Circuit board detection equipment

Abstract

The utility model relates to the technical field of circuit board detection equipment, in particular to circuit board detection equipment, which comprises a press-down driving part and at least three film thickness testing parts, and the at least three film thickness testing parts are arranged on the press-down driving part, so that the press-down driving part drives the film thickness testing parts to be close to or away from a to-be-detected circuit board; each film thickness testing part comprises a contact used for being in contact with the surface of the circuit board to be tested, and at least three coplanar contacts exist in the at least three film thickness testing parts and are not collinear. According to the circuit board detection equipment provided by the invention, the current operation mode of manually operating a handheld tester to realize the thickness of a three-proofing paint film is effectively replaced, the consistency of test operation of the circuit board detection equipment is ensured, the uniformity of the film thickness can be effectively judged, unqualified products with non-uniform film thickness are further avoided, and the production efficiency is improved. As the local film thickness of the detection point is qualified and passes the test, the reliability of the circuit board detection equipment is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board detection equipment, and in particular to a circuit board detection equipment. BACKGROUND

[0002] Potted coating is a coating commonly used to protect circuit boards and other electronic components from moisture, dust and chemical substances. The thickness of the coating directly affects its protective performance and electrical performance. Therefore, it is very important to detect the film thickness of the potted coating.

[0003] However, the film thickness of the potted coating of the circuit board is usually tested by manually holding a tester at present. On the one hand, this makes the accuracy of the film thickness detection of the potted coating of the circuit board greatly affected by the operation actions of the detector (for example, the operator sets the probe angle, places the probe with force, etc.), and the film thickness structure of the same position of the same circuit board still has differences under the tests of different operators, which makes it difficult to unify the standard of the film thickness detection of the potted coating of the circuit board. On the other hand, the manual holding of the tester at present is mostly single-point testing, which is difficult to judge the uniformity of the film thickness of the potted coating, resulting in some unqualified products with uneven film thickness passing the test due to the local film thickness of the detection point being qualified, and low reliability of the film thickness data. CONTENT OF THE INVENTION

[0004] The present application aims to provide a circuit board detection equipment to solve the technical problems in the prior art that the accuracy of the film thickness detection of the potted coating of the circuit board is greatly affected by the operation actions of the detector, the standard of the film thickness detection of the potted coating of the circuit board is difficult to unify, the manual holding of the tester at present is mostly single-point testing, which is difficult to judge the uniformity of the film thickness of the potted coating, resulting in some unqualified products with uneven film thickness passing the test due to the local film thickness of the detection point being qualified, and low reliability of the film thickness data.

[0005] According to a first aspect of the present application, a circuit board detection equipment is provided, comprising a pressing driving part and at least three film thickness testing parts, the at least three film thickness testing parts are arranged on the pressing driving part, so as to drive the film thickness testing parts to approach and move away from a circuit board to be detected by the pressing driving part.

[0006] The film thickness testing part comprises a contact point for contacting the surface of the circuit board to be detected. In the at least three film thickness testing parts, there are three coplanar contact points, and the three coplanar contact points are not collinear.

[0007] Preferably, the film thickness testing part comprises:

[0008] a film thickness testing probe comprising the contact point;

[0009] A stress detection member is arranged on the film thickness test probe and used to detect the stress applied by the film thickness test probe to the circuit board to be tested.

[0010] Preferably, the stress detection member is in communication connection with the pressing driving part.

[0011] Preferably, the film thickness test probe further comprises:

[0012] A placing platform is arranged to support the circuit board to be tested.

[0013] A supporting assembly is arranged to connect the pressing driving part and the placing platform, so that the pressing driving part and the placing platform are arranged opposite to each other along a first direction, and the first direction is perpendicular to the placing platform.

[0014] Preferably, the supporting assembly comprises a first moving part, the first moving part extends along a second direction, the pressing driving part is in transmission connection with the first moving part, and the first moving part is capable of driving the pressing driving part to move along the second direction, and the second direction is parallel to the placing platform.

[0015] Preferably, the supporting assembly comprises a second moving part, the second moving part extends along a third direction, the first moving part is in transmission connection with the second moving part, the second moving part is capable of driving the first moving part to move along the third direction, the third direction is parallel to the placing platform, and the third direction is perpendicular to the second direction.

[0016] Preferably, the second moving part is fixedly arranged on the placing platform.

[0017] Both ends of the first moving part along the second direction are provided with the second moving part.

[0018] Preferably, the film thickness test probe further comprises a limiting block, and the limiting block is detachably connected with the placing platform.

[0019] Preferably, the film thickness test probe further comprises a taking groove, and the taking groove is arranged at the edge of the placing platform, and in the state that the circuit board to be tested is arranged on the placing platform, part of the taking groove can be covered by the edge of the circuit board to be tested.

[0020] Preferably, the film thickness test probe further comprises a first switch and a second switch, and both the first switch and the second switch are in communication connection with the pressing driving part.

[0021] Compared with the prior art, the film thickness test probe has the following advantages:

[0022] The circuit board detection equipment provided by the application has the following advantages. On the one hand, the plurality of film thickness testing parts are arranged on the downward pressing driving part, so that the film thickness testing part is driven by the downward pressing driving member to approach and move away from the circuit board to be tested, so that the circuit board detection equipment can perform a test action and a withdrawal action, realizes automatic test of the circuit board detection equipment, effectively replaces the current manual operation of the handheld tester to realize the operation mode of the three-proof paint film thickness, ensures the consistency of the test operation of the circuit board detection equipment, and improves the accuracy and stability of the film thickness test data. On the other hand, the contacts of the three film thickness testing parts are arranged coplanarly and non-collinearly. In this way, the film thickness value of the circuit board to be tested can be directly obtained by the film thickness testing part, and the contacts of the three film thickness testing parts are arranged coplanarly and non-collinearly. The film thickness uniformity can be effectively judged by the difference value of the three feedback data, thereby avoiding the unqualified product with uneven film thickness passing the test due to the local film thickness of the detection point being qualified, and improving the reliability of the circuit board detection equipment.

[0023] In order to make the above-mentioned purposes, characteristics and advantages of the application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the specific embodiments of the application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings described below are some embodiments of the application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0025] Figure 1 The axial structure schematic diagram of the circuit board detection equipment provided by the embodiment of the application is shown in the figure.

[0026] Figure 2 The axial structure schematic diagram of the circuit board detection equipment provided by the embodiment of the application is shown in the figure.

[0027] REFERENCE NUMERALS:

[0028] 1-downward pressing driving part; 2-film thickness testing part; 21-film thickness testing probe; 211-contact; 22-force detection member; 3-putting platform; 4-support assembly; 41-first moving part; 42-second moving part; 5-limiting bump; 6-taking slot; 71-first switch; 72-second switch; 8-circuit board to be tested.

[0029] F1-first direction; F2-second direction; F3-third direction. DETAILED DESCRIPTION

[0030] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application.

[0031] The components of the embodiments of the present application generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application.

[0032] Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0033] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0034] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Figure 1 and Figure 2 The circuit board detection device according to some embodiments of the present application is described below with reference to

[0036] Referring to Figure 1 and Figure 2 The embodiments of the first aspect of the present application provide a circuit board detection device, which comprises a downward driving part 1 and at least three film thickness test parts 2, and the at least three film thickness test parts 2 are arranged on the downward driving part 1, so that the film thickness test parts 2 are driven by the downward driving part 1 to approach or move away from the circuit board to be tested 8. The film thickness test part 2 comprises a contact point 211 for contacting the surface of the circuit board to be tested 8. In the at least three film thickness test parts 2, there are at least three coplanar contact points 211, and the at least three coplanar contact points 211 are not collinear.

[0037] According to the technical features, the circuit board detection device has the following advantages. On the one hand, the plurality of film thickness testing parts 2 are arranged on the downward pressing driving part 1, so that the film thickness testing parts 2 are driven by the downward pressing driving part 1 to approach or move away from the circuit board 8 to be tested, so that the circuit board detection device can perform the testing action and the withdrawing action, realize the automatic testing of the circuit board detection device, effectively replace the manual operation of the handheld tester to realize the operation mode of the three-proof paint film thickness, ensure the consistency of the testing operation of the circuit board detection device, and improve the accuracy and stability of the film thickness testing data. On the other hand, the contacts 211 of at least three of the plurality of film thickness testing parts 2 are arranged coplanarly and non-collinearly. In this way, the film thickness value of the circuit board to be tested can be directly obtained by the film thickness testing part 2, and the contacts 211 of the at least three of the plurality of film thickness testing parts 2 are arranged coplanarly and non-collinearly. The uniformity of the film thickness can be effectively judged by the difference value of the feedback data of the at least three, so as to avoid the unqualified product with uneven film thickness passing the test due to the local film thickness of the detection point being qualified, and improve the reliability of the circuit board detection device.

[0038] As shown in Figure 1 and Figure 2 , the figure shows an example of arranging three film thickness testing parts 2 on the above-mentioned downward pressing driving part 1, and the contacts 211 of the three film thickness testing parts 2 are coplanar and non-collinear. However, it is not limited to this, and the circuit board detection device is not limited to the example of arranging three film thickness testing parts 2 on the above-mentioned downward pressing driving part 1. As long as the film thickness uniformity can be detected, the number of film thickness testing parts 2 arranged on the above-mentioned downward pressing driving part 1 can also be N (wherein N is an integer greater than 3). In the N film thickness testing parts 2, the contacts 211 of at least three film thickness testing parts 2 are coplanar and non-collinear.

[0039] Preferably, as shown in Figure 1 and Figure 2 , the above-mentioned film thickness testing part 2 can include a film thickness testing probe 21, which includes the above-mentioned contact 211. It should be noted that the above-mentioned contact 211 can be understood as the point of the film thickness testing probe 21 in contact with the circuit board 8 to be tested when detecting the film thickness.

[0040] Preferably, as shown in Figure 1 and Figure 2 , the above-mentioned film thickness testing part 2 can further include a force detection member 22 arranged on the film thickness testing probe 21, for detecting the pressure applied by the film thickness testing probe 21 to the circuit board 8 to be tested. By monitoring the pressure applied by the film thickness testing probe 21 to the circuit board 8 to be tested through the force detection member 22, it can be ensured that the film thickness testing probe 21 effectively contacts the three-proof paint film of the circuit board 8 to be tested according to the set pressure value, and the film thickness testing probe 21 will not be over-pressured, which will cause the film thickness to be compressed and affect the measurement result.

[0041] Preferably, the stress detection piece 22 is in communication connection with the downward driving part 1, so as to control the downward action of the downward driving part 1 by the pressure applied to the circuit board 8 to be tested by the real-time film thickness testing probe 21 detected by the stress detection piece 22, in other words, when the stress detection piece 22 detects a large pressure value reaching a predetermined pressure, a feedback signal can be fed to the downward driving part 1, so that the downward driving part 1 stops the downward action, thereby ensuring the timeliness and sensitivity of the force control of the film thickness testing probe 21, and avoiding the damage to the circuit board 8 to be tested.

[0042] Optionally, the stress detection piece 22 can be a force moment sensor, a pressure sensor or other mechanical sensor.

[0043] Optionally, the downward driving part can be a pneumatic cylinder, an electric cylinder or other linear driving device.

[0044] Preferably, as shown in Figure 1 and Figure 2 , the circuit board detection device can further comprise a placement platform 3 for supporting the circuit board 8 to be tested.

[0045] Preferably, as shown in Figure 1 and Figure 2 , the circuit board detection device can further comprise a limiting block 5 in detachable connection with the placement platform 3, so as to limit the circuit board 8 to be tested by the limiting block 5, to prevent the deviation of the circuit board 8 to be tested in the testing process, resulting in the deviation of the test result or the damage to the circuit board. The detachable connection of the limiting block 5 and the placement platform 3 can effectively improve the versatility of the placement platform 3, so as to realize the purpose that the placement platform 3 can fix circuit boards 8 to be tested of different sizes by changing the position of the limiting block 5.

[0046] Optionally, as shown in Figure 1 and Figure 2 , the limiting block 5 can be in the shape of “└”, so as to be adapted to the top corner structure of the rectangular circuit board 8 to be tested.

[0047] Preferably, as shown in Figure 2 , the number of the limiting block 5 can be set to two, and the two limiting blocks 5 can be adapted to the top corner structure of two opposite corners of the rectangular circuit board 8 to be tested, so as to improve the limiting stability of the limiting block 5 to the circuit board 8 to be tested.

[0048] Preferably, as shown in Figure 1 and Figure 2As shown in the drawings, the circuit board detection device can further comprise a taking groove 6, which can be arranged at the edge of the placing platform 3. In the state that the circuit board 8 to be detected is placed on the placing platform 3, part of the taking groove 6 can be covered by the edge of the circuit board 8 to be detected. The part of the taking groove 6 covered by the circuit board 8 to be detected can be extended into the lower part of the circuit board 8 to be detected, so as to facilitate the taking and placing of the circuit board 8 to be detected.

[0049] Preferably, as shown in the drawings, Figure 1 and Figure 2 The circuit board detection device can further comprise a support assembly 4, which can be connected with the pressing driving part 1, so that the pressing driving part 1 and the placing platform 3 are arranged opposite to each other along the first direction F1, and the first direction F1 is perpendicular to the placing platform 3.

[0050] As shown in the drawings, Figure 1 and Figure 2 F1 shown in the drawings can be an example of the first direction F1. Preferably, the first direction F1 is perpendicular to the placing platform, so as to ensure the vertical detection of the film thickness testing part 2, and further improve the testing accuracy of the film thickness testing part 2. For the convenience of description, two directions perpendicular to each other and parallel to the placing platform 3 are defined as the second direction F2 and the third direction F3. Figure 1 Figure 2 F2 shown in the drawings can be an example of the second direction F2, and F3 shown in the drawings can be an example of the third direction F3. Preferably, the second direction F2 and the third direction F3 are perpendicular to each other, so as to adapt to most rectangular circuit boards 8 to be detected.

[0051] Preferably, as shown in the drawings, Figure 1 and Figure 2 The support assembly 4 can comprise a first moving part 41 extending along the second direction F2. The pressing driving part 1 is drivingly connected with the first moving part 41. The first moving part 41 can drive the pressing driving part 1 to move along the second direction F2, so as to realize the free movement of the film thickness testing part 2 along the second direction F2 of the placing platform 3.

[0052] Preferably, as shown in the drawings, Figure 1 and Figure 2 The support assembly 4 comprises a second moving part 42 extending along the third direction F3. The first moving part 41 is drivingly connected with the second moving part 42. The second moving part 42 can drive the first moving part 41 to move along the third direction F3, so as to realize the free movement of the film thickness testing part 2 along the third direction F3 of the placing platform 3.

[0053] Preferably, as shown in the drawings, Figure 1 and Figure 2 ​As shown, the second moving part 42 can be fixedly arranged on the placement platform 3. The two ends of the first moving part 41 in the second direction F2 are respectively provided with the second moving part 42, so as to improve the moving stability of the film thickness testing part 2, and further ensure the testing precision and stability.

[0054] Preferably, the first moving part 41 and the second moving part 42 are both linear sliding mechanisms, which can include a rotary motor, a lead screw and a sliding part. The sliding part is provided with an internal threaded hole matched with the lead screw. The rotary motor is in driving connection with one end of the lead screw, so as to drive the lead screw to rotate and further drive the sliding part to slide along the lead screw, so as to realize the linear motion of the sliding part along the extension direction of the lead screw.

[0055] Optionally, the linear sliding mechanism can further include a guide rod arranged in parallel with the lead screw. The sliding part is further provided with a guide hole. The guide rod penetrates through the guide hole and is in sliding connection with the sliding part, so as to improve the precision and stability of the linear motion of the sliding part along the extension direction of the lead screw.

[0056] Optionally, the linear sliding mechanism can include a plurality of guide rods arranged side by side, so as to further improve the precision and stability of the linear motion of the sliding part along the extension direction of the lead screw.

[0057] Preferably, as shown in Figure 1 and Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 The circuit board detection device can further include a first switch 71 and a second switch 72. The first switch 71 and the second switch 72 can be in series with the pressing driving, so that when the operator triggers the first switch 71 and the second switch 72 to be closed at the same time, the pressing driving triggers the pressing action. Thus, when the pressing driving performs the pressing action, the operator's hands can be effectively limited from leaving the placement platform 3, and the probability of the operator being pressed by the pressing driving is effectively reduced.

[0058] Optionally, the circuit board detection device can further include a host computer. The host computer can be in communication connection with the film thickness testing part 2, so as to transmit the film thickness data detected by the film thickness testing part 2 to the host computer. The host computer can analyze the film thickness data detected by the three or more film thickness testing parts 2, so as to obtain whether the film thickness uniformity of the detection point of the circuit board 8 is qualified.

[0059] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board inspection apparatus characterized by comprising: The device comprises a pressing driving part (1) and at least three film thickness testing parts (2), the at least three film thickness testing parts (2) are arranged on the pressing driving part (1) and are driven by the pressing driving part (1) to approach or move away from the circuit board (8) to be tested; The film thickness testing part (2) comprises a contact point (211) for contacting the surface of the circuit board (8) to be tested, and there are at least three contact points (211) in the at least three film thickness testing parts (2), and the at least three contact points (211) are coplanar and not collinear.

2. The circuit board inspection apparatus according to claim 1, characterized by The film thickness testing part (2) comprises: A film thickness testing probe (21) comprising the contact point (211); A force detection member (22) arranged on the film thickness testing probe (21) for detecting the pressure applied by the film thickness testing probe (21) to the circuit board (8) to be tested.

3. The circuit board testing device according to claim 2, wherein The force detection member (22) is in communication connection with the pressing driving part (1).

4. The circuit board inspection apparatus according to any one of claims 1 to 3, characterized by Further comprising: A placing platform (3) for supporting the circuit board (8) to be tested; A support assembly (4) connected with the pressing driving part (1) to arrange the pressing driving part (1) and the placing platform (3) opposite to each other along a first direction (F1), and the first direction (F1) is perpendicular to the placing platform (3).

5. The circuit board inspection apparatus according to claim 4, characterized by The support assembly (4) comprises a first moving part (41) extending along a second direction (F2), the pressing driving part (1) is in transmission connection with the first moving part (41), and the first moving part (41) can drive the pressing driving part (1) to move along the second direction (F2), and the second direction (F2) is parallel to the placing platform (3).

6. The circuit board inspection apparatus according to claim 5, characterized by The support assembly (4) comprises a second moving part (42) extending along a third direction (F3), the first moving part (41) is in transmission connection with the second moving part (42), the second moving part (42) can drive the first moving part (41) to move along the third direction (F3), the third direction (F3) is parallel to the placing platform (3), and the third direction (F3) is perpendicular to the second direction (F2).

7. The circuit board testing device according to claim 6, wherein The second moving part (42) is fixedly connected with the placing platform (3); Both ends of the second moving part (42) in the second direction (F2) are fixedly connected with the first moving part (41).

8. The circuit board inspection apparatus according to claim 4, characterized by Further comprising a limiting protrusion (5) in detachable connection with the placing platform (3).

9. The circuit board inspection apparatus according to claim 4, characterized by Further comprising a taking groove (6), and part of the taking groove (6) can be covered by the edge of the circuit board (8) to be tested when the circuit board (8) to be tested is placed on the placing platform (3).

10. The circuit board inspection apparatus according to claim 1, characterized by Further included are a first switch (71) and a second switch (72), each of which is connected in series to the lower pressing driving section (1).

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