Separating device and device manufacturing equipment

Abstract

The utility model relates to the technical field of flexible substrate separation, in particular to a separation device and device manufacturing equipment, and the device comprises a carrying platform, a sealing cover structure, a sealing structure and an inflation assembly, the carrying table comprises a bearing position which is used for bearing a substrate and a carrying plate. The sealing cover structure is located above the carrying table and connected with the carrying table through the sealing structure, the sealing cover structure, the sealing structure and the carrying table define a sealing cavity, and the bearing position is located in the sealing cavity; the air inflation assembly comprises an air inflation opening, and the air inflation opening is formed in the sealing cavity, faces the base plate and the carrier plate and is used for blowing air into the gap between the base plate and the carrier plate. According to the technical scheme provided by the utility model, the substrate and the carrier plate are separated by using the gas blown out of the blowing port, and the gas separation mode does not generate overlarge acting force on the substrate and the carrier plate, so that the damage to the substrate can be reduced under the condition of ensuring effective separation, and the production yield of products is further improved.

Description

Technical Field

[0001] This utility model relates to the field of flexible substrate separation technology, and in particular to the fabrication of a separation device and apparatus. Background Technology

[0002] Thin-film circuit boards are used in some flexible electronic products, such as flexible display panels. When preparing thin-film circuit boards, integrated circuits need to be fabricated on the substrate, for example, the substrate material is ultra-thin glass or PI film.

[0003] Due to the flexible nature of the substrate, it is generally bonded to a carrier plate structure. The carrier plate supports the substrate and keeps it in a horizontal unfolded state. After the electronic devices on the substrate are fabricated, the substrate needs to be separated from the carrier plate for subsequent processing steps.

[0004] However, due to the large area and thin thickness of the substrate, it is very easy to damage the substrate during the separation of the substrate and the carrier plate, which in turn leads to a decrease in product yield. Utility Model Content

[0005] To address at least the above-mentioned technical problems existing in the prior art, this utility model provides a separation device and its fabrication.

[0006] This utility model provides a separation device for separating a substrate and a carrier plate stacked together. The device includes a platform with a bearing position for supporting the substrate and the carrier plate; a capping structure located above the platform; a sealing structure connected to the platform via the sealing structure, the capping structure, the sealing structure, and the platform forming a sealed cavity, the bearing position located within the sealed cavity; and an inflation assembly including an inflation port located within the sealed cavity, the inflation port facing the substrate and the carrier plate to blow air into the gap formed by the substrate and the carrier plate.

[0007] In some embodiments, the stage further includes a fixing structure; the substrate or the carrier plate is positioned at the bearing position by the fixing structure.

[0008] In some embodiments, the fixing structure includes a vacuum suction tube; the vacuum suction tube is disposed within the stage, the vacuum suction tube includes a plurality of suction ports, the plurality of suction ports are disposed at the bearing position, and the vacuum suction tube is connected to a vacuum generating device.

[0009] In some embodiments, the capping structure and the platform are separate structures; when the capping structure is in a set position, the capping structure, the sealing structure, and the platform form the sealing cavity.

[0010] In some embodiments, one end of the sealing structure is fixedly connected to the capping structure, and when the capping structure, the sealing structure, and the platform form a sealed cavity, the other end of the sealing structure abuts against the platform; or one end of the sealing structure is fixedly connected to the platform, and when the capping structure, the sealing structure, and the platform form a sealed cavity, the capping structure abuts against the other end of the sealing structure.

[0011] In some embodiments, one end of the sealing structure is rotatably connected to the platform via a rotating structure, and the sealing structure is rotated to the set position via the rotating structure to form the sealed cavity; or the side of the sealing structure away from the sealing structure and the platform is connected to a lifting structure, and the sealing structure is moved to the set position via the lifting structure to form the sealed cavity.

[0012] In some embodiments, the air inlet is located on one side of the substrate and the carrier plate; the air inlet is used to blow air into the gap on one side of the substrate and the carrier plate.

[0013] In some embodiments, a plurality of air inlets are spaced apart on one side of the substrate and the carrier plate within the sealed cavity; the plurality of air inlets are used to simultaneously blow air into the gap on one side of the substrate and the carrier plate.

[0014] In some embodiments, the air inlet is disposed on the platform, and the air outlet direction of the air inlet is perpendicular or parallel to the surface of the platform; or the air outlet direction of the air inlet has a set angle with the surface of the platform, and the set angle is less than 90 degrees.

[0015] In another aspect, this utility model provides a device manufacturing apparatus, including the aforementioned separation device.

[0016] This utility model provides a separation device and device fabrication equipment. In use, a substrate and carrier plate for electronic device fabrication are placed in a sealed cavity. Then, the inflation component is activated, and air is blown into the gap between the substrate and carrier plate through the inflation port. The blown gas enters the gap and uses air to separate the substrate and carrier plate. As the blowing continues, the substrate and carrier plate are completely separated by the gas. This utility model's technical solution utilizes gas blown from the air port to separate the substrate and carrier plate. This gas separation method does not exert excessive force on the substrate and carrier plate, ensuring effective separation while reducing damage to the substrate, thereby improving product yield. Attached Figure Description

[0017] The above and other objects, features, and advantages of the present invention will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of the present invention are illustrated in the drawings by way of example and not limitation, in which:

[0018] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0019] Figure 1 A cross-sectional schematic diagram of the separation device provided in the embodiment of this utility model in its non-use state;

[0020] Figure 2 A cross-sectional schematic diagram showing the use state of the separation device provided in an embodiment of this utility model;

[0021] Figure 3 This is a front view schematic diagram of the sealing structure in the separation device provided in the embodiment of this utility model;

[0022] Figure 4 This is a schematic diagram of the separation device provided in an embodiment of the present invention.

[0023] In the picture:

[0024] 1: Platform; 2: Cover structure; 3: Sealing structure; 4: Inflation assembly; 41: Inflation port; 5: Base plate; 6: Carrier plate; 7: Sealed cavity; 8: Rotation structure. Detailed Implementation

[0025] To make the objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0026] This utility model provides a separation device, including a platform, a cover structure, a sealing structure, and an inflation component. The platform is used to support the substrate and the carrier plate to be separated, and the platform, the cover structure, and the sealing structure form a sealed cavity to provide the scene required for the separation operation. The inflation component is used to blow air into the gap between the substrate and the carrier plate. After the gas enters the gap, the gas is used to separate the substrate and the carrier plate.

[0027] The following description, in conjunction with the accompanying drawings, details the various structures of the separation device provided in the embodiments of this utility model, the positional relationships between the structures, and the connection relationships.

[0028] like Figures 1 to 3As shown, the stage 1 includes a support position for supporting the substrate 5 and the carrier plate 6. The support position includes a plane, and the substrate 5 and the carrier plate 6 are in a bonded connection state. The substrate 5 is placed on the plane of the support position and is bonded to the plane, so that the support position supports the substrate 5 and the carrier plate 6.

[0029] In this embodiment, substrate 5 is a glass substrate. In other embodiments, substrate 5 may also be a flexible substrate. Substrate 5 may be a simple substrate or a substrate with conductive lines or electronic components formed on its surface.

[0030] For example, substrate 5 and carrier plate 6 are stacked, with the surface of substrate 5 attached to the surface of the support position. If the surface of substrate 5 contains protruding electronic devices, a corresponding recessed structure is provided on the support position to adapt to the current structure of substrate 5. Alternatively, for example, the plane of the support position can be set as a detachable planar structure, which supports substrate 5 and carrier plate 6, and the corresponding planar structure can be replaced according to the type of substrate 5.

[0031] The stage 1 also includes a fixing structure; the substrate 5 or the carrier plate 6 is positioned at the bearing position by the fixing structure. The fixing structure is used to limit the substrate 5 or the carrier plate 6. After the substrate 5 and the carrier plate 6 are placed in place, the fixing structure is used to fix one of the substrate 5 or the carrier plate 6 to ensure that the substrate 5 or the carrier plate 6 will not move relative to the stage 1 during subsequent operations.

[0032] The fixing structure only fixes one of the substrate 5 and the carrier plate 6. The unfixed structure needs to be separated by the air blowing action of the inflation component 4. Generally, it is necessary to limit the structure that is in contact with the stage 1, that is, to limit the substrate 5.

[0033] For example, the fixing structure includes a vacuum suction tube (not shown in the figure); the vacuum suction tube is disposed inside the stage 1, and includes multiple suction ports located on the surface of the support position, and the vacuum suction tube is connected to a vacuum generating device. After the substrate 5 and the carrier plate 6 are placed in place, the vacuum generating device is activated, and a negative pressure is generated inside the vacuum suction tube, causing the suction ports to adsorb the substrate 5 or the carrier plate 6 on the stage 1, thereby fixing the substrate 5 or the carrier plate 6.

[0034] For example, multiple adsorption ports are evenly distributed on the support position, and the adsorption force on each region of the substrate 5 or carrier plate 6 is the same or tends to be the same, which can improve the stability of adsorption on the substrate 5 or carrier plate 6.

[0035] Continue to refer to Figures 1 to 3 As shown in the embodiment of this utility model, the capping structure 2 is located above the platform 1 and is connected to the platform 1 through the sealing structure 3. The capping structure 2, the sealing structure 3 and the platform 1 form a sealed cavity 7, and the bearing position is located inside the sealed cavity 7.

[0036] The sealed cavity 7 can be completely sealed, or it can have an exhaust port on one side, such as the opposite side of the air inlet 41, so that an airflow can be formed in the sealed cavity 7 to separate the substrate 5 and the carrier plate 6.

[0037] The actions of placing or removing the substrate 5 and the carrier plate 6 need to be performed within the sealed cavity 7. Therefore, the sealed cavity 7 needs to have an opening and closing function. When it is open, it is used for placing and removing the substrate, and when it is closed, it is used for inflation and separation.

[0038] That is, the sealing structure 2 and the platform 1 are separate structures; when the sealing structure 2 is in the set position, the sealing structure 2, the sealing structure 3, and the platform 1 form a sealed cavity 7, and the sealing structure 2 is in the closed position; when the sealing structure 2 is away from the set position, the sealed cavity 7 is opened, and the sealing structure 2 is in the open position. The opening and closing methods of the sealing structure 2 can include various forms, as long as the sealing structure 2 can move to the set position and form the sealed cavity 7.

[0039] For example, one end of the capping structure 2 is rotatably connected to the platform 1 via the rotating structure 8. The capping structure 2 rotates to a set position via the rotating structure 8 to form a sealed cavity 7. The rotating structure 8 includes a rotating shaft, and a bearing seat is provided on the platform 1. The two ends of the rotating shaft are connected to the bearings on the bearing seat. When it needs to be opened, the capping structure 2 is driven to rotate around the position of the rotating structure 8. After the pick-up and put-down operation is completed, the capping structure 2 is driven to rotate in the opposite direction to the set position. At the set position, the capping structure 2, the sealing structure 3 and the platform 1 form a sealed cavity 7.

[0040] For example, a lifting structure is connected to the side of the capping structure 2 away from the sealing structure 3 and the platform 1. The capping structure 2 moves to a set position via the lifting structure to form a sealed cavity 7. The lifting structure can drive the capping structure 2 to move along a straight line or a set path. When the capping structure 2 is lifted a certain distance, the substrate 5 and the carrier plate 6 can be picked up and put down. Then, the lifting structure is used to drive the capping structure 2 to move in the opposite direction, so that the capping structure 2 moves to a set position. At this set position, the capping structure 2, the sealing structure 3 and the platform 1 form a sealed cavity 7.

[0041] For example, the lifting structure can be a multi-axis robotic arm, a cylinder structure, or a lead screw drive module.

[0042] In this embodiment of the present invention, the sealing structure 3 can be set independently, or it can be connected to the capping structure 2 or the platform 1.

[0043] For example, one end of the sealing structure 3 is fixedly connected to the capping structure 2, and when the capping structure 2, the sealing structure 3, and the platform 1 form a sealed cavity 7, the other end of the sealing structure 3 abuts against the platform 1; or, for example, one end of the sealing structure 3 is fixedly connected to the platform 1, and when the capping structure 2, the sealing structure 3, and the platform 1 form a sealed cavity 7, the capping structure 2 abuts against the other end of the sealing structure 3.

[0044] For example, the sealing structure 3 is made of rubber. The sealing rubber has a certain height and deformation capability. When the sealing structure 3 comes into contact with the cover structure 2 or the platform 1, the sealing structure 3 fits tightly with the cover structure 2 or the platform 1.

[0045] The height of the sealing structure 3 determines the height of the space inside the sealing cavity 7. When the sealing structure 2 moves to the set position, the inner surface of the sealing structure 2 is at a certain distance from the carrier plate 6. When the air blowing port blows airflow to the substrate 5 and the carrier plate 6, this distance can meet the space requirements for the separation of the substrate 5 and the carrier plate 6.

[0046] Continue to refer to Figures 1 to 3 As shown in the embodiment of this utility model, the inflation component 4 includes an inflation port 41, which is disposed in the sealed cavity 7 and faces the substrate 5 and the carrier plate 6, for blowing air into the gap between the substrate 5 and the carrier plate 6.

[0047] The inflation component 4 includes an air pump, which supplies air to the inflation port 41. The flow rate of the airflow from the inflation port 41 can be adjusted according to actual needs. During inflation, a constant flow rate or a variable flow rate can be used to blow air into the gap.

[0048] The airflow blown out of the air inlet 41 enters the gap between the substrate 5 and the carrier plate 6. Under the action of the airflow, the airflow exerts an upward force on the carrier plate 6, which can separate the substrate 5 and the carrier plate 6. With the continuous inflation operation, the airflow gradually fills the entire gap, thereby separating the entire substrate 5 and the carrier plate 6.

[0049] For example, the air inlet 41 is located on one side of the substrate 5 and the carrier plate 6; the air inlet 41 is used to blow air into the gap on one side of the substrate 5 and the carrier plate 6. The airflow used to separate the substrate 5 and the carrier plate 6 enters from one side of the substrate 5 and the carrier plate 6 and flows out from the other side to complete the separation of the substrate 5 and the carrier plate 6.

[0050] For example, multiple air inlets 41 are spaced apart on one side of the substrate 5 and the carrier plate 6 within the sealed cavity 7; the multiple air inlets 41 are used to simultaneously blow air into the gap on one side of the substrate 5 and the carrier plate 6. By providing multiple air inlets 41, more airflow can be simultaneously introduced into the gap, thereby improving the separation efficiency of the substrate 5 and the carrier plate 6.

[0051] In this embodiment of the present invention, the air inlet 41 is provided on the platform 1, and the air outlet direction of the air inlet 41 is perpendicular or parallel to the surface of the platform 1.

[0052] For example, an air inlet 41 is positioned on the stage 1, with its outlet direction perpendicular to the surface of the stage 1. The area of ​​the carrier plate 6 is slightly larger than the area of ​​the substrate 5, and the edge of the carrier plate 6 forms a stepped structure with the edge of the substrate 5, creating a gap. The airflow from the air inlet 41 reaches the edge of the carrier plate 6 and then enters the gap. Alternatively, for example, the air inlet 41 is positioned on the stage 1, with its outlet direction parallel to the surface of the stage 1. The air inlet 41 is flush with the gap, and the airflow from the air inlet 41 enters the gap directly. Alternatively, for example, the outlet direction of the air inlet 41 forms a set angle with the surface of the stage 1, and the angle is less than 90 degrees. The airflow from the air inlet 41 enters the gap at an angle. This angled airflow is more conducive to the separation of the substrate 5 and the carrier plate 6.

[0053] In another embodiment, when the substrate 5 is a flexible substrate, the edge of the flexible substrate can be manually separated along the carrier plate 6 to form an opening to create a gap.

[0054] like Figure 4 The diagram shown is a structural schematic of a separation device provided in an embodiment of the present invention. The separation device is mounted on a base, which has a certain accommodating space for accommodating structures such as an air pump, a vacuum generator, and an electrical control system.

[0055] As shown in the figure, the sealing structure 2 is connected to the platform 1 and the sealing structure 3 by a rotating method to form a sealed cavity 7, and the sealing structure 3 is fixedly installed on the sealing structure.

[0056] This utility model embodiment provides a circuit board 5 forming equipment, including the above-mentioned separation device. During the circuit board 5 fabrication process, after the electronic devices are fabricated on the board 5, the board 5 and the carrier plate 6 are moved to the stage 1 manually or automatically, and the separation device is used to separate the board 5 and the carrier plate 6.

[0057] This utility model provides a separation device and circuit board 5 forming equipment. In use, the completed electronic device substrate 5 and carrier plate 6 are placed in a sealed cavity 7. Then, the inflation component 4 is activated, and the inflation port 41 blows air into the gap between the substrate 5 and the carrier plate 6. The blown air enters the gap, using air to separate the substrate 5 and the carrier plate 6. As the blowing continues, the substrate 5 and the carrier plate 6 are completely separated by the gas. This utility model's technical solution utilizes the gas blown from the inflation port to separate the substrate 5 and the carrier plate 6. This gas separation method does not exert excessive force on the substrate 5 and the carrier plate 6, ensuring effective separation while reducing damage to the substrate 5, thereby improving product yield.

[0058] This embodiment also provides a device fabrication apparatus. The aforementioned separation device can be part of the device fabrication apparatus. This device fabrication apparatus can also be used to form conductive lines or electronic components on the substrate 5 before separation. It should be noted that the separation device provided in this embodiment can also be a standalone device, used only for separating the substrate 5 from the carrier plate 6.

[0059] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. Furthermore, the described specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0061] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A separation device for separating a substrate and a carrier plate stacked together, characterized in that, include: The stage (1) includes a support position for supporting the substrate (5) and the carrier plate (6); The sealing structure (2) is located above the platform (1); A sealing structure (3) is provided, wherein the sealing cap structure is connected to the platform (1) via the sealing structure (3), and the sealing cap structure (2), the sealing structure (3), and the platform (1) form a sealed cavity (7), wherein the bearing position is located within the sealed cavity (7); and An inflation assembly (4) includes an inflation port (41) located within the sealed cavity (7). The inflation port (41) is positioned facing the substrate (5) and the carrier plate (6) to blow air into the gap formed by the substrate (5) and the carrier plate (6).

2. The separation device according to claim 1, characterized in that, The platform (1) also includes a fixing structure; The substrate (5) or the carrier plate (6) is positioned at the bearing position by the fixing structure.

3. The separation device according to claim 2, characterized in that, The fixing structure includes a vacuum suction tube; The vacuum suction tube is located inside the stage (1). The vacuum suction tube includes multiple suction ports, which are located at the support position. The vacuum suction tube is connected to a vacuum generating device.

4. The separation device according to claim 1, characterized in that, The sealing structure (2) and the platform (1) are separate structures; The capping structure (2) is located in a set position, and the capping structure (2), the sealing structure (3) and the platform (1) form the sealing cavity (7).

5. The separation device according to claim 4, characterized in that, One end of the sealing structure (3) is fixedly connected to the capping structure (2). When the capping structure (2), the sealing structure (3), and the platform (1) form a sealed cavity (7), the other end of the sealing structure (3) abuts against the platform (1); or One end of the sealing structure (3) is fixedly connected to the platform (1). When the cover structure (2), the sealing structure (3), and the platform (1) form a sealed cavity (7), the cover structure (2) abuts against the other end of the sealing structure (3).

6. The separation device according to claim 4, characterized in that, One end of the sealing structure (2) is rotatably connected to the platform (1) via a rotating structure (8). The sealing structure (2) is rotated to the set position via the rotating structure (8) to form the sealed cavity (7); or The sealing structure (2) is connected to a lifting structure on the side away from the sealing structure (3) and the platform (1). The sealing structure (2) is moved to the set position through the lifting structure to form the sealing cavity (7).

7. The separation device according to claim 1, characterized in that, The air inlet (41) is located on one side of the substrate (5) and the carrier plate (6); The air inlet (41) is used to blow air into the gap on one side of the substrate (5) and the carrier plate (6).

8. The separation device according to claim 7, characterized in that, The sealed cavity (7) has a plurality of air inlets (41) spaced apart on one side of the substrate (5) and the carrier plate (6); Multiple air inlets (41) are used to simultaneously blow air into the gaps on one side of the substrate (5) and the carrier plate (6).

9. The separation device according to claim 8, characterized in that, The air inlet (41) is located on the platform (1), and the air outlet direction of the air inlet (41) is perpendicular or parallel to the plane of the platform (1); or The air outlet (41) has a set angle with the surface of the platform (1), and the set angle is less than 90 degrees.

10. A device fabrication apparatus, characterized in that, Includes the separation device as described in any one of claims 1 to 9.

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