Chip heat dissipation device, controller and vehicle

Abstract

The utility model provides a chip heat dissipation device, a controller and a vehicle. The chip heat dissipation device comprises a substrate, heat dissipation fins and a metal piece. One surface of the substrate and the heat dissipation fins are integrally forged and formed, and cooling liquid flow channels are formed among the multiple heat dissipation fins; a metal piece is welded on the other surface of the substrate; and one side, deviating from the substrate, of the metal piece is used for heat dissipation of the chip. The heat conductivity of the material formed by the forging technology is higher, so that the heat conductivity of the radiating fins can be particularly improved. Besides, the substrate formed through forging can be connected with the metal piece through brazing, so that the heat conductivity is improved, the heat flux is increased, heat on the chip can be rapidly diffused, and the heat dissipation requirement of a high-power chip such as a large model calculation chip is met.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of electronic device heat dissipation, specifically relates to a chip heat dissipation device, controller and vehicle. BACKGROUND

[0002] With the development of the field of artificial intelligence, the intelligent development of the automobile has become a new trend, and the continuous evolution of the artificial intelligence algorithm of the automatic driving and intelligent cabin of the automobile, the automobile large model technology is widely applied. The high computing power of the large model needs high computing energy consumption, which will produce high heat. How to reliably dissipate heat for the high heat and high integration chip used in the vehicle becomes a common problem faced by the industry.

[0003] In the related art, a water cooling heat dissipation scheme is usually used: a flow channel is sealed by aluminum plate and die casting shell friction stir welding, and the heat dissipation fins are integrally formed on the die casting shell. The other side of the heat dissipation fin is in contact with the heat dissipation chip through a thermal interface material. Generally, the cooling water temperature is controlled by the vehicle control system, and the temperature will not exceed 65 DEG C. The general vehicle controller environment temperature is 85 DEG C. After using the water cooling scheme, the actual controller internal environment temperature is lowered by 20 DEG C, which is equivalent to the controller working within 65 DEG C.

[0004] As long as the chip power is not high, the power is less than 50W, and the junction temperature requirement is not more than 115 DEG C, the related technology can ensure the heat dissipation effect. However, when using a large model computing chip, the power is generally more than 160W, and the junction temperature requirement is controlled within 90 DEG C, and the related technology cannot ensure the heat dissipation effect, that is, the heat dissipation effect of the related technology is limited. INVENTION CONTENTS

[0005] The purpose of the embodiment of the utility model is to provide a chip heat dissipation device, controller and vehicle to improve the heat dissipation effect of the chip heat dissipation device.

[0006] In order to solve the above technical problems, the utility model is realized as follows:

[0007] In the first aspect, the utility model embodiment provides a kind of chip heat dissipation device, including substrate, heat dissipation fin and metal piece;

[0008] The substrate is integrally forged and formed on one surface with the heat dissipation fin, and cooling liquid flow channel is formed between multiple heat dissipation fins;

[0009] The other surface of the substrate away from the heat dissipation fin is welded with the metal piece, and the side of the metal piece away from the substrate is used for chip heat dissipation.

[0010] Optionally, the substrate is a forged aluminum plate, the heat dissipation fin is a forged aluminum sheet, and / or the metal piece is a copper plate.

[0011] Optionally, the heat-conducting phase-change film is further included.

[0012] One side of the heat-conducting phase-change film is in contact with the side of the metal piece away from the substrate, and the other side of the heat-conducting phase-change film is used to contact the chip for heat dissipation.

[0013] Optionally, the shell is further included.

[0014] The substrate is clamped and connected in the shell, the shell has opposite first and second openings, the metal piece and the heat-conducting phase-change film are fixed on the side of the substrate close to the first opening, the heat-conducting phase-change film is used to contact the first chip for heat dissipation, the second opening is used to fix the second chip for heat dissipation, and the power of the first chip is greater than that of the second chip.

[0015] Optionally, the shell is a die-casting aluminum shell, and the substrate and the shell are friction stir welded.

[0016] Optionally, the thickness of the heat dissipation fin is t1, and 1mm≤t1≤1.2mm.

[0017] Optionally, the spacing between adjacent heat dissipation fins is a, and 3mm≤a≤3.5mm.

[0018] Optionally, the thickness of the heat-conducting phase-change film (4) is t2, and 0.1mm≤t2≤0.2mm.

[0019] In the second aspect, the utility model embodiments provide a kind of controller, including chip and any one of the chip heat dissipation device described above;

[0020] At least one of the chips is fixed to the side of the metal piece away from the substrate.

[0021] In the third aspect, the utility model embodiments provide a kind of vehicle, including the controller described above.

[0022] The chip heat dissipation device provided in the embodiment of the utility model, including substrate, heat dissipation fin and metal piece, heat dissipation fin and substrate are integrally formed through forging process, cooling liquid flow channel is formed between heat dissipation fin, and cooling liquid is filled between flow channel, and the heat generated during the working process of chip is taken away, the shell and heat dissipation fin in the related art are limited by pressure casting process, and a certain pressure casting process material is contained in the inside, and the thermal conductivity is affected, and the thermal conductivity of the material formed by forging technology is higher, and the thermal conductivity of heat dissipation fin can be improved, and the heat dissipation efficiency of cooling liquid flow channel is improved, heat dissipation fin is connected to one surface of substrate, and the other opposite surface of substrate is welded with metal piece, and metal piece is directly contacted with chip for heat dissipation, since the substrate is a forged piece, and can be connected with metal piece through brazing, so as to improve the thermal conductivity, increase the heat flux, so that the heat on the chip can be rapidly diffused, cooperate with water-cooling heat dissipation, effectively reduce the junction temperature of chip, and meet the heat dissipation demand of high-power chip such as large model calculation chip.

[0023] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, which can be implemented according to the content of the specification, and in order to let the above and other purposes, characteristics and advantages of the utility model can be more obvious and easy to understand, the specific embodiment of the utility model is described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0024] The above and / or additional aspects and advantages of the utility model will become apparent and more readily appreciated from the following description of the embodiments, with reference to the following drawings, in which:

[0025] Figure 1 It is the structure schematic diagram of the heat dissipation device and chip provided in the embodiment of the utility model,

[0026] Figure 2 It is the structure sectional view of the heat dissipation device and chip provided in the embodiment of the utility model,

[0027] Figure 3 It is the structure schematic diagram of the substrate along one direction in the embodiment of the utility model,

[0028] Figure 4 It is the structure schematic diagram of the substrate along another direction in the embodiment of the utility model.

[0029] EXPLANATION OF REFERENCE NUMERALS:

[0030] 1-substrate, 2-heat dissipation fin, 3-metal piece, 4-phase change heat conduction film, 5-shell, 51-first opening, 52-second opening, 61-first chip, 62-second chip. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort are within the protection scope of the present application.

[0032] The terms "first", "second" and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a particular order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second" and the like are generally of a kind and are not limited in number, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0033] In the related art, the conventional water-cooling heat dissipation scheme cannot meet the heat dissipation requirement of the high-power computing chip. The simulation calculation shows that when the chip is cooled by the related technical scheme, the junction temperature of the chip exceeds 150 DEG C when the power of the computing chip exceeds 160 W, which cannot meet the requirement of 90 DEG C junction temperature. Therefore, it is necessary to optimize the chip cooling technology, improve the heat dissipation effect of the chip, and meet the heat dissipation requirement of the high-power computing chip.

[0034] The thermal resistance of each link in the heat transfer process is optimized, including: thermal interface material thermal resistance, thermal conductivity of the heat conducting carrier, density of the heat dissipation fins and cooling water flow rate. Among them, the cooling water flow rate should not be too high, and is usually controlled within 4 L / min, otherwise the flow resistance will be too large, and the motor burden of the whole vehicle will be increased. In the conventional water-cooling heat dissipation scheme, when the die-cast shell is used, the thermal conductivity cannot be improved, the number of the die-cast heat dissipation fins cannot be improved in the limited space, and the thermal interface material thermal resistance is large, therefore, the present application mainly optimizes the design of the first three points.

[0035] The chip cooling device, the controller and the vehicle provided by the embodiments of the present application will be described in detail with reference to the drawings and specific embodiments and application scenarios.

[0036] With reference to Figure 1 And Figure 2The utility model embodiment provides a kind of chip heat dissipation device, including substrate 1, heat dissipation fin 2 and metal piece 3;The substrate 1 is integrally forged on one surface with the heat dissipation fin 2 and is formed, and cooling liquid flow channel is formed between multiple heat dissipation fins 2;Another surface of the substrate 1 is welded with the metal piece 3, and the side of the metal piece 3 away from the substrate 1 is used for chip heat dissipation.

[0037] In one embodiment, substrate 1, also known as waterway cover plate, is processed and formed by forging process, and heat dissipation fin 2 is integrally forged on the basis of substrate 1.

[0038] It can be understood that forging is a processing method that uses forging machinery to apply pressure to metal blanks to produce plastic deformation to obtain forgings with certain mechanical properties, certain shape and size. Forging includes cold forging and hot forging. The difference between the two is that cold forging is carried out at room temperature, and hot forging is carried out at high temperature. In related technology, the die casting material is usually ADC12, and due to the limitation of die casting process, it contains certain die casting process substances, and its thermal conductivity is 97 W / m·k. Since the forging process is not suitable for parts with complex shape and appearance, the substrate 1 is forged in the embodiment of the utility model instead of the shell 5. The substrate 1 and the heat dissipation fin 2 are formed into an integral part by forging process, and its thermal conductivity can reach 200 W / m·k to 230 W / m·k, which is greatly improved compared with die casting material. Especially, the heat dissipation area of the heat dissipation fin 2 is large, and the cooling liquid flow channel is formed between the heat dissipation fins 2, so the improvement of the thermal conductivity of the heat dissipation fin 2 contributes greatly to the improvement of the thermal conductivity of the whole heat dissipation device. The heat dissipation fin 2 can be rectangular or circular arc, to form a plurality of cooling liquid flow channels, and the cooling liquid flow channel is filled with cooling liquid. That is, the heat dissipation fin 2 not only serves as a heat conductor for the chip, but also serves as a water-cooled heat dissipation environment.

[0039] As shown in Figure 3 and Figure 4 , along the thickness direction of the substrate 1, one surface of the substrate 1 is integrally connected with the heat dissipation fin 2, and the other surface is welded with the metal piece 3.

[0040] Generally, the die casting and the metal piece cannot be connected by brazing, and the metal piece can only be pressed into the die casting by interference fit, which can cause a small gap between the metal piece and the die casting and affect the thermal conductivity. However, in the embodiment, due to the characteristics of the forging process, the substrate 1 can be connected with the metal piece 3 by brazing. After the brazing filler melts, the gap is filled by capillary action, and the substrate 1 is diffused and dissolved with each other to form a brazed joint. This connection mode can effectively reduce the thermal resistance, improve the thermal conductivity, and increase the heat flux, so that the heat on the chip can be quickly spread out. Therefore, compared with the related art, the die casting process is replaced by the forging process, and the heat dissipation fin 2 is also formed by the forging process. At the same time, the welding process between the substrate 1 and the metal piece 3 can also improve the thermal conductivity to meet the heat dissipation requirements of high-power chips, that is, to optimize the design of the heat transfer process from the aspect of improving the thermal conductivity of the heat conduction carrier.

[0041] The chip heat dissipation device provided in the embodiment of the utility model is processed by integrated forging forming process, the material formed by forging technology has high thermal conductivity, the thermal conductivity of the heat dissipation fin can be improved in particular, and the heat dissipation efficiency of the cooling liquid flow channel is improved. In addition, the substrate formed by forging can be connected with the metal piece by brazing to improve the thermal conductivity and increase the heat flux, so that the heat on the chip can be quickly spread out, and the water cooling heat dissipation is matched to effectively reduce the chip junction temperature and meet the heat dissipation requirements of high-power chips such as large model calculation chips.

[0042] Optionally, referring to Figure 1 and Figure 4 , the substrate 1 is a forged aluminum plate, the heat dissipation fin 2 is a forged aluminum sheet, and / or the metal piece 3 is a copper plate.

[0043] Specifically, Figure 3 and Figure 4 are structure schematic diagrams of the substrate 1 in two different directions, that is, one is a front structure schematic diagram of the substrate 1, and the other is a back structure schematic diagram of the substrate 1. As shown in Figure 1 and Figure 4 , the substrate 1 is a forged aluminum plate, the heat dissipation fin 2 and the substrate 1 are integrated forged aluminum sheets, the substrate 1 and the heat dissipation fin 2 in the embodiment of the utility model are 6063 aluminum, and the thermal conductivity can reach 200 W / m·k to 230 W / m·k, which greatly improves the heat dissipation efficiency of the heat dissipation device. In addition, the metal piece 3 is a copper plate, that is, a copper plate is arranged between the substrate 1 and the chip, and the forged aluminum plate and the copper plate are connected by brazing. The thermal conductivity of copper is usually 397 W / m·k, which is higher than that of aluminum, so that the thermal resistance of the heat conduction interface between the chip and the substrate 1 can be reduced, and the heat dissipation efficiency of the heat dissipation device is further improved.

[0044] Optionally, referring to Figure 3 , the thickness of the heat dissipation fin 2 is t1, and 1mm≤t1≤1.2mm.

[0045] Optionally, the interval between the adjacent heat dissipation fins 2 is a, 3mm≤a≤3.5mm.

[0046] Specifically, as shown in Figure 3 the related art, the heat dissipation fins and the shell are integrally pressure cast, due to the characteristics of the pressure casting process, the interval of the heat dissipation fins 2 is large, and the minimum interval can only be 6mm, which makes the heat dissipation fins 2 not dense enough, affecting the heat dissipation efficiency. In the embodiment of the utility model, the heat dissipation fins 2 and the base plate 1 are integrally forged, due to the characteristics of the forging process, the interval a of the heat dissipation fins 2 can be reduced, 3mm≤a≤3.5mm, in some embodiments, the interval a can take the value parameters 3mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm or 3.5mm. When the interval a is greater than 3.5mm, the density of the heat dissipation fins 2 is easily reduced, and the heat dissipation efficiency is reduced. When the interval a is less than 3.5mm, the interval is too small, which will cause the fluid cooling liquid between the heat dissipation fins 2 to flow poorly, produce a flow dead zone, and reduce the heat dissipation efficiency. Therefore, the embodiment optimizes the design of the heat transfer process from the aspect of improving the density of the heat dissipation fins.

[0047] In addition, compared with the related art, the thickness of the heat dissipation fins 2 is reduced, the thickness of the heat dissipation fins 2 is t1, 1mm≤t1≤1.2mm, in some embodiments, the thickness t1 of the heat dissipation fins 2 can take the value parameters 1mm, 1.05mm, 1.1mm, 1.15mm or 1.2mm. When the thickness t1 is less than 1mm, the structural strength of the heat dissipation fins 2 is insufficient, and when the thickness t1 is greater than 1.2mm, the heat dissipation area of the heat dissipation fins 2 is reduced, and the heat dissipation efficiency is reduced. Exemplarily, the interval a of the heat dissipation fins 2 of the embodiment of the utility model is 3.5mm, and the thickness t1 is 1.2mm.

[0048] Optionally, referring to Figure 1 , it further comprises a phase change heat conduction film 4, one side of the phase change heat conduction film 4 is in contact with the side of the metal piece 3 away from the base plate 1, and the other side of the phase change heat conduction film 4 is used to contact the chip for heat dissipation.

[0049] Specifically, as shown in Figure 1As shown, the lower surface of the phase change heat conducting film 4 is in contact with the copper plate, and the upper surface is in contact with the chip for heat dissipation. The phase change heat conducting film 4 is arranged on the upper surface of the copper plate, and the substrate 1 is brazed to the lower surface of the copper plate, that is, the phase change heat conducting film 4 is located between the copper plate and the chip and directly contacts the chip for heat conduction. The PCM (Phase Change Material) is a material that can absorb or release a large amount of heat when the state of the material changes. It can effectively fill the air gap between the copper plate and the chip, has flexibility and elasticity characteristics, and can be used to cover uneven surfaces, reduce the contact thermal resistance, improve the heat conduction efficiency, and solve the technical problem of high chip junction temperature caused by excessive contact thermal resistance of the thermal interface material.

[0050] In the related art, a heat conducting gel is usually applied on the heat conducting interface of the chip, and the thermal conductivity of the heat conducting gel is 6W / m·k. Due to reliability limitations, the thickness of the heat conducting gel is not less than 0.5mm. For a chip with a heat power of 160W and an area of 16cm2, the thermal interface temperature difference is 8.3℃, which is relatively large. In the embodiment of the present application, the reliability of the PCM is relatively high, and the thinnest thickness can reach 0.1mm, and the thermal conductivity can reach 8W / m·k. For a chip with a heat power of 160W and an area of 16cm2, the thermal interface temperature difference is reduced to 1.25℃, that is, the thermal conductivity is greatly improved. Therefore, the present embodiment optimizes the design of the heat transfer process from the aspect of reducing the thermal resistance of the thermal interface material.

[0051] Optionally, the thickness of the phase change heat conducting film 4 is t2, and 0.1mm≤t2≤0.2mm.

[0052] Specifically, the thickness of the PCM is t2, and 0.1mm≤t2≤0.2mm. In some embodiments, the thickness t2 of the PCM can take the value parameters of 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm or 0.2mm. When the thickness t2 is less than 0.1mm, the structural stability of the PCM cannot be guaranteed; when the thickness t2 is greater than 0.2mm, the thermal resistance between the PCM and the chip will be increased, and the heat dissipation efficiency will be reduced. In the embodiment of the present application, the thickness t2 of the PCM is 0.1mm.

[0053] Optionally, with reference to Figure 2 Further comprising a shell 5; the substrate 1 is connected in the shell 5, the shell 5 has opposite first and second openings 51 and 52, the metal piece 3 and the phase change heat conducting film 4 are fixed on the side of the substrate 1 close to the first opening 51, the phase change heat conducting film 4 is used to contact the first chip 61 for heat dissipation, the second opening 52 is used to fix the second chip 62 for heat dissipation, and the power of the first chip 61 is greater than that of the second chip 62.

[0054] Specifically, as shown in Figure 2 The shell 5 has a protective support and heat dissipation effect, and the base plate 1 is buckled and connected in the shell 5. The shell 5 is an open structure at the upper and lower parts, the upper part is a first opening 51, and the lower part is a second opening 52. The base plate 1 is installed into the shell 5 through the first opening 51, and the copper block of the metal piece 3 is welded to the upper surface of the base plate 1 close to the first opening 51. The upper surface of the metal piece 3 is provided with a phase change heat conduction film 4, and the upper surface of the phase change heat conduction film 4 is used to contact the first chip 61 for heat dissipation. The second opening 52 of the shell 5 is used to fix the second chip 62, so that the second chip 62 is directly cooled through the shell 5. The cooling fin 2 integrally connected on the base plate 1 forms a cooling liquid flow channel, which is used for water cooling heat exchange of the first chip 61 and the second chip 62. The power and junction temperature requirements of the first chip 61 and the second chip 62 are different, so they are installed at different positions. The power of the first chip 61 is greater than that of the second chip 62, so the cast-shaped base plate 1, the copper block of the metal piece 3 and the phase change heat conduction film 4 are used for heat dissipation of the first chip 61 to improve the heat dissipation efficiency, and the shell 5 is used for heat dissipation of the second chip 62 to meet the junction temperature requirement.

[0055] Therefore, the structure formed by connecting the base plate 1 and the shell 5 has a double-sided heat dissipation effect, can effectively cool two chips at the same time, and improves the space utilization.

[0056] Optionally, referring to Figure 2 The shell 5 is a die-cast aluminum shell, and the base plate 1 and the shell 5 are friction stir welded.

[0057] Specifically, as shown in Figure 2 The shell 5 is a die-cast aluminum shell, and the base plate 1 and the shell 5 are friction stir welded. The power of the first chip 61 is greater than that of the second chip 62, so a die-cast part with lower thermal conductivity than a forged part is used as a shell forming material. The first chip 61 of the embodiment of the present application is a large model calculation chip, and the second chip 62 is a conventional SOC (System-on-a-Chip, system level chip). The power of the conventional SOC is usually not more than 50W, and the power of the large model calculation chip reaches more than 160W. The structure and process advantages are fully utilized to realize the double-sided heat dissipation effect of the heat dissipation device.

[0058] Specifically, as shown in Figure 2 The base plate 1 and the shell 5 are connected by friction stir welding. This process uses friction heat and plastic deformation heat as a welding heat source. This welding method has low residual stress, the welded workpiece is not easy to deform, and can complete long welds, large sections and different positions at one time, has low energy consumption, high efficiency, and low requirements for the working environment.

[0059] The utility model embodiment further provides a kind of controller, refer to Figure 2 Including chip and the chip heat dissipation device described in any one of the above;At least one described chip is fixed to the one side of the metal piece 3 away from the substrate 1.

[0060] Specifically, as Figure 2 Indicated, the controller provided by the utility model embodiment is designed based on cabin area controller product with large model, for other controllers in vehicle manufacturing technical field, such as intelligent driving area controller or central computing unit, or other electronic devices including notebook, mobile phone or game machine etc. Chip heat dissipation device provided by the utility model embodiment can be used. The upper surface of substrate 1 is used to fix large model computing chip, and the lower part of shell 5 is used to fix conventional SOC chip, realizes double-sided heat dissipation, has strong heat dissipation efficiency, can ensure that controller is in safe temperature range during working process, improves the performance of controller.

[0061] The utility model embodiment further provides a kind of vehicle, including the controller of above embodiment, controller can be used as vehicle-mounted area controller, satisfies the heat dissipation demand of vehicle-mounted area controller, ensures vehicle control performance and safety.

[0062] It should be noted that, in this paper, the term "including", "containing" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or device. Without more limitations, the element defined by the sentence "including a …" does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0063] The embodiments of the utility model are described above in combination with the drawings, but the utility model is not limited to the above specific embodiments, and the above specific embodiments are only illustrative, not restrictive, and those skilled in the art can make many forms under the inspiration of the utility model without departing from the purpose of the utility model and the scope protected by the claims, which all belong to the protection of the utility model.

Claims

1. A chip heat dissipating device, characterized by comprising: The chip heat dissipation device comprises a substrate (1), heat dissipation fins (2) and a metal piece (3); The substrate (1) is integrally forged and formed with the heat dissipation fins (2) on one surface, and cooling liquid flow channels are formed between the heat dissipation fins (2); The other surface of the substrate (1) is welded with the metal piece (3), and the side of the metal piece (3) away from the substrate (1) is used for chip heat dissipation.

2. The chip heat dissipating device according to claim 1, wherein The substrate (1) is a forged aluminum plate, the heat dissipation fins (2) are forged aluminum plates, and / or The metal piece (3) is a copper plate.

3. The chip heat dissipating device according to claim 1, wherein The chip heat dissipation device further comprises a phase change heat conduction film (4); One side of the phase change heat conduction film (4) is in contact with the side of the metal piece (3) away from the substrate (1), and the other side of the phase change heat conduction film (4) is used for contact with a chip for heat dissipation.

4. The chip heat dissipating device according to claim 3, wherein The chip heat dissipation device further comprises a shell (5); The substrate (1) is connected to the shell (5) by buckling, the shell (5) has opposite first and second openings (51, 52), the side of the substrate (1) close to the first opening (51) is fixed with the metal piece (3) and the phase change heat conduction film (4), the phase change heat conduction film (4) is used for contact with a first chip (61) for heat dissipation, the second opening (52) is used for fixing a second chip (62) for heat dissipation, and the power of the first chip (61) is greater than that of the second chip (62).

5. The chip heat dissipating device according to claim 4, wherein The shell (5) is a die-cast aluminum shell, and the substrate (1) and the shell (5) are friction stir welded.

6. The chip heat dissipating device according to claim 1, wherein The thickness of the heat dissipation fins (2) is t1, and 1mm≤t1≤1.2mm.

7. The chip heat dissipating device according to claim 1, wherein The spacing between adjacent heat dissipation fins (2) is a, and 3mm≤a≤3.5mm.

8. The chip heat dissipating device according to claim 3, wherein The thickness of the phase change heat conduction film (4) is t2, and 0.1mm≤t2≤0.2mm.

9. A controller characterized by comprising: The chip heat dissipation device comprises a chip and the chip heat dissipation device according to any one of claims 1 to 8. At least one chip is fixed to the side of the metal piece (3) away from the substrate (1).

10. A vehicle characterized by comprising: The controller according to claim 9 is provided.

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