Composite structure for wafer grinding and delaminating and forming auxiliary tool thereof

Abstract

The utility model discloses a combined structure for wafer grinding and delaminating and a forming auxiliary tool thereof, which belong to the technical field of wafer grinding and delaminating and comprise a wafer sample and a wafer carrier plate easy to hold, and the wafer sample is adhered on the surface of one side of the wafer carrier plate. The wafer sample grinding device has the advantages that a wafer sample is adhered to the surface of one side of the wafer carrying disc, the wafer sample is held on the wafer carrying disc during grinding and layer removing, controllability during grinding is improved, and grinding is smoother.

Description

Technical Field

[0001] This utility model relates to the field of wafer grinding and delamination technology, and more specifically, to a combined structure for wafer grinding and delamination and its forming auxiliary tool. Background Technology

[0002] After locating the electrical failure point in the fault analysis, further physicochemical delamination analysis is performed on the detected abnormal areas. This process typically involves manual, step-by-step acid etching and manual grinding and polishing to allow for layer-by-layer observation of the abnormal areas.

[0003] When grinding and delaminating tall and thin driver ICs on a grinding turntable, the IC is often prone to tumbling due to the sample's height and small contact area, and may also cause the sample to bounce or break.

[0004] In view of this, the inventors conducted in-depth research to address this need, which led to the present invention. Utility Model Content

[0005] To address the problems in existing technologies where wafer samples are prone to tumbling during grinding and delamination, potentially leading to sample ejection or breakage, this invention provides a combined structure and its forming auxiliary tool for wafer grinding and delamination. By smoothly adhering the wafer to be ground and delaminated onto an easily held grinding carrier, it increases controllability during grinding, making the process smoother and preventing sample ejection. It also reduces the likelihood of rapid delamination at the sample edges, effectively improving sample preparation efficiency and execution quality. The specific technical solution is as follows:

[0006] A composite structure for wafer polishing and delamination includes a wafer sample and an easy-to-grip wafer carrier, wherein the wafer sample is adhered to one side surface of the wafer carrier. Adhering the wafer sample to one side surface of the wafer carrier allows it to be held on the wafer carrier during polishing and delamination, increasing control during the polishing process and making polishing more convenient.

[0007] Here, hot melt wax is preferably used as an adhesive, that is, the wafer sample is adhered to one side of the wafer carrier by hot melt wax. Taking advantage of the characteristics of hot melt wax, which has a low melting point, is easy to melt when heated, and solidifies after cooling, the wafer sample can be easily adhered to the wafer carrier.

[0008] In a preferred embodiment, a holding portion is provided on the surface of the wafer carrier away from the wafer sample.

[0009] In a preferred embodiment, the wafer carrier has two or more protrusions on the surface away from the wafer sample, and the protrusions form the gripping portion on the wafer carrier.

[0010] In a preferred embodiment, the two protrusions are arc-shaped blocks symmetrically arranged on the wafer carrier.

[0011] After adopting the above technical solution, the hand can directly hold the wafer on the holding part during the grinding and delamination process. The arc-shaped block design makes it easy to hold the wafer carrier and grind the wafer sample from different angles. The structure is simple and the operation is convenient.

[0012] In a preferred embodiment, the wafer carrier is a disk, and the outer edge of the disk is provided with the protrusion along its circumference, and the protrusion coincides with the axis of the wafer carrier.

[0013] In a preferred embodiment, the surface of the protrusion near the outer edge of the wafer carrier is flush with the outer edge of the wafer carrier, and its curvature is 75-120°, preferably 90°.

[0014] The raised block here is designed in an arc shape. When the hand holds and grinds, the two ends of the arc can provide support and restraint, which is better than the ring-shaped design. However, the ring-shaped design can also achieve the effect of easy grip.

[0015] In order to enable the above-mentioned combined structure to be formed, the present invention also provides a forming auxiliary tool for the above-mentioned wafer grinding and delamination combined structure, including a base and a top cover. A blocking block for preventing the top cover from continuing to press down is provided on one side surface of the base, and a forming space for forming the combined structure is surrounded by the blocking block. The top cover has a lower surface that can cover all the blocking blocks on the base.

[0016] In a preferred embodiment, the lower surface of the top cover is flat, and the height of the blocking block is greater than the overall thickness of the wafer carrier.

[0017] In a preferred embodiment, the height of the blocking block differs from the overall thickness of the wafer carrier by 1.0-3.0 mm. This allows space for the wafer sample and adhesive, enabling the adhesive to adhere to the wafer carrier surface under the pressure of the upper surface of the base and the top cover.

[0018] The beneficial effects of adopting the technical solution of this utility model are as follows:

[0019] (1) The wafer sample is adhered to one side of the wafer carrier by hot melt wax. During the grinding and delamination process, it is held on the wafer carrier, which increases the control during grinding and makes grinding easier.

[0020] (2) Due to better grip, the wafer sample will not fly away during grinding, and the sample edge is less likely to generate layer difference phenomenon quickly, thus effectively improving the sample preparation efficiency and execution quality. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a preferred assembly structure for wafer grinding and delamination according to the present invention;

[0023] Figure 2 This is a top view schematic diagram of the preferred wafer carrier structure of this utility model;

[0024] Figure 3 This is the preferred molding auxiliary operation step one of this utility model;

[0025] Figure 4 This is the second preferred molding auxiliary operation step of this utility model;

[0026] Figure 5 This is the third preferred molding auxiliary operation step of this utility model. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0028] See Figure 1-2 The wafer polishing and delamination assembly 100 includes a wafer sample 101 and an easy-to-grip wafer carrier 102, wherein the wafer sample 101 is adhered to one side surface of the wafer carrier 102. Adhering the wafer sample to one side surface of the wafer carrier allows it to be held on the wafer carrier during polishing and delamination, increasing control during polishing and making the process more convenient.

[0029] Here, hot melt wax 103 is preferably used as the adhesive. The wafer sample is adhered to one side of the wafer carrier surface by hot melt wax 103. The characteristics of hot melt wax, such as low melting point, easy melting when heated and solidification after cooling, make it easy for the wafer sample to adhere to the wafer carrier. Of course, in actual operation, other adhesives with the above characteristics can also be considered, namely low melting point adhesives. They need to be solids with a certain hardness at room temperature so that the wafer sample can adhere more firmly to the surface of the wafer carrier. They also need to melt at a temperature higher than room temperature, but not too high, such as below 100°C, that is, with a low melting point.

[0030] In a preferred embodiment, a gripping portion 104 is provided on the surface of the wafer carrier 102 away from the wafer sample 101. The gripping portion can have any structure, as long as it is easy to grip. It can be an integral structure with the wafer carrier or a structure fixed to the wafer carrier.

[0031] In a preferred embodiment, the wafer carrier 102 has two or more protrusions on the surface away from the wafer sample 101, and the protrusions form the gripping portion 104 on the wafer carrier 102.

[0032] In a preferred embodiment, the two protrusions are symmetrically arranged arc-shaped blocks on the wafer carrier 102. With this technical solution, during grinding and delamination, the hand can directly hold the wafer on the gripping part. The arc-shaped block design facilitates holding the wafer carrier and grinding the wafer sample from different angles, resulting in a simple structure and convenient operation.

[0033] In a preferred embodiment, the wafer carrier 102 is a disk, and the outer edge of the disk is provided with the protrusion along its circumferential direction, and the protrusion coincides with the axis of the wafer carrier 102.

[0034] In a preferred embodiment, the surface of the protrusion near the outer edge of the wafer carrier 102 is flush with the outer edge of the wafer carrier 102, and its curvature is 75-120°, preferably 90°.

[0035] The raised block here is designed in an arc shape. When the hand holds and grinds, the two ends of the arc can provide support and restraint, which is better than the ring-shaped design. However, the ring-shaped design can also achieve the effect of easy grip.

[0036] To enable the above-described composite structure to be formed, this embodiment also provides a forming auxiliary tool for the above-described wafer grinding and delamination composite structure, such as... Figure 4 and 5As shown, the structure includes a base 200 and a top cover 300. The base 200 has a blocking block 201 on one side surface to prevent the top cover 300 from pressing down further, and a forming space 202 formed by the blocking block 201 for forming the combined structure 100. The top cover 300 has a lower surface 301 that can cover all the blocking blocks 201 on the base 200.

[0037] In a preferred embodiment, the lower surface of the top cover 300 is a plane, and the height of the blocking block 201 is greater than the overall thickness of the wafer carrier 102. Here, the overall thickness refers to the thickness including the gripping part. When the top cover is not pressed down, the overall thickness of the combined structure formed by the wafer sample 101 adhering to one side surface of the wafer carrier 102 is greater than the height of the blocking block 201. In this way, the adhesive will deform under pressure when the top cover 300 is pressed down.

[0038] In a preferred embodiment, the height difference between the blocking block 201 and the overall thickness of the wafer carrier 102 is 1.0-3.0 mm. This allows space for the wafer sample and adhesive, enabling the adhesive to adhere to the wafer carrier surface under the pressure of the upper surface of the base and the top cover.

[0039] Specifically, the forming steps for the combined structure used in wafer grinding and delamination are as follows:

[0040] Step 1: Prepare the wafer carrier 102 and place an appropriate amount of hot melt wax 103 on its surface. Adhere the wafer sample 101 to be delaminated onto the surface of the hot melt wax 103. Figure 3 As shown;

[0041] Step two, place the combined structure 100 obtained in step one upside down into the molding space 202 of the preheated base 200, as shown. Figure 4 As shown, the base is preferably made of metal.

[0042] Step 3: Slowly cover the top with the upper cover 300, allowing the hot melt wax 103 to deform slowly due to compression, embedding the wafer sample 101 and forming a certain thickness, such as... Figure 5 As shown;

[0043] Step 4: Remove the top cover, take out the assembly structure 100, and perform grinding, delamination, and analysis.

[0044] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A composite structure for wafer grinding and delamination, characterized in that, Includes a wafer sample and an easy-to-grip wafer carrier, wherein the wafer sample is adhered to one side surface of the wafer carrier; The wafer sample is adhered to one side of the wafer carrier by hot melt wax; a holding part is provided on the surface of the wafer carrier away from the wafer sample.

2. The composite structure for wafer grinding and delamination according to claim 1, characterized in that, The wafer carrier has two or more protrusions on the side of the wafer sample away from the wafer sample, and the protrusions form the gripping portion on the wafer carrier.

3. The composite structure for wafer grinding and delamination according to claim 2, characterized in that, The two protrusions are symmetrically arranged arc-shaped blocks on the wafer carrier.

4. The composite structure for wafer grinding and delamination according to claim 3, characterized in that, The wafer carrier is a disc, and the outer edge of the disc is provided with the protrusion along its circumference, and the protrusion coincides with the axis of the wafer carrier.

5. The composite structure for wafer grinding and delamination according to claim 4, characterized in that, The surface of the protrusion near the outer edge of the wafer carrier is flush with the outer edge of the wafer carrier, and its curvature is 75-120°.

6. A forming auxiliary tool with a combined structure for wafer grinding and delamination as described in any one of claims 1-5, characterized in that, The assembly includes a base and a top cover. One side surface of the base is provided with a blocking block for preventing the top cover from pressing down further, and a molding space enclosed by the blocking block for shaping the combined structure. The top cover has a lower surface that can cover all the blocking blocks on the base.

7. The forming auxiliary tool with a combined structure for wafer grinding and delamination according to claim 6, characterized in that, The lower surface of the upper cover is flat, and the height of the blocking block is greater than the overall thickness of the wafer carrier.

8. The forming auxiliary tool with a combined structure for wafer grinding and delamination according to claim 7, characterized in that, The difference between the height of the blocking block and the overall thickness of the wafer carrier is 1.0-3.0 mm.

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