Universal K-band radio frequency ceramic tube shell

Abstract

According to the technical scheme, the general K-waveband radio frequency ceramic tube shell comprises a first circuit substrate, a lead is welded on the first circuit substrate, the lead is bent in an omega shape, a ceramic substrate is welded on the top of the lead, a second circuit substrate is welded on the top of the ceramic substrate, and the second circuit substrate is welded on the top of the second circuit substrate. The two sides of the interior of the ceramic substrate are both provided with internal wires, the two sides of the internal wires are connected with the same side of the first circuit substrate and the same side of the second circuit substrate respectively, the two sides of the second circuit substrate are bonded with the internal wires through gold wires, and an enclosure frame is further welded to the top of the ceramic substrate to form a ceramic tube shell. The utility model has the advantages that the hybrid integration technology is adopted, compared with the packaging integration technology, the hybrid integration technology is high in process maturity, short in development period and low in development cost, customers can design different circuit boards and tube shells according to the requirements for welding use, and meanwhile, each channel works independently, and the isolation degree is excellent.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic system technical field, concretely is a general K wave band radio frequency ceramic tube shell. BACKGROUND

[0002] With the development of modern electronic technology, the function of electronic system is more and more complex, and the volume of electronic equipment is more and more small. As an important part of electronic system, improving the integration density of radio frequency system is an important way to realize the miniaturization of electronic system. Radio frequency circuit integration technology has experienced discrete board-level integration, MCM hybrid integration and packaging integration.

[0003] The Chinese patent with publication number CN114256575A discloses a multi-channel miniaturized microwave assembly and its metal matrix composite substrate structure, but the frequency band of such radio frequency ceramic circuit and traditional radio frequency ceramic circuit is only DC~8GHZ, the application range is limited, and it cannot meet the existing market. UTILITY MODEL CONTENT

[0004] In view of the deficiencies of the prior art, the utility model aims to provide a general K wave band radio frequency ceramic tube shell.

[0005] In order to achieve the above-mentioned purpose, the utility model is technical scheme as follows:

[0006] A general K wave band radio frequency ceramic tube shell, including circuit substrate one, the circuit substrate one is welded with lead, the lead top is welded with ceramic substrate, the ceramic substrate top is welded with circuit substrate two, the both sides of the ceramic substrate inside are provided with internal wiring, and the both sides of the internal wiring are connected with the same side of the circuit substrate one and the circuit substrate two respectively, the ceramic substrate top is still welded with frame to form ceramic tube shell.

[0007] Preferably, the both sides of the circuit substrate two are bonded with the internal wiring through gold wire.

[0008] Preferably, the lead adopts the bending of "Ω" shape.

[0009] Preferably, the ceramic substrate is made of the substrate of 92% content of alumina, and the metal surface of the ceramic substrate is plated with the nickel layer welded with the lead and the frame.

[0010] Preferably, the ceramic substrate is made of the substrate of multiple green ceramic strips.

[0011] Preferably, the lead is made of the wire of Kovar alloy, and the Kovar alloy is specifically 4J42.

[0012] Preferably, the frame is made of the frame body of Kovar alloy, and the Kovar alloy is specifically 4J29.

[0013] Compared with the prior art, the utility model has the advantages of:

[0014] 1、The utility model discloses a mixed integrated technology, compared with the packaging integrated technology, the scheme process maturity is high, and the development cycle is short, and the development cost is low, and the customer can according to the demand to design different circuit board and tube shell and use welding, and each channel works independently, and the isolation degree is excellent.

[0015] 2、The utility model discloses through lead adopts " omega " shape and bends, can effectively promote the bending resistance characteristic of lead, thereby improve the reliability of product, and under the condition that the appearance size and chip mounting position do not change, increase the use frequency band from DC ~ 8GHZ to DC ~ 18GHZ, thereby increase the application scope of product. BRIEF DESCRIPTION OF DRAWINGS

[0016] The disclosure of the utility model is explained with reference to the drawings. It should be understood that the drawings are only for illustrative purposes, and are not intended to limit the scope of protection of the utility model. In the drawings, the same reference signs are used to refer to the same parts. Among them:

[0017] Figure 1 It is the whole structure schematic diagram of the utility model.

[0018] The figure mark explanation: 1, circuit substrate one;2, lead;3, circuit substrate two;

[0019] 4, surround frame;5, gold wire;6, internal wiring;7, ceramic substrate. DETAILED DESCRIPTION

[0020] It is easy to understand that according to the technical scheme of the utility model, a plurality of structure modes and implementation modes that can be replaced each other can be proposed by the general technical personnel in the art without changing the essential spirit of the utility model. Therefore, the following specific embodiments and drawings are only exemplary description of the technical scheme of the utility model, and should not be regarded as the whole of the utility model or regarded as the limitation or restriction of the technical scheme of the utility model.

[0021] As Figure 1As shown, as a kind of general K band radio frequency ceramic tube shell of the utility model, including circuit substrate one 1, ceramic substrate 7 and circuit substrate two 3, circuit substrate one 1 is set to 0.254 thickness 5880 circuit substrate, circuit substrate two 3 is set to 0.127 thickness 5880 circuit substrate, circuit substrate one 1 is welded with lead 2, lead 2 is set to the wire made of Kovar 4J42, 4J42 has very low expansion coefficient, is very stable in the range of room temperature to 200 degrees Celsius, which makes it perform well in high-precision instrument equipment manufacturing requiring stable size.Secondly, it also has good thermal stability and thermal conductivity, is not easily affected by temperature change, can maintain stable size at high temperature, in addition, 4J42 alloy also has good welding performance, mechanical properties and surface treatment performance, easy to process into various shaped parts.

[0022] As shown, Figure 1 Lead 2 is bent in "Ω" shape, which can effectively improve the bending resistance of lead 2, thereby improving the reliability of the product, lead 2 is welded with ceramic substrate 7, the top of ceramic substrate 7 is welded with circuit substrate two 3, both sides of the inside of ceramic substrate 7 are provided with internal wiring 6, both sides of internal wiring 6 are connected with the same side of circuit substrate one 1 and circuit substrate two 3 respectively, and both sides of circuit substrate two 3 are bonded with internal wiring 6 through gold wire 5, and the top of ceramic substrate 7 is also welded with surrounding frame 4 to form a ceramic tube shell, and the surrounding frame 4 is set as a frame made of Kovar 4J29, which has good sealing, welding and processing performance.

[0023] Circuit substrate one 1 is respectively used as input end and output end, from input end, signal passes through circuit substrate one 1 and lead 2, and is transmitted to the front surface of the tube shell through internal wiring 6 of ceramic substrate 7, and is introduced to circuit substrate two 3 through gold wire 5 bonding method, and is transmitted to output end in the same way, the signal quality from input end to output end is simulated accordingly, and finally the voltage standing wave ratio can reach within 1.6, and the insertion loss is ≥-1.3dB, under the condition that the size and chip mounting position are not changed, the frequency band is increased from DC~8GHZ to DC~18GHZ, thereby increasing the application range of the product.

[0024] The ceramic substrate 7 is made of 92% content of alumina, raw ceramic tapes are first cut into standard size squares, the raw ceramic tapes are punched, conductive paste is filled into the punched holes, screen printing is performed on the surface of the raw ceramic tapes, each raw ceramic tape is stacked after printing, the multiple raw ceramic tapes are pressed together in a laminated manner to ensure that delamination does not occur, the laminated raw ceramic tapes are cut into multiple individual ceramic substrates 7, side printing is performed on the individual ceramic substrates 7 to ensure that the side is fully printed with metal paste, the ceramic substrate 7 is sintered after side printing, and a complete ceramic substrate 7 is obtained. Since the paste used for the ceramic substrate 7 is tungsten paste, silver copper solder cannot be welded, it is necessary to pre-plate nickel on the metal surface of the ceramic substrate 7, the pre-plated ceramic substrate 7 is welded with the lead 2 and the frame 4 using silver copper solder, and then gold plating is performed, so that a finished ceramic tube shell is obtained. Compared with the packaging integration technology, the scheme has high process maturity, short development cycle, low development cost, customers can design different circuit boards and tube shells according to requirements, and the scheme is used for welding, meanwhile, each channel works independently, and the isolation degree is excellent.

[0025] The technical scope of the utility model is not limited to the content in the above description, and those skilled in the art can make various modifications and changes to the above embodiment without departing from the technical thought of the utility model, and these modifications and changes should all belong to the protection scope of the utility model.

Claims

1. A general purpose K-band radio frequency ceramic package, characterized by: The application relates to a circuit board, which comprises a first circuit board (1), a lead wire (2) welded on the first circuit board (1), a ceramic substrate (7) welded on the top of the lead wire (2), a second circuit board (3) welded on the top of the ceramic substrate (7), internal wires (6) arranged on both sides of the ceramic substrate (7), and a surrounding frame (4) welded on the top of the ceramic substrate (7) to form a ceramic tube shell.

2. A general K-band RF ceramic package according to claim 1, characterized in that: The second circuit board (3) is connected with the internal wires (6) through gold wires (5) on both sides.

3. A general-purpose K-band RF ceramic package according to claim 2, characterized in that: The lead wire (2) is bent into an omega shape.

4. The general K-band RF ceramic package of claim 1, wherein: The ceramic substrate (7) is a substrate formed by pressing a plurality of green ceramic belts.

5. A general K-band RF ceramic package as claimed in claim 1, wherein: The lead wire (2) is a wire made of Kovar alloy, and the Kovar alloy is 4J42.

6. A general purpose K-band RF ceramic package according to claim 5, wherein: The surrounding frame (4) is a frame made of Kovar alloy, and the Kovar alloy is 4J29.

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