) has an observation hole (16) located above the receiving station (3).
10. A rejection device according to claim 1, characterized in that: Multiple vacuum adsorption holes (10) are provided on the inner and outer sides of the conveyor belt (9).