Multi-target magnetron sputtering coating instrument

Abstract

The utility model relates to the technical field of controlled sputtering coating equipment, and particularly discloses a multi-target magnetron sputtering coating instrument which comprises a support platform, a main cavity is mounted at the upper end of the support platform through a bottom flange, a substrate component is arranged in the main cavity, an adjusting mechanism is arranged at the upper end of the main cavity, and the substrate component is arranged in the main cavity. The adjusting mechanism comprises a substrate Y-axis rotation driver, a substrate lifting driver and a substrate X-axis rotation driver, and the interior of the main cavity is connected with a sputtering gun through an angle adjusting assembly; the magnetron sputtering coating instrument provided by the utility model is compact in overall structural design and small in occupied space; the device adopts an all-metal sealing technology, so that the sealing performance is obviously improved; the sputtering gun can be switched to a radio frequency power supply to realize coating of a non-metallic material; the angle of the sputtering gun can be adjusted as required; the substrate can freely rotate along the X axis and the Y axis and can be lifted along the Z axis; and the sputtering rate is improved, and multi-angle positions of a sample can be coated according to customer requirements.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of sputtering equipment control, specifically relates to a kind of multi-target magnetron sputtering coating instrument. BACKGROUND

[0002] Magnetron sputtering technology is a kind of physical vapor deposition technology, because it has the advantages of fast deposition speed, low substrate temperature rise, dense and uniform controllable thin film, easy to control, environmental protection and the like, it is widely used, covers multiple fields from basic research to industrial application;

[0003] Magnetron sputtering technology is under vacuum condition, generally argon is imported, a large number of argon ions and electrons are ionized by collision under the action of electrons accelerated to fly to the substrate in the process of electric field, argon ions are accelerated to bombard target material under the action of electric field, and target material atoms or ions are sputtered to form continuous thin film on the substrate, in this process, electrons and secondary electrons are constrained by magnetic field, bound to the surface of cathode to do three-dimensional spiral motion, greatly increase the probability of electron ionization argon atom, form high-density plasma, greatly improve the rate of sputtering deposition;Because the magnetic strength of permanent magnet magnet steel is limited, and the weakening effect of spatial distance on magnetic field strength is huge, the existing magnetron sputtering target gun has limitations in structure size, the magnetic field intensity of the surface of target material is limited, especially for magnetic target material, the magnetic field is almost completely shielded, resulting in extremely low sputtering rate, which is inconvenient to use. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of compact full metal seal multi-target magnetron sputtering coating instrument, it is a set of magnetron sputtering equipment containing many functions, it overcomes the shortcomings that original sputtering technology is difficult to sputter deposition magnetic material, and further improves the sputtering rate of non-magnetic material, makes its application range more widely in integrated circuit, semiconductor and other fields, to solve the problems proposed in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of multi-target magnetron sputtering coating instrument, comprising:

[0007] The upper end of the support platform is provided with a main cavity through a bottom flange, which realizes tight connection to ensure the stability of the structure, and the inner bottom end of the support platform is provided with a molecular pump through a lifting platform, which mainly supports the molecular pump to realize force balance of the whole device and prevent the vibration of the molecular pump in the vacuum pumping process from adversely affecting the performance of the equipment, the molecular pump is connected with the main cavity, the inside of the main cavity is provided with a substrate assembly for installing a substrate, the upper end of the main cavity is provided with an adjusting mechanism connected with the substrate assembly for driving the substrate assembly to rotate and lift, the adjusting mechanism includes a substrate Y-axis rotation driver, a substrate lifting driver and a substrate X-axis rotation driver for driving the substrate to rotate along the Y-axis, lift along the Z-axis and rotate along the X-axis respectively, the substrate Y-axis rotation driver can be a mechanism in the prior art for driving the substrate to rotate along the Y-axis, the substrate lifting driver can be a mechanism in the prior art for driving the substrate to lift along the Z-axis, the sample is installed on a sample stage and can move with the substrate assembly during sputtering to switch to different samples, the inside of the main cavity is connected with a sputtering gun through an angle adjusting assembly, the sputtering gun is provided in three groups, the angle adjusting assembly is used to drive the sputtering gun to rotate, and the operator can adjust the rotation angle of the sputtering gun in the main cavity to meet the needs of the customer for multi-angle film coating of the sample, and the outer side of the main cavity is provided with a metal sealing flange, and metal sealing flanges are used at the sealing positions of the equipment to enhance the sealing performance of the whole equipment.

[0008] Preferably, the substrate assembly includes a shell, a heating sheet and a sample stage, the inside of the shell is provided with a sample stage through a rotating shaft for installing a sample, the rotating shaft can rotate relative to the shell, the inner side of the sample stage is provided with a heating sheet connected with a glass electrode to play a heating role, and the glass electrode is used to apply current to the heating sheet to start heating to improve the adhesion of the film in the sputtering process and reduce the stress and defects in the film.

[0009] Preferably, the substrate X-axis rotation driver includes a rotating handle, a rotating shaft and a bevel gear set, the upper end of the main cavity is provided with the rotating handle, the lower end of the rotating handle is connected with the rotating shaft, and the rotating shaft is connected with the rotating shaft through the bevel gear set to drive the rotating shaft and the sample stage to rotate along the Y-axis, and the bevel gear set is two meshing bevel gears arranged at ninety degrees with each other in the prior art, which is used to drive the rotating shaft to facilitate the sample stage to rotate along the Y-axis.

[0010] Preferably, the angle adjusting assembly comprises an angle adjusting handle, a horizontal gear set, an angle adjusting shaft and a rotating plate, the inner bottom end of the main cavity is rotatably connected with the rotating plate, the sputtering gun is installed on the upper end of the rotating plate, the sputtering gun is provided in three groups, the angle adjusting shaft is connected with the horizontal gear set on one side of the rotating plate, the horizontal gear set can be a gear plate arranged outside the rotating plate and a horizontal gear engaged with the gear plate, the angle adjusting shaft is connected with the angle adjusting handle, during adjustment, the angle adjusting handle drives the angle adjusting shaft to rotate, the angle adjusting shaft drives the horizontal gear to rotate, the horizontal gear is engaged with the gear plate, thereby realizing horizontal rotation of the rotating plate and the sputtering gun, and realizing angle adjustment.

[0011] Preferably, the main cavity is provided with an insertion plate valve between the main cavity and the molecular pump, when the vacuum degree in the main cavity 6 reaches a predetermined value, the insertion plate valve 4 interrupts the vacuum pumping operation of the molecular pump 3, and meanwhile, the sputtering work is carried out inside the cavity.

[0012] Preferably, the outer side of the main cavity is connected with an observation window through a flange pipeline, and a window handle is installed on the observation window.

[0013] Preferably, an ionization gauge is installed on the outer bottom end of the main cavity, for measuring the air pressure in real time during the work.

[0014] Preferably, an air release valve is further installed on the outer side of the main cavity, after the sputtering work is completed, the air release valve 12 is opened, so that the atmosphere in the main cavity returns to normal, and the sample can be taken out.

[0015] Compared with the prior art, the utility model has the advantages that:

[0016] 1. The overall structure is compact and occupies less space.

[0017] 2. The device adopts full-metal sealing technology, which significantly improves the sealing performance.

[0018] 3. The sputtering gun can be switched to a radio frequency power supply to realize the coating of non-metallic materials.

[0019] 4. The angle of the sputtering gun can be adjusted as needed.

[0020] 5. The substrate can be freely rotated along the X-axis and the Y-axis, and simultaneously lifted along the Z-axis.

[0021] 6. The sputtering rate is improved, and the sample can be coated at multiple angle positions according to customer requirements. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0023] Figure 2 is a partial internal structure schematic view of the utility model;

[0024] Figure 3 is a sectional view of the substrate assembly of the utility model;

[0025] In the figure: 1, support platform; 2, lifting platform; 3, molecular pump; 4, plug-in valve; 5, angle adjusting handle; 6, main cavity; 7, observation window; 8, window handle; 9, substrate Y axis rotation driver; 10, substrate lifting driver; 11, metal sealing flange; 12, air release valve; 13, bottom flange; 14, substrate assembly; 15, sputtering gun; 16, ion gauge; 17, glass peak electrode; 18, rotating handle; 19, rotating shaft; 20, bevel gear set; 21, heating sheet; 22, sample stage. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the utility model.

[0027] Embodiment:

[0028] Please refer to Figures 1-3 As shown in the figure, a kind of multi-target magnetron sputtering coating instrument, comprising:

[0029] The main cavity 6 is installed on the upper end of the support platform 1 through the bottom flange 13 to realize tight connection and ensure the stability of the structure. The molecular pump 3 is installed on the inner bottom end of the support platform 1 through the lifting platform 2, which mainly supports the molecular pump 3 to realize force balance of the whole device and prevent the vibration of the molecular pump 3 in the vacuum pumping process from adversely affecting the performance of the equipment. The molecular pump 3 is connected with the main cavity 6. The main cavity 6 is internally provided with a substrate assembly 14 for installing a substrate. The upper end of the main cavity 6 is provided with an adjusting mechanism connected with the substrate assembly 14 for driving the substrate assembly 14 to rotate and lift. The adjusting mechanism includes a substrate Y-axis rotating driver 9, a substrate lifting driver 10 and a substrate X-axis rotating driver for respectively driving the substrate to rotate along the Y-axis, lift along the Z-axis and rotate along the X-axis. The substrate Y-axis rotating driver 9 can be a mechanism for driving the substrate to rotate along the Y-axis in the prior art. The substrate lifting driver 10 can be a mechanism for driving the substrate to lift along the Z-axis in the prior art. The sample is installed on the sample stage 22 and can move with the substrate assembly during the sputtering process, so as to switch to different samples. The inside of the main cavity 6 is connected with the sputtering gun 15 through an angle adjusting assembly. The sputtering gun 15 is provided in three groups. The angle adjusting assembly is used to drive the sputtering gun 15 to rotate. The operator can adjust the rotation angle of the sputtering gun 15 in the main cavity 6 to meet the customer's demand for multi-angle coating of the sample. The outer side of the main cavity 6 is provided with a metal sealing flange 11. The sealing parts of the equipment are all provided with the metal sealing flange 11 to enhance the sealing performance of the whole equipment.

[0030] Further, the sputtering gun 15 can be switched to a radio frequency power source to realize coating of non-metallic materials.

[0031] The whole device has compact structure design and occupies small space.

[0032] Reference Figures 1-3 As shown, the substrate assembly 14 includes a shell, a heating sheet 21 and a sample stage 22. The sample stage 22 is installed on the inside of the shell through a rotating shaft for installing a sample. The rotating shaft can rotate relative to the shell. The inside of the sample stage 22 is provided with the heating sheet 21. The heating sheet 21 is connected with a glass peak electrode 17 to play a heating role. The glass peak electrode 17 applies current to the heating sheet 21 to start heating to improve the adhesion of the film in the sputtering process and reduce the stress and defects in the film. The sample stage 22 is provided in multiple groups so that the device can prepare multiple samples at a time and make the samples coated with different coatings, so that the magnetron effect is more significant and the sputtering rate of the magnetron sputtering is greatly improved.

[0033] Reference Figures 1-3As shown in the drawings, the substrate X-axis rotation driver comprises a rotation handle 18, a rotation shaft 19 and a bevel gear set 20, the rotation handle 18 is installed at the upper end of the main cavity 6, the lower end of the rotation handle 18 is connected with the rotation shaft 19, the rotation shaft 19 is connected with the rotating shaft through the bevel gear set 20, and the rotating shaft and the sample stage 22 are driven to rotate along the Y-axis, and the bevel gear set 20 is a prior art two meshing bevel gears arranged at 90 degrees with each other, used for driving the rotating shaft to facilitate the sample stage 22 to rotate along the Y-axis.

[0034] Reference Figures 1-3 As shown in the drawings, the angle adjusting assembly comprises an angle adjusting handle 5, a horizontal gear set, an angle adjusting shaft and a rotating plate, the rotating plate is rotatably connected to the inner bottom end of the main cavity 6, the sputtering gun 15 is installed at the upper end of the rotating plate, the sputtering gun 15 is provided in three groups, the angle adjusting shaft is connected with the angle adjusting handle 5 through the horizontal gear set, the horizontal gear set can be a gear plate arranged outside the rotating plate and a horizontal gear meshing with the gear plate, the angle adjusting handle 5 drives the angle adjusting shaft to rotate, the angle adjusting shaft drives the horizontal gear to rotate, the horizontal gear meshes with the gear plate, and then the rotating plate and the sputtering gun 15 can be horizontally rotated, and then the angle adjusting is realized.

[0035] Reference Figures 1-3 As shown in the drawings, the plug valve 4 is installed between the main cavity 6 and the molecular pump 3, when the vacuum degree in the main cavity 66 reaches a predetermined value, the plug valve 44 interrupts the vacuum pumping operation of the molecular pump 33, and the cavity is used for sputtering work.

[0036] Reference Figures 1-3 As shown in the drawings, the outside of the main cavity 6 is connected with the observation window 7 through a flange pipeline, and the observation window 7 is provided with a window handle 8.

[0037] Reference Figures 1-3 As shown in the drawings, the bottom end of the main cavity 6 is provided with an ion gauge 16 for real-time measurement of air pressure during work.

[0038] Reference Figures 1-3 As shown in the drawings, the outside of the main cavity 6 is also provided with a gas release valve 12, after the sputtering work is completed, the gas release valve 1212 is opened, so that the atmosphere in the main cavity 6 returns to normal, and the sample can be taken out.

[0039] The utility model optimizes the spatial position and the structure of target gun, makes the overall equipment compact in the case of perfect function, small space occupation, adds integral adjusting mechanism to make the substrate assembly can rotate in multiple dimensions to make the sample coating, simultaneously makes the equipment can prepare multiple samples at one time and makes the sample coats different coating, makes the magnetron effect more remarkable, greatly improves the sputtering rate of magnetron sputtering.

[0040] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-target magnetron sputtering coater, characterized in that, The utility model relates to a sputtering machine, including: Support platform (1), the upper end of support platform (1) is installed with main cavity (6) through bottom flange (13), the inner side bottom end of support platform (1) is installed with molecular pump (3) through lifting platform (2), molecular pump (3) is connected with main cavity (6), the inside of main cavity (6) is provided with substrate assembly (14), the upper end of main cavity (6) is provided with adjusting mechanism, adjusting mechanism is connected with substrate assembly (14), adjusting mechanism includes substrate Y axis rotation driver (9), substrate lifting driver (10) and substrate X axis rotation driver, the inside of main cavity (6) is connected with sputtering gun (15) through angle adjusting assembly, the outside of main cavity (6) is provided with metal seal flange (11).

2. A multi-target magnetron sputtering coater according to claim 1, characterized in that: Substrate assembly (14) includes shell, heating sheet (21) and sample stage (22), the inside of shell is installed with sample stage (22) through rotating shaft, the inner side of sample stage (22) is provided with heating sheet (21), heating sheet (21) is connected with glass electrode (17).

3. A multi-target magnetron sputter coater according to claim 2, characterized in that: Substrate X axis rotation driver includes rotation handle (18), rotation shaft (19), bevel gear set (20), the upper end of main cavity (6) is installed with rotation handle (18), the lower end of rotation handle (18) is connected with rotation shaft (19), rotation shaft (19) is connected with rotating shaft through bevel gear set (20).

4. A multi-target magnetron sputter coater according to claim 3, characterized in that: Angle adjusting assembly includes angle adjusting handle (5), horizontal gear set, angle adjusting shaft and rotating plate, the inside bottom end of main cavity (6) is rotatably connected with rotating plate, sputtering gun (15) is installed on the upper end of rotating plate, sputtering gun (15) is provided with three groups, one side of rotating plate is connected with angle adjusting shaft through horizontal gear set, angle adjusting shaft is connected with angle adjusting handle (5).

5. A multi-target magnetron sputter coater according to claim 4, characterized in that: Plug-in valve (4) is installed between main cavity (6) and molecular pump (3).

6. A multi-target magnetron sputter coater according to claim 5, characterized in that: The outside of main cavity (6) is connected with observation window (7) through flange pipeline, observation window (7) is installed with window handle (8).

7. A multi-target magnetron sputter coater according to claim 6, characterized in that: The bottom end outside of main cavity (6) is installed with ionization gauge (16).

8. A multi-target magnetron sputter coater according to claim 7, characterized in that: The outside of main cavity (6) is also installed with air release valve (12).

Images