Upper ring seat mechanism of automatic film expanding machine

Abstract

The utility model provides an upper ring seat mechanism of an automatic film expanding machine, which is mounted on an upper fixing table, is used for mounting an upper mounting ring and comprises a blue film pressing plate, a pressing plate driving mechanism, an upper mounting disc and an upper disc driving mechanism, and the blue film pressing plate is arranged on the periphery of the upper mounting disc; the pressing plate driving mechanism drives the blue film pressing plate to vertically move, after the upper mounting ring is accurately mounted, the blue film can be reliably pressed in the mode that the blue film is pressed firstly and then the upper mounting ring and the lower mounting ring are pressed, subsequent blue film expansion is facilitated, meanwhile, the upper mounting ring is clamped by the outer ring clamping mechanism, and after pressing of the child ring and the mother ring is completed, the blue film can be reliably pressed. And the blue film can be separated from the upper mounting ring, so that subsequent cutting and separation of the blue film are facilitated.

Description

Technical Field

[0001] This utility model relates to the field of discrete device packaging, and in particular to an upper ring seat mechanism for an automatic film expansion machine. Background Technology

[0002] In the manufacturing process of discrete devices, the step of fixing and protecting the chips on the wafer using a blue film carrier is called wafer-level packaging, also known as blue film packaging. Typically, the package consists of a wafer, a blue film, and a frame. The frame is used to fix and support the blue film and the wafer, providing sufficient support strength and stability to ensure the wafer is securely held within the frame.

[0003] In existing technologies, the frame often adopts a mother-daughter ring structure, also known as a male-female ring or a quick-release ring. In the blue film packaging process using the mother-daughter ring structure, there are often problems such as poor blue film expansion effect leading to blue film damage and abnormal deformation, poor adhesion between blue film and wafer, and poor blue film cutting and separation after wafer blue film packaging.

[0004] In blue film encapsulation, the mother ring (upper mounting ring) needs to be reliably clamped so that subsequent processes can press it together with the daughter ring (lower mounting ring). Utility Model Content

[0005] The technical problem to be solved by this utility model is that during the blue film encapsulation process, the upper mounting ring needs to be reliably and accurately positioned, and it needs to be able to detach from the upper mounting ring after being pressed together with the lower mounting ring. This utility model provides an automatic film expansion machine for wafer blue film mounting to solve the above problem.

[0006] The technical solution adopted by this utility model to solve its technical problem is: an upper ring seat mechanism of an automatic film expanding machine, which is installed on an upper fixed platform for installing an upper mounting ring, including a blue film pressure plate, a pressure plate driving mechanism, an upper mounting plate and an upper plate driving mechanism, wherein the blue film pressure plate is disposed on the outer periphery of the upper mounting plate; the pressure plate driving mechanism drives the blue film pressure plate to move vertically.

[0007] Furthermore: the upper mounting plate is provided with a plurality of outer ring clamping mechanisms along the circumferential direction, the outer ring clamping mechanism including an outer clamping seat and an outer clamping claw; the middle part of the outer clamping claw is rotatably hinged to the outer clamping seat, and its bottom has a clamp for clamping the outer circumference of the upper mounting ring; on the upper mounting plate, an outer clamping spring is provided at the top position corresponding to the outer clamping claw, and the outer clamping spring pushes the outer clamping claw outward.

[0008] Furthermore: the pressure plate driving mechanism includes a pressure plate cylinder, a pressure plate guide post, and a pressure plate guide sleeve; the pressure plate guide sleeve is vertically fixed on the upper fixed platform, the pressure plate guide post passes through the pressure plate guide sleeve and its bottom is fixedly connected to the blue film pressure plate; the pressure plate cylinder is vertically fixed on the upper fixed platform, and its piston rod is connected to the blue film pressure plate.

[0009] Furthermore: the upper plate drive mechanism includes an upper plate cylinder, an upper plate guide post, and an upper plate guide sleeve; the upper plate guide sleeve is vertically fixed on the upper fixed platform, the upper plate guide post passes through the upper plate guide sleeve and its bottom is fixedly connected to the upper mounting plate; the upper plate cylinder is vertically fixed on the upper fixed platform, and its piston rod is connected to the upper mounting plate.

[0010] The beneficial effects of this utility model are that, after the upper mounting ring is accurately installed, the upper mounting ring and the lower mounting ring are pressed together by first pressing the blue film and then pressing the blue film together. This can reliably press the blue film, which is convenient for subsequent blue film expansion. At the same time, the upper mounting ring is clamped by the outer ring clamping mechanism. After the mother and daughter rings are pressed together, the upper mounting ring can be separated from the upper mounting ring, which is convenient for subsequent blue film cutting and separation. Attached Figure Description

[0011] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0012] Figure 1 This is a schematic diagram of the overall structure of an automatic film expansion machine for mounting blue film on wafers according to this utility model;

[0013] Figure 2 yes Figure 1 The schematic diagram of the upper ring seat mechanism is omitted.

[0014] Figure 3 This is a partial schematic diagram of the expansion and pressing point where the upper mounting ring and the lower mounting ring are to be pressed together.

[0015] Figure 4 This is a partial schematic diagram of the expansion and pressing joint after the upper mounting ring and lower mounting ring have been pressed together;

[0016] Figure 5 and Figure 6 These are schematic diagrams of the lower ring seat mechanism mounted on the mounting platform from different perspectives;

[0017] Figure 7 , Figure 9 Schematic diagrams of the partial structure of the lower ring seat mechanism from different perspectives;

[0018] Figure 8 yes Figure 7 Enlarged view of section B in the image;

[0019] Figure 10 and Figure 11 These are structural schematic diagrams of the upper ring seat mechanism from different perspectives;

[0020] Figure 12 yes Figure 10 The structural diagram of the blue film pressure plate and installation structure is omitted.

[0021] Figure 13 yes Figure 11 A structural schematic diagram of the blue film pressure plate is omitted.

[0022] Figure 14 This is a schematic diagram of the installation of the outer ring clamping mechanism;

[0023] Figure 15 yes Figure 14 A magnified view of section A in the image.

[0024] In the diagram: 1. Mounting platform; 2. Upper mounting platform; 3. Wafer; 4. Blue film; 5. Lower mounting ring; 6. Upper mounting ring; 7. Blue film pressure plate; 8. Upper mounting plate; 9. Lower mounting plate; 10. Clamping platform; 11. Film cutting knife; 12. Outer ring clamping mechanism; 13. Outer clamping seat; 14. Outer clamping claw; 15. Outer clamping spring; 16. Inner ring clamping mechanism; 17. Inner clamping seat; 18. Inner clamping spring; 19. Inner clamping ball; 20. Pressure plate cylinder. 21. Pressure plate guide post; 22. Pressure plate guide sleeve; 23. Upper plate cylinder; 24. Upper plate guide post; 25. Upper plate guide sleeve; 26. Motor base; 27. Lower plate drive motor; 28. Lower plate drive screw; 29. ​​Lower plate drive nut; 30. Lower movable table; 31. Lower plate guide post; 32. Lower plate guide sleeve; 33. Air extraction hole; 34. Vacuum tube; 35. Heating rod; 36. Temperature sensor; 37. Embossing; 38. Vacuum suction cup. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Rather, the embodiments of this utility model include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.

[0026] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0027] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, in the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0028] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of the present invention includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order according to the functions involved, as should be understood by those skilled in the art to which embodiments of the present invention pertain.

[0029] like Figures 1 to 15As shown, this utility model provides an automatic expansion machine for mounting blue film on wafers, including a mounting platform 1, a lower ring seat mechanism mounted on the mounting platform 1, an upper fixed platform 2 fixed to the mounting platform 1, and an upper ring seat mechanism mounted on the upper fixed platform 2 and located above the lower ring seat mechanism. The lower ring seat mechanism is used to mount a wafer 3, a blue film 4, and a lower mounting ring 5, and the upper ring seat mechanism is used to mount an upper mounting ring 6. The upper ring seat mechanism includes a blue film pressure plate 7, a pressure plate driving mechanism, an upper mounting plate 8, and an upper plate driving mechanism. The blue film pressure plate 7 is disposed on the upper mounting plate. The outer periphery of 8; the pressure plate driving mechanism drives the blue film pressure plate 7 to move vertically so that the blue film pressure plate 7 presses tightly against the mounting platform 1; the lower ring seat mechanism includes a lower mounting plate 9 and a lower plate driving mechanism, the lower mounting plate 9 is disposed below the upper mounting plate 8, the lower mounting ring 5 is mounted on the lower mounting plate 9, and the upper mounting ring 6 is mounted on the upper mounting plate 8; the upper plate driving mechanism drives the upper mounting plate 8 to move vertically so that the upper mounting plate 8 presses against the lower mounting plate 9; the lower plate driving mechanism drives the lower mounting plate 9 to move vertically.

[0030] An automatic film expansion machine is used in the mounting of the mother and daughter rings and wafer 3. The daughter ring is smaller and can be used to fix the edge of wafer 3, while the mother ring is larger and can be fitted over the daughter ring. The two are tightly fixed together by pressing, thereby fixing wafer 3. The wafer 3, which has completed blue film encapsulation through the ring structure, can ensure that wafer 3 remains stable during processing, transportation, and storage, and will not move or be damaged. In this application, the daughter ring is the lower mounting ring 5, and the mother ring is the upper mounting ring 6.

[0031] The automatic film expansion machine of this application is used for expanding the blue film 4 and pressing and installing the mother and daughter rings. The processing process is as follows: the upper ring seat mechanism and the lower ring seat mechanism are currently in a separate state. When preparing for installation, the wafer 3 is placed on the upper surface of the lower mounting plate 9, and then the lower mounting ring 5 is installed on the lower mounting plate 9. The blue film 4 is then covered on the surface of the lower mounting ring 5 and the wafer 3. Finally, the upper mounting ring 6 is installed on the upper mounting plate 8.

[0032] The pressure plate drive mechanism drives the blue film pressure plate 7 to move vertically, pressing the blue film pressure plate 7 tightly against the surface of the blue film 4 on the mounting stage 1, so that the blue film 4 is tightly attached to the lower mounting ring 5 and the surface of the wafer 3. This process expands the blue film 4. After the film expansion operation is completed, it adheres to the wafer 3 and sticks to each other, so that the blue film 4 is expanded and taut on the wafer 3.

[0033] Then, the upper mounting plate 8 is driven vertically by the upper mounting mechanism, pressing it against the lower mounting plate 9. The upper mounting ring 6 on the upper mounting plate 8 is then pressed against the outer periphery of the lower mounting ring 5. Since the blue film 4 was previously covered on the lower mounting ring 5 and the wafer 3, it naturally embeds itself between the lower mounting ring 5 and the upper mounting ring 6. This completes the fixation of the blue film 4 and the wafer 3 in their expanded state, thus installing the blue film encapsulation. During the process of the upper mounting ring 6 pressing down on the lower mounting ring 5, the upper mounting ring 6 presses down to expand the blue film 4, and the expansion of the blue film 4 is uniform throughout, ensuring the expansion effect of the blue film 4. After the expansion is completed, the upper mounting ring 6 and the lower mounting ring 5 are pressed together and fixed to each other. The blue film 4 completes the mother-daughter ring installation under continuous expansion, the internal expansion force remains unchanged, the state of the blue film 4 is stable, and it has a good adhesion effect on the wafer 3.

[0034] Finally, the lower drive mechanism drives the lower mounting plate 9 to move vertically. The lower mounting plate 9 rises and tears the blue film of the wafer that has completed blue film encapsulation off the whole blue film 4, thus completing the entire film expansion and encapsulation process.

[0035] The lower mounting plate 9 is provided with a clamping platform 10, the lower mounting ring 5 is sleeved on the clamping platform 10, and the lower mounting plate 9 is provided with a film cutting knife 11. The film cutting knife 11 is annular in shape and coaxially arranged on the outer periphery of the clamping platform 10. The top of the film cutting knife 11 is serrated.

[0036] The lower mounting ring 5 is fitted onto the outer periphery of the clamping platform 10. The wafer 3 is placed on the platform of the clamping platform 10. When the upper mounting plate 8 presses against the lower mounting plate 9, the upper mounting ring 6 is fitted onto the lower mounting ring 5. During this installation process, the upper mounting ring 6 presses against the blue film 4 and presses the blue film 4 against the top surface of the dicing blade 11. The serrated edge of the dicing blade 11 pierces the blue film 4 from bottom to top, forming pin-like holes on the blue film 4. This creates a circular cutting track composed of several pins on the blue film 4. Finally, when the lower mounting plate 9 rises, the blue film of the wafer with the expanded film encapsulation is easily peeled off from the entire blue film 4, following the aforementioned cutting track. This method of pre-piercing the cutting track using the dicing blade 11 facilitates peeling and ensures a smooth peel cut on the blue film 4, preventing burrs and stretching deformation, thus improving the packaging quality of the wafer 3.

[0037] The upper mounting plate 8 is provided with a plurality of outer ring clamping mechanisms 12 along the circumferential direction. Each outer ring clamping mechanism 12 includes an outer clamping seat 13 and an outer clamping claw 14. The middle part of the outer clamping claw 14 is rotatably hinged to the outer clamping seat 13, and its bottom has a clamp for clamping the outer circumference of the upper mounting ring 6. On the upper mounting plate 8, an outer clamping spring 15 is provided at the top position corresponding to the outer clamping claw 14, and the outer clamping spring 15 pushes the outer clamping claw 14 outward.

[0038] The outer ring clamping mechanism 12 is mounted on the upper mounting plate 8 and is used to clamp the upper mounting ring 6. The outer clamping spring 15 pushes the top of the outer clamping claw 14 outward, so that the bottom end of the outer clamping claw 14 tilts inward. In this way, the multiple outer clamping claws 14 arranged circumferentially combine to form a retractable clamping claw assembly. When the upper mounting ring 6 is placed in this retractable clamping claw assembly, the outer clamping spring 15 can push the outer clamping claw 14 outward so that the outer clamping claw 14 can reliably grip the upper mounting ring 6.

[0039] Meanwhile, the clamping force provided by the outer clamping spring 15 is limited. After the upper mounting ring 6 and the lower mounting ring 5 are pressed together, due to the reliable connection and binding force between them, when the upper mounting plate 8 is lifted upwards, the outer clamping claw 14 will no longer be able to hold the upper mounting ring 6. That is, the outer clamping claw 14 will disengage from the upper mounting ring 6, and the upper mounting ring 6 will remain on the outer periphery of the lower mounting ring 5, thus completing the pressing of the male and female rings. This clamping claw structure, which clamps and positions the rings before pressing and can freely detach from the upper mounting ring 6 after pressing, satisfies the pressing requirements of the male and female rings.

[0040] The clamping platform 10 is provided with a plurality of inner ring clamping mechanisms 16 along the circumferential direction. Each inner ring clamping mechanism 16 includes an inner clamping seat 17. An inner clamping spring 18 is provided on the inner clamping seat 17 along the radial direction. An inner clamping ball 19 is provided at the top of the inner clamping spring 18. The inner clamping spring 18 pushes the inner clamping ball 19 outward.

[0041] The lower mounting ring 5 is mounted on the clamping platform 10, which is circular. The lower mounting ring 5 can be positioned. The inner ring clamping mechanism 16 clamps the inner ring of the lower mounting ring 5. The inner clamping spring 18 presses the inner clamping ball 19 against the inner ring of the lower mounting ring 5. The inner clamping ball 19 can roll to adjust the contact position, so that the inner ring of the lower mounting ring 5 is reliably clamped.

[0042] The inner ring clamping mechanism 16 positions the lower mounting ring 5, preventing it from moving. This ensures that the positions of the blue film 4 do not change during the expansion process of the blue film 4 after the wafer 3 is placed on the clamping stage 10, thus improving the positional accuracy of the blue film 4 and the wafer 3 after packaging and improving the packaging quality.

[0043] The pressure plate driving mechanism includes a pressure plate cylinder 20, a pressure plate guide post 21, and a pressure plate guide sleeve 22; the pressure plate guide sleeve 22 is vertically fixed on the upper fixed platform 2, the pressure plate guide post 21 passes through the pressure plate guide sleeve 22 and its bottom is fixedly connected to the blue film pressure plate 7; the pressure plate cylinder 20 is vertically fixed on the upper fixed platform 2, and its piston rod is connected to the blue film pressure plate 7.

[0044] The upper plate drive mechanism includes an upper plate cylinder 23, an upper plate guide post 24, and an upper plate guide sleeve 25; the upper plate guide sleeve 25 is vertically fixed on the upper fixed platform 2, the upper plate guide post 24 passes through the upper plate guide sleeve 25 and its bottom is fixedly connected to the upper mounting plate 8; the upper plate cylinder 23 is vertically fixed on the upper fixed platform 2, and its piston rod is connected to the upper mounting plate 8.

[0045] The structure of guide pillars and guide sleeves enables precise guidance in the linear direction, improving the motion accuracy of the blue film pressure plate 7 and the upper mounting plate 8. The use of cylinders as the power source makes control convenient and the movement sensitive, enabling efficient linear drive and improving the efficiency of the equipment.

[0046] The lower plate drive mechanism includes a motor base 26 fixedly mounted to the mounting platform 1, a lower plate drive motor 27 vertically fixedly mounted on the motor base 26, a lower plate drive screw 28 mounted at the output end of the lower plate drive motor 27, a lower plate drive nut 29 mounted on the lower plate drive screw 28, a lower movable platform 30, a lower plate guide post 31, and a lower plate guide sleeve 32. The lower plate guide sleeve 32 is vertically fixedly mounted on the mounting platform 1, and the lower plate guide post 31 passes through the lower plate guide sleeve 32. The upper end of the lower plate guide post 31 is fixedly connected to the lower mounting plate 9, and its lower end is fixedly connected to the lower movable platform 30. The lower plate drive nut 29 and the lower movable platform 30 are fixedly connected.

[0047] The linear drive method, which uses a motor to drive a lead screw and then a nut, offers high precision control and enables accurate control of the lower movable stage 30. Since the lower movable stage 30 moves after the blue film 4 has expanded and the upper mounting ring 6 has been pressed, its primary purpose is to peel the packaged wafer 3 and mounting ring as a whole from the original blue film 4. Using linear actuators such as cylinders would have drawbacks due to uncontrollable drive speed and stroke. This process requires the lower movable stage 30 to perform the peeling motion upwards at a stable speed. Therefore, this drive method meets the requirements and achieves a better peeling effect, preventing deformation of the blue film 4.

[0048] The lower mounting plate 9 has an evacuation hole 33 on its upper surface, which is connected to a vacuum tube 34. A heating rod 35 and a temperature sensor 36 are also provided on the lower mounting plate 9. The evacuation hole 33 creates a negative pressure between the lower mounting plate 9 and the blue film 4, ensuring that the blue film 4 can be stably and reliably adhered to the surfaces of the lower mounting plate 9 and the wafer 3. Simultaneously, it eliminates the presence of pores on the surfaces of the blue film 4 and the wafer 3, improving the blue film packaging quality.

[0049] The heating rod 35 and temperature sensor 36 can reliably heat the lower mounting plate 9, which can promote the softening of the blue film 4, facilitate the expansion and pressing of the blue film 4, improve the adhesion to the surface of the wafer 3, and also improve the packaging quality.

[0050] The bottom surface of the upper mounting plate 8 is provided with embossing 37, and the upper mounting plate 8 is also provided with several vacuum suction cups 38. The embossing 37 increases the contact friction between the upper mounting plate 8 and the surface of the blue film 4, and the vacuum suction cups 38 can stabilize the blue film 4 on the lower mounting stage 1, pressing the blue film 4 stably and reliably around the perimeter. In this way, the position displacement of the blue film 4 can be avoided during the film expansion process, thereby improving the packaging quality of film expansion and attachment to the surface of the wafer 3.

[0051] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0052] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. An upper ring seat mechanism for an automatic film expanding machine, mounted on an upper fixed platform (2), for mounting an upper mounting ring (6), characterized in that: It includes a blue film pressure plate (7), a pressure plate driving mechanism, an upper mounting plate (8) and an upper plate driving mechanism. The blue film pressure plate (7) is disposed on the outer periphery of the upper mounting plate (8). The pressure plate driving mechanism drives the blue film pressure plate (7) to move vertically.

2. The upper ring seat mechanism of the automatic film expanding machine as described in claim 1, characterized in that: The upper mounting plate (8) is provided with a plurality of outer ring clamping mechanisms (12) along the circumferential direction. The outer ring clamping mechanism (12) includes an outer clamping seat (13) and an outer clamping claw (14). The middle part of the outer clamping claw (14) is rotatably hinged to the outer clamping seat (13), and its bottom has a clamp for clamping the outer circumference of the upper mounting ring (6). On the upper mounting plate (8), an outer clamping spring (15) is provided at the top position corresponding to the outer clamping claw (14), and the outer clamping spring (15) pushes the outer clamping claw (14) outward.

3. The upper ring seat mechanism of the automatic film expanding machine as described in claim 2, characterized in that: The pressure plate driving mechanism includes a pressure plate cylinder (20), a pressure plate guide post (21), and a pressure plate guide sleeve (22); the pressure plate guide sleeve (22) is vertically fixed on the upper fixed platform (2), the pressure plate guide post (21) passes through the pressure plate guide sleeve (22) and its bottom is fixedly connected to the blue film pressure plate (7); the pressure plate cylinder (20) is vertically fixed on the upper fixed platform (2), and its piston rod is connected to the blue film pressure plate (7).

4. The upper ring seat mechanism of the automatic film expanding machine as described in claim 3, characterized in that: The upper plate drive mechanism includes an upper plate cylinder (23), an upper plate guide post (24), and an upper plate guide sleeve (25); the upper plate guide sleeve (25) is vertically fixed on the upper fixed platform (2), the upper plate guide post (24) passes through the upper plate guide sleeve (25) and its bottom is fixedly connected to the upper mounting plate (8); the upper plate cylinder (23) is vertically fixed on the upper fixed platform (2), and its piston rod is connected to the upper mounting plate (8).

Images