Ceramic packaging shell for IPM and IPM

Abstract

The utility model provides a ceramic packaging shell for an IPM (Intelligent Power Module) and the IPM. The ceramic packaging shell comprises a ceramic tube base and a cover plate, and the ceramic tube base is provided with a containing groove capable of forming a cavity with the cover plate. A first metallization area and a second metallization area are arranged at the two ends of the bottom of the containing groove respectively, the first metallization area is used for installing a functional circuit needed by the IPM, and the second metallization area is used for installing a power device; the ceramic tube seat is provided with a first leading-out terminal group and a second leading-out terminal group; the first leading-out terminal group is electrically connected with the first metallization area and comprises a plurality of low-current pins; the second leading-out terminal group is electrically connected with the second metallization area and comprises a plurality of small current pins and a plurality of large current pins. According to the ceramic packaging shell, the IPM can have good heat dissipation performance and electrical insulation performance, and therefore it is guaranteed that the IPM can still operate at high performance in a harsh environment.

Description

Technical Field

[0001] This application relates to the technical field of power switching devices, and more specifically to a ceramic package for an IPM and the IPM itself. Background Technology

[0002] IPM (Intelligent Power Module) is a general term for modules that integrate power devices such as IGBTs, MOSFETs, and FRDs with functional circuits such as drive circuits and protection circuits. Due to its high degree of integration, modularity, and intelligence, IPM can significantly improve the reliability, efficiency, and ease of use of power electronic equipment. Therefore, IPM plays an important role in modern power electronics technology.

[0003] Currently, most IPMs on the market use plastic encapsulation. However, due to the numerous problems with plastic materials in terms of thermal conductivity, mechanical strength, and electromagnetic shielding performance, the application of IPMs is limited.

[0004] Therefore, there is an urgent need for a packaging shell that can support IPM to maintain high performance operation in harsh environments. Utility Model Content

[0005] To address or improve the aforementioned problems in the prior art, the first aspect of this application provides a ceramic packaging housing for IPM, including a ceramic tube base and a cover plate, wherein the ceramic tube base has a receiving groove capable of forming a cavity with the cover plate.

[0006] The bottom of the receiving tank is provided with a metallized area, which includes a first metallized area and a second metallized area respectively disposed at both ends of the bottom of the receiving tank. The first metallized area is used to install the functional circuit required by the IPM, and the second metallized area is used to install power devices.

[0007] The ceramic tube socket is provided with a first lead group and a second lead group on its outer side; the first lead group is electrically connected to the first metallized region and includes multiple low-current pins; the second lead group is electrically connected to the second metallized region and includes multiple low-current pins and multiple high-current pins; the high-current pins can withstand a current intensity greater than that of the low-current pins.

[0008] The ceramic package provided by the aforementioned solution has excellent electrical insulation properties, and because the ceramic material maintains a stable shape and size under different temperature changes, it ensures the high-performance operation of the IPM in various temperature environments. Furthermore, two sets of leads are provided for the IPM's functional circuits and power devices respectively, and pins supporting higher currents are provided in the lead group corresponding to the power devices to meet the operating requirements of the power devices and improve the reliability of the IPM.

[0009] In addition, due to the excellent thermal conductivity of ceramic materials, it can provide a better heat dissipation environment for the IPM during operation, thereby avoiding damage to the internal components and circuits of the IPM caused by poor heat dissipation.

[0010] Optionally, the first metallized region includes an assembly region and a conductive strip; wherein the assembly region is used to mount functional circuitry; the conductive strip passes through the sidewall of the ceramic socket and is used to electrically connect the functional circuitry to the first lead group.

[0011] The second metallization region includes a first mounting region, or includes both a first mounting region and a second mounting region. The first mounting region is used to mount an insulated-gate bipolar transistor (IGBT), and the second mounting region is used to mount at least a fast recovery diode (FRD) or a metal-oxide-semiconductor field-effect transistor (MOSFET).

[0012] Optionally, the second metallized area includes a plurality of sub-areas arranged sequentially and spaced apart; at least some of the sub-areas include the first mounting area, or include the first mounting area and the second mounting area;

[0013] Some sub-regions have protrusions that face and embed into adjacent sub-regions located on one side of the sub-region;

[0014] The first mounting area is close to the first metallized area, and the protrusion is far away from the first metallized area.

[0015] Optionally, the outer wall of the ceramic socket is provided with a plurality of first-side pads and a plurality of second-side pads, wherein the first-side pads are electrically connected to the low-current pins and the corresponding first metallization area or second metallization area, and are located on the same side of the ceramic socket as the metallization area to which they are electrically connected; the second-side pads are electrically connected to the high-current pins and the corresponding second metallization area, and are located on the same side of the ceramic socket as the second metallization area.

[0016] By placing the corresponding metallized areas on the same side as the lead-out groups, it facilitates rational internal wiring when functional circuits and power devices are electrically connected to their respective lead-out groups. Furthermore, due to the internal partitioning and rational wiring, when an IPM using this ceramic package experiences a problem, the location of the problem can be quickly identified.

[0017] Optionally, the top of the ceramic tube base is provided with a plurality of end face pads that are connected one-to-one with the first side pads and / or the second side pads; preferably, the end face pads are integrally formed with the corresponding first side pads or second side pads.

[0018] As mentioned above, the end face pads and the corresponding low-current or high-current pins can form side wrap corners, thereby providing additional structural support for the corresponding pins. This helps to disperse external forces or stresses, avoids fatigue or cracking of the solder joints when subjected to mechanical vibration or thermal expansion and contraction, and improves the durability of the solder joints.

[0019] Optionally, the ceramic tube seat is provided with a sealing pad surrounding the opening of the receiving groove; correspondingly, the surface of the cover plate is provided with a first solder layer, which is used to fused and seal with the sealing pad.

[0020] Optionally, a through hole penetrating the sidewall of the ceramic tube is provided between the high-current pin and the receiving groove. A conductive post is provided in the through hole, with one end of the conductive post electrically connected to the second metallization region and the other end electrically connected to the high-current pin.

[0021] Specifically, since the power devices located on the second metallization region have a large operating current, placing conductive pillars, especially copper pillars, between the metallization region and the high-current pins can help reduce energy loss in current transmission, improve overall electrical efficiency, and effectively improve the current carrying capacity of the IPM due to the large cross-sectional area of ​​the conductive pillars.

[0022] Optionally, a hollow area is provided at the bottom of the receiving groove; a heat-conducting block is provided in the hollow area, and the heat-conducting block is in contact with the second metallized area.

[0023] In the aforementioned alternative, the heat-conducting block is used to draw out the heat generated when the power device is working, so as to achieve the purpose of heat dissipation for the power device and IPM.

[0024] Optionally, a heat-conducting plate is provided on the bottom outer surface of the ceramic tube base. The heat-conducting plate contacts the heat-conducting block, and the heat-conducting plate fixes the heat-conducting block inside the hollow area.

[0025] Optionally, multiple heat dissipation fins are provided on the side of the heat-conducting plate facing away from the heat-conducting plate to enhance the heat dissipation effect of the heat-conducting plate.

[0026] In the aforementioned alternative solutions, by setting a heat-conducting plate and heat dissipation fins on the heat-conducting plate, the heat generated by the power devices and IPM during operation can be drawn out, thereby improving the heat dissipation effect.

[0027] In a second aspect of this application, an IPM is further provided, comprising: a power device, a functional circuit, and a ceramic package for the IPM as provided in the first aspect of the technical solution and any of its alternatives.

[0028] In summary, the ceramic package housing for IPM provided in this application has good heat dissipation performance. Furthermore, due to the good mechanical properties of ceramic material, it can maintain a stable shape and size in environments with temperature changes. This gives IPMs using this housing advantages such as high thermal resistance and low electrical insulation performance, thereby meeting the application requirements for maintaining high-performance operation in harsh environments.

[0029] Furthermore, the ceramic package provided in this application, through the rational layout of the internal metallized area and the connection of functional circuits and power devices to pins that support different operating currents, effectively improves the current carrying capacity of the module and helps to ensure the stable operation of the IPM. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0031] Figure 1 This is a top view of the ceramic packaging shell provided in an embodiment of this application, showing the metallized areas at the bottom of the receiving groove;

[0032] Figure 2 This is a side view of a ceramic encapsulation housing provided in an embodiment of the present application, showing a first lead-out terminal group disposed on the ceramic encapsulation housing;

[0033] Figure 3 This is a side view of another ceramic encapsulation housing provided in an embodiment of this application, showing a second lead-out terminal group disposed on the ceramic encapsulation housing;

[0034] Figure 4 This is a cross-sectional view of the ceramic packaging shell provided in an embodiment of this application, showing the heat-conducting block and related structures at the bottom of the receiving groove;

[0035] Figure 5 This is a partial cross-sectional view of a ceramic package shell provided in an embodiment of this application, showing structural details around the conductive pillars;

[0036] Figure 6 A bottom view of the ceramic packaging shell provided in the embodiments of this application;

[0037] Figure 7 This is a schematic diagram of the fin structure involved in the embodiments of this application;

[0038] Figure 8 This is a schematic diagram of the cover plate structure involved in the embodiments of this application;

[0039] Figure 9 This is a schematic diagram of the region division and shape of the second metallized region in an embodiment of this application.

[0040] The image is labeled as follows:

[0041] 1: Ceramic socket, 2: Cover plate, 3: Low-current pin, 4: High-current pin, 5: End face pad

[0042] 6: Sealed pad, 7: Heat-conducting block, 8: Heat-conducting plate;

[0043] 11: First metallized area; 111: Assembly area; 112: Guide belt; 12: Second metallized area; 121: First mounting area; 122: Second mounting area; 123: Protrusion.

[0044] 1201: First sub-region, 1202: Second sub-region;

[0045] 13: Through hole; 14: Conductive post; 15: Hollowed-out area;

[0046] 21: First solder layer;

[0047] 31: First side pad; 41: Second side pad;

[0048] 81: Heat dissipation fins; 82: Second solder layer. Detailed Implementation

[0049] In this specification, it will also be understood that when a component / circuit is referred to as being "connected to" other components / circuits relative to them, such as "connected to" other components / circuits, that component / circuit may be directly connected to or directly coupled to other components / circuits, or there may be an intervening third component / module / unit / circuit.

[0050] This application will now be described more fully below with reference to the accompanying drawings. However, this application can be implemented in many different ways and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided herein to make this application more detailed and complete, and to fully convey the scope of this application to those skilled in the art. The same reference numerals denote the same objects throughout the drawings.

[0051] This application provides a ceramic packaging shell for IPM and an IPM product using the shell.

[0052] The ceramic encapsulation shell provided in this application embodiment includes, for example: Figure 1 The ceramic tube seat 1 shown and as shown Figure 8 The cover plate 2 shown has a receiving groove that can form a cavity with the ceramic tube seat 1.

[0053] The ceramic tube base 1 serves multiple functions, including heat dissipation, mechanical protection, electrical insulation, and thermal expansion matching. Its main body is a one-piece molded ceramic structure. Optionally, the ceramic tube base 1 can be made of aluminum nitride, which has high thermal conductivity and high electrical insulation.

[0054] In a preferred embodiment, such as Figure 1 As shown, the edges of the receiving groove on the ceramic tube socket 1 are rounded or chamfered. The bottom of the receiving groove is provided with a metallized area, one end of which is provided with a first metallized area 11 and the other end is provided with a second metallized area 12. The first metallized area 11 is used to install the functional circuit required by the IPM, and the second metallized area 12 is used to install power devices.

[0055] The aforementioned power devices include power semiconductor devices such as IGBTs (Insulated Gate Bipolar Transistors), FRDs (Fast Recovery Diodes), and MOSFETs (Metal Oxide Semiconductor Field Effect Transistors).

[0056] The functional circuits required for the aforementioned IPM include at least one of, for example, a drive circuit and a protection circuit. The drive circuit may be a gate drive circuit, and the protection circuit may be a fault detection and protection circuit for overcurrent, overvoltage, undervoltage, overheating, etc.

[0057] The ceramic tube socket 1 has a first lead-out group and a second lead-out group on its outer side. These groups are used to establish electrical connections between the functional circuits and power devices within the socket cavity and external circuits. The first and second lead-out groups are located on different sides of the socket. For example... Figure 1 and Figure 2 As shown, the first lead group is electrically connected to the first metallized region 11 and includes multiple low-current pins 3; Figure 1 and Figure 3 As shown, the second lead group is electrically connected to the second metallization region 12 and includes multiple low-current pins 3 and multiple high-current pins 4.

[0058] In this embodiment, the physical dimensions of the high-current pin 4, such as its width, are wider than those of the low-current pin 3, and optionally, its thickness is also greater, to reduce resistance and heat loss. Compared to the low-current pin 3, it can carry a larger current. The specific parameters for the high-current pin 4 and the low-current pin 3 in this embodiment can be designed with reference to the application scenario and existing technology, and are not detailed in this embodiment.

[0059] like Figure 1As shown, the first metallized region 11 may specifically include an assembly region 111 and a conductive strip 112; wherein, the assembly region 111 is used to mount the functional circuit; the conductive strip 112 passes through the sidewall of the ceramic tube socket 1 and is used to electrically connect the functional circuit to the first lead group. The assembly region 111 is generally rectangular, and its size and number can be determined according to the actual situation of the functional circuit. The conductive strip 112 is strip-shaped, and can be a straight strip or a bent strip. The number of conductive strips 112 depends on the number of leads and connection relationships of the functional circuit, and is generally adapted to the number of small current pins 3 arranged on the same side.

[0060] like Figure 1 As shown, in a typical embodiment, the conductive strip 112 includes two types. The first type is directly electrically connected to the assembly area 111 or is an integral structure. In this way, the electrodes in the functional circuit (such as the back electrode) can be pasted to or soldered to the assembly area 111 through a conductive medium, so that the electrodes of the functional circuit can be electrically connected to the corresponding low-current pin 3 through this first type of conductive strip 112. The second type of conductive strip 112 is spaced apart from the assembly area 111. The electrodes in the functional circuit (such as the front electrode) can be connected to this second type of conductive strip 112 through metal bonding wire, so as to achieve electrical connection with the low-current pin 3.

[0061] As mentioned above, the second metallization region 12 is used to mount power devices so that the power devices can be electrically connected to the corresponding pins.

[0062] In one implementation, the second metallization region 12 includes at least a first mounting region 121 for mounting IGBTs.

[0063] In another implementation, such as Figure 1 As shown, the second metallization region 12 includes a first mounting region 121 and a second mounting region 122, wherein the first mounting region 121 is used to mount an IGBT, and the second mounting region 122 is used to mount at least an FRD or a MOSFET. Of course, depending on the actual power devices required by the IPM, the second metallization region 12 may further include a third mounting region (not shown), and the second mounting region 122 and the third mounting region are used to mount an FRD and a MOSFET, respectively.

[0064] This embodiment does not particularly limit the specific mounting method of the power device on the second metallization region 12. Common mounting methods in the art can be used. For example, IGBTs can be fixed to the first mounting region 121 by sintering or other methods. In addition, depending on the electrode arrangement of the power device, conductive adhesive or insulating adhesive can also be used to fix it to the second metallization region 12.

[0065] In a typical embodiment, such as Figure 1 As shown, the bottom of the receiving groove is along the first direction ( Figure 1 In the longitudinal direction, a first metallized region 11 and a second metallized region 12 are respectively provided. The first metallized region 11 further includes a metallized region along the second direction ( Figure 1 The second metallized region 12 includes multiple assembly areas 111 arranged in the horizontal direction. The second metallized region 12 includes multiple sub-regions arranged sequentially along the aforementioned second direction. In some of the sub-regions, a first mounting area 121 and a second mounting area 122 are respectively arranged along the first direction, wherein the first mounting area 121 is relatively closer to the first metallized region 11.

[0066] Typically, in Figure 1 and Figure 9 In the illustrated embodiment, there are five sub-regions, with the four right-hand sub-regions each having a first mounting area 121 and a second mounting area 122. Within these sub-regions, a portion of the electrodes of a power device on one sub-region can be connected to its adjacent left-hand sub-region via metal bonding wires, thereby achieving electrical connection with the corresponding pins. For example, the front electrode of the IGBT on the first mounting area 121 of a certain sub-region can be connected to its adjacent left-hand sub-region via metal bonding wires.

[0067] like Figure 9 As shown, some sub-regions in the second metallized region 12 have protrusions 123 facing and embedded in one side of adjacent sub-regions, for example, according to Figure 9 From left to right, the first sub-region on the left forms a protrusion 123 facing the second sub-region, making the sub-region approximately "L"-shaped; the second sub-region forms a protrusion 123 facing the third sub-region, and the third sub-region forms a protrusion 123 facing the fourth sub-region. By adopting the above-mentioned protrusion 123 configuration, some electrodes of the power device located on the right sub-region can be connected to the protrusion 123 on its adjacent left sub-region via metal bonding wires, thereby shortening the size of the metal bonding wires, avoiding interference between the bonding wires, and also reducing the difficulty of wire bonding.

[0068] In a typical embodiment, such as Figure 9 As shown, the sub-regions in the second metallized region 12 include multiple first sub-regions 1201, and a second sub-region 1202 located in the lower left corner of the figure; wherein, some of the multiple first sub-regions 1201 may have the same width, for example... Figure 9 The first three sub-regions 1201, starting from the left, each include a first mounting area and a second mounting area; among the multiple sub-regions 1201, there may also be wider sub-regions 1201, for example... Figure 9 The rightmost first sub-region 1201 includes three sets of first mounting areas and second mounting areas. Each first sub-region 1201 is electrically connected to one or more high-current pins in the second lead group.

[0069] like Figure 9 As shown, the second sub-region 1202 is approximately "L"-shaped and is electrically connected to at least one low-current pin in the second lead group. The second sub-region 1202 also has protrusions that face and are embedded in the adjacent sub-regions, and components on the adjacent sub-regions can be connected to the second sub-region 1202 via bonding wires to achieve electrical connection between the power devices and the low-current pins in the second lead group.

[0070] In a preferred embodiment, such as Figure 2 and Figure 3 As shown, the outer wall of the ceramic tube socket 1 is provided with a plurality of first-side pads 31 and a plurality of second-side pads 41. The plurality of first-side pads 31 are connected one-to-one with a plurality of low-current pins 3 and are electrically connected to the first metallization region 11 or the second metallization region 12 corresponding to the low-current pins 3; the plurality of second-side pads 41 are connected one-to-one with a plurality of high-current pins 4 and are electrically connected to the second metallization region 12 corresponding to the high-current pins 4.

[0071] A portion of the plurality of first-side pads 31 are disposed on the side of the ceramic tube seat 1 near the first metallization region 11. Figure 2 The arrangement of the first side pad 31 is shown, and another part is disposed on the side of the ceramic tube seat 1 near the second metallization region 12. Figure 3 The arrangement of the first-side pads is shown. Multiple second-side pads 41 are all located on the side of the ceramic socket 1 closest to the second metallization region 12. Figure 3 The arrangement of the second side pad 41 is shown.

[0072] For the aforementioned first-side pad 31 or second-side pad 41, in the actual processing, the conductor paste can be printed on the predetermined position of the ceramic green body. After high-temperature co-firing (HTCC), the metal layer formed based on the conductor paste is used to form the required pad. The pad is then fixed to the corresponding low-current pin 3 or high-current pin 4 by welding to form an electrical connection.

[0073] In a preferred embodiment, such as Figure 1 , Figure 4 or Figure 5 As shown, the top of the ceramic tube base 1 is provided with a plurality of end face pads 5 that are connected one-to-one with the first side pad 31 and / or the second side pad 41.

[0074] In a typical embodiment, the end face pad 5 is integrally formed with the corresponding first side pad 31 or second side pad 41. That is, in a specific processing step, the end face pad 5 and the corresponding first side pad 31 or second side pad 41 are made of the same material and are integrally formed in the same process.

[0075] from Figure 4 or Figure 5 As can be seen from the cross-sectional structure shown, the end face pad 5 can form a side wrap corner together with the corresponding side pad and the small current pin 3 or large current pin 4 mounted on the side pad. This can provide additional mechanical support for the pin and help to disperse external forces or stresses, preventing fatigue or cracking of the solder joint when subjected to mechanical vibration or thermal expansion and contraction, thereby improving the durability of the solder joint.

[0076] In a typical embodiment, such as Figure 1 As shown, the ceramic tube seat 1 is provided with a sealing pad 6 surrounding the opening of the receiving groove. Specifically, the sealing pad 6 is provided on the top surface of the ceramic tube seat 1 and is located inside the end face pad 5; correspondingly, as Figure 8 As shown, a first solder layer 21 is provided on the surface of the cover plate 2, which is used to fused and seal with the sealing pad 6.

[0077] Optionally, the first solder layer 21 is a gold-tin soft solder layer.

[0078] In a preferred embodiment, to further enhance the current conduction capability of the high-current pin 4, such as... Figure 5 As shown, a through hole 13 penetrating the side wall of the ceramic tube seat 1 is provided between the high current pin 4 and the receiving groove. A conductive post 14 is provided in the through hole 13. One end of the conductive post 14 is electrically connected to the second metallization region 12, and the other end is electrically connected to the high current pin 4.

[0079] In a typical embodiment, one end of the conductive post 14 is connected to the second metallized region 12 inside the receiving groove by brazing.

[0080] In a typical embodiment, such as Figure 5 As shown, one end of the conductive post 14 is connected to the second metallization region 12, and the other end is connected to the second side pad 41, and an electrical connection with the high current pin 4 is indirectly formed through the second side pad 41.

[0081] In a preferred embodiment, the conductive pillar 14 is a copper pillar.

[0082] In high-power applications, good conductivity is crucial for the stable operation of the system. IPMs, especially power devices such as IGBTs, can have peak currents exceeding 30 amperes during operation. Copper has excellent conductivity, and its low resistance helps reduce energy loss during current transmission and improve overall electrical efficiency. Combined with conductive pillars 14, especially copper conductive pillars which have a significantly larger cross-sectional area than conventional metallization layers, the current carrying capacity of the module can be effectively improved.

[0083] Considering that high-power devices, especially IGBTs, generate a large amount of heat during operation, it is preferable to use, such as Figure 4 or Figure 5 As shown, a hollow area 15 is provided at the bottom of the receiving groove, and a heat-conducting block 7 is embedded in the hollow area 15. The heat-conducting block 7 is in contact with the second metallized region 12 to conduct heat. Typically, the heat-conducting block 7 is located at the bottom of the second metallized region 12. Preferably, the heat-conducting block 7 is located below the IGBT; preferably, the upper surface of the heat-conducting block 7 is flush with the bottom surface of the receiving groove, so that the bottom surface of the receiving groove forms a relatively flat surface.

[0084] The heat-conducting block 7 can be made of beryllium oxide, which has the characteristics of high thermal conductivity and low coefficient of thermal expansion, effectively improving the overall performance of the IPM.

[0085] Furthermore, such as Figure 4 and Figure 5 As shown, a heat-conducting plate 8 is also provided on the bottom outer surface of the ceramic tube base 1. The heat-conducting plate 8 contacts the heat-conducting block 7 and is welded to the bottom of the ceramic tube base 1 through a second solder layer 82. While the heat-conducting plate 8 contacts the heat-conducting block 7 to transfer heat, the heat-conducting plate 8 can also fix the heat-conducting block 7 inside the hollow area 15 at the bottom of the receiving groove.

[0086] The heat-conducting plate 8 can dissipate the heat generated by the power devices in the cavity during operation. The heat-conducting plate 8 can be a heat sink, and can be a tungsten copper alloy plate.

[0087] To further enhance the heat dissipation effect of the packaging shell, in a preferred embodiment, such as... Figure 7 As shown, multiple heat dissipation fins 81 are provided on the outer side of the heat conduction plate 8. Optionally, the heat dissipation fins 81 can be fixed to the heat conduction plate 8 by mechanical fixing, welding, or using thermally conductive adhesive, as long as good contact is formed between the heat dissipation fins 81 and the heat conduction plate 8 to ensure the heat dissipation effect.

[0088] In one specific embodiment, the multiple heat dissipation fins 81 have different shapes. For example... Figure 7 As shown, the heat dissipation fins 8 located in the middle of the heat-conducting plate 8 are straight plates, while the remaining heat dissipation fins 81 are symmetrically distributed on both sides of the straight plate-shaped heat dissipation fins. Preferably, the curvature of the other heat dissipation fins extending to both sides from the straight plate-shaped heat dissipation fins gradually increases.

[0089] Based on the aforementioned packaged housing embodiments, this application further provides an embodiment of an IPM product, including the ceramic packaged housing provided in the aforementioned embodiments, and power devices and functional circuits disposed within the ceramic packaged housing.

[0090] In a preferred embodiment, the ceramic package of the aforementioned IPM is further filled with potting compound to fill the internal gaps of the cavity, providing electrical insulation protection for functional circuits and power devices. In addition, the potting compound can also reduce the damage to internal electronic components caused by shocks and vibrations during use.

[0091] In summary, the ceramic encapsulation shell for IPM and the IPM product using the shell provided in this application have excellent electrical insulation properties, stable morphological characteristics, good sealing effect, and a reasonable internal and lead layout, which facilitates product installation and wiring. Furthermore, they have good heat dissipation performance. In addition, compared to existing IPMs using plastic encapsulation, the ceramic encapsulation shell provided in this application eliminates the need for plastic encapsulation molds during processing, thus saving on mold design and manufacturing costs, making it more suitable for small-batch, dedicated IPM products.

[0092] The above description is only a partial embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the embodiments of this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A ceramic packaging shell for IPM, characterized in that, It includes a ceramic tube seat (1) and a cover plate (2), wherein the ceramic tube seat (1) has a receiving groove that can form a cavity with the cover plate (2); The bottom of the receiving tank is provided with a metallized area, which includes a first metallized area (11) and a second metallized area (12) respectively disposed at both ends of the bottom of the receiving tank. The first metallized area (11) is used to install functional circuits, and the second metallized area (12) is used to install power devices. The ceramic tube base (1) is provided with a first lead-out group and a second lead-out group on its outer side; the first lead-out group is electrically connected to the first metallized region (11) and includes a plurality of small current pins (3); the second lead-out group is electrically connected to the second metallized region (12) and includes a plurality of small current pins (3) and a plurality of large current pins (4); the large current pins (4) can withstand a current intensity greater than that of the small current pins (3).

2. The ceramic encapsulation shell according to claim 1, characterized in that, The first metallized region (11) includes an assembly region (111) and a guide strip (112); the assembly region (111) is used to mount the functional circuit; the guide strip (112) passes through the sidewall of the ceramic tube seat (1) and is used to electrically connect the functional circuit to the first lead-out terminal group; The second metallization region (12) includes a first mounting region (121), or includes a first mounting region (121) and a second mounting region (122); the first mounting region (121) is used to mount an insulated gate bipolar transistor, and the second mounting region (122) is used to mount at least a fast recovery diode or a metal-oxide-semiconductor field-effect transistor.

3. The ceramic encapsulation shell according to claim 1, characterized in that, The second metallized region (12) includes a plurality of sub-regions arranged sequentially and spaced apart; at least some of the sub-regions include a first mounting region (121), or include a first mounting region (121) and a second mounting region (122); Some of the sub-regions have protrusions that face and are embedded into adjacent sub-regions located on one side of the sub-region; The first mounting area (121) is close to the first metallized area (11), and the protrusion is far away from the first metallized area (11).

4. The ceramic encapsulation shell according to claim 1, characterized in that, The outer wall of the ceramic tube seat (1) is provided with a plurality of first side pads (31) and a plurality of second side pads (41), wherein: The first side pad (31) is electrically connected to the low current pin (3) and the corresponding first metallization area (11) or second metallization area (12), and is located on the same side of the ceramic tube base (1) as the electrically connected metallization area; The second side pad (41) is electrically connected to the high current pin (4) and the corresponding second metallization area (12), and is located on the same side of the ceramic tube socket (1) as the second metallization area (12).

5. The ceramic encapsulation shell according to claim 4, characterized in that, The top of the ceramic tube base (1) is provided with a plurality of end face pads (5) that are connected one-to-one with the first side pad (31) and / or the second side pad (41); The end face pad (5) is integrally formed with the corresponding first side pad (31) or second side pad (41).

6. The ceramic encapsulation shell according to claim 1, characterized in that, The ceramic tube seat (1) is provided with a sealing pad (6) surrounding the opening of the receiving groove; The cover plate (2) has a first solder layer (21) on its surface, which is used to fused and seal with the sealing pad (6).

7. The ceramic encapsulation housing according to any one of claims 1 to 5, characterized in that, A through hole (13) penetrating the side wall of the ceramic tube seat (1) is provided between the high current pin (4) and the receiving groove. A conductive post (14) is provided in the through hole (13). One end of the conductive post (14) is electrically connected to the second metallized area (12), and the other end is electrically connected to the high current pin (4).

8. The ceramic encapsulation shell according to claim 1, characterized in that, The bottom of the receiving groove is provided with a hollow area (15); A heat-conducting block (7) is provided in the hollow area (15), and the heat-conducting block (7) is in contact with the second metallized area (12).

9. The ceramic encapsulation shell according to claim 8, characterized in that, A heat-conducting plate (8) is provided on the bottom outer surface of the ceramic tube base (1). The heat-conducting plate (8) contacts the heat-conducting block (7) and fixes the heat-conducting block (7) in the hollow area (15).

10. The ceramic encapsulation shell according to claim 9, characterized in that, Multiple heat dissipation fins (81) are provided on the outer side of the heat-conducting plate (8).

11. An IPM, characterized in that, include: The ceramic encapsulation housing as described in any one of claims 1 to 10; Power devices and functional circuits disposed within the ceramic package.

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