Chip sputtering mask sheet reversing test equipment

Abstract

The utility model relates to the technical field of sputtering mask piece reversing testing equipment, in particular to chip sputtering mask piece reversing testing equipment which comprises a rack, a bearing jig feeding mechanism, a bearing jig grabbing mechanism, a bearing jig conveying mechanism, a mask piece reversing mechanism and a chip detecting mechanism. The bearing jig feeding mechanism, the bearing jig grabbing mechanism, the bearing jig conveying mechanism, the mask sheet reversing mechanism and the wafer detection mechanism are sequentially arranged on the rack; through cooperation of the bearing jig feeding mechanism, the bearing jig grabbing mechanism, the bearing jig conveying mechanism, the mask piece reversing mechanism and the chip detection mechanism with the PLC control system, automatic stripping of mask pieces on the bearing jig after chip sputtering and automatic testing of electrical parameters of the chip after sputtering are achieved. The problems that in the manual stripping operation process of the sputtered chip mask, sputtered chips are prone to scattering, and visual inspection is difficult are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to sputtering mask piece test equipment technical field, specifically a kind of chip sputtering mask piece test equipment. BACKGROUND

[0002] At present, sputtering parameter calculation and setting before sputtering are all using artificial calculation and setting operation mode, this operation mode is greatly influenced by human factors, once parameter calculation error or parameter setting error, it will directly lead to product scrap;Secondly, the chip carrier fixture after sputtering includes upper cover plate, mask piece, gap piece and lower cover plate in turn from top to bottom, the upper cover plate and mask piece in the chip carrier fixture after sputtering adopt manual peeling (stripping) operation mode, and the electrical sampling test of chip after peeling also adopts manual operation mode. First, in the manual stripping operation process of sputtered chip mask piece, sputtered chip scattering phenomenon and visual inspection difficulty phenomenon are prone to occur, and due to the small size of chip, it leads to more and more difficult for operator to reorganize and arrange chip, and also leads to operator's visual fatigue and the appearance of other health problems;In addition, in the manual electrical sampling test operation process of sputtered chip, because there are differences in the operation method of operator, so it will lead to that sampling data is greatly influenced by human factors, leading to inaccurate chip test data, which has certain influence on subsequent production process. CONTENT OF UTILITY MODEL

[0003] The utility model intends to provide a kind of chip sputtering mask piece test equipment, to solve the problem that sputtered chip mask piece manual stripping operation process is prone to sputtered chip scattering and visual inspection difficulty.

[0004] In order to achieve the above purpose, the basic scheme of the utility model is as follows: a kind of chip sputtering mask piece test equipment, including rack, carrier fixture feeding mechanism, carrier fixture grabbing mechanism, carrier fixture conveying mechanism, mask piece peeling mechanism and chip detection mechanism, the carrier fixture feeding mechanism, carrier fixture grabbing mechanism, carrier fixture conveying mechanism, mask piece peeling mechanism and wafer detection mechanism are sequentially arranged on rack;

[0005] The mask film unloading mechanism comprises a carrier disc storage box, a carrier disc fixing seat, a carrier disc feeding assembly, a carrier disc fixing clamp jaw assembly and a mask film clamping assembly, a plurality of jig carrier discs are placed in the carrier disc storage box, the carrier disc feeding assembly takes out the jig carrier disc from the carrier disc storage box and places it on the carrier disc fixing seat, the carrier disc fixing clamp jaw assembly clamps the carrier jig from the carrier jig conveying mechanism and places it on the jig carrier disc on the carrier disc fixing seat, and the mask film clamping assembly clamps and separates the upper cover plate and the mask film in the carrier jig; the mask film clamping assembly comprises a mask film clamping X-axis, a mask film clamping jaw and a mask film storage box, the mask film clamping jaw is installed on the mask film clamping X-axis, the mask film storage box is placed directly below the moving path of the mask film clamping jaw, the mask film clamping jaw comprises a clamping jaw lifting motor, a sliding rail, a sliding block, a baffle cylinder, a clamping baffle, a clamping jaw cylinder and a magnetic clamping jaw, the sliding rail is installed on the moving part of the mask film clamping X-axis, the sliding block is vertically and slidably connected to the sliding rail, the clamping jaw lifting motor drives the sliding block to slide along the sliding rail, the baffle cylinder is vertically installed at the bottom of the sliding block, the clamping baffle is fixed on the output shaft at the bottom of the baffle cylinder, the clamping jaw cylinder is transversely installed at the bottom of the sliding block, the output shaft of the clamping jaw cylinder faces the clamping baffle, the magnetic clamping jaw is fixed on the output shaft of the clamping jaw cylinder, and an electromagnet is fixed at the end of the magnetic clamping jaw.

[0006] Further, the carrier jig feeding mechanism comprises a carrier storage bin, a storage bin Y-axis, a carrier conveying track, a carrier conveying storage bin, a carrier conversion Y-axis and a carrier sputtering track, the carrier jig to be sputtered is placed on the carrier and fed into the carrier storage bin, the carrier storage bin is installed on the output part of the storage bin Y-axis, one end of the carrier conveying track is installed on the side of the carrier storage bin, the other end of the carrier conveying track is installed on the side of the carrier conveying storage bin, the carrier conveying storage bin is installed on the output part of the carrier conversion Y-axis, and the carrier sputtering track is installed on the side of the carrier conveying storage bin.

[0007] Further, the carrier gripper grabbing mechanism comprises a carrier gripper grabbing Y-axis, a carrier gripper grabbing slide rail, a carrier gripper grabbing X-axis and a carrier gripper grabbing rotary clamp jaw, the carrier gripper grabbing Y-axis and the carrier gripper grabbing slide rail are respectively arranged on both sides of the carrier conveying material preparation bin, the carrier gripper grabbing X-axis is respectively installed on the moving parts of the carrier gripper grabbing Y-axis and the carrier gripper grabbing slide rail, the carrier gripper grabbing Y-axis drives the carrier gripper grabbing X-axis to slide, the carrier gripper grabbing rotary clamp jaw is installed on the moving part of the carrier gripper grabbing X-axis, the carrier gripper grabbing rotary clamp jaw comprises a clamp jaw lifting cylinder, a rotary cylinder, a clamping cylinder and a carrier gripper clamp jaw, the clamp jaw lifting cylinder is installed on the moving part of the carrier gripper grabbing X-axis, the rotary cylinder is horizontally installed on the moving part of the clamp jaw lifting cylinder, the clamping cylinder is installed on the moving part of the rotary cylinder, and the carrier gripper clamp jaw is installed on the clamping cylinder.

[0008] Further, the carrier gripper conveying mechanism comprises a carrier gripper conveying belt, an encoding recognition CCD, a rotary conveying belt and a positioning conveying belt, one end of the carrier gripper conveying belt is installed directly below the carrier gripper grabbing mechanism, the other end of the carrier gripper conveying belt is installed on the side edge of the rotary conveying belt, the positioning conveying belt is located on the side edge of the rotary conveying belt and is arranged perpendicularly to the carrier gripper conveying belt, and the encoding recognition CCD is arranged across the middle part of the carrier gripper conveying belt.

[0009] Further, the chip detection mechanism comprises a chip suction assembly, a chip automatic test seat and a chip inspection positioning CCD, the chip suction assembly and the chip detection positioning CCD are installed on the moving path of the wafer feeding assembly, the chip automatic test seat is installed on the side edge of the chip suction assembly, the chip suction assembly comprises a chip suction X-axis, a suction nozzle lifting cylinder, a suction nozzle rotary motor and a chip suction nozzle, the suction nozzle lifting cylinder is installed on the moving part of the chip suction X-axis, the suction nozzle rotary motor is installed on the output shaft of the suction nozzle lifting cylinder, and the chip suction nozzle is installed on the output shaft of the suction nozzle rotary motor.

[0010] Further, the chip automatic test seat comprises a base plate, a stand, a test probe, a test circuit board, a probe lifting cylinder, a chip placement seat, a placement seat moving cylinder and a chip collection cup, the stand is fixed vertically on the base plate, the probe lifting cylinder is installed vertically on the stand, the test probe is installed on the moving part of the probe lifting cylinder, the test probe is electrically connected with the test circuit board, the placement seat moving cylinder is installed horizontally on the base plate, the chip placement seat is installed on the moving part of the placement seat moving cylinder, the chip placement seat can be moved to the position directly below the test probe, and the chip collection cup is located on the side edge of the placement seat moving cylinder.

[0011] Further, the carrier disc feeding assembly comprises a carrier disc feeding Y-axis and a carrier disc feeding tongue plate, the carrier disc feeding Y-axis is arranged along the connecting direction of the carrier disc storage box and the carrier disc fixing seat, and the carrier disc feeding tongue plate is installed on the moving part of the carrier disc feeding Y-axis and can extend into the carrier disc storage box to take out the carrier disc and place it on the carrier disc fixing seat.

[0012] Further, the carrier disc storage box comprises a box body, a multi-layer placing rack and a lifting platform, the multi-layer placing rack is vertically and slidingly connected in the box body, the lifting platform drives the multi-layer placing rack to move up and down, and the side of the box body is provided with an opening, and the opening faces the carrier disc feeding assembly.

[0013] The beneficial effects of the scheme are as follows: (1) through the cooperation of the carrier jig feeding mechanism, the carrier jig grabbing mechanism, the carrier jig conveying mechanism, the mask film unloading mechanism and the chip detection mechanism with the PLC control system, the automatic peeling of the mask film on the carrier jig after sputtering and the automatic testing of the electrical parameters of the sputtered chip are realized.

[0014] (2) In the carrier jig feeding mechanism, a carrier feeding bin, a carrier feeding bin Y-axis, a carrier conveying track, a carrier conveying feeding bin, a carrier conversion Y-axis and a carrier sputtering track are arranged, and the carrier jig automatically enters the sputtering machine for sputtering and records the material after sputtering through the cooperation of the PLC control system.

[0015] (3) In the mask film clamping assembly, a carrier jig grabbing Y-axis, a carrier jig grabbing sliding rail, a carrier jig grabbing X-axis, a clamping jaw lifting cylinder, a rotating cylinder, a clamping cylinder and a carrier jig clamping jaw are arranged, the carrier jig clamping jaw can be driven by the clamping jaw lifting cylinder to grab the carrier jig, then the clamping jaw lifting cylinder drives the rotating cylinder, the clamping cylinder and the carrier jig clamping jaw to rise, and then the rotating cylinder rotates the carrier jig from a vertical state to a horizontal state.

[0016] (4) In the carrier jig conveying mechanism, an encoding recognition CCD is arranged to detect the encoding of the carrier jig in the positioning area and compare the encoding recognition with the database.

[0017] (5) In the mask film clamping assembly, a clamping jaw lifting motor, a sliding rail, a sliding block, a baffle cylinder, a clamping baffle, a clamping jaw cylinder and a magnetic clamping jaw are arranged, the clamping baffle, the clamping jaw cylinder and the magnetic clamping jaw are driven to descend by the clamping jaw lifting motor, then the target object is grabbed by the clamping baffle and the magnetic clamping jaw, since the upper cover plate in the carrier jig and the mask film are magnetic materials, the gap piece and the lower cover plate are non-magnetic materials, and the lower two layers cannot be clamped by the clamping baffle due to their own structure, thereby realizing the peeling of the mask film.

[0018] (6) The scheme sets multiple layers of placing racks and lifting platforms in the tray storage box, and drives the multiple layers of placing racks to move up and down through the lifting platforms for the tray feeding assembly to take and place the tray.

[0019] (7) The scheme sets a chip suction assembly, a chip automatic test seat and a chip inspection positioning CCD in the chip detection mechanism, the chip suction assembly can correct and arrange the scattered chips in order, and then the chip suction assembly sucks the chips and places them into the chip automatic test seat to complete the automatic test of the electrical parameters of the chips. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is an overall structural schematic view of the embodiment of the present application;

[0021] Figure 2 It is a specific structural schematic view of the bearing jig rotating clamping jaw in the embodiment of the present application;

[0022] Figure 3 It is a specific structural schematic view of the mask piece clamping clamping jaw in the embodiment of the present application;

[0023] Figure 4 It is a specific structural schematic view of the chip suction assembly in the embodiment of the present application;

[0024] Figure 5 It is a specific structural schematic view of the chip automatic test seat in the embodiment of the present application; DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] The reference numerals in the accompanying drawings include: 1. Frame; 2. Carrier with material bin; 3. Y-axis of material bin; 4. Carrier conveyor track; 5. Carrier conveyor material bin; 6. Carrier conversion Y-axis; 7. Carrier sputtering track; 8. Y-axis of carrier fixture gripping; 9. X-axis of carrier fixture gripping; 10. Gripper lifting cylinder; 11. Rotary cylinder; 12. Clamping cylinder; 13. Carrier fixture gripper; 14. Carrier fixture conveyor belt; 15. CCD for encoding and identification; 16. Rotary conveyor belt; 17. Carrier tray storage box; 18. Carrier tray fixing seat; 19. Carrier fixture fixing gripper assembly; 20. Carrier tray supply Y-axis; 21. Carrier... 22. Plate supply tongue, 23. Mask clamping X-axis, 24. Mask clamping jaws, 25. Mask storage box, 26. Jaw lifting motor, 27. Slide rail, 28. Slider, 29. Baffle cylinder, 30. Clamping baffle, 31. Jaw cylinder, 32. Magnetic jaws, 33. Chip picking assembly, 34. Automatic chip testing base, 35. Chip inspection and positioning CCD, 36. Chip picking X-axis, 37. Nozzle lifting cylinder, 38. Nozzle rotation motor, 39. Chip picking nozzle, 40. Base plate, 41. Stand, 42. Test probe, 43. Probe lifting cylinder, 44. Chip placement base, 45. Placement base movement cylinder.

[0027] Example

[0028] The basics are as follows: Figure 1 As shown: A chip sputtering mask wafer flipping test equipment includes a frame 1, a carrier fixture feeding mechanism, a carrier fixture gripping mechanism, a carrier fixture conveying mechanism, a mask wafer flipping mechanism, and a chip testing mechanism. The carrier fixture feeding mechanism, carrier fixture gripping mechanism, carrier fixture conveying mechanism, mask wafer flipping mechanism, and wafer testing mechanism are sequentially arranged on the frame 1.

[0029] The carrier fixture feeding mechanism includes a carrier material bin 2, a material bin Y-axis 3, a carrier conveying track 4, a carrier conveying material bin 5, a carrier conversion Y-axis 6, and a carrier sputtering track 7. The carrier fixture to be sputtered is placed on the carrier and fed into the carrier material bin 2. The carrier material bin 2 is installed on the output component of the material bin Y-axis 3. One end of the carrier conveying track 4 is installed on the side of the carrier material bin 2, and the other end of the carrier conveying track 4 is installed on the side of the carrier conveying material bin 5. The carrier conveying material bin 5 is installed on the output component of the carrier conversion Y-axis 6, and the carrier sputtering track 7 is installed on the side of the carrier conveying material bin 5.

[0030] The carrying jig grabbing mechanism comprises a carrying jig grabbing Y-axis 8, a carrying jig grabbing slide rail 9, a carrying jig grabbing X-axis 10 and a carrying jig grabbing rotary clamp. The carrying jig grabbing Y-axis 8 and the carrying jig grabbing slide rail 9 are respectively arranged on both sides of the carrier conveying material preparation bin 5. The two ends of the carrying jig grabbing X-axis 10 are respectively installed on the moving parts of the carrying jig grabbing Y-axis 8 and the carrying jig grabbing slide rail 9. The carrying jig grabbing Y-axis 8 drives the carrying jig grabbing X-axis 10 to slide. The carrying jig grabbing rotary clamp is installed on the moving part of the carrying jig grabbing X-axis 10. The carrying jig grabbing rotary clamp is combined with the carrying jig grabbing X-axis 10 to form a carrying jig grabbing rotary clamp mechanism. Figure 2 As shown, the carrying jig grabbing rotary clamp comprises a clamp lifting cylinder 11, a rotary cylinder 12, a clamping cylinder 13 and a carrying jig clamp 14. The clamp lifting cylinder 11 is installed on the moving part of the carrying jig grabbing X-axis 10. The rotary cylinder 12 is horizontally installed on the moving part of the clamp lifting cylinder 11. The clamping cylinder 13 is installed on the moving part of the rotary cylinder 12. The carrying jig clamp 14 is installed on the clamping cylinder 13.

[0031] The carrying jig conveying mechanism comprises a carrying jig conveying belt 15, a code recognition CCD 16, a rotary conveying belt 17 and a positioning conveying belt. One end of the carrying jig conveying belt 15 is installed directly below the carrying jig grabbing mechanism. The other end of the carrying jig conveying belt 15 is installed on the side edge of the rotary conveying belt 17. The positioning conveying belt is located on the side edge of the rotary conveying belt 17 and is arranged vertically with the carrying jig conveying belt 15. The code recognition CCD 16 is arranged across the middle part of the carrying jig conveying belt 15.

[0032] The mask film reversing mechanism comprises a carrier disc storage box 18, a carrier disc fixing seat 19, a carrier disc feeding assembly, a carrier disc fixing clamp jaw assembly 20 and a mask film clamping assembly. A plurality of jig carrier discs are placed in the carrier disc storage box 18. The carrier disc feeding assembly takes out the jig carrier disc from the carrier disc storage box 18 and places it on the carrier disc fixing seat 19. The carrier disc feeding assembly comprises a carrier disc feeding Y-axis 21 and a carrier disc feeding tongue plate 22. The carrier disc feeding Y-axis 21 is arranged along the connecting line direction of the carrier disc storage box 18 and the carrier disc fixing seat 19. The carrier disc feeding tongue plate 22 is installed on the moving part of the carrier disc feeding Y-axis 21. The carrier disc feeding tongue plate 22 can extend into the carrier disc storage box 18 to take out the jig carrier disc and place it on the carrier disc fixing seat 19. The carrier disc storage box 18 comprises a box body, a plurality of layers of placing racks and a lifting platform. The plurality of layers of placing racks are vertically and slidably connected in the box body. The lifting platform drives the plurality of layers of placing racks to move up and down. The side of the box body is provided with an opening. The opening faces the carrier disc feeding assembly. The carrier disc fixing clamp jaw assembly takes out the carrier disc from the carrier disc conveying mechanism and places it on the jig carrier disc on the carrier disc fixing seat 19. The mask film clamping assembly separates the upper cover plate in the carrier disc and the mask film. The mask film clamping assembly comprises a mask film clamping X-axis 23, a mask film clamping jaw 24 and a mask film storage box 25. The mask film clamping jaw 24 is installed on the mask film clamping X-axis 23. The mask film storage box 25 is placed directly below the moving path of the mask film clamping jaw 24. Figure 3 As shown in the combination, the mask film clamping jaw 24 comprises a clamping jaw lifting motor 26, a sliding rail 27, a sliding block 28, a baffle cylinder 29, a clamping baffle 30, a clamping jaw cylinder 31 and a magnetic clamping jaw 32. The sliding rail 27 is installed on the moving part of the mask film clamping X-axis 23. The sliding block 28 is vertically and slidably connected on the sliding rail 27. The clamping jaw lifting motor 26 drives the sliding block 28 to slide along the sliding rail 27. The baffle cylinder 29 is vertically installed on the bottom of the sliding block 28. The clamping baffle 30 is fixed on the output shaft at the bottom of the baffle cylinder 29. The clamping jaw cylinder 31 is transversely installed on the bottom of the sliding block 28. The output shaft of the clamping jaw cylinder 31 faces the clamping baffle 30. The magnetic clamping jaw 32 is fixed on the output shaft of the clamping jaw cylinder 31. The end of the magnetic clamping jaw 32 is fixed with an electromagnet.

[0033] The chip detection mechanism comprises a chip suction assembly 33, a chip automatic test seat 34 and a chip inspection positioning CCD 35. The chip suction assembly 33 and the chip inspection positioning CCD 35 are installed on the moving path of the carrier disc feeding assembly. The chip automatic test seat 34 is installed on the side of the chip suction assembly 33. Figure 4 As shown in the combination, the chip suction assembly 33 comprises a chip suction X-axis 36, a suction nozzle lifting cylinder 37, a suction nozzle rotating motor 38 and a chip suction nozzle 39. The suction nozzle lifting cylinder 37 is installed on the moving part of the chip suction X-axis 36. The suction nozzle rotating motor 38 is installed on the output shaft of the suction nozzle lifting cylinder 37. The chip suction nozzle 39 is installed on the output shaft of the suction nozzle rotating motor 38. Figure 5As shown, the chip automatic test seat 34 includes a base plate 40, a stand 41, test probes 42, a test circuit board, a probe lifting cylinder 43, a chip placement seat 44, a placement seat moving cylinder 45, and a chip collection cup. The stand 41 is vertically fixed on the base plate 40. The probe lifting cylinder 43 is vertically installed on the stand 41. The test probes 42 are installed on the moving part of the probe lifting cylinder 43. The test probes 42 are electrically connected with the test circuit board. The placement seat moving cylinder 45 is horizontally installed on the base plate 40. The chip placement seat 44 is installed on the moving part of the placement seat moving cylinder 45. The chip placement seat 44 can move to the position directly below the test probes 42. The chip collection cup is located at the side of the placement seat moving cylinder 45.

[0034] The implementation process is as follows: when the device is running, first, the sputtering carrier to be sputtered is placed on the carrier and sent into the carrier stock bin 2, after the stock is completed, the work order information is scanned using the scanning gun connected with the device, the corresponding sputtering file is called out, the device starts to run, the carrier stock bin Y axis 3 starts to move, the first track carrier in the carrier stock bin 2 is aligned with the carrier conveying track 4, the carrier is conveyed to the carrier conveying stock bin 5, at this time, the carrier conversion Y axis 6 is not moved at the original position, then the carrier passes through the carrier conveying stock bin 5 and is conveyed into the carrier sputtering track 7, the carrier is conveyed to the sputtering machine stock bin, the sputtering machine starts the sputtering program, after the first track carrier is sputtered, it is conveyed into the carrier sputtering track 7 through the sputtering machine conveying mechanism, the carrier sputtering track 7 moves reversely, the carrier is conveyed to the carrier conveying stock bin 5 into the position (remembering the track information when entering the sputtering machine), then the second track carrier to be sputtered is conveyed into the carrier sputtering track 7, then the carrier holding gripper Y axis 8 drives the carrier holding gripper X axis 10 to move to the position above the first track of the carrier conveying stock bin 5 after the sputtering is completed, then the carrier holding gripper rotating clamp descends to the height, grabs the carrier holding gripper piece above the carrier, the carrier holding gripper rotating clamp rises to the original position, then the carrier holding gripper Y axis 8 drives the carrier holding gripper X axis 10 to move to the position above the carrier conveying belt 15, then the carrier holding gripper rotating clamp rotates upward by 90° to make the carrier holding gripper horizontal and keep, then the carrier holding gripper rotating clamp descends to the height above the carrier conveying belt 15 about 5mm, then the carrier holding gripper rotating clamp opens to make the carrier holding gripper enter the carrier conveying belt 15; the carrier holding gripper is conveyed to stop at the carrier holding gripper code recognition CCD 16 and is recognized by the carrier holding gripper code recognition CCD 16, the code information is input into the sputtering file system and the jig management system, then the carrier holding gripper is conveyed to the rotating conveying belt 17 and rotates clockwise by 90° to align with the positioning conveying belt, then the carrier holding gripper is conveyed to the positioning position of the positioning conveying belt and stops;The tray supply Y-axis 21 drives the tray supply tongue plate 22 to move to the front of the tray storage box 18, then the multi-layer placing rack in the tray storage box 18 is lifted by the lifting platform, then the tray supply Y-axis 21 drives the tray supply tongue plate 22 to enter the tray storage box 18, then the multi-layer placing rack in the tray storage box 18 is lowered by the lifting platform to just place the tray on the tray supply tongue plate 22, the tray supply Y-axis 21 reverses to take out the tray supply tongue plate 22 and the tray on it from the tray storage box 18, then continues to move to the top of the tray fixing seat 19 and stops, then the built-in lifting cylinder in the tray fixing seat 19 drives the four-corner lifting platform to rise and lift the tray stopped above by a distance, then the tray supply Y-axis 21 drives the tray supply tongue plate 22 to continue to move to the original position, then the built-in lifting cylinder in the tray fixing seat 19 drives the four-corner lifting platform to lower by a certain distance to fix the tray in the tray fixing seat 19, the carrier fixture fixing jaw assembly 20 grabs the carrier fixture and places it on the tray fixed in the tray fixing seat 19, then the mask clamping X-axis 23 drives the mask clamping jaw 24 to move above the tray fixing seat 19, then the mask clamping jaw 24 is lowered by a certain height to the surface of the sputtered carrier fixture, at this time the power supply of the electromagnet on the magnetic jaw 32 generates electromagnetic force on the magnetic jaw 32, the first layer of upper cover plate and mask is magnetically attracted by the electromagnetic force, the upper cover plate and mask combination is fixed by the blocking plate cylinder 29 driving the blocking plate, the upper cover plate and mask edge is clamped by the jaw cylinder 31 driving the magnetic jaw 32, the slider 28 is slowly driven upward to the set position by the jaw lifting motor 26, realizing the separation of the upper two layers of upper cover plate, mask and the lower two layers of gap piece, lower cover plate in the carrier fixture, then the mask clamping X-axis 23 drives the mask clamping jaw 24 to move above the mask clamping box, at this time the mask clamping jaw 24 is lowered and the power supply of the magnetic jaw 32 is disconnected to place the upper cover plate and mask in the mask clamping box.The built-in lifting cylinder in the carrier fixing seat 19 drives the four-corner lifting platform to ascend a certain distance, the carrier feeding Y shaft 21 drives the carrier feeding tongue plate 22 to move to the lower side of the carrier, the built-in lifting cylinder in the carrier fixing seat 19 drives the four-corner lifting platform to descend, at this time, the carrier fixture with the peeled-off mask can be placed on the carrier feeding tongue plate 22, then the carrier feeding Y shaft 21 drives the carrier feeding tongue plate 22 to move to the chip inspection position, then the chip inspection positioning CCD 35 starts to inspect the chip arrangement position, when the chip arrangement position changes and the angle changes, at this time, the chip suction assembly 33 positions the chip according to the chip inspection positioning CCD inspection result, the suction nozzle lifting cylinder 37 drives the suction nozzle rotating motor 38 to move downward, and then the chip suction nozzle 39 sucks the irregularly arranged chip, the suction nozzle rotating motor 38 corrects the angle of the sucked chip, the suction nozzle lifting cylinder 37 drives the chip suction nozzle 39 to move downward to place the corrected angle chip on the gap sheet again, and places the defective product in the defective product box after sucking, then the chip suction assembly 33 sucks the chip at a specific position to move to the test station on the chip automatic test seat 34 to test the frequency, resistance and other electrical parameters, then places the tested chip in the chip collection cup, after the chip test is completed, the carrier feeding Y shaft 21 drives the carrier feeding tongue plate 22 to move to the carrier storage box 18, the carrier feeding Y shaft 21 drives the carrier feeding tongue plate 22 to exit the carrier storage box 18, thus completing a working cycle.

[0035] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0036] The above-mentioned is only the embodiment of the present application, and the common knowledge of the specific structure and characteristics in the scheme is not described in detail, the ordinary skilled person in the art knows all the ordinary technical knowledge in the technical field of the present application before the application date or the priority date, can know all the prior art in the field, and has the ability to apply the conventional experimental means before the date, the ordinary skilled person in the art can improve and implement the present scheme under the inspiration given in the present application, and some typical known structures or known methods should not become an obstacle for the ordinary skilled person in the art to implement the present application. It should be pointed out that for the skilled person in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, which will not affect the effect and practicality of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like in the specification can be used to explain the content of the claims.

Claims

1. A chip sputter mask strip test apparatus, characterized by: The chip detection mechanism comprises a rack, a carrier jig feeding mechanism, a carrier jig grabbing mechanism, a carrier jig conveying mechanism, a mask film reversing mechanism and a chip detection mechanism, which are sequentially arranged on the rack. The mask film reversing mechanism comprises a carrier disc storage box, a carrier disc fixing seat, a carrier disc supply assembly, a carrier jig fixing jaw assembly and a mask film clamping assembly. The carrier disc storage box is provided with a plurality of jig carrier discs. The carrier disc supply assembly takes out the jig carrier disc from the carrier disc storage box and places it on the carrier disc fixing seat. The carrier jig fixing jaw assembly grabs the carrier jig from the carrier jig conveying mechanism and places it on the jig carrier disc on the carrier disc fixing seat. The mask film clamping assembly separates the upper cover plate and the mask film in the carrier jig. The mask film clamping assembly comprises a mask film clamping X-axis, a mask film clamping jaw and a mask film storage box. The mask film clamping jaw is installed on the mask film clamping X-axis. The mask film storage box is placed directly below the moving path of the mask film clamping jaw. The mask film clamping jaw comprises a jaw lifting motor, a sliding rail, a sliding block, a baffle cylinder, a clamping baffle, a jaw cylinder and a magnetic jaw. The sliding rail is installed on the moving part of the mask film clamping X-axis. The sliding block is vertically connected to the sliding rail. The jaw lifting motor drives the sliding block to slide along the sliding rail. The baffle cylinder is vertically installed at the bottom of the sliding block. The clamping baffle is fixed to the output shaft at the bottom of the baffle cylinder. The jaw cylinder is transversely installed at the bottom of the sliding block. The output shaft of the jaw cylinder faces the clamping baffle. The magnetic jaw is fixed to the output shaft of the jaw cylinder. An electromagnet is fixed to the end of the magnetic jaw.

2. The apparatus of claim 1, wherein: The carrier jig feeding mechanism comprises a carrier feeding bin, a feeding bin Y-axis, a carrier conveying track, a carrier conveying feeding bin, a carrier conversion Y-axis and a carrier sputtering track. The carrier jig to be sputtered is placed on the carrier and sent to the carrier feeding bin. The carrier feeding bin is installed on the output part of the feeding bin Y-axis. One end of the carrier conveying track is installed on the side of the carrier feeding bin. The other end of the carrier conveying track is installed on the side of the carrier conveying feeding bin. The carrier conveying feeding bin is installed on the output part of the carrier conversion Y-axis. The carrier sputtering track is installed on the side of the carrier conveying feeding bin.

3. The apparatus of claim 2, wherein: the first and second electrodes are disposed on the substrate; and the third electrode is disposed on the sputter mask. 3 The bearing fixture grabbing mechanism comprises a bearing fixture grabbing Y-axis, a bearing fixture grabbing slide rail, a bearing fixture grabbing X-axis and a bearing fixture grabbing rotary clamp jaw, the bearing fixture grabbing Y-axis and the bearing fixture grabbing slide rail are respectively arranged on both sides of the carrier conveying material preparation bin, the two ends of the bearing fixture grabbing X-axis are respectively installed on the moving parts of the bearing fixture grabbing Y-axis and the bearing fixture grabbing slide rail, the bearing fixture grabbing Y-axis drives the bearing fixture grabbing X-axis to slide, the bearing fixture grabbing rotary clamp jaw is installed on the moving part of the bearing fixture grabbing X-axis, and the bearing fixture grabbing rotary clamp jaw comprises a clamp jaw lifting cylinder, a rotary cylinder, a clamping cylinder and a bearing fixture clamp jaw.

4. The apparatus of claim 3, wherein: the first and second electrodes are disposed on the substrate; and the third electrode is disposed on the sputter mask. 5 The bearing fixture conveying mechanism comprises a bearing fixture conveying belt, an encoding recognition CCD, a rotary conveying belt and a positioning conveying belt, one end of the bearing fixture conveying belt is installed directly below the bearing fixture grabbing mechanism, the other end of the bearing fixture conveying belt is installed on the side edge of the rotary conveying belt, the positioning conveying belt is arranged on the side edge of the rotary conveying belt and is perpendicular to the bearing fixture conveying belt, and the encoding recognition CCD is arranged in the middle part of the bearing fixture conveying belt.

5. The chip sputtering mask flipping test equipment according to claim 4, characterized in that: The chip detection mechanism comprises a chip suction assembly, a chip automatic test seat and a chip inspection positioning CCD, the chip suction assembly and the chip detection positioning CCD are installed on the moving path of the carrier disc feeding assembly, the chip automatic test seat is installed on the side edge of the chip suction assembly, the chip suction assembly comprises a chip suction X-axis, a suction nozzle lifting cylinder, a suction nozzle rotary motor and a chip suction nozzle, the suction nozzle lifting cylinder is installed on the moving part of the chip suction X-axis, the suction nozzle rotary motor is installed on the output shaft of the suction nozzle lifting cylinder, and the chip suction nozzle is installed on the output shaft of the suction nozzle rotary motor.

6. The apparatus of claim 5, wherein: The chip automatic test seat comprises a base plate, a stand, a test probe, a test circuit board, a probe lifting cylinder, a chip placement seat, a placement seat moving cylinder and a chip collection cup, the stand is vertically fixed on the base plate, the probe lifting cylinder is vertically installed on the stand, the test probe is installed on the moving part of the probe lifting cylinder, the test probe is electrically connected with the test circuit board, the placement seat moving cylinder is horizontally installed on the base plate, the chip placement seat is installed on the moving part of the placement seat moving cylinder, the chip placement seat can move to the position directly below the test probe, and the chip collection cup is located on the side edge of the placement seat moving cylinder.

7. The apparatus of claim 1 wherein: the substrate is a wafer; the sputter mask is a sputter mask for a wafer; and the test equipment is a sputter mask strip test apparatus for a wafer. The carrier disc feeding assembly comprises a carrier disc feeding Y-axis and a carrier disc feeding tongue plate, the carrier disc feeding Y-axis is arranged along the connection line direction of the carrier disc storage box and the carrier disc fixing seat, and the carrier disc feeding tongue plate is installed on the moving part of the carrier disc feeding Y-axis.

8. The apparatus of claim 7, wherein: The tray storage box comprises a box body, a multi-layer placing rack and a lifting platform, the multi-layer placing rack is vertically and slidingly connected in the box body, the lifting platform drives the multi-layer placing rack to move up and down, and the box body is provided with an opening at the side edge, and the opening faces the tray feeding assembly.

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