Motor controller and electric vehicle
By separately packaging SiC MOSFETs and Si IGBT power units, and combining them with copper busbars and driver chip circuits, the reliability problem in the motor controller was solved, achieving higher reliability and performance.
Patent Information
- Application Number
- CN202520367536.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-03-04
AI Technical Summary
The existing parallel hybrid scheme of Si IGBT and SiC MOSFET in motor controllers suffers from poor wafer packaging yield and consistency, leading to reduced reliability.
Power units that separately package SiC MOSFETs and Si IGBTs are used and connected to a heat sink substrate via copper busbars. Combined with driver chip circuits and amplifier circuits, independent control and amplification of the drive signal are achieved.
This improves the reliability of the motor controller, avoids the impact of differences in wafer integration processes on reliability, and enhances the overall performance of the motor controller.
Smart Images
Figure CN223844041U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of vehicle technology, and in particular to a motor controller and an electric vehicle. Background Technology
[0002] With the rapid development of vehicle technology, electric vehicles are becoming increasingly popular to meet people's demands for energy conservation and environmental protection. Among them, the motor controller, as an important component of electric vehicles, is responsible for converting the electrical energy stored in the power battery into the electrical energy required to drive the motor based on commands such as gear selection, throttle, and braking, thereby controlling the driving state of the electric vehicle.
[0003] To improve the performance of motor controllers, a hybrid parallel scheme combining silicon insulated gate bipolar transistors (Si IGBTs) and silicon carbide metal-oxide-semiconductor field-effect transistors (SiC MOSFETs) has been proposed. However, in related technologies, the hybrid parallel scheme for motor controllers typically involves co-packaging the Si IGBTs and SiC MOSFETs. Due to differences in the wafer integration processes of Si IGBTs and SiC MOSFETs, co-packaging leads to issues such as poor wafer packaging yield and inconsistency, thereby reducing the reliability of the motor controller. Utility Model Content
[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a motor controller and an electric vehicle that can improve the reliability of the motor controller.
[0005] In a first aspect, embodiments of this application provide a motor controller, characterized in that it includes:
[0006] Heat dissipation substrate;
[0007] A power module is disposed on the heat dissipation substrate. The power module includes at least one first power unit and at least one second power unit. The first power unit is a power unit formed by packaging a silicon carbide metal oxide semiconductor field-effect transistor, and the second power unit is a power unit formed by packaging a silicon insulated gate bipolar transistor.
[0008] A copper busbar, which is connected to the at least one first power unit and the at least one second power unit.
[0009] In some embodiments, the characteristic is that,
[0010] The copper busbar is a laminated busbar; and / or,
[0011] The power module is soldered to the heat dissipation substrate by silver sintering; and / or
[0012] The first power unit and the second power unit are laser-welded onto the copper busbar.
[0013] In some embodiments, the motor controller further includes:
[0014] A driver board, the driver board being connected to the at least one first power unit and the at least one second power unit;
[0015] A driver chip circuit is provided, which is connected to each of the first power units and each of the second power units via the driver board. The driver chip circuit is used to generate a first drive signal and a second drive signal. The first drive signal is used to drive the first power unit, and the second drive signal is used to drive the second power unit.
[0016] In some embodiments, the driver chip circuit includes:
[0017] Control logic module;
[0018] A first drive signal output module, wherein the input terminal of the first drive signal output module is connected to the first output terminal of the control logic module, and the output terminal of the first drive signal output module is connected to the first power unit, and the first drive signal output module is used to convert the electrical signal output by the control logic module into the first drive signal;
[0019] The second drive signal output module has its input terminal connected to the second output terminal of the control logic module, and its output terminal connected to the second power unit. The second drive signal output module is used to convert the electrical signal output by the control logic module into the second drive signal.
[0020] In some implementations, the control terminal of the first drive signal output module is connected to a first power supply, and the control terminal of the second drive signal output module is connected to a second power supply, which is different from the first power supply.
[0021] In some embodiments, the motor controller further includes:
[0022] An amplifier circuit is connected between the driver chip circuit, the first power unit, and the second power unit, and the amplifier circuit is used to amplify the first drive signal and the second drive signal.
[0023] In some embodiments, the amplification circuit includes:
[0024] A first amplifier sub-circuit is connected to the driver chip circuit and the first power unit.
[0025] The second amplifier sub-circuit is connected to the driver chip circuit and the second power unit.
[0026] In some embodiments, at least one of the first amplifying sub-circuit and the second amplifying sub-circuit includes:
[0027] The PMOS transistor has its gate connected to the driver chip circuit, its source connected to a third power supply, and its drain connected to the corresponding power unit.
[0028] The NMOS transistor has its gate connected to the driving chip circuit, its source connected to the fourth power supply, and its drain connected in parallel with the drain of the PMOS transistor to the corresponding power unit.
[0029] In some embodiments, both the first amplification sub-circuit and the second amplification sub-circuit include the PMOS transistor and the NMOS transistor, and the source of the PMOS transistor in the first amplification sub-circuit is connected to the second power supply, while the source of the PMOS transistor in the second amplification sub-circuit is connected to the first power supply.
[0030] Secondly, embodiments of this application also provide an electric vehicle, including the motor controller as described in the first aspect.
[0031] In this embodiment, the motor controller includes a heat sink substrate, a power module, and a copper busbar. The power module is disposed on the heat sink substrate and includes at least one first power unit and at least one second power unit. The first power unit is a power unit formed by packaging a SiC MOSFET, and the second power unit is a power unit formed by packaging a SiIGBT. The copper busbar is connected to the at least one first power unit and the at least one second power unit. Thus, since the first and second power units in the power module of the motor controller are separately packaged and disposed on the copper busbar and the heat sink substrate, compared to the traditional co-packaging method, the differences in wafer integration processes between SiC MOSFETs and Si IGBTs can be avoided, thus preventing the impact on the reliability of the motor controller and improving its reliability.
[0032] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0033] Figure 1 This is a schematic diagram of the structure of the motor controller provided in the embodiment of this application;
[0034] Figure 2 This is an exploded view of the motor controller provided in an embodiment of this application;
[0035] Figure 3 This is a schematic diagram of the power module provided in the embodiments of this application;
[0036] Figure 4 This is a schematic diagram of the power module disposed on the copper busbar according to an embodiment of this application;
[0037] Figure 5 This is a partial circuit diagram of the motor controller provided in the embodiments of this application. Detailed Implementation
[0038] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.
[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.
[0040] Please refer to the following at the same time Figures 1 to 4 This application provides a motor controller 100, which includes:
[0041] Heat dissipation substrate 10;
[0042] The power module 20 is disposed on the heat dissipation substrate 10. The power module 20 includes at least one first power unit 21 and at least one second power unit 22. The first power unit 21 is a power unit formed by packaging a silicon carbide metal oxide semiconductor field-effect transistor (i.e., SiC MOSFET), and the second power unit 22 is a power unit formed by packaging a silicon insulated gate bipolar transistor (i.e., Si IGBT).
[0043] A copper busbar 30 is connected to at least one first power unit 21 and at least one second power unit 22.
[0044] In this embodiment, the motor controller 100 includes a heat dissipation substrate 10, a power module 20, and a copper busbar 30. The power module 20 is disposed on the heat dissipation substrate 10 and includes at least one first power unit 21 and at least one second power unit 22. The first power unit 21 is a power unit formed by packaging a SiC MOSFET, and the second power unit 22 is a power unit formed by packaging a Si IGBT. The copper busbar 30 is connected to at least one first power unit 21 and at least one second power unit 22. Thus, since the first power unit 21 and the second power unit 22 in the power module 20 of the motor controller 100 are separately packaged and disposed on the copper busbar 30 and the heat dissipation substrate 10, compared with the traditional encapsulation method, the differences between SiC MOSFETs and Si IGBTs in wafer integration processes can be avoided, thus preventing the impact on the reliability of the motor controller 100 and improving the reliability of the motor controller 100.
[0045] It should be noted that the "connection" mentioned in the embodiments of this application can refer to a physical structural connection or an electrical connection, and is not limited here.
[0046] The aforementioned heat dissipation substrate 10 can be any structure capable of dissipating heat from the power module 20 disposed thereon. Specifically, the aforementioned heat dissipation substrate 10 can be a water-cooled substrate, or it can be a graphene substrate, etc.
[0047] The power module 20 is disposed on the heat dissipation substrate 10, which can be achieved by soldering each power unit (including the first power unit 21 and the second power unit 22) in the power module 20 onto the heat dissipation substrate 10. For example, the power module 20 can be disposed on the heat dissipation substrate 10 by reflow soldering.
[0048] In some embodiments, the power module 20 may be silver-sintered onto the heat sink substrate 10. Since sintering requires both heating and pressurization compared to reflow soldering which only requires heating, the soldering quality is higher and the soldering consistency is better, thereby further improving the reliability of the motor controller 100.
[0049] The number of first power units 21 and second power units 22 included in the power module 20 can be set according to the power requirements of the motor controller 100, and are not limited here. For example, Figure 2 As shown, the power module 20 may be configured to include one first power unit 21 and two second power units 22; or, the power module 20 may be configured to include two first power units 21 and two second power units 22, etc., and is not limited here.
[0050] It should be noted that the motor controller 100 may include at least one power module 20, where each power module 20 is either the upper or lower bridge arm of any bridge arm module connected to the motor in the motor controller 100. For example, in... Figure 3 The power module 20 shown includes a first power unit 21 and two second power units 22. It can be installed in both the upper and lower arms of a bridge arm module connected to the three phases of the motor; that is, the motor controller 100 is equipped with such a power module 20. Figure 4 The 6 power modules 20 shown (i.e. Figure 4 The three black packaged structures within the red dashed box form a power module 20.
[0051] The first power unit 21 can be formed by individually packaging the SiC MOSFET using any packaging method. For example, it can be formed by packaging the SiC MOSFET using a high-density packaging (HDP) method; or it can be formed by packaging the SiC MOSFET using a Tesla pack (TPAK) method, and so on.
[0052] Similarly, the second power unit 22 described above can also be a power unit formed by individually packaging the Si IGBT using any packaging method. For example, it can be a first power unit 21 formed by packaging the SiC MOSFET using a high-density packaging (HDP) method; or it can be a first power unit 21 formed by packaging the SiC MOSFET using a Tesla Pack (TPAK) method, and so on.
[0053] The copper busbar 30 described above is any copper structure used to realize the transmission of electrical signals between the power units in the motor controller 100 and the motor. In some embodiments, the copper busbar 30 is a laminated busbar, thereby improving the performance of the copper busbar 30 and further improving the reliability of the motor controller 100.
[0054] The copper busbar 30 is connected to at least one first power unit 21 and at least one second power unit 22. The pins of each first power unit 21 and each second power unit 22 can be soldered to the copper busbar 30 using any soldering method. In some embodiments, the first power unit 21 and the second power unit 22 are laser-welded to the copper busbar 30, which can reduce the stray inductance of the entire power module and further improve the reliability of the motor controller 100.
[0055] It should be noted that, in addition to the heat dissipation substrate 10, power module 20 and copper busbar 30, the motor controller 100 may also include a drive board 41, temperature sampling board 50, insulating pad 60, positive electrode insulating plate 70, negative electrode insulating plate 80 and support plate 90. Since the improvement of this application does not lie in these components and their connection relationship, they will not be described in detail here.
[0056] In some implementations, please refer to... Figure 5 The motor controller 100 may also include:
[0057] The drive board 41 is connected to at least one first power unit 21 and at least one second power unit 22.
[0058] The driver chip circuit 42 is connected to each first power unit 21 and each second power unit 22 through the driver board 41. The driver chip circuit 42 is used to generate a first driving signal and a second driving signal. The first driving signal is used to drive the first power unit 21 and the second driving signal is used to drive the second power unit 22.
[0059] In this embodiment, the driving chip circuit 42 can generate a first driving signal to drive the first power unit 21 and a second driving signal to drive the second power unit 22, thereby avoiding the problem of difficulty in matching due to the inconsistency of driving voltage and switching speed of SiC MOSFET and Si IGBT, and further improving the reliability of motor controller 100.
[0060] The aforementioned driver chip circuit 42 can be any circuit component capable of generating the first and second driver signals. The first and second driver signals can be driver signals with different voltages, for example, +18V and -5V driver signals respectively.
[0061] In some embodiments, the driver chip circuit 42 includes:
[0062] Control logic module 421;
[0063] The first drive signal output module 422 has its input terminal connected to the first output terminal of the control logic module 421, and its output terminal connected to the first power unit 21. The first drive signal output module 422 is used to convert the electrical signal output by the control logic module 421 into a first drive signal.
[0064] The second drive signal output module 423 has its input terminal connected to the second output terminal of the control logic module 421, and its output terminal connected to the second power unit 22. The second drive signal output module 423 is used to convert the electrical signal output by the control logic module 421 into a second drive signal.
[0065] In this embodiment, the output signal of the control logic module 421 can be converted simultaneously by the first drive signal output module 422 and the second drive signal output module 423, thereby realizing the output of the first drive signal and the second drive signal, which makes the circuit design simpler.
[0066] The first drive signal output module 422 and the second drive signal output module 423 can be circuit modules with adjustable conduction sequence and adjustable delay between them. For example, each drive signal output module can be a circuit structure composed of a signal conversion sub-circuit and an operational amplifier.
[0067] In some implementations, the control terminal of the first drive signal output module 422 is connected to the first power supply VHB, and the control terminal of the second drive signal output module 423 is connected to the second power supply VHA, which is different from the first power supply VHB. Thus, by setting dual power supplies (i.e., the first power supply VHB and the second power supply VHA), the conduction sequence of the first drive signal output module 422 and the second drive signal output module 423, as well as the delay between them, can be independently adjusted, thereby flexibly implementing various control modes.
[0068] It should be noted that when the control terminal of the first drive signal output module 422 is connected to the first power supply VHB, and the control terminal of the second drive signal output module 423 is connected to the second power supply VHA, the connection between the control terminal of the first drive signal output module 422 and the first power supply VHB, and the connection between the control terminal of the second drive signal output module 423 and the second power supply VHA, can be respectively connected to the pull-down power supply VL through capacitors, so as to achieve filtering and voltage regulation of the input voltage signals of the control terminal of the second drive signal output module 423 and the control terminal of the first drive signal output module 422.
[0069] In some embodiments, the motor controller 100 may further include:
[0070] Amplifier circuit 43 is connected between driver chip circuit 42, first power unit 21 and second power unit 22. Amplifier circuit 43 is used to amplify the first drive signal and the second drive signal.
[0071] In this embodiment, the first drive signal and the second drive signal can be amplified by setting the amplifier circuit 43, thereby ensuring that the first drive signal and the second drive signal can effectively drive the corresponding power unit, and further improving the reliability of the motor controller 100.
[0072] The aforementioned amplifier circuit 43 can be any circuit capable of simultaneously amplifying the first driving signal and the second driving signal, and it can be an integral circuit structure.
[0073] In some embodiments, the amplifier circuit 43 includes:
[0074] The first amplifier sub-circuit 431 is connected to the driver chip circuit 42 and the first power unit 21.
[0075] The second amplifier sub-circuit 432 is connected to the driver chip circuit 42 and the second power unit 22.
[0076] In this embodiment, by setting the first amplification sub-circuit 431 and the second amplification sub-circuit 432, the first driving signal and the second driving signal can be amplified simultaneously, thereby making the circuit more stable and easier to implement.
[0077] The first amplification sub-circuit 431 described above can be a circuit for amplifying the first driving signal, and the second amplification circuit 43 can be a circuit for amplifying the second driving signal. For example, when the driving chip circuit 42 includes the first driving signal output module 422 and the second driving signal output module 423, the first amplification sub-circuit 431 can be connected between the first driving signal output module 422 and the first power unit 21 to amplify the first driving signal output by the first driving signal output module 422; while the second amplification sub-circuit 432 can be connected between the second driving signal output module 423 and the second power unit 22 to amplify the second driving signal output by the second driving signal output module 423.
[0078] It should be noted that when the power module 20 includes multiple first power units 21, the signal input terminals of the multiple first power units 21 can be connected in parallel to the signal output terminals of the first amplifier sub-circuit 431; similarly, when the power module 20 includes multiple second power units 22, the signal input terminals of the multiple second power units 22 can be connected in parallel to the signal output terminals of the second amplifier sub-circuit 432.
[0079] In some embodiments, at least one of the first amplifying sub-circuit 431 and the second amplifying sub-circuit 432 includes:
[0080] The PMOS transistor has its gate connected to the driver chip circuit 42, its source connected to the third power supply, and its drain connected to the corresponding power unit.
[0081] The gate of the NMOS transistor is connected to the driver chip circuit 42, the source of the NMOS transistor is connected to the fourth power supply, and the drain of the NMOS transistor is connected in parallel with the drain of the PMOS transistor to the corresponding power unit.
[0082] In this embodiment, at least one of the first amplification sub-circuit 431 and the second amplification sub-circuit 432 includes a PMOS transistor and an NMOS transistor. That is, the amplification sub-circuit is a push-pull amplifier circuit 43 composed of PN transistors, which further improves the stability of the amplifier circuit 43.
[0083] It should be noted that the power supply connected to the source of the PMOS transistor can be an independently configured power supply.
[0084] In some embodiments, both the first amplification sub-circuit 431 and the second amplification sub-circuit 432 include PMOS transistors and NMOS transistors. The source of the PMOS transistor in the first amplification sub-circuit 431 is connected to the first power supply VHB, and the source of the PMOS transistor in the second amplification sub-circuit 432 is connected to the second power supply VHA, thereby further improving the reliability of the motor controller 100 and reducing the complexity of the circuit.
[0085] Of course, the third power supply mentioned above can also be a power supply other than the first power supply VHB and the second power supply VHA, and this is not limited here.
[0086] When the source of the PMOS transistor in the first amplification sub-circuit 431 is connected to the first power supply VHB, and the source of the PMOS transistor in the second amplification sub-circuit 432 is connected to the second power supply VHA, the sources of the PMOS transistors in the first amplification sub-circuit 431 and the second amplification sub-circuit 432 can both be connected to the pull-down power supply VL (i.e., the fourth power supply is the pull-down power supply VL).
[0087] It should be noted that, in the case where the above-mentioned amplifier sub-circuit includes PMOS transistors and NMOS transistors, the amplifier sub-circuit may also include other components, such as current-limiting resistors, etc., which are not limited here.
[0088] Based on the motor controller 100 described above, this application embodiment also provides an electric vehicle, including the motor controller 100 described above.
[0089] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.
Claims
1. A motor controller, characterized in that, include: Heat dissipation substrate; A power module is disposed on the heat dissipation substrate. The power module includes at least one first power unit and at least one second power unit. The first power unit is a power unit formed by packaging a silicon carbide metal oxide semiconductor field-effect transistor, and the second power unit is a power unit formed by packaging a silicon insulated gate bipolar transistor. A copper busbar, which is connected to the at least one first power unit and the at least one second power unit.
2. The motor controller according to claim 1, characterized in that, The copper busbar is a laminated busbar; and / or, The power module is soldered to the heat dissipation substrate by silver sintering; and / or The first power unit and the second power unit are laser-welded onto the copper busbar.
3. The motor controller according to claim 1, characterized in that, The motor controller also includes: A driver board, the driver board being connected to the at least one first power unit and the at least one second power unit; A driver chip circuit is provided, which is connected to each of the first power units and each of the second power units via the driver board. The driver chip circuit is used to generate a first drive signal and a second drive signal. The first drive signal is used to drive the first power unit, and the second drive signal is used to drive the second power unit.
4. The motor controller according to claim 3, characterized in that, The driver chip circuit includes: Control logic module; A first drive signal output module, wherein the input terminal of the first drive signal output module is connected to the first output terminal of the control logic module, and the output terminal of the first drive signal output module is connected to the first power unit, and the first drive signal output module is used to convert the electrical signal output by the control logic module into the first drive signal; The second drive signal output module has its input terminal connected to the second output terminal of the control logic module, and its output terminal connected to the second power unit. The second drive signal output module is used to convert the electrical signal output by the control logic module into the second drive signal.
5. The motor controller according to claim 4, characterized in that, The control terminal of the first drive signal output module is connected to the first power supply, and the control terminal of the second drive signal output module is connected to the second power supply, which is different from the first power supply.
6. The motor controller according to claim 3, characterized in that, The motor controller also includes: An amplifier circuit is connected between the driver chip circuit, the first power unit, and the second power unit, and the amplifier circuit is used to amplify the first drive signal and the second drive signal.
7. The motor controller according to claim 6, characterized in that, The amplifier circuit includes: The first amplifier sub-circuit is connected to the driver chip circuit and the first power unit. The second amplifier sub-circuit is connected to the driver chip circuit and the second power unit.
8. The motor controller according to claim 7, characterized in that, At least one of the first amplification sub-circuit and the second amplification sub-circuit includes: The PMOS transistor has its gate connected to the driver chip circuit, its source connected to a third power supply, and its drain connected to the corresponding power unit. The NMOS transistor has its gate connected to the driving chip circuit, its source connected to the fourth power supply, and its drain connected in parallel with the drain of the PMOS transistor to the corresponding power unit.
9. The motor controller according to claim 8, characterized in that, Both the first amplification sub-circuit and the second amplification sub-circuit include the PMOS transistor and the NMOS transistor, and the source of the PMOS transistor in the first amplification sub-circuit is connected to the second power supply, while the source of the PMOS transistor in the second amplification sub-circuit is connected to the first power supply.
10. An electric vehicle, characterized in that, Includes the motor controller as described in any one of claims 1 to 9.